ATE508154T1 - Elektronische verpackung - Google Patents

Elektronische verpackung

Info

Publication number
ATE508154T1
ATE508154T1 AT08156292T AT08156292T ATE508154T1 AT E508154 T1 ATE508154 T1 AT E508154T1 AT 08156292 T AT08156292 T AT 08156292T AT 08156292 T AT08156292 T AT 08156292T AT E508154 T1 ATE508154 T1 AT E508154T1
Authority
AT
Austria
Prior art keywords
epoxy
epoxy compound
resin composition
epoxy resin
group
Prior art date
Application number
AT08156292T
Other languages
English (en)
Inventor
Ruediger Nowak
Thomas Schlosser
Reiner Wartusch
Original Assignee
Evonik Degussa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa Gmbh filed Critical Evonik Degussa Gmbh
Application granted granted Critical
Publication of ATE508154T1 publication Critical patent/ATE508154T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Glass Compositions (AREA)
  • Liquid Crystal Substances (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
AT08156292T 2008-05-15 2008-05-15 Elektronische verpackung ATE508154T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP08156292A EP2119737B1 (de) 2008-05-15 2008-05-15 Elektronische Verpackung

Publications (1)

Publication Number Publication Date
ATE508154T1 true ATE508154T1 (de) 2011-05-15

Family

ID=39738214

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08156292T ATE508154T1 (de) 2008-05-15 2008-05-15 Elektronische verpackung

Country Status (11)

Country Link
US (1) US20110163461A1 (de)
EP (1) EP2119737B1 (de)
JP (1) JP2011521033A (de)
KR (1) KR20110017853A (de)
CN (1) CN102027036A (de)
AT (1) ATE508154T1 (de)
DE (1) DE602008006681D1 (de)
ES (1) ES2364790T3 (de)
PL (1) PL2119737T3 (de)
TW (1) TW201004995A (de)
WO (1) WO2009138301A1 (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101825259B1 (ko) * 2011-08-31 2018-02-02 히타치가세이가부시끼가이샤 수지 조성물, 수지 시트, 금속박 구비 수지 시트, 수지 경화물 시트, 구조체, 및 동력용 또는 광원용 반도체 디바이스
KR101321981B1 (ko) * 2012-10-25 2013-10-28 한국전기연구원 용매제어형 실리카-에폭시 하이브리드 패키징 소재 제조방법
CN104822768B (zh) * 2012-11-30 2017-09-08 Lg伊诺特有限公司 环氧树脂组合物和包括使用该环氧树脂组合物的绝缘层的印刷电路板
KR101985256B1 (ko) * 2012-11-30 2019-06-03 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR101985255B1 (ko) * 2012-11-30 2019-06-03 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR101973685B1 (ko) 2012-12-12 2019-08-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR101984791B1 (ko) * 2012-12-12 2019-09-03 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
KR102012311B1 (ko) * 2012-12-12 2019-08-20 엘지이노텍 주식회사 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR101973686B1 (ko) 2012-12-12 2019-08-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR101952356B1 (ko) * 2012-12-14 2019-02-26 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 인쇄 회로 기판
KR102034228B1 (ko) 2012-12-14 2019-10-18 엘지이노텍 주식회사 에폭시 수지 조성물, 이를 이용한 프리프레그 및 인쇄 회로 기판
KR102022430B1 (ko) * 2013-05-28 2019-09-18 엘지이노텍 주식회사 에폭시 수지 조성물 및 이를 이용한 절연층을 포함하는 인쇄 회로 기판
KR20150097359A (ko) 2014-02-18 2015-08-26 주식회사 엘지화학 봉지 필름 및 이를 포함하는 유기전자장치

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3333776A (en) * 1965-04-05 1967-08-01 Dow Corning Hydrophobic silica as a grinding aid
US4043969A (en) * 1973-04-23 1977-08-23 National Semiconductor Corporation Casting compound for semiconductor devices
JPS6031517A (ja) 1983-07-29 1985-02-18 Sumitomo Chem Co Ltd エポキシ樹脂の製造法
JP2501804B2 (ja) * 1986-11-20 1996-05-29 松下電工株式会社 エポキシ樹脂組成物
EP0289632A1 (de) * 1987-05-04 1988-11-09 American Cyanamid Company Durch Induktion härtbare Klebstoffe mit hoher Festigkeit in ungehärtetem Zustand
JPH01297453A (ja) * 1988-05-24 1989-11-30 Matsushita Electric Works Ltd 一液性エポキシ樹脂組成物
DE4119332A1 (de) * 1991-06-12 1992-12-17 Huels Chemische Werke Ag Verfahren zur herstellung von methylidengruppen enthaltenden (alpha), (omega) -ungesaettigten oligomeren aus (alpha), (omega) -diolefinen in gegenwart von aluminiumorganischen verbindungen als katalysator
DE4233021A1 (de) * 1992-10-01 1994-04-07 Huels Chemische Werke Ag Organosilanpolykondensate
US6193795B1 (en) * 1993-08-02 2001-02-27 Degussa Corporation Low structure pyrogenic hydrophilic and hydrophobic metallic oxides, production and use
DE19508088A1 (de) * 1995-03-08 1996-09-12 Huels Chemische Werke Ag Verfahren zur Herstellung eines Oligomer-Gemisches aus alpha,omega-Diolefinen
JP3508289B2 (ja) * 1995-05-02 2004-03-22 住友化学工業株式会社 エポキシ樹脂組成物および樹脂封止型半導体装置
EP0739877B1 (de) * 1995-04-27 1999-08-04 Sumitomo Chemical Company Limited Epoxyharz, Harzzusammensetzung und Harz-verkapselte Halbleitervorrichtung
US5959005A (en) 1996-04-26 1999-09-28 Degussa-Huls Aktiengesellschaft Silanized silica
DE19616781A1 (de) * 1996-04-26 1997-11-06 Degussa Silanisierte Kieselsäure
DE19624032A1 (de) * 1996-06-17 1997-12-18 Huels Chemische Werke Ag Oligomerengemisch kondensierter Alkylalkoxysilane
DE19639782A1 (de) * 1996-09-27 1998-04-02 Huels Chemische Werke Ag Glycidether-, Acryl- und/oder Methacryl-funktionelle Organopolysiloxan-haltige Zusammensetzungen auf Wasser-Basis, Verfahren zu deren Herstellung sowie deren Verwendung
JPH10298170A (ja) * 1997-02-28 1998-11-10 Sumitomo Chem Co Ltd エポキシ化合物、その製造法、その精製方法、エポキシ樹脂組成物および樹脂封止型半導体装置
TW593528B (en) * 1997-03-31 2004-06-21 Sumitomo Chemical Co Epoxy resin composition
DE19818924A1 (de) * 1998-04-28 1999-11-04 Degussa Oberflächenmodifizierte Füllstoffe, Verfahren zu deren Herstellung sowie deren Verwendung
JP2000044773A (ja) * 1998-07-28 2000-02-15 Konishi Co Ltd １液湿気硬化型組成物
DE19834990B4 (de) * 1998-08-03 2005-09-15 Degussa Ag Acryloxypropyl- oder Methacryloxypropyl-Gruppen enthaltende Siloxan-Oligomere, Verfahren zu ihrer Herstellung sowie deren Verwendung
DE19848351A1 (de) * 1998-10-21 2000-04-27 Degussa Vernetzbare Polymere, Verfahren zu deren Herstellung und Formkörper aus vernetzten Polymeren
DE19849308A1 (de) * 1998-10-27 2000-05-04 Degussa Aminopropyl-funktionelle Siloxan-Oligomere
DE19904132C2 (de) * 1999-02-03 2002-11-28 Degussa Zusammensetzung fluororganofunktioneller Silane und Siloxane, Verfahren zu ihrer Herstellung und ihre Verwendung
DE19929021A1 (de) * 1999-06-25 2000-12-28 Degussa Funktionelle Organylorganyloxysilane auf Trägerstoffen in Kabelcompounds
DE19961972A1 (de) * 1999-12-22 2001-06-28 Degussa Organosilan- und/oder Organosiloxan-haltige Mittel für gefülltes Polyamid
EP1195417B1 (de) * 2000-10-05 2009-10-14 Evonik Degussa GmbH Siliciumorganische Nanokapseln
EP1195416A3 (de) * 2000-10-05 2005-12-28 Degussa AG Polymerisierbare siliciumorganische Nanokapseln
DE10056344A1 (de) * 2000-11-14 2002-05-16 Degussa n-Propylethoxysiloxane, Verfahren zu deren Herstellung und deren Verwendung
DE10100384A1 (de) * 2001-01-05 2002-07-11 Degussa Verfahren zur Modifizierung der Funktionalität von organofunktionellen Substratoberflächen
ATE366279T1 (de) * 2001-03-30 2007-07-15 Degussa Siliciumorganische nano-mikrohybridsysteme oder mikrohybridsysteme enthaltende zusammensetzung für kratz- und abriebfeste beschichtungen
EP1249470A3 (de) * 2001-03-30 2005-12-28 Degussa AG Hochgefüllte pastöse siliciumorganische Nano- und/oder Mikrohybridkapseln enthaltende Zusammensetzung für kratz- und/oder abriebfeste Beschichtungen
DE10132942A1 (de) * 2001-07-06 2003-01-23 Degussa Siloxan-Oligomere, Verfahren zu deren Herstellung und deren Verwendung
DE10141687A1 (de) * 2001-08-25 2003-03-06 Degussa Siliciumverbindungen enthaltendes Mittel zur Beschichtung von Oberflächen
DE10142555A1 (de) * 2001-08-30 2003-03-20 Degussa Mittel für die Verbesserung der Scorch-Bedingungen bei der Herstellung gepfropfter und/oder vernetzter Polymere sowie gefüllter Kunststoffe
DE10159952A1 (de) * 2001-12-06 2003-06-18 Degussa Verwendung flüssiger oder auf Trägermaterial aufgebrachter ungestättigter Organosilan/-mischungen zur Herstellung von feuchtigkeitsvernetzten und gefüllten Kabelcompounds
DE10212523A1 (de) * 2002-03-21 2003-10-02 Degussa Lufttrocknende, silanhaltige Beschichtungsmittel
DE10238369A1 (de) * 2002-08-22 2004-03-04 Degussa Ag Mittel als Haftvermittler für gefüllte und peroxidisch zu vernetzende Gummicompounds
DE10327624B3 (de) * 2003-06-20 2004-12-30 Degussa Ag Organosiliciumverbindungen, Verfahren zu ihrer Herstellung, sowie ihre Verwendung
DE10362060B4 (de) * 2003-10-21 2009-07-09 Altana Coatings & Sealants Gmbh Verpackungsmaterial mit einer Barriereschicht für Gase
DE102004007456A1 (de) * 2004-02-13 2005-09-01 Degussa Ag Hochgefüllte Polyolefin-Compounds
JP4977973B2 (ja) * 2004-07-13 2012-07-18 日立化成工業株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
CN1984960B (zh) * 2004-07-13 2011-04-20 日立化成工业株式会社 密封用环氧树脂成形材料及电子零件装置
DE102004037043A1 (de) * 2004-07-29 2006-03-23 Degussa Ag Blockkondensate organofunktioneller Siloxane, deren Herstellung, Verwendung sowie deren Eigenschaften
DE102004049427A1 (de) * 2004-10-08 2006-04-13 Degussa Ag Polyetherfunktionelle Siloxane, polyethersiloxanhaltige Zusammensetzungen, Verfahren zu deren Herstellung und deren Verwendung
DE102005004872A1 (de) * 2005-02-03 2006-08-10 Degussa Ag Wässrige Emulsionen von funktionellen Alkoxysilanen und deren kondensierten Oligomeren, deren Herstellung und Verwendung zur Oberflächenbehandlung
DE102005004871A1 (de) * 2005-02-03 2006-08-10 Degussa Ag Hochviskose wässrige Emulsionen von funktionellen Alkoxysilanen, deren kondensierten Oligomeren, Organopolysiloxanen, deren Herstellung und Verwendung zur Oerflächenbehandlung von anorganischen Materialien
DE102006013090A1 (de) * 2006-03-20 2007-09-27 Georg-August-Universität Göttingen Kompositwerkstoff aus Holz und thermoplastischem Kunststoff
DE102006033310A1 (de) * 2006-07-17 2008-01-31 Evonik Degussa Gmbh Gemische aus siliciumhaltigen Kopplungsreagentien
PL1982964T3 (pl) * 2007-04-20 2019-08-30 Evonik Degussa Gmbh Mieszanina zawierająca związek krzemoorganiczny i jej zastosowanie
DE102007038314A1 (de) * 2007-08-14 2009-04-16 Evonik Degussa Gmbh Verfahren zur kontrollierten Hydrolyse und Kondensation von Epoxy-funktionellen Organosilanen sowie deren Condensation mit weiteren organofunktionellen Alkoxysilanen
DE102007045186A1 (de) * 2007-09-21 2009-04-09 Continental Teves Ag & Co. Ohg Rückstandsfreies, schichtbildendes, wässriges Versiegelungssystem für metallische Oberflächen auf Silan-Basis
DE102008001808A1 (de) * 2008-05-15 2009-11-19 Evonik Degussa Gmbh Beschichtungszusammensetzung
DE102008001855A1 (de) * 2008-05-19 2009-11-26 Evonik Degussa Gmbh Zweikomponenten-Zusammensetzung zur Herstellung von flexiblen Polyurethan-Gelcoats

Also Published As

Publication number Publication date
US20110163461A1 (en) 2011-07-07
TW201004995A (en) 2010-02-01
WO2009138301A1 (en) 2009-11-19
PL2119737T3 (pl) 2011-09-30
EP2119737A1 (de) 2009-11-18
KR20110017853A (ko) 2011-02-22
CN102027036A (zh) 2011-04-20
DE602008006681D1 (de) 2011-06-16
JP2011521033A (ja) 2011-07-21
ES2364790T3 (es) 2011-09-14
EP2119737B1 (de) 2011-05-04

Similar Documents

Publication Publication Date Title
ATE508154T1 (de) Elektronische verpackung
EP2557103A4 (de) Epoxidverbindung, härtbare zusammensetzung und gehärtetes produkt daraus
SG195098A1 (en) Resin composition, prepreg and laminate
TW200722456A (en) Thermosetting resin composition and photosemiconductor encapsulation material
ATE526321T1 (de) Neue epoxidverbindung, alkalisch entwickelbare harzzusammensetzung und alkalisch entwickelbare lichtempfindliche harzzusammensetzung
WO2008133228A1 (ja) ケイ素含有化合物、硬化性組成物及び硬化物
MY167031A (en) Phenolic resin composition
TW200617086A (en) Curable resin composition, curable film and cured film
TW200801074A (en) Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
DE602007002402D1 (de) Haftvermittler, härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
MY162601A (en) Curable epoxy resin composition
MY175000A (en) Epoxy resin, epoxy resin composition and cured product
MY145942A (en) Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator
TW200626660A (en) Epoxy resin composition and semiconductor device
TW200734377A (en) Phenol resin and resin composition
ATE500212T1 (de) Bisphenol monoester
TW200740870A (en) Epoxy resin composition for encapsulating semiconductor and semiconductor device
WO2009005135A1 (ja) エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
TW200942580A (en) Radiation-sensitive resin composition, cured product thereof, and interlayer insulation film and optical device using the composition
PH12018502283A1 (en) Epoxy resin composition and electronic component device
TW200613436A (en) Resin composition for semiconductor encapsulation and semiconductor device
WO2008123237A1 (ja) エポキシ樹脂組成物
WO2008123238A1 (ja) 樹脂組成物
TW200609262A (en) Ultraviolet-curable composition
MY158651A (en) Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties