CN100483693C - 半导体封装及其制造方法 - Google Patents

半导体封装及其制造方法 Download PDF

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Publication number
CN100483693C
CN100483693C CNB2005100802253A CN200510080225A CN100483693C CN 100483693 C CN100483693 C CN 100483693C CN B2005100802253 A CNB2005100802253 A CN B2005100802253A CN 200510080225 A CN200510080225 A CN 200510080225A CN 100483693 C CN100483693 C CN 100483693C
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China
Prior art keywords
substrate
semiconductor
dielectric film
hole
pin
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Expired - Fee Related
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CNB2005100802253A
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English (en)
Chinese (zh)
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CN1716579A (zh
Inventor
冨田道和
末益龙夫
平船沙亚卡
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Fujikura Ltd
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Fujikura Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H10W76/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W20/023—
    • H10W20/0234—
    • H10W20/0242—
    • H10W72/0198—

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CNB2005100802253A 2004-06-30 2005-06-28 半导体封装及其制造方法 Expired - Fee Related CN100483693C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004194663A JP4271625B2 (ja) 2004-06-30 2004-06-30 半導体パッケージ及びその製造方法
JP2004194663 2004-06-30

Publications (2)

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CN1716579A CN1716579A (zh) 2006-01-04
CN100483693C true CN100483693C (zh) 2009-04-29

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CNB2005100802253A Expired - Fee Related CN100483693C (zh) 2004-06-30 2005-06-28 半导体封装及其制造方法

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US (2) US7274101B2 (enExample)
EP (1) EP1612867B1 (enExample)
JP (1) JP4271625B2 (enExample)
KR (1) KR100701531B1 (enExample)
CN (1) CN100483693C (enExample)
DE (1) DE602005014170D1 (enExample)

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CN106298712A (zh) * 2015-05-18 2017-01-04 成都艾德沃传感技术有限公司 一种传感器及传感器的制备方法

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JP5301108B2 (ja) * 2007-04-20 2013-09-25 セミコンダクター・コンポーネンツ・インダストリーズ・リミテッド・ライアビリティ・カンパニー 半導体装置
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JP4687742B2 (ja) * 2007-08-27 2011-05-25 株式会社デンソー 半導体装置の製造方法
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TWI489600B (zh) * 2011-12-28 2015-06-21 精材科技股份有限公司 半導體堆疊結構及其製法
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CN108496147A (zh) * 2016-01-29 2018-09-04 孙业扬 使用光传感器采集货架系统上商品库存数据
TWI649856B (zh) * 2016-05-13 2019-02-01 Xintec Inc. 晶片封裝體與其製造方法
CN107777657A (zh) * 2016-08-25 2018-03-09 中芯国际集成电路制造(上海)有限公司 一种mems器件及其制备方法和电子装置
TWI782830B (zh) * 2021-12-21 2022-11-01 勝麗國際股份有限公司 感測器封裝結構
CN114464540B (zh) * 2022-02-11 2025-01-28 展讯通信（上海）有限公司 元器件封装方法及元器件封装结构
CN118824956A (zh) * 2023-04-17 2024-10-22 Jcet星科金朋韩国有限公司 半导体封装条带和用于形成半导体器件的方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298712A (zh) * 2015-05-18 2017-01-04 成都艾德沃传感技术有限公司 一种传感器及传感器的制备方法
CN106298712B (zh) * 2015-05-18 2019-09-20 成都艾德沃传感技术有限公司 一种传感器及传感器的制备方法

Also Published As

Publication number Publication date
JP4271625B2 (ja) 2009-06-03
DE602005014170D1 (de) 2009-06-10
KR20060048559A (ko) 2006-05-18
EP1612867A3 (en) 2006-05-24
EP1612867A2 (en) 2006-01-04
US7274101B2 (en) 2007-09-25
JP2006019428A (ja) 2006-01-19
US7368321B2 (en) 2008-05-06
US20070264753A1 (en) 2007-11-15
CN1716579A (zh) 2006-01-04
US20060001147A1 (en) 2006-01-05
EP1612867B1 (en) 2009-04-29
KR100701531B1 (ko) 2007-03-29

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