CN100447988C - 半导体器件及其制造方法 - Google Patents
半导体器件及其制造方法 Download PDFInfo
- Publication number
- CN100447988C CN100447988C CNB2004100319070A CN200410031907A CN100447988C CN 100447988 C CN100447988 C CN 100447988C CN B2004100319070 A CNB2004100319070 A CN B2004100319070A CN 200410031907 A CN200410031907 A CN 200410031907A CN 100447988 C CN100447988 C CN 100447988C
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- Prior art keywords
- gate electrode
- field
- effect transistor
- semiconductor device
- memory
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- Expired - Lifetime
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66825—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a floating gate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H7/00—Processes or apparatus applicable to both electrical discharge machining and electrochemical machining
- B23H7/02—Wire-cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H11/00—Auxiliary apparatus or details, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40114—Multistep manufacturing processes for data storage electrodes the electrodes comprising a conductor-insulator-conductor-insulator-semiconductor structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/401—Multistep manufacturing processes
- H01L29/4011—Multistep manufacturing processes for data storage electrodes
- H01L29/40117—Multistep manufacturing processes for data storage electrodes the electrodes comprising a charge-trapping insulator
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/41—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions
- H01L29/423—Electrodes ; Multistep manufacturing processes therefor characterised by their shape, relative sizes or dispositions not carrying the current to be rectified, amplified or switched
- H01L29/42312—Gate electrodes for field effect devices
- H01L29/42316—Gate electrodes for field effect devices for field-effect transistors
- H01L29/4232—Gate electrodes for field effect devices for field-effect transistors with insulated gate
- H01L29/42324—Gate electrodes for transistors with a floating gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66833—Unipolar field-effect transistors with an insulated gate, i.e. MISFET with a charge trapping gate insulator, e.g. MNOS transistors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0003—Arrangements for preventing undesired thermal effects on tools or parts of the machine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/12—Arrangements for cooling or lubricating parts of the machine
- B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
Abstract
Description
Claims (43)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP094517/2003 | 2003-03-31 | ||
JP2003094517A JP2004303918A (ja) | 2003-03-31 | 2003-03-31 | 半導体装置の製造方法および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1534768A CN1534768A (zh) | 2004-10-06 |
CN100447988C true CN100447988C (zh) | 2008-12-31 |
Family
ID=32985429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100319070A Expired - Lifetime CN100447988C (zh) | 2003-03-31 | 2004-03-31 | 半导体器件及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7087955B2 (zh) |
JP (1) | JP2004303918A (zh) |
KR (1) | KR101026288B1 (zh) |
CN (1) | CN100447988C (zh) |
TW (1) | TW200501428A (zh) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4593159B2 (ja) * | 2003-05-28 | 2010-12-08 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
US7586137B2 (en) * | 2004-08-09 | 2009-09-08 | Samsung Electronics Co., Ltd. | Non-volatile memory device and method of fabricating the same |
DE102005051492B4 (de) * | 2004-10-21 | 2008-02-28 | Samsung Electronics Co., Ltd., Suwon | Nichtflüchtiges Speicherbauelement mit Ladungseinfangstruktur und Herstellungsverfahren |
US20060113586A1 (en) * | 2004-11-29 | 2006-06-01 | Macronix International Co., Ltd. | Charge trapping dielectric structure for non-volatile memory |
JP2006179736A (ja) * | 2004-12-24 | 2006-07-06 | Sanyo Electric Co Ltd | 半導体装置の製造方法 |
US8264028B2 (en) * | 2005-01-03 | 2012-09-11 | Macronix International Co., Ltd. | Non-volatile memory cells, memory arrays including the same and methods of operating cells and arrays |
JP5014591B2 (ja) * | 2005-05-24 | 2012-08-29 | ルネサスエレクトロニクス株式会社 | 半導体装置及びその製造方法 |
US20070108495A1 (en) * | 2005-11-17 | 2007-05-17 | Macronix International Co., Ltd. | MNOS memory devices and methods for operating an MNOS memory devices |
US20070158734A1 (en) * | 2006-01-09 | 2007-07-12 | Freescale Semiconductor, Inc. | Electronic device with a multi-gated electrode structure and a process for forming the electronic device |
US7391659B2 (en) * | 2006-01-27 | 2008-06-24 | Freescale Semiconductor, Inc. | Method for multiple step programming a memory cell |
US7317222B2 (en) * | 2006-01-27 | 2008-01-08 | Freescale Semiconductor, Inc. | Memory cell using a dielectric having non-uniform thickness |
KR100824401B1 (ko) * | 2006-03-07 | 2008-04-22 | 삼성전자주식회사 | 낸드 플래시 메모리의 셀 어레이 구조 |
TWI431726B (zh) * | 2006-06-01 | 2014-03-21 | Semiconductor Energy Lab | 非揮發性半導體記憶體裝置 |
KR100807221B1 (ko) * | 2006-08-22 | 2008-02-28 | 삼성전자주식회사 | 불휘발성 메모리 장치 및 그 제조 방법 |
JP4965948B2 (ja) | 2006-09-21 | 2012-07-04 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5376122B2 (ja) * | 2006-11-14 | 2013-12-25 | 日本電気株式会社 | 半導体装置 |
JP5086626B2 (ja) * | 2006-12-15 | 2012-11-28 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置及びその製造方法 |
US8410543B2 (en) | 2007-02-01 | 2013-04-02 | Renesas Electronics Corporation | Semiconductor storage device and manufacturing method thereof |
JP5161494B2 (ja) * | 2007-02-01 | 2013-03-13 | ルネサスエレクトロニクス株式会社 | 半導体記憶装置 |
JP4316627B2 (ja) * | 2007-03-07 | 2009-08-19 | 三井金属鉱業株式会社 | フレキシブル配線基材並びに半導体装置及びその製造方法 |
KR100846393B1 (ko) * | 2007-03-30 | 2008-07-15 | 주식회사 하이닉스반도체 | 반도체 소자의 트랜지스터 및 그 제조 방법 |
JP2008270343A (ja) * | 2007-04-17 | 2008-11-06 | Renesas Technology Corp | 不揮発性半導体記憶装置 |
US7968934B2 (en) * | 2007-07-11 | 2011-06-28 | Infineon Technologies Ag | Memory device including a gate control layer |
JP5212770B2 (ja) * | 2007-07-13 | 2013-06-19 | ルネサスエレクトロニクス株式会社 | 不揮発性半導体記憶装置およびその動作方法 |
US20090101961A1 (en) * | 2007-10-22 | 2009-04-23 | Yue-Song He | Memory devices with split gate and blocking layer |
US8178406B2 (en) * | 2007-10-29 | 2012-05-15 | Freescale Semiconductor, Inc. | Split gate device and method for forming |
JP2009272365A (ja) * | 2008-05-01 | 2009-11-19 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2009302269A (ja) * | 2008-06-13 | 2009-12-24 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
JP2010067645A (ja) * | 2008-09-08 | 2010-03-25 | Renesas Technology Corp | 半導体装置およびその製造方法 |
JP5519154B2 (ja) * | 2009-01-09 | 2014-06-11 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP5638679B2 (ja) * | 2009-01-15 | 2014-12-10 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
WO2010082328A1 (ja) | 2009-01-15 | 2010-07-22 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP2010183022A (ja) | 2009-02-09 | 2010-08-19 | Renesas Electronics Corp | 半導体装置およびその製造方法 |
JP5538838B2 (ja) * | 2009-11-25 | 2014-07-02 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
JP5592214B2 (ja) * | 2010-09-22 | 2014-09-17 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
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KR101026288B1 (ko) | 2011-03-31 |
TW200501428A (en) | 2005-01-01 |
JP2004303918A (ja) | 2004-10-28 |
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US7087955B2 (en) | 2006-08-08 |
US20040188753A1 (en) | 2004-09-30 |
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CN1534768A (zh) | 2004-10-06 |
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