KR100701531B1 - 반도체 패키지 및 그 제조방법 - Google Patents

반도체 패키지 및 그 제조방법 Download PDF

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Publication number
KR100701531B1
KR100701531B1 KR1020050055789A KR20050055789A KR100701531B1 KR 100701531 B1 KR100701531 B1 KR 100701531B1 KR 1020050055789 A KR1020050055789 A KR 1020050055789A KR 20050055789 A KR20050055789 A KR 20050055789A KR 100701531 B1 KR100701531 B1 KR 100701531B1
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South Korea
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insulating film
substrate
encapsulant
functional element
semiconductor substrate
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KR1020050055789A
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Korean (ko)
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KR20060048559A (ko
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미치카즈 도미타
다츠오 스에마스
사야카 히라후네
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가부시키가이샤후지쿠라
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H10W76/10—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H10W20/023—
    • H10W20/0234—
    • H10W20/0242—
    • H10W72/0198—

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Light Receiving Elements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
KR1020050055789A 2004-06-30 2005-06-27 반도체 패키지 및 그 제조방법 Expired - Fee Related KR100701531B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004194663A JP4271625B2 (ja) 2004-06-30 2004-06-30 半導体パッケージ及びその製造方法
JPJP-P-2004-00194663 2004-06-30

Publications (2)

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KR20060048559A KR20060048559A (ko) 2006-05-18
KR100701531B1 true KR100701531B1 (ko) 2007-03-29

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US (2) US7274101B2 (enExample)
EP (1) EP1612867B1 (enExample)
JP (1) JP4271625B2 (enExample)
KR (1) KR100701531B1 (enExample)
CN (1) CN100483693C (enExample)
DE (1) DE602005014170D1 (enExample)

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KR101608084B1 (ko) 2007-12-27 2016-03-31 스태츠 칩팩, 엘티디. 광학 센서를 구비한 반도체 소자 및 그 소자의 프론트 및 백사이드상에 상호접속 구조체를 형성하는 방법

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JP5344336B2 (ja) * 2008-02-27 2013-11-20 株式会社ザイキューブ 半導体装置
TWI384602B (zh) * 2008-06-13 2013-02-01 欣興電子股份有限公司 嵌埋有感光半導體晶片之封裝基板及其製法
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Publication number Priority date Publication date Assignee Title
KR101608084B1 (ko) 2007-12-27 2016-03-31 스태츠 칩팩, 엘티디. 광학 센서를 구비한 반도체 소자 및 그 소자의 프론트 및 백사이드상에 상호접속 구조체를 형성하는 방법

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Publication number Publication date
JP4271625B2 (ja) 2009-06-03
CN100483693C (zh) 2009-04-29
DE602005014170D1 (de) 2009-06-10
KR20060048559A (ko) 2006-05-18
EP1612867A3 (en) 2006-05-24
EP1612867A2 (en) 2006-01-04
US7274101B2 (en) 2007-09-25
JP2006019428A (ja) 2006-01-19
US7368321B2 (en) 2008-05-06
US20070264753A1 (en) 2007-11-15
CN1716579A (zh) 2006-01-04
US20060001147A1 (en) 2006-01-05
EP1612867B1 (en) 2009-04-29

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