HK1151810A1 - Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins - Google Patents
Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resinsInfo
- Publication number
- HK1151810A1 HK1151810A1 HK11105989.9A HK11105989A HK1151810A1 HK 1151810 A1 HK1151810 A1 HK 1151810A1 HK 11105989 A HK11105989 A HK 11105989A HK 1151810 A1 HK1151810 A1 HK 1151810A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- dicyanadiamide
- dimethylformamide
- curing agent
- epoxy resins
- thermosetting epoxy
- Prior art date
Links
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 title abstract 2
- 239000003822 epoxy resin Substances 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 229920000647 polyepoxide Polymers 0.000 title abstract 2
- 239000003795 chemical substances by application Substances 0.000 title 1
- 238000009472 formulation Methods 0.000 title 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title 1
- 229920001187 thermosetting polymer Polymers 0.000 title 1
- 125000000217 alkyl group Chemical group 0.000 abstract 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/315—Compounds containing carbon-to-nitrogen triple bonds
- C08K5/3155—Dicyandiamide
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US99117507P | 2007-11-29 | 2007-11-29 | |
PCT/US2008/084161 WO2009070488A1 (en) | 2007-11-29 | 2008-11-20 | Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1151810A1 true HK1151810A1 (en) | 2012-02-10 |
Family
ID=40290743
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK11105989.9A HK1151810A1 (en) | 2007-11-29 | 2011-06-14 | Dimethylformamide-free formulations using dicyanadiamide as curing agent for thermosetting epoxy resins |
Country Status (9)
Country | Link |
---|---|
US (1) | US20100261837A1 (xx) |
EP (1) | EP2217637B1 (xx) |
JP (1) | JP2011505461A (xx) |
KR (1) | KR101150311B1 (xx) |
CN (1) | CN101925629B (xx) |
AT (1) | ATE509053T1 (xx) |
HK (1) | HK1151810A1 (xx) |
TW (1) | TWI452057B (xx) |
WO (1) | WO2009070488A1 (xx) |
Families Citing this family (18)
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US20110132646A1 (en) * | 2009-06-12 | 2011-06-09 | Icl-Ip America Inc. | Flame retardant epoxy resin composition, prepreg and laminate thereof |
WO2011011920A1 (en) * | 2009-07-31 | 2011-02-03 | Dow Global Technologies Inc. | Amine-phenolic dual cure hardener blend for resin compositions |
US20130126217A1 (en) * | 2010-04-23 | 2013-05-23 | Panasonic Corporation | Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board |
JP5961923B2 (ja) * | 2010-05-31 | 2016-08-03 | 日立化成株式会社 | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 |
EP2578613B8 (en) | 2010-05-31 | 2018-12-19 | Hitachi Chemical Company, Ltd. | Epoxy resin composition and pre-preg, support-provided resin film, metallic foil clad laminate plate and multilayer printed circuit board utilizing said composition |
JP5866806B2 (ja) * | 2010-05-31 | 2016-02-24 | 日立化成株式会社 | エポキシ樹脂組成物、このエポキシ樹脂組成物を用いたプリプレグ、支持体付き樹脂フィルム、金属箔張り積層板及び多層プリント配線板 |
JP5909693B2 (ja) * | 2010-11-24 | 2016-04-27 | パナソニックIpマネジメント株式会社 | 高耐熱性エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板 |
CN103429663B (zh) | 2010-12-28 | 2015-11-25 | 三井化学东赛璐株式会社 | 树脂组合物、含有其的保护膜、干膜、电路基板及多层电路基板 |
EP2744860B1 (en) * | 2011-08-18 | 2021-02-24 | Blue Cube IP LLC | Curable resin compositions |
JP2013087253A (ja) * | 2011-10-21 | 2013-05-13 | Panasonic Corp | エポキシ樹脂組成物、プリプレグ、金属張積層板およびプリント配線板 |
TWI513741B (zh) * | 2011-12-27 | 2015-12-21 | Nat Univ Chung Hsing | 新穎磷系雙酚a型酚醛樹脂及其製造方法與應用 |
US20160340468A1 (en) * | 2013-12-30 | 2016-11-24 | Blue Cube Ip Llc | Halogen free epoxy formulations with low dielectric constant |
US9650306B2 (en) * | 2014-04-17 | 2017-05-16 | Gary David McKnight | Compositions and methods comprising nitrification inhibitors containing a mixture of protic and aprotic solvent systems |
CN107227001B (zh) * | 2016-03-25 | 2019-06-14 | 广东生益科技股份有限公司 | 一种无卤热固性树脂组合物以及含有它的预浸料、层压板和印制电路板 |
KR20170132605A (ko) * | 2016-05-24 | 2017-12-04 | 주식회사 아모그린텍 | 절연성 방열 코팅조성물 및 이를 통해 형성된 절연성 방열유닛 |
CN106883377A (zh) * | 2017-03-23 | 2017-06-23 | 苏州顶裕节能设备有限公司 | 一种利用生产tmpta废水制备的固化剂及其方法 |
TWI671355B (zh) * | 2018-01-03 | 2019-09-11 | Taiwan Union Technology Corporation | 樹脂組合物,以及使用該組合物所製得之預浸漬片、金屬箔積層板、與印刷電路板 |
CN112724600A (zh) * | 2020-12-28 | 2021-04-30 | 陕西生益科技有限公司 | 一种热固性树脂组合物、包含其的预浸料、层压板及印制电路板 |
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US403220A (en) * | 1889-05-14 | Ments | ||
US2750395A (en) * | 1954-01-05 | 1956-06-12 | Union Carbide & Carbon Corp | Diepoxides |
US2890194A (en) * | 1956-05-24 | 1959-06-09 | Union Carbide Corp | Compositions of epoxides and polycarboxylic acid compounds |
US5066735A (en) * | 1987-11-16 | 1991-11-19 | The Dow Chemical Company | Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol |
GB8912952D0 (en) * | 1989-06-06 | 1989-07-26 | Dow Rheinmuenster | Epoxy-terminated polyoxazolidones,process for the preparation thereof and electrical laminates made from the epoxy-terminated polyoxazolidones |
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US5135993A (en) * | 1990-09-11 | 1992-08-04 | Dow Corning Corporation | High modulus silicones as toughening agents for epoxy resins |
DE4111418A1 (de) * | 1991-04-09 | 1992-10-15 | Schering Ag | Verfahren zur herstellung von faserverstaerkten traegermaterialien fuer den elektrosektor |
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TW593526B (en) * | 2001-09-20 | 2004-06-21 | Wangsuen Su Jen | Phosphorus group containing flame retardant hardener, advanced epoxy resins and cured epoxy resins thereof |
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CN103554184A (zh) * | 2004-05-28 | 2014-02-05 | 陶氏环球技术有限责任公司 | 可用于制造无卤素抗引燃聚合物的含磷化合物 |
EP1818350B1 (en) * | 2004-11-30 | 2012-10-03 | Panasonic Corporation | Epoxy resin composition for prepreg, prepreg, and multilayered printed wiring board |
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-
2008
- 2008-11-20 WO PCT/US2008/084161 patent/WO2009070488A1/en active Application Filing
- 2008-11-20 JP JP2010536068A patent/JP2011505461A/ja active Pending
- 2008-11-20 AT AT08854038T patent/ATE509053T1/de active
- 2008-11-20 CN CN2008801256395A patent/CN101925629B/zh not_active Expired - Fee Related
- 2008-11-20 KR KR1020107014274A patent/KR101150311B1/ko not_active IP Right Cessation
- 2008-11-20 EP EP08854038A patent/EP2217637B1/en not_active Not-in-force
- 2008-11-20 US US12/743,003 patent/US20100261837A1/en not_active Abandoned
- 2008-11-26 TW TW097145682A patent/TWI452057B/zh active
-
2011
- 2011-06-14 HK HK11105989.9A patent/HK1151810A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2009070488A1 (en) | 2009-06-04 |
KR20100100911A (ko) | 2010-09-15 |
EP2217637B1 (en) | 2011-05-11 |
JP2011505461A (ja) | 2011-02-24 |
CN101925629B (zh) | 2012-11-28 |
KR101150311B1 (ko) | 2012-06-11 |
TW200930740A (en) | 2009-07-16 |
TWI452057B (zh) | 2014-09-11 |
EP2217637A1 (en) | 2010-08-18 |
ATE509053T1 (de) | 2011-05-15 |
CN101925629A (zh) | 2010-12-22 |
US20100261837A1 (en) | 2010-10-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20161120 |