JP5530458B2 - エポキシ樹脂のための金属安定剤 - Google Patents
エポキシ樹脂のための金属安定剤 Download PDFInfo
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- JP5530458B2 JP5530458B2 JP2011543959A JP2011543959A JP5530458B2 JP 5530458 B2 JP5530458 B2 JP 5530458B2 JP 2011543959 A JP2011543959 A JP 2011543959A JP 2011543959 A JP2011543959 A JP 2011543959A JP 5530458 B2 JP5530458 B2 JP 5530458B2
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/249—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs characterised by the additives used in the prepolymer mixture
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- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/014—Stabilisers against oxidation, heat, light or ozone
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- C08K3/10—Metal compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/005—Stabilisers against oxidation, heat, light, ozone
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0091—Complexes with metal-heteroatom-bonds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
- C08K5/098—Metal salts of carboxylic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/39—Thiocarbamic acids; Derivatives thereof, e.g. dithiocarbamates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/16—Halogen-containing compounds
- C08K2003/168—Zinc halides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/32—Phosphorus-containing compounds
- C08K2003/321—Phosphates
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/387—Borates
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Wood Science & Technology (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Laminated Bodies (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Description
ガラス転移温度(Tg)は、非晶質の固体が硬いガラス様状態からゴム様状態に移行する温度である。Tgが示差走査熱量測定法(DSC)によって求められる(IPC方法IPC−TM−650 2.4.25)。
125部量のD.E.R.(商標)592−A80(アセトンにおいて80重量パーセントの固形分の、オキサゾリジノン複素環を含有する臭素化エポキシ樹脂、100部の固形分)、36.25部のジシアンジアミド(N,N−ジメチルホルムアミド(DMF)/Dowanol(商標)PM=50wt%/50wt%において8重量パーセントの固形分)を混合し、30分間振とうして、均一な溶液を得た。その後、この溶液に、様々な亜鉛含有安定剤を加えた。これらの安定剤が表Iに示される。安定剤を加えた後、混合物を振とう機により10分間激しく振とうした。不透明な懸濁物が、Zn(acac)2(濁った溶液)及びZn(ステアラート)2(可溶性)を除いて、これらの安定剤について得られた。
ワニスを下記のように調製した:125部量のD.E.R.(商標)539−A80(アセトンにおいて80重量パーセントの固形分、100部の固形分)及び37.5部のジシアンジアミド溶液(DMF/PM=50wt%/50wt%において8重量パーセントの固形分)を混合し、30分間振とうして、均一な溶液を得た。この溶液に4部のジメチルジチオカルバミン酸亜鉛(ジラム)粉末を加え、混合物を振とう機により10分間激しく振とうして、澄んだ透明な溶液を得た。このワニスから得られる硬化樹脂のTdが309℃である。
本手順をドライボックス中で行った。手順は下記の通りである:20mLのシンチレーションバイアルに、1.02グラムの事前に乾燥したフェノールノボラック(ReziCure(登録商標)3026、SI Group,Inc.から得られる)及び5mLの無水テトラヒドロフランを加えた。サンプルは、溶解するまで撹拌することができ、溶解したとき、ジエチル亜鉛のヘキサン(hexanes)における1.2M溶液の1.5mLを、絶え間ない撹拌とともに滴下により加えた。白色の固体が1分後に形成し、反応混合物は、完全な反応を保証するためにさらに90分間撹拌し続けることができた。溶媒を減圧下で除いて、1.74グラムの白色固体(亜鉛フェナート)を得た。ワニスの配合では、それぞれの成分を混合し、生じた混合物を示されるような期間にわたって振とうすることが伴った。ワニスの特性を試験した。3つの別個の温浸物(反応が確実に生じるために与えられた時間の量)を試験した。結果が下記の表VIに示される。
Claims (24)
- a)エポキシ樹脂、
b)硬化剤、及び
c)酸化亜鉛および、ジメチルジチオカルバミン酸亜鉛からなる群から選択される金属含有化合物を含む安定剤
を含み、前記安定剤が、前記組成物の総重量に基づいて1重量パーセント〜20重量パーセントの範囲における量で前記組成物に存在する組成物であって、ハロゲン含有化合物から調製される組成物。 - 溶媒を0.5wt%〜95wt%の範囲における量でさらに含む、請求項1に記載の組成物。
- タルク、シリカ、アルミナ及びそれらの組合せからなる群より選択される不活性なフィラーをさらに含む、請求項1に記載の組成物。
- 前記ハロゲン含有化合物が臭素含有化合物である、請求項1に記載の組成物。
- 前記臭素含有化合物が臭素化ポリフェノールである、請求項4に記載の組成物。
- 前記臭素化ポリフェノールが、テトラブロモビスフェノール−A(TBBA)及びテトラブロモビスフェノールFからなる群より選択される、請求項5に記載の組成物。
- 前記エポキシ樹脂が、グリシジルエーテルを、オキサゾリジノン成分を形成するためのビスフェノール化合物と接触させることによって製造される、請求項1に記載の組成物。
- 前記エポキシ樹脂が、グリシジルエーテルをビスフェノール化合物及びポリイソシアナートと接触させることによって製造される、請求項7に記載の組成物。
- 前記ビスフェノール化合物がビスフェノールAである、請求項7に記載の組成物。
- 前記ビスフェノール化合物がテトラブロモビスフェノールAである、請求項7に記載の組成物。
- 前記金属含有化合物が酸化亜鉛である、請求項1に記載の組成物。
- 前記酸化亜鉛が、前記エポキシ樹脂への酸化亜鉛前駆体の添加によって形成される、請求項11に記載の組成物。
- 前記酸化亜鉛前駆体が亜鉛フェナートである、請求項12に記載の組成物。
- 前記金属含有化合物がジメチルジチオカルバミン酸亜鉛である、請求項13に記載の組成物。
- 前記エポキシ樹脂が、フェノール樹脂、ベンゾキサジン樹脂、アリールシアナート樹脂、アリールトリアジン樹脂、マレイミド樹脂及びそれらの任意の2つ以上の組合せからなる群より選択される、請求項1に記載の組成物。
- 少なくとも1つの求核性窒素源を有し、供与結合が、前記金属と、前記求核性窒素源との間に形成される、請求項1に記載の組成物。
- 前記少なくとも1つの求核性窒素源が、イミダゾール系化合物、オキサゾリジノン系化合物、ジシアンジアミド及びそれらの組合せからなる群より選択される、請求項16に記載の組成物。
- 請求項1に記載される組成物から製造されるワニス。
- 請求項18に記載されるワニスから調製されるプレプレグ。
- 請求項18に記載されるワニスから調製される電気用積層物。
- 請求項18に記載されるワニスから調製される被覆。
- 請求項18に記載されるワニスから調製される複合物。
- 請求項18に記載されるワニスから調製される注入成形物。
- 請求項18に記載されるワニスから調製される接着剤。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2009/000013 WO2010078688A1 (en) | 2009-01-06 | 2009-01-06 | Metal stabilizers for epoxy resins |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014019934A Division JP5878568B2 (ja) | 2014-02-05 | 2014-02-05 | エポキシ樹脂のための金属安定剤 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2012514660A JP2012514660A (ja) | 2012-06-28 |
JP5530458B2 true JP5530458B2 (ja) | 2014-06-25 |
Family
ID=42316188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2011543959A Expired - Fee Related JP5530458B2 (ja) | 2009-01-06 | 2009-01-06 | エポキシ樹脂のための金属安定剤 |
Country Status (8)
Country | Link |
---|---|
US (2) | US20110257299A1 (ja) |
EP (1) | EP2385970B1 (ja) |
JP (1) | JP5530458B2 (ja) |
KR (1) | KR101567123B1 (ja) |
CN (1) | CN102272228B (ja) |
SG (1) | SG172873A1 (ja) |
TW (1) | TWI551633B (ja) |
WO (1) | WO2010078688A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20120040153A (ko) * | 2009-06-22 | 2012-04-26 | 다우 글로벌 테크놀로지스 엘엘씨 | 에폭시 수지용 경화제 조성물 |
JP5785111B2 (ja) * | 2012-02-15 | 2015-09-24 | Jx日鉱日石エネルギー株式会社 | 繊維強化複合材料 |
TWI465513B (zh) * | 2012-08-13 | 2014-12-21 | Taiwan Union Technology Corp | 樹脂組合物及其應用 |
EP2716692A1 (de) * | 2012-10-08 | 2014-04-09 | WKP Products SA | Verbundwerkstoffe zur Nutzung in Spritzguss-Verfahren |
CN103396742B (zh) * | 2013-08-05 | 2014-10-15 | 上海康达新能源材料有限公司 | 一种环氧胶膜 |
US10662304B2 (en) | 2013-12-31 | 2020-05-26 | Saint-Gobain Performance Plastics Corporation | Composites for protecting signal transmitters/receivers |
US9617373B2 (en) * | 2015-02-13 | 2017-04-11 | LCY Chemical Corp. | Curable resin composition, article, and method for fabricating the same |
CN107774545A (zh) * | 2017-10-30 | 2018-03-09 | 中石化重庆天然气管道有限责任公司 | 一种天然气长输管道防腐方法 |
EP3737725B1 (en) * | 2018-01-08 | 2023-03-01 | DDP Specialty Electronic Materials US, LLC | Epoxy resin adhesive compositions |
CN109054296B (zh) * | 2018-07-04 | 2020-12-04 | 法尔胜泓昇集团有限公司 | 一种表面带树脂肋的高强度碳纤维复合材料筋材及其制备方法 |
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US4975319A (en) * | 1988-07-14 | 1990-12-04 | General Electric Company | Printed circuit board from fibers impregnated with epoxy resin mixture, halogenated bisphenol and polyphenylene ether |
US4853423A (en) * | 1988-07-14 | 1989-08-01 | General Electric Company | Curable polyphenylene ether-polyepoxide compositions useful in printed circuit board production |
EP0375980A3 (en) * | 1988-12-29 | 1991-10-30 | International Business Machines Corporation | Epoxy composition of increased thermal conductivity and use thereof |
US5721323A (en) * | 1990-05-21 | 1998-02-24 | The Dow Chemical Company | Cure inhibited epoxy resin compositions and laminates prepared from the compositions |
US5095050A (en) * | 1990-11-21 | 1992-03-10 | The Dow Chemical Company | Advanced epoxy compositions, curable compositions and cured products |
JP3290449B2 (ja) * | 1991-08-19 | 2002-06-10 | 旭化成エポキシ株式会社 | エポキシ樹脂組成物 |
CA2126984A1 (en) * | 1992-01-28 | 1993-08-05 | Ha Q. Pham | Blends of epoxy resins phosphate esters of epoxy resins, curable compositions, coating compositions and cured and cured articles |
BR9305888A (pt) * | 1992-01-29 | 1997-08-19 | Dow Chemical Co | Composição de resina epoxi modificada composição curável composição de revestimento em pó composição adequada como agente de cura para resinas epóxi produto e artigo |
JPH09124904A (ja) * | 1995-10-30 | 1997-05-13 | Sumitomo Bakelite Co Ltd | 半導体封止用樹脂組成物 |
CA2343443C (en) * | 1998-09-10 | 2008-12-02 | The Dow Chemical Company | Polyols useful for preparing water blown rigid polyurethane foam |
TW572983B (en) * | 2001-07-19 | 2004-01-21 | Microcosm Technology Co Ltd | Method for producing substrate for flexible circuit board, and adhesive used by the method |
CN1206278C (zh) * | 2001-07-23 | 2005-06-15 | 帝人化成株式会社 | 热塑性树脂组合物、成形品及其制造方法 |
KR101143893B1 (ko) * | 2004-01-30 | 2012-05-11 | 미쓰이 가가쿠 가부시키가이샤 | 난연성 폴리아미드 조성물 및 그 용도 |
WO2008144252A1 (en) * | 2007-05-16 | 2008-11-27 | Dow Global Technologies Inc. | Flame retardant composition |
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2009
- 2009-01-06 JP JP2011543959A patent/JP5530458B2/ja not_active Expired - Fee Related
- 2009-01-06 US US13/127,567 patent/US20110257299A1/en not_active Abandoned
- 2009-01-06 KR KR1020117015497A patent/KR101567123B1/ko active IP Right Grant
- 2009-01-06 CN CN2009801536329A patent/CN102272228B/zh not_active Expired - Fee Related
- 2009-01-06 WO PCT/CN2009/000013 patent/WO2010078688A1/en active Application Filing
- 2009-01-06 EP EP09837247.7A patent/EP2385970B1/en not_active Not-in-force
- 2009-01-06 SG SG2011049251A patent/SG172873A1/en unknown
-
2010
- 2010-01-05 TW TW099100087A patent/TWI551633B/zh not_active IP Right Cessation
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2015
- 2015-07-15 US US14/800,274 patent/US20150319858A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
TWI551633B (zh) | 2016-10-01 |
KR20110112319A (ko) | 2011-10-12 |
CN102272228A (zh) | 2011-12-07 |
EP2385970B1 (en) | 2017-03-01 |
EP2385970A4 (en) | 2015-03-04 |
JP2012514660A (ja) | 2012-06-28 |
US20110257299A1 (en) | 2011-10-20 |
KR101567123B1 (ko) | 2015-11-06 |
WO2010078688A1 (en) | 2010-07-15 |
CN102272228B (zh) | 2013-04-17 |
EP2385970A1 (en) | 2011-11-16 |
US20150319858A1 (en) | 2015-11-05 |
SG172873A1 (en) | 2011-08-29 |
TW201035196A (en) | 2010-10-01 |
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