CN100446202C - 晶片级封装与制作上盖结构的方法 - Google Patents
晶片级封装与制作上盖结构的方法 Download PDFInfo
- Publication number
- CN100446202C CN100446202C CNB2006100061867A CN200610006186A CN100446202C CN 100446202 C CN100446202 C CN 100446202C CN B2006100061867 A CNB2006100061867 A CN B2006100061867A CN 200610006186 A CN200610006186 A CN 200610006186A CN 100446202 C CN100446202 C CN 100446202C
- Authority
- CN
- China
- Prior art keywords
- wafer
- upper cover
- cover wafer
- depression
- patterning photoresist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 49
- 238000005538 encapsulation Methods 0.000 title claims abstract description 21
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 30
- 235000012431 wafers Nutrition 0.000 claims description 117
- 238000000059 patterning Methods 0.000 claims description 27
- 238000005520 cutting process Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000004568 cement Substances 0.000 claims description 2
- 230000005496 eutectics Effects 0.000 claims description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000010923 batch production Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229920002521 macromolecule Polymers 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000000708 deep reactive-ion etching Methods 0.000 description 1
- 238000011982 device technology Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 230000010412 perfusion Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16235—Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip
Landscapes
- Micromachines (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Pressure Sensors (AREA)
Abstract
Description
Claims (21)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100061867A CN100446202C (zh) | 2006-01-25 | 2006-01-25 | 晶片级封装与制作上盖结构的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100061867A CN100446202C (zh) | 2006-01-25 | 2006-01-25 | 晶片级封装与制作上盖结构的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101009233A CN101009233A (zh) | 2007-08-01 |
CN100446202C true CN100446202C (zh) | 2008-12-24 |
Family
ID=38697561
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100061867A Expired - Fee Related CN100446202C (zh) | 2006-01-25 | 2006-01-25 | 晶片级封装与制作上盖结构的方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100446202C (zh) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004037711A2 (en) * | 2002-10-23 | 2004-05-06 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
US20050023629A1 (en) * | 2003-07-31 | 2005-02-03 | Xiaoyi Ding | Wafer-level sealed microdevice having trench isolation and methods for making the same |
US20050073040A1 (en) * | 2003-10-01 | 2005-04-07 | Lee Joo Ho | Wafer level package for micro device and manufacturing method thereof |
US20060001147A1 (en) * | 2004-06-30 | 2006-01-05 | Fujikura Ltd. | Semiconductor package and method for manufacturing the same |
-
2006
- 2006-01-25 CN CNB2006100061867A patent/CN100446202C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2004037711A2 (en) * | 2002-10-23 | 2004-05-06 | Rutgers, The State University Of New Jersey | Processes for hermetically packaging wafer level microscopic structures |
US20040126953A1 (en) * | 2002-10-23 | 2004-07-01 | Cheung Kin P. | Processes for hermetically packaging wafer level microscopic structures |
US20050023629A1 (en) * | 2003-07-31 | 2005-02-03 | Xiaoyi Ding | Wafer-level sealed microdevice having trench isolation and methods for making the same |
US20050073040A1 (en) * | 2003-10-01 | 2005-04-07 | Lee Joo Ho | Wafer level package for micro device and manufacturing method thereof |
US20060001147A1 (en) * | 2004-06-30 | 2006-01-05 | Fujikura Ltd. | Semiconductor package and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
CN101009233A (zh) | 2007-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: CHINA TAIWAN GELEIMENG CO., LTD. Free format text: FORMER OWNER: TOUCH MICRO-SYSTEM TECHNOLOGY CORP. Effective date: 20140520 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20140520 Address after: Taiwan, Taipei, China three East Road, No. 170, 9 floor Patentee after: Chinese gredmann Taiwan Limited by Share Ltd Address before: China Taiwan Taoyuan County Patentee before: Touch Micro-System Technology Corp. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081224 Termination date: 20150125 |
|
EXPY | Termination of patent right or utility model |