TWI452057B - 使用二氰二醯胺作為用於熱固性環氧樹脂之固化劑的無二甲基甲醯胺調配物 - Google Patents
使用二氰二醯胺作為用於熱固性環氧樹脂之固化劑的無二甲基甲醯胺調配物 Download PDFInfo
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- TWI452057B TWI452057B TW097145682A TW97145682A TWI452057B TW I452057 B TWI452057 B TW I452057B TW 097145682 A TW097145682 A TW 097145682A TW 97145682 A TW97145682 A TW 97145682A TW I452057 B TWI452057 B TW I452057B
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- hardener
- dicyandiamide
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
- C08K5/3155—Dicyandiamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
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Description
文中所揭示之實施態樣一般而言係有關於在使用二氰二醯胺作為固化劑之環氧調配物中排除具毒性且高沸點之溶劑,如DMF、NMP及DMSO。更明確地,文中所揭示之實施例係有關於硬化劑組成物及自此等可固化組成物所形成之經固化樹脂,其中該等硬化劑組成物包括環氧樹脂、二氰二醯胺、及含磷酚系硬化劑。
用於電用層板應用之樹脂組成物通常需要良好的性質平衡。例如具有低黏度之樹脂組成物可減少與孔隙、劣纖維濕潤、劣半固化片外觀、及其它爭議有關之問題。亦較佳為具有高玻璃轉化溫度之經固化樹脂。溶劑通常用以形成該等樹脂組成物,諸如用以降低樹脂黏度或溶解觸媒或硬化劑。
二氰二醯胺為用於環氧樹脂,尤其用於含溶劑電用層板及複合材料應用之一般硬化劑。二氰二醯胺在一般有機溶劑內具有有限溶度,因此限制了可用於這些含溶劑應用之溶劑選擇。
極性溶劑,諸如二甲基甲醯胺(DMF)、二甲基亞碸(DMSO)及N-甲基吡咯啶酮(NMP),通常可併用二氰二醯胺。遺憾的是,此等溶劑具毒性、具有高沸點,因此很難
自半固化片移除該溶劑,或此等溶劑不適於在該等半固化片內需要低含量之殘留溶劑以獲得最佳性能的應用。此外,由於其毒性,工業正試圖在電用層板應用中減少或去除DMF之使用。
各種阻燃劑及含磷化合物之阻燃性環氧組成物係描述在以下公開案內:諸如包括WO2007011075、JP2006342217、EP1657972、WO2005118604、JP2005067095、CN1488672、美國專利第6,797,821號、JP2003206392、JP2003049051、JP2003012765、JP2002265567、JP2002322241、及美國專利第6,291,627號。含磷環氧化合物亦描述在以下專利案內:包括WO2006059363、JP2004175895、JP2003342349、JP2003171438、JP2002249540、及美國專利第6,720,077號與第6,054,515號。作為另一實例之JP2002302529揭示具有優異阻燃性之已添加二氰二醯胺之經磷改質的環氧樹脂。這些公開案中之多種揭示9,10-二氫-9-氧雜-10-膦菲-10-氧化物(有時稱為DOPO)作為所使用該含磷化合物之用途。
因此,有需要使用二氰二醯胺作為用於熱固性環氧樹脂之固化劑的無DMF調配物。
在一方面中,文中揭示之實施例係有關於包括二氰二醯胺及具有以下通式之酚系硬化劑之實質上均質溶液:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
在其它方面中,文中揭示之實施例係有關於可固化組成物,其包括環氧樹脂、二氰二醯胺、及具有以下通式之酚系硬化劑。
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
在其它方面中,文中揭示之實施例係有關於熱固性樹脂,其包括以下組份之反應產物:環氧樹脂;二氰二醯胺;及具有以下通式之酚系硬化劑:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
在其它方面中,文中揭示之實施例係有關於一種用於形成二氰二醯胺硬化劑組成物之方法,該方法包括:摻合二氰二醯胺及具有以下通式之酚系硬化劑:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
在其它方面中,文中揭示之實施例係有關於一種用於形成含二氰二醯胺之可固化組成物的方法,該方法包括:摻合二氰二醯胺及酚系硬化劑以形成硬化劑組成物,其中該酚系硬化劑具有以下通式:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數;且以該硬化劑組成物摻合環氧樹脂。
其它方面及優點自以下說明文及附加申請專利範圍可瞭解。
在一方面中,文中揭示之實施例係有關於毒性暨高沸點溶劑,諸如DMF、NMP、及DMSO,在用於,例如塗料、複合材料、及電用層板中之二氰二醯胺固化調配物內的脫去反應。更明確地,文中揭示之實施例係有關於具有以下通式之酚係硬化劑:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
在一方面中,文中揭示之實施例係有關於可固化組成物及自此等可固化組成物所形成之固化樹脂。例如該等可固化組成物可包括該環氧樹脂及上述酚系硬化劑之摻合物。
本發明者已意外地發現可在不使用DMF、DMSO或NMP之情況下,使二氰二醯胺溶解在此等酚系硬化劑中。這些二氰二醯胺溶液可實質上具均質性且可直接摻入環氧樹脂溶液內以作為固化劑及阻燃劑。所形成清漆、半固化片、及層板可不含有任何DMF。此外,由於該等半固化片及層板中無殘留DMF,所以所形成固化樹脂之玻璃轉化溫度可高於含DMF之調配物。
除該環氧樹脂及含磷酚系硬化劑外,另外硬化劑、觸媒、阻燃劑、及其它添加劑亦可用於文中揭示之組成物內。其等各在下文有更詳細地描述。
用於文中揭示之實施例中的該等環氧樹脂可不同且包括習知且市售之環氧樹脂,其可單獨或以2或多種之組合使用。在選擇用於文中揭示之組成物的環氧樹脂時,不應僅考慮最終產物之性質,而且應考慮可影響該樹脂組成物之加工的黏度及其它性質。
該環氧樹脂組份可以是任何類型之環氧樹脂,其包括含一或多種反應性環氧乙烷基團,文中稱為“環氧基”或“環氧官能基”之任何材料。可用於文中揭示之實施例中的環氧樹脂可包括單官能基環氧樹脂、多官能基環氧樹脂、及其等之組合。單體性及聚合性環氧樹脂可以是脂肪族、環脂肪族、芳香族或雜環族環氧樹脂。該等聚合性環氧化物包括具有末端環氧基之直鏈聚合物(例如聚伸烷二醇之二縮水甘油醚)、聚合物骨架環氧乙烷單元(聚丁二烯聚環氧化物)及具有環氧側基團之聚合物(諸如甲基丙烯酸縮水甘油醚聚合物)。該等環氧化物可以是純化合物,但是通常為每分子含有1、2或多個環氧基之混合物或化合物。在某些實施例中,環氧樹脂亦可包括可以於較高溫度下與酸酐、有機酸、胺基樹脂、酚系樹脂或與環氧基團(當經催化時)反應以產生另外交聯之反應性-OH基團。
一般而言,該等環氧樹脂可以是縮水甘油化樹脂、環脂肪族樹脂、環氧化油等。該等縮水甘油化樹脂通常為環氧氯丙烷與雙酚化合物(諸如雙酚A)之反應產物;C4
至C28
烷基縮水甘油醚;C2
至C28
烷基-及烯基-縮水甘油酯;C1
至C28
烷基-、單-及多-酚縮水甘油醚;以下多價酚之聚縮水甘油醚:諸如兒茶酚、間苯二酚、氫醌、4,4’-二羥二苯基甲烷(或雙酚F)、4,4’-二羥基-3,3’-二甲基二苯基甲烷、4,4’-二羥二苯基二甲基甲烷(或雙酚A)、4,4’-二羥二苯基甲基甲烷、4,4’-二羥二苯基環己烷、4,4’-二羥基-3,3’-二甲基二苯基丙烷、4,4’-二羥二苯基碸、及三(4-羥苯基)甲烷;上述二酚之氯化及溴化產物的聚縮水甘油醚;酚醛清漆之聚縮水甘油醚;藉酯化二酚之醚(其係藉以二鹵烷或二鹵二烷基醚酯化芳香族氫羧酸之鹽而獲得)而獲得之二酚的聚縮水甘油醚;藉縮合酚及含有至少兩個鹵原子之長鏈鹵素石蠟而獲得之多酚的聚縮水甘油醚。可用於文中揭示之實施例中的環氧樹脂之其它實例包括雙-4,4’-(1-甲基亞乙基)酚二縮水甘油醚及(氯甲基)環氧乙烷雙酚A二縮水甘油醚。
在某些實施例中,該環氧樹脂可包括縮水甘油醚類型;縮水甘油酯類型;脂環族類型;雜環族類型、及鹵化環氧樹脂等。合適的環氧樹脂之非限制性實例可包括甲酚酚醛清漆環氧樹脂、酚系酚醛清漆環氧樹脂、聯苯環氧樹脂、氫醌環氧樹脂、二苯乙烯環氧樹脂、及其等之混合物與組成。
合適的聚環氧化合物可包括間苯二酚二縮水甘油醚(1,3-雙-(2,3-環氧丙氧基)苯)、雙酚A(2,2-雙(對-(2,3-環氧丙氧基)苯基)丙烷)之二縮水甘油醚、三縮水甘油基對-胺基酚(4-(2,3-環氧丙氧基)-N,N-雙(2,3-環氧丙基)苯胺)、溴雙酚A(2,2-雙(4-(2,3-環氧丙氧基)3-溴-苯基)丙烷)之二縮水甘油醚、雙酚F(2,2-雙(對-(2,3-環氧丙氧基)苯基)甲烷)之二縮水甘油醚、間-及/或對-胺基酚(3-(2,3-環氧丙氧基)N,N-雙(2,3-環氧丙基)苯胺)之三縮水甘油醚、及四縮水甘油基亞甲基二苯胺(N,N,N’,N’-四(2,3-環氧丙基)4,4’-二胺基二苯基甲烷)、及2或多種聚環氧化合物之混合物。有用之環氧樹脂的詳細群組可以在以下參考文獻中找到:Lee,H.and Neville,K.,Handbook of Epoxy Resins,McGraw-Hill Book Company,1982再版本。
其它合適的環氧樹脂包括主要含芳香族胺及環氧氯丙烷之聚環氧化合物,諸如N,N-二縮水甘油基苯胺、N,N’-二甲基-N,N’-二縮水甘油基、4,4’-二胺基二苯基甲烷、N,N,N’,N’-四縮水甘油基-4,4’-二胺基二苯基甲烷、N-二縮水甘油基-4-胺基苯基縮水甘油醚、及雙-4-胺基苯甲酸、N,N,N’,N’-四縮水甘油基-1,3-丙烯酯。環氧樹脂亦可包括以下一或多種之縮水甘油基衍生物:芳香族二胺、芳香族單第一胺、胺基酚、多羥酚、多羥醇、多羧酸。
有用的環氧樹脂包括,例如以下多羥多元醇之聚縮水甘油醚:諸如乙二醇、三乙二醇、1,2-丙二醇、1,5-戊二醇、1,2,6-己三醇、甘油、及2,2-雙(4-羥環己基)丙烷;以下脂肪族及芳香族多羧酸之聚縮水甘油醚:諸如草酸、琥珀酸、戊二酸、對苯二酸、2,6-萘二羧酸、及二聚化亞麻二油酸;以下多酚之聚縮水甘油醚:諸如雙酚A、雙酚F、1,1-雙(4-羥苯基)乙烷、1,1-雙(4-羥苯基)異丁烷、及1,5-二羥基萘;具有丙烯酸酯及胺甲酸乙酯分子團之經改質環氧樹脂;縮水甘油基胺環氧樹脂;及酚醛清漆樹脂。
該等環氧化合物可以是環脂肪族或脂環族環氧化物。環脂肪族環氧化物之實例包括環脂肪族二羧酸酯之二環氧化物,諸如雙(3,4-環氧基環己基甲基)草酸酯、雙(3,4-環氧基環己基甲基)己二酸酯、雙(3,4-環氧基-6-甲基環氧己基甲基)己二酸酯、雙(3,4-環氧基環己基甲基)庚二酸酯;二環氧化乙烯基環己烯;二環氧化薴烯(limonene);二環氧化二環戊二烯等。其它合適的環脂肪族二羧酸酯之二環氧化描述在,例如美國專利第2,750,395號中。
其它環脂肪族環氧化物包括羧酸3,4-環氧基環己基甲基-3,4-環氧基環己酯,諸如羧酸3,4-環氧基環己基甲基-3,4-環氧基環己酯;羧酸3,4-環氧基-1-甲基環己基-甲基-3,4-環氧基-1-甲基環己酯;羧酸6-甲基-3,4-環氧基環氧己基甲基甲基-6-甲基-3,4-環氧基環己酯;羧酸3,4-環氧-2-甲基環己基甲基-3,4-環氧基-2-甲基環己酯;羧酸3,4-環氧基-3-甲基環己基-甲基-3,4-環氧基-3-甲基環己酯;羧酸3,4-環氧基-5-甲基環己基-甲基-3,4-環氧基-5-甲基環己酯等。其它合適的羧酸3,4-環氧基環己基甲基-3,4-環氧基環己酯描述在,例如美國專利第2,890,194號中。
特別有用之另外含環氧基材料包括彼等主要含縮水甘油醚單體之材料。實例為藉使多羥酚與過量氯乙醇(諸如環氧氯丙烷)進行反應而獲得之多羥酚的二-或聚縮水甘油醚。此等多羥酚包括間苯二酚、雙(4-羥苯基)甲烷(亦稱為雙酚F)、2,2-雙(4-羥苯基)丙烷(亦稱為雙酚A)、2,2-雙(4’-羥基-3’,5’-二溴苯基)丙烷、1,1,2,2-四(4’-羥基-苯基)乙烷、或在酸條件下獲得之酚與甲醛的縮合產物,諸如酚型酚醛清漆及甲酚型酚醛清漆。此種環氧樹脂之實例描述在美國專利第3,018,262號中。其它實例包括多羥醇(諸如1,4-丁二醇)或聚伸烷二醇(諸如聚丙二醇)之二-或聚縮水甘油醚、及環脂肪族多元醇(諸如2,2-雙(4-羥環己基)丙烷)之二-或聚縮水甘油醚。其它實例為單官能基樹脂,諸如甲苯酚基縮水甘油醚或丁基縮水甘油醚。
其它環氧化合物種類包括以下多價羧酸之聚縮水甘油酯及聚(β-甲基縮水甘油基)酯:諸如酞酸、對苯二甲酸、四氫酞酸或六氫酞酸。另外的環氧化合物種類為胺、醯胺及雜環族氮鹼之N-縮水甘油基衍生物,諸如N,N-二縮水甘油基苯胺、N,N-二縮水甘油基甲苯胺、N,N,N’,N’-四縮水甘油基雙(4-胺基苯基)甲烷、異三聚氰酸三縮水甘油酯、N,N’-二縮水甘油基乙基脲、N,N’-二縮水甘油基-5,5-二甲基乙內醯脲、及N,N’-二縮水甘油基-5-異丙基乙內醯脲。
又其它含環氧材料為縮水甘油之丙烯酸酯(諸如丙烯酸縮水甘油酯及甲基丙烯酸縮水甘油酯)與一或多種可共聚合乙烯基化合物之共聚物。此等共聚物之實例為1:1苯乙烯-甲基丙烯酸縮水甘油酯,1:1甲基丙烯酸甲酯-丙烯酸縮水甘油酯、及62.5:24:13.5甲基丙烯酸甲酯-丙烯酸乙酯-甲基丙烯酸縮水甘油酯。
容易獲得之環氧化合物包括環氧十八烷;甲基丙烯酸縮水甘油酯;雙酚A之二縮水甘油醚;得自The Dow Chemical Company,Midland,Michigan之D.E.R. 331、D.E.R.332及D.E.R. 334;二氧化乙烯基環己烯;羧酸3,4-環氧環環己基甲基-3,4-環氧基環己酯;羧酸3,4-環氧基-6-甲基環己基-甲基-3,4-環氧基-6-甲基環己酯;雙(3,4-環氧基-6-甲基環己基甲基)己二酸酯;雙(2,3-環氧基環戊基)醚;經聚丙二醇改質之脂肪族環氧基物;二氧化二戊烯;環氧化聚丁二烯;含有環氧官能基之聚矽氧樹脂;阻燃性環氧樹脂(諸如以品名D.E.R. 580得自The Dow Chemical Company,Midland,Michigan之溴化雙酚型環氧樹脂);酚-甲醛酚醛清漆之1,4-丁二醇二縮水甘油醚(諸如彼等以品名D.E.N. 431及D.E.N. 438得自The Dow Chemical Company,Midland,Michigan之二縮水甘油醚);及間苯二酚二縮水甘油醚。雖然並未明確描述,亦可使用以品名D.E.R及D.E.N得自The Dow Chemical Company之其它環氧樹脂。在某些實施例中,環氧樹脂組成物可包括藉雙酚A之二縮水甘油醚與雙酚A之反應而形成之環氧樹脂。
其它合適的環氧樹脂揭示在美國專利第5,112,932號中,該專利在此併入本案以為參考資料。此等環氧樹脂可包括含環氧端基之聚唑啶酮化合物,其包括,例如聚環化物化合物與聚異氰酸酯化合物。所揭示之聚環氧化物可包括2,2-雙(4-羥苯基)丙烷(通稱為雙酚A)之二縮水甘油醚及2,2-雙(3,5-二溴-4-羥苯基)丙烷(通稱為四溴雙酚A)之二縮水甘油醚。合適的聚異氰酸酯包括4,4’-亞甲基雙(苯基異氰酸酯)(MDI)及其異構物;MDI之高碳官能基同系物(通稱為“聚合性MDI”);二異氰酸甲苯酯(TDI),諸如2,4-二異氰酸甲苯酯、及2,6-二異氰酸甲苯酯;間-苯二甲基二異氰酸酯、六亞甲基二異氰酸酯(HMDI)及異佛爾酮二異氰酸酯(isophoronediisocyanate)。
其它合適環氧樹脂揭示在以下專利案中:例如美國專利第7,163,973號、第6,887,574號、第6,632,893號、第6,242,083號、第7,037,958號、第6,572,971號、第6,153,719號、及第5,405,688號、PCT公開案WO 2006/052727、與美國專利申請公開案第20060293172及第20050171237號,其等各在此併入本案以為參考資料。
如上述,二氰二醯胺在一般有機溶劑(諸如酮及醇)中具劣溶度。因此,極性溶劑,諸如二甲基甲醯胺(DMF)-N-甲基吡咯啶酮(NMP)、及二甲基亞碸(DMSO),通常用於使用二氰二醯胺作為硬化劑之應用。
反之,文中揭示之可固化組成物包括作為硬化劑或固化劑之二氰二醯胺,其中該二氰二醯胺並未併用DMF、NMP、DMSO或不適於在半固化片中僅需要低殘留溶劑之應用的其它溶劑。
文中揭示之二氰二醯胺硬化劑溶液可包括已溶於含磷化合物或具有含磷化合物之溶液中的二氰二醯胺。在某些實施例中,該含磷化合物可包括具有以下通式化合物:
其中R’及R”可相同或不同且各代表R-或RO-基團,且R為烷基或芳香族基團;R’’’為氫、烷基或芳香族基團、-CH2
P(O)R’R”或-CH2
OR;n為在自0至100範圍內之整數。
上述含磷酚系硬化劑可包括,例如可溶酚醛樹脂(resole)與下式(I)磷化合物之反應產物:
其中R1
及R2
可相同或不同且各代表具有1至8個碳原子之直鏈或分支鏈烷基、環內具有5至6個碳原子之脂環族基團、具有6至10個碳原子之經取代或未經取代芳基、或R1
及R2
可以與磷原子一起形成5至8員環;m為自0至1之整數。該活性氫係與可溶酚醛樹脂反應以形成該含磷化合物。
在特定實施例中,該含磷酚系硬化劑可包括DOP-BN、DOP(9,10-二氫-9-氧雜-10-膦菲10-氧化物)與可溶酚醛樹脂之反應產物。可藉諸如PCT/US2005/017954中所揭示之可溶酚醛樹脂與含磷化合物之反應而形成其它合適含磷酚系硬化劑,該專利案在此併入本案以為參考資料。
可溶酚醛樹脂為在中性或鹼性條件下,酚與過量醛(典型上為甲醛或甲醛前驅物)之縮合產物(見Encyclopedia of Polymer Science and Technology,Vol. 7,“Phenolic Resins,”John Wiley and Sons)。可溶酚醛樹脂之特徵為含有至少一個芳香族環,其中至少一個酚系-OH基及一個-CH2
OR側鏈之“R”為氫或烷基。可溶酚醛樹脂可特別包括酚-甲醛型可溶酚醛樹脂、甲酚-甲醛型可溶酚醛樹脂、酚甲醛型可溶酚醛樹脂、雙酚F-甲醛型可溶酚醛樹脂、及雙酚A-甲醛型可溶酚醛樹脂。這些二氰二醯胺/酚系硬化劑溶液可實質上呈均質性且可直接摻入環氧樹脂溶液內以作為固化劑及阻燃劑。
作為實例,形成文中所述酚系硬化劑之該反應的進行步驟為將不同數量之DOP(9,10-二氫-9-氧雜-10-膦菲-10-氧化物)或上述其它含磷化合物與可溶酚醛樹脂摻合在一起並將該混合物加熱至足以引發該磷化合物與可溶酚醛樹脂之反應的溫度。一般而言,該反應溫度大於25℃、較佳大於150℃且更佳大於170℃。該反應之進行時間較佳足以使組份(A)之H-P=O、P-H、或P-OH分子團組份(B)之OR”分子團反應。該反應時間典型上為自30分鐘至20小時、較佳自1小時至10小時且更佳自2小時至6小時。可合併該含磷化合物及可溶酚醛樹脂,以該組成物之總固體含量為基準計,在某些實施例中其重量比之範圍為自10:1至1:10;在其它實施例中為自5:1至1:5;在其它實施例中為自2:1至1:2;且在又其它實施例中為自1.1:1至1:1.1。
文中描述之酚系硬化劑亦可包括溶劑,諸如酮、醇、及乙二醇醚。合適的醇可包括,例如丙醇、丁醇(亦即異丙醇、丁醇、異丁醇)、及其它醇。例如乙二醇醚可包括以品名DOWANOL PM得知The Dow Chemical Company,Midland,Michigan之丙二醇甲基醚。例如在某些實施例中,二氰二醯胺可溶解在上述酚係硬化劑(諸如DOP-BN)中。在其它實施例中,二氰二醯胺可溶解在該酚系硬化劑與DOWANOL PM之混合物中,在又其它實施例中,二氰二醯胺可溶解在該酚系硬化劑、丁醇、及DOWANOL PM之混合物中以形成貯存安定性溶液。可添加此等溶液至環氧樹脂組成物以形成可用以形成,例如半固化片及電用層板之安定性可固化調配物。
根據用於溶液中之該酚系硬化劑及溶劑(諸如乙二醇醚)的濃度,在某些實施例中,二氰二醯胺可以以至高35重量%或更高之濃度溶解在上述酚系硬化劑或其溶液內。在其它實施例中,二氰二醯胺可以以至高20重量%或更高之濃度溶解在該酚系硬化劑或其溶液內;在其它實施例中濃度可至高10重量%或更高;在其它實施例中濃度可至高5重量%或更高;在又其它實施例中濃度可至高3.5重量%或更高。此等濃度適用於無溴之二氰二醯胺固化調配物。
在某些實施例中,包括該二氰二醯胺及酚系硬化劑或其溶液之硬化劑溶液可包括1至60重量%3,4,5,6-二苯并-1,2-氧雜磷烷(oxaphosphane)-2-氧化物及可溶酚醛樹脂之反應產物;1至20重量%該二氰二醯胺;及5至30重量%溶劑,諸如醇、乙二醇醚、酮或其等之組合。
除了上述二氰二醯胺硬化劑外,亦可提供另外硬化劑或固化劑來促進該環氧樹脂之交聯以形成聚合物組成物。如同該等環氧樹脂情況一樣,該等另外硬化劑及固化劑可個別或以2或多種之混合物形成使用。該固化劑組份(亦稱為硬化劑或交聯劑)可包括具有可以與該環氧樹脂之環氧基反應之活性基團的任何化合物。該等固化劑可包括含氮化合物,諸如胺及其衍生物;含氧化合物,諸如羧酸末端性聚酯、酸酐、酚型酚醛清漆、雙酚A酚醛清漆、DCPD-酚縮合產物、溴化酚系寡聚物、胺基-甲醛縮合產物、酚、雙酚A及甲酚型酚醛清漆、酚系-末端性環氧樹脂;含硫化合物,諸如聚硫化物、聚硫醇;及催化性固化劑,諸如第三胺、路易斯酸(Lewis acid)、路易斯鹼及2或多種上述固化劑之組合。實際上可使用,例如聚胺、二胺基二苯基碸及其等之異構物、胺基苯甲酸酯、各種酸酐、酚-酚醛清漆樹脂及甲酚-酚醛清漆樹脂,但是本揭示文容並不限於這些化合物之使用。
可使用之交聯劑的其它實施例描述在美國專利第6,613,839號中且包括,例如具有分子量(Mw
)在自1,500至50,000範圍內且超過15%之酸酐含量之苯乙烯與順丁烯二酸酐的共聚物。
可用於文中揭示之組成物中的其它組份包括固化觸媒。固化觸媒之實例包括咪唑衍生物、第三胺、及有機金屬鹽。此等固化觸媒之其它實例包括自由基起始劑,諸如偶氮化合物,其包括偶氮異丁腈,及有機過氧化物,諸如過氧苯甲酸第三-丁酯、過氧辛酸第三-丁酯、及過氧化苯甲醯;過氧化甲基乙基酮、乙醯乙酸過氧化物、氫過氧化異丙苯、氫過氧化環己酮、過氧化二異丙苯、及其等之混合物。過氧化甲基乙基酮及過氧化苯甲醯較佳用於本發明中。
在某些實施例中,固化劑可包括第一與第二聚胺及彼等之加成物、酸酐、及聚醯胺。例如多官能基胺可包括脂肪族胺化合物,諸如二乙三胺(得自The Dow Chemical Company,Midland,Michigan之D.E.H. 20)、三乙四胺(得自The Dow Chemical Company,Midland,Michigan之D.E.H. 24)、四乙五胺(得自The Dow Chemical Company,Midland,Michigan之D.E.H. 26)、以及上述胺與環氧樹脂、稀釋劑或其它胺反應性化合物之加成物。亦可使用芳香族胺,諸如間苯二胺及二胺二苯基碸;脂肪族聚胺,諸如胺基乙基哌及聚乙聚胺;及芳香族聚胺,諸如間苯二胺、二胺基二苯基碸、及二乙基甲苯二胺。
酸酐固化劑可尤其包括,例如耐地酸(nadic)甲基酸酐、六氫酞酸酐、苯三甲酸酐、十二烯基琥酸酐、酞酸酐、甲基六氫酞酸酐、四氫酞酸酐、及甲基四氫酞酸酐。酸酐固化劑亦可包括苯乙烯及順丁烯二酸酐及如美國專利第6,613,839號中所述之其它酸酐的共聚物,該專利案在此併入本案以為參考資料。
在某些實施例中,該酚型酚醛清漆硬化劑可含有聯苯基或萘基分子團。該酚系羥基可連接至該化合物之聯苯基或萘基分子團。可,例如根據EP915118A1中所述之方法以製備本硬化劑類型。例如可藉使酚與雙甲氧基-亞甲基聯苯反應而製成含聯苯基分子團之硬化劑。
在其它實施例中,固化劑可包括三氟化硼單乙胺、及二胺基環己烷。固化劑亦可包括咪唑、其鹽、及加成物。於室溫下,這些環氧固化劑典型上為固體。合適的咪唑固化劑實例包括2-苯基咪唑;其它合適的咪唑固化劑描述在EP906927A1中。其它固化劑包括芳香族胺、脂肪族胺、酸酐、及酚。
在某些實施例中,該等固化劑可以是每一胺基具有至高500之分子量的胺基化合物,諸如芳香族胺或胍衍生物。胺基固化劑之實例包括4-氯苯基-N,N-二甲基-脲及3,4-二氯苯基-N,N-二甲基-脲。
可用於文中揭示之實施例的固化劑之其它實例包括:3,3’-及4,4’-二胺基二苯基碸;亞甲二苯胺;雙(4-胺基-3,5-二甲基苯基)-1,4-二異丙基苯,其係以品名EPON 1062得自Shell Chemical Co.;及雙(4-胺基苯基)-1,4-二異丙基苯,其係以品名EPON 1061得自Shell Chemical Co。
亦可使用用於環氧化合物之硫醇固化劑,且其係描述在,例如美國專利第5,374,668號中。如文中使用,“硫醇”亦包括聚硫醇(polythiol或polymercaptan)固化劑。硫醇實例包括脂肪族硫醇,諸如甲二硫醇、丙二硫醇、環己二硫醇、2-巰基乙基-2,3-二巰基琥珀酸酯、2,3-二巰基-1-丙醇(2-巰基乙酸酯)、二乙二醇雙(2-巰基乙酸酯)、1,2-二巰基丙基甲基醚、雙(2-巰基乙基)醚、三羥甲基丙烷三(巰基乙酸酯)、異戊四醇四(巰基丙酸酯)、異戊四醇四(巰基乙酸酯)、乙二醇二巰基乙酸酯、三羥甲基丙烷三(β-硫丙酸酯)、丙氧化烷之三-縮水甘油醚的三-硫醇衍生物、及二異戊四醇聚(β-硫丙酸酯);該等脂肪族硫醇之經鹵素取代衍生物;芳香族硫醇,諸如二-、三-或四-巰基苯、雙-、三-或四-(巰基烷基)苯、二巰基聯苯基、甲苯二硫醇及萘二硫醇;該等芳香族硫醇之經鹵素取代衍生物;含雜環族環之硫醇,諸如胺基-4,6-二硫醇-對稱-三、芳氧基、4,6-二硫醇、對稱-三及1,3,5-三(3-巰基丙基)異三聚氰酸酯;該等含雜環族環之硫醇的經鹵素取代衍生物;具有至少兩個巰基及含有非該等巰基之硫原子的硫醇化合物,諸如雙-、三-或四(巰基烷硫基)苯、雙-、三-或四(巰基烷硫基)烷、雙(巰基烷基)二硫化物、羥烷基硫化雙(巰基丙酸酯)、羥烷基硫化雙(巰基乙酸酯)、巰基乙基醚雙(巰基丙酸酯)、1,4-二噻烷-2,5-二硫雙(巰基乙酸酯)、硫二羥乙酸雙(巰基烷酯)、硫二丙酸雙(2-巰基烷酯)、4,4-硫丁酸雙(2-巰基烷酯)、3,4-噻吩二硫醇、試鉍硫醇(bismuththiol)及2,5-二巰基-1,3,4-噻二唑。
該固化劑亦可以是親核性物質,諸如胺、第三膦、具有一個親核性陰離子之第四銨鹽、具有一個親核性陰離子之第四鏻鹽、咪唑、具有一個親核性陰離子之第三鉮鹽、及具有一個親核性陰離子之第三鋶鹽。
亦可使用藉使用環氧樹脂、丙烯腈或(甲基)丙烯酸酯進行加成反應而改質之脂肪族聚胺作為固化劑。此外,可使用各種曼尼克(Mannich)鹼。亦可使用其中該等胺基係直接連接至芳香族環之芳香族胺。
可作為文中揭示之實施例中之硬化劑的具有一個親核性陰離子之第四銨鹽可包括氯化四乙銨、乙酸四丙銨、溴化己基三甲銨、氰化芐基三甲銨、疊氮化鯨蠟基三乙銨、氰酸N,N-二甲基吡咯錠、酚酸N-甲基吡錠、氯化N-甲基-鄰-氯吡錠、二氯化甲基紫精(viologen)等。
在某些實施例中,可使用至少一種陽離子光起始劑。陽離子光起始劑包括當接觸特定波長或波長範圍之電磁輻射時可分解以形成可催化,諸如環氧基與羥基之聚合反應之陽離子種類的化合物。該等陽離子種類亦可催化該可固化組成物內所含之環氧基與其它環氧化物反應性種類(諸如其它羥基、胺基、酚系基團、巰基、酸酐基、羧酸基等)之反應。陽離子光起始劑之實例包括二芳基錪鹽及三芳基鋶鹽。例如二芳基錪鹽型之光起始劑係以品名IRGACURE 250得自Ciba-Geigy。三芳基鋶型之光起始劑係以品名CYRACURE 6992得自The Dow Chemical Company。可使用催化有效量之該陽離子光起始劑且其含量佔該可固化組成物之約10重量%。
在某些實施例中,可使用觸媒以促進該環氧樹脂組份與固化劑或硬化劑(其包括二氰二醯胺及上述酚系硬化劑)之反應。觸媒可包括路易斯酸,例如三氟化硼,最好為具有胺,諸如哌啶或甲基乙胺之衍生物。觸媒亦可以具鹼性,諸如咪唑或胺。其它觸媒可包括其它金屬鹵化物路易斯酸,其包括氯化錫、氯化鋅等;金屬羧酸鹽,諸如辛酸亞錫等;苄基二甲胺;二甲基二胺基甲基酚;及胺,諸如三乙胺、咪唑衍生物等。
第三胺觸媒描述在,例如美國專利第5,385,990號中,該專利在此併入本案以為參考資料。第三胺之實例包括甲基二乙醇胺、三乙醇胺、二乙基胺基丙胺、芐基二甲胺、間-苯二甲基二(二甲胺)、N,N’-二甲基哌、N-甲基吡咯啶、N-甲基羥基哌啶、N,N,N’,N’-四甲基二胺基乙烷、N,N,N’,N’,N’-五甲基二乙三胺、三丁胺、三甲胺、二乙基癸胺、三乙二胺、N-甲基嗎啉、N,N,N’,N’-四甲基丙二胺、N-甲基哌啶、N,N’-二甲基-1,3-(4-哌啶基)丙烷、吡啶等。其它第三胺包括1,8-重氮雙環氧[5.4.0]十一-7-烯、1,8-二吖雙環[2.2.2]辛烷、4-二甲胺基吡啶、4-(N-吡咯啶基)吡啶、三乙胺及2,4,6-三(二甲胺基甲基)酚。
如上述,文中所述之樹脂組成物可用於含有溴化及非溴化阻燃劑之調配物中。溴化添加劑之特定實例包括四溴化雙酚A(TBBA)及衍生自以下之材料:TBBA-二縮水甘油醚;雙酚A或TBBA與TBBA-二縮水甘油醚之反應產物;及雙酚A二縮水甘油醚與TBBA之反應產物。
非溴化阻燃劑包括衍生自DOP(9,10-二氫-9-氧雜-10-膦菲10-氧化物之各種材料,諸如DOP-氫醌(10-(2’,5’-二羥苯基)-9,10-二氫-9-氧雜-10-膦菲10-氧化物)、DOP與酚醛清漆之縮水甘油醚衍生物的縮合產物、及無機阻燃劑,諸如鋁三水合物及次膦酸鋁。
文中揭示之可固化及熱固性組成物可選擇性包括習知添加劑及填料。添加劑及填料可尤其包括,例如其它阻燃劑、硼酸、氧化矽、玻璃、滑石、金屬粉末、二氧化鈦、潤濕劑、顏料、著色劑、脫模劑、偶合劑、離子清除劑、紫外線安定劑、增靭劑、靭化劑、及賦黏劑。添加劑及填料亦可包括發煙氧化矽;凝聚體,諸如玻璃珠;聚四氟乙烯;多元醇樹脂;聚酯樹脂;酚系樹脂;石墨;二硫化鉬;研磨顏料;減黏劑;氮化硼;雲母;成核劑;及安定劑。在添加至該環氧樹脂組成物前,可預熱填料及改質劑以驅除濕氣。另外,在固化前及/或後,這些視需要選用之添加劑可對該組成物之性質具有影響,且當調配該組成物及所欲反應產物時,應該考慮該影響。文中揭示之可固化組成物亦可選擇性含有習用類型之其它添加物,其包括,例如安定劑、其它有機或無機添加劑、顏料、潤濕劑、調流劑、紫外線阻隔劑、及螢光添加劑。在某些實施例中,這些添加劑之存在量為自0至5重量%、且在其它實施例中,小於3重量%。合適添加劑之實例亦描述在美國專利第5,066,735號及PCT/US2005/017954中。
在某些實施例中可使用有機溶劑,其包括酮,諸如甲基乙基酮(MEK);乙二醇醚,諸如丙二醇甲基醚;及醇,諸如甲醇。在某些實施例中,若必要,亦可使用微量之高分子量的相當非揮發性一元醇、多元醇、及其它環氧-或異氰酸基-反應性稀釋劑以作為文中揭示之該等可固化及熱固性組成物中之增塑劑。
可藉合併含磷酚系硬化劑或其溶液與如上述之二氰二醯胺而形成硬化劑組成物。可藉合併環氧樹脂及該硬化劑組成物、與另外硬化劑、添加劑、觸媒、及其它可視需要選用之組份而形成文中揭示之可固化組成物。例如在某些實施例中,可藉在不使用觸媒之情況下,摻合環氧樹脂組成物及二氰二醯胺硬化劑組成物以形成可固化組成物之混合物。該環氧樹脂與硬化劑之性質可部份取決於欲製備可固化組成物或經固化組成物所欲之性質、該組成物之所欲固化反應、及該組成物之所欲貯存安定性(所欲保存時間)。在其它實施例中,一形成可固化組成物之方法可包括以下步驟中之一或多種:形成環氧樹脂或預聚物組成物、摻合二氰二醯胺硬化劑、摻合另外硬化劑或觸媒、摻合阻燃劑、及摻合添加物。
在某些實施例中,以該可固化組成物之重量計,該環氧樹脂可存在於該可固化組成物內之含量範圍為自0.1至99重量%。在其它實施例中,該環氧組成物之含量範圍為自0.1至50重量%;在其它實施例中為自15至45重量%;且在又其它實施例中為自25至40重量%。在其它實施例中,以該可固化組成物之重量計,該環氧組成物之含量範圍為自30至99重量%;在其它實施例中為自50至99重量%;在其它實施例中為自60至95重量%;且在又其它實施例中為自70至90重量%。
在某些實施例中,可固化組成物可包括自約30至約98體積%環氧樹脂。在其它實施例中,可固化組成物可包括65至95體積%環氧樹脂;在其它實施例中包括自70至90體積%環氧樹脂;在其它實施例中包括自30至65體積%環氧樹脂;且在又其它實施例中包括自40至60體積%環氧樹脂。
在某些實施例中,可存在於該可固化組成物內之二氰二醯胺-酚系硬化劑混合物的含量範圍為自0.01重量%至60重量%。在其它實施例中,該二氰二醯胺硬化劑溶液之存在量範圍為自0.1重量%至55重量%;在其它實施例中為0.5重量%至50重量%;且在其它實施例中為自1至45重量%。
在某些實施例中,可存在於該可固化組成物內之觸媒含量範圍為自0.01重量%至10重量%。在其它實施例中,該觸媒之存在量範圍為自0.1重量%至8重量%;在其它實施例中為自0.5重量%至6重量%;且在又其它實施例中為自1至4重量%。
在一些實施例中,文中所述之可固化組成物可包括:30至99重量%環氧樹脂、0.01至5重量%二氰二醯胺;1至40重量%該含磷酚系硬化劑;及0至30重量%含醇、酮、及乙二醇醚中之至少一種的溶劑;其中該重量%係以該酚系硬化劑、二氰二醯胺、環氧樹脂、及溶劑之合併重量為基準計。
在某些實施例中,另外硬化劑亦可以與文中所述之該等環氧組成物摻合。用以選擇另外硬化劑及該另外硬化劑之數量的考慮變數可包括,例如該樹脂組成物之性質、該經固化組成物之所欲性質(可撓性、電性質等)、所欲固化速率、以及每一分子之活性基團數,諸如胺中之活性氫數。在某些實施例中,所使用該另外硬化劑含量可自每百份樹脂組成物之0.1至150重量份不等。在其它實施例中,該另外硬化劑之使用量範圍可以是每百份樹脂組成物之自1至95重量份;在其它實施例中,該硬化劑之使用量範圍可以是每百份樹脂組成物之自2.5至90重量份;且在又其它實施例中,為每百份樹脂組成物之自5至85重量份。
在某些實施例中,可固化組成物亦可包括自約0.1至約50體積%視需要選用之添加物。在其它實施例中,可固化組成物可包括自約0.1至約5體積%視需要選用之添加物;且在又其它實施例中,為自約0.5至約2.5體積%視需要選用之添加劑。
可將上述該等可固化組成物配置在基片上並固化。該基片並未特別受限。因此,基片可包括金屬,諸如不銹鋼、鐵、鋼、銅、鋅、錫、鋁、氧皮鋁(alumite)等;此等金屬之合金、及經此等金屬電鍍之薄片、與此等金屬之層合薄片。基片亦可包括聚合物、玻璃、及各種纖維,諸如碳/石墨;硼;石英;氧化鋁;玻璃,諸如E玻璃、S玻璃、S-2或C玻璃;及碳化矽或含鈦之碳化矽纖維。市售纖維可包括:有機纖維,諸如得自DuPont之KEVLAR;含氧化鋁之纖維,諸如得自3M之NEXTEL纖維;碳化矽纖維,諸如得自Nippon Carbon之NICALON;及含鈦之碳化矽纖維,諸如得自Ube之TYRRANO。在特定實施例中,該等可固化組成物可用以形成電路板或印刷電路板之至少一部份。在某些實施例中,該基片可經相容劑塗覆蓋以改善該可固化或經固化組成物對該基片之黏著性。
在某些實施例中,可藉固化文中揭示之該等可固化組成物而形成複合材料。在其它實施例中,可藉施加可固化組成物至基片或強化材料而形成複合材料,其係,諸如藉浸漬或塗覆該基片或強化材料,並固化該可固化組成物。
上述可固化組成物可以呈粉末、漿體或液體之形式。如上述之可固化組成物業經製成後,可在該可固化組成物固化前、期間或後,配置在上述基片上、內或其間。
例如可藉使用可固化組成物塗覆基片而形成複合材料。可藉各種程序,其包括噴塗法、簾幕式流動塗覆法、使用滾輪塗佈機或凹板塗佈機之塗覆法、刷塗法、及浸塗法或浸沒塗覆法而進行塗覆。
在各種實施例中,該基片可以是單層或多層。例如該基片可以是包括,例如含有兩合金之複合材料、多層狀聚合物件、及塗金屬之聚合物。在其它各種實施例中,該可固化組成物之一或多層可配置在基片上或內。文中亦涵蓋藉基片層與可固化組成物層而形成之其它多層複合材料。
在某些實施例中,可局部進行該可固化組成物之加熱,以避免,例如熱敏性基片之過熱。在其它實施例中,該加熱可包括將該基片及可固化組成物加熱。
根據該樹脂組成物、硬化劑、及若使用之觸媒,文中揭示之該等可固化組成物的固化可需要至少約30℃、至高約250℃之溫度,費時數分鐘至高數小時。在其它實施例中,可以於至少100℃之溫度下進行固化,費時數分鐘至高數小時。亦可使用後處理法,此等後處理法通常係於介於約100℃與200℃間之溫度下進行。
在某些實施例中,可分段進行固化以防止放熱,例如分段固化之步驟包括於一溫度下固化一段時間,繼而於更高溫度下固化一段時間。分段固化可包括2或多固化步驟,且在某些實施例中可以在約180℃以下之溫度下進行,且在其它實施例中可以在約150℃以下之溫度下進行。
在某些實施例中,固化溫度之範圍可以自30℃、40℃、50℃、60℃、70℃、80℃、90℃、100℃、110℃、120℃、130℃、140℃、150℃、160℃、170℃或180℃之下限至250℃、240℃、230℃、220℃、210℃、200℃、190℃、180℃、170℃、160℃之上限,其中該範圍可以自任何下限至任何上限。
文中描述之該等可固化組成物及複合材料可作為黏著劑、結構及電用層板、塗料、鑄件、用於航太工業之結構體、及用於電子工業及其它應用之電路板等。文中揭示之該等可固化組成物亦可特別用於以下應用中:電用清漆、封裝材料、半導體、通用模製粉末、長絲纏繞管、貯存槽、用於泵之襯墊、及抗蝕塗料。在特定實施例中,文中描述之該等可固化組成物可用於形成類似如美國專利第6,432,541號中所述之塗樹脂箔,該專利案在此併入本案以為參考資料。
可使用各種加工技術以形成含有文中所揭示之以環氧
為主的組成物之複合材料。例如長絲纏繞法、溶劑預漬法、及拉擠成形法為可使用未經固化之環氧樹脂的典型加工技術。而且,呈束形式之纖維可經該未經固化之環氧樹脂組成物塗覆,藉長絲纏繞法而搓編,並固化以形成複合材料。
文中描述之該等環氧樹脂組成物及複合材料可作為黏著劑、結構及電用層板、塗料、鑄件、用於航太工業之結構體、作為用於電子工業之電路板等、以及用以形成滑雪板、雪杖、釣桿、及其它戶外運動設備。文中揭示之該等環氧組成物亦可特別用於電用清漆、封裝材料、半導體、通用模製粉末、長絲纏繞管、貯存槽、用於泵之襯墊、及抗蝕塗料中。
含磷酚系硬化劑溶液之製法如下。將580克DOP(9,10-二氫-9-氧雜-10-膦菲10-氧化物)及560克PHENODUR PR 411(可由市販通路購自UCB集團或旗下之UCB GmbH & Co.KG,前者總部在比利時布魯賽爾,後者位於德國)一起混合並裝入配備機械攪拌器、加熱套、氮氣入口管、冷凝器及溶劑收集器之1升玻璃反應器內。自室溫至約150℃逐步加熱該混合物以進行乙醇之可控性蒸發,在溶劑收集器內收集丁醇。然後於150℃下維持該反應混合物,費時約5小時。緩慢添加經收集凝液(丁醇)及DOWANOL PM至該反應器內以將該等反應器內容物冷卻至約60℃並將該反應混合物稀釋至約55重量%固體。
硬化劑溶液A之製法為於40℃之溫度下使2.4份二氰二醯胺溶解在66.9份該酚系硬化劑溶液內。於60℃下攪拌該混合物,費時至少60分鐘,直到獲得均質溶液為止。然後將該溶液冷卻至室溫以形成清澈均質溶液。
然後於室溫下,藉摻合69.3份硬化劑溶液A與3.15份硼酸溶液(硼酸在甲醇中之20重量%溶液)、8份2-苯基咪唑溶液(固體在甲醇中之20重量%溶液)及74.6份酚環氧型酚醛清漆(85重量% D.E.N.®
438。15重量% DOWANOL PM),費時2小時而形成可固化組成物之均質溶液。如藉根據IPC方法IPC-TM-650 2.3.18,在171℃熱板上進行之衝擊固化(stroke cure)方法所測定,於171℃下所形成可固化組成物之膠化時間為214秒。
硬化劑溶液B之製法為於40℃之溫度下,使2.4份二氰二醯胺溶解在9.6份二甲基甲醯胺(DMF)內,於室溫下攪拌該混合物,費時30分鐘,並冷卻以形成於室溫下具有20重量%固體含量之清澈均質溶液。
然後於室溫下藉摻合12份硬化劑溶液B及3.15份硼酸溶液(硼酸在甲醇內之20重量%溶液)、8份2-苯基咪唑溶液(固體在甲醇內之20重量%溶液)與74.6份酚環氧基酚醛清漆(85重量% D.E.N.®
438。15重量% DOWANOL PM)以形成可固化組成物之均質溶液。於170℃所形成可固化組成物之膠化時間為233秒。
測定該等可固化組成物(實例1及比較例1)及自該等可
固化組成物所製成之層合物的各種性質,其包括半固化片膠化時間、最低熔體黏度、玻璃轉化溫度(Tg
)、降解溫度(Td
)、T 288、及UL 94等級。藉於200℃下以2層之銅箔外層壓製8層半固化片而製成層合物。
使用IPC Method IPC-TM-650 2.4.25以差示掃描式量熱法(DSC)測定玻璃轉化溫度。使用熱重量分析法(TGA)測定降解溫度,其中該降解溫度係使用熱重量分析儀(TGA),根據IPC Method IPC-TM-650 2.4.24.6以該試樣之5%重量損失記錄該降解溫度。該T288為於288℃下該層合物降解所需之最低時間,且其係根據IPC Method IPC-TM-650 2.4.24.1使用熱機械分析議(TMA)以在空氣中10℃/分鐘之速率測定。該熔體黏度係根據ASTM D445方法使用Ebrecht錐形體及平板黏度計測定。在表1內比較該等可固化組成物之性質。
如表1內之結果所示,可在不使用DMF之情況下利用二氰二醯胺以形成具有合適性質之可固化組成物。此外,可能由於該半固化片中所殘留之DMF溶劑導致經固化組成物之增塑作用,所以自試樣1所形成之層合物的玻璃轉化溫度高於比較試樣1。
如上述,文中揭示之環氧樹脂組成物可包括作為固化劑之二氰二醯胺,其中用於該二氰二醯胺之溶劑包括含磷酚系硬化劑或含磷酚系硬化劑之溶液。此等環氧樹脂組成物提供可使用以下溶劑之替代抉擇:諸如DMF、NMP、DMSO,及其它毒性溶劑、高沸點溶劑、或不適用於低殘留溶劑之應用的其它溶劑。這些環氧樹脂組成物可用以形成,諸如用於電用層板、塗料、複合材料、電子封裝材料、及電路板與其它應用之可固化組成物及熱固性組成物。有利的是,文中揭示之實施例可提供自該等樹脂組成物形成之無DMF熱固性組成物,其中該熱固性組成物兼具高分解溫度及高玻璃轉化溫度。另外,當作為塗料、填料等時,該等樹脂組成物可具有能使孔隙、劣纖維潤濕性、及劣半固化片外觀中之至少一項減至最低的黏度。
雖然該揭示文包括有限之實施例數,根據本揭示文之優點,熟悉本項技藝者可知只要不違背本揭示文之範圍,可設計其它實施例。因此,該範圍應該僅受限於以下附加申請專利範圍。
Claims (17)
- 一種均質溶液,其包含:二氰二醯胺;及具有以下通式之酚系硬化劑:
- 如申請專利範圍第1項之溶液,其進一步包括含醇、酮、及乙二醇醚中之至少一種的溶劑。
- 如申請專利範圍第2項之溶液,其中該醇包含丁醇。
- 如申請專利範圍第2-3項中任一項之溶液,其中該酮包含甲基乙基酮。
- 如申請專利範圍第2項之溶液,其中該乙二醇醚包含丙二醇甲基醚。
- 如申請專利範圍第1-2項中任一項之溶液,其進一步包含咪唑觸媒。
- 如申請專利範圍第1-2項中任一項之溶液,其進一步包含至少一選自由酚型酚醛清漆、雙酚A酚醛清漆、及甲 酚型酚醛清漆所組成之群組的另外硬化劑。
- 如申請專利範圍第2項之溶液,其中該溶液包含:1至60重量%之該酚系硬化劑;1至20重量%之該二氰二醯胺;及5至30重量%之該溶劑;其中所予之重量%係以該酚系硬化劑、二氰二醯胺、及溶劑之合併重量為基準計。
- 一種可固化組成物,其包含申請專利範圍第1項之溶液、及環氧樹脂。
- 如申請專利範圍第9項之可固化組成物,其中該組成物包含:30至95重量%之該環氧樹脂;0.01至5重量%之該二氰二醯胺;1至40重量%之該酚系硬化劑;及0至30重量%之含醇、酮、及乙二醇醚中之至少一種的溶劑;其中所予重量%係以該酚系硬化劑、二氰二醯胺、環氧樹脂、及溶劑之合併重量為基準計。
- 如申請專利範圍第9-10項中任一項之組成物,其中該環氧樹脂包括含環氧末端性聚唑啶酮化合物。
- 如申請專利範圍第11項之組成物,其中該含環氧末端性聚唑啶酮化合物包含聚環氧化合物與聚異氰酸酯化合物之反應產物。
- 一種熱固性樹脂,其包含以下組份之反應產物: 環氧樹脂;及一硬化劑組成物,其包含:二氰二醯胺;及具有以下通式之酚系硬化劑:
- 一種用於形成二氰二醯胺硬化劑組成物之方法,其包括:摻合二氰二醯胺及具有以下通式之酚系硬化劑:
- 如申請專利範圍第14項之方法,其進一步包括摻合含醇、酮、及乙二醇醚中之至少一種的溶劑、及該二氰二醯胺與酚系硬化劑中之至少一種。
- 一種用於形成含二氰二醯胺可固化組成物之方法,其包括:摻合二氰二醯胺及酚系硬化劑以形成硬化劑組成物,其中該酚系硬化劑具有以下通式:
- 一種用於形成一熱固性樹脂之方法,其包括:如申請專利範圍第16項之用於形成含二氰二醯胺可固化組成物之方法;及固化該含二氰二醯胺可固化組成物以形成一熱固性樹脂。
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