CN100411147C - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number
CN100411147C
CN100411147C CNB2004100372231A CN200410037223A CN100411147C CN 100411147 C CN100411147 C CN 100411147C CN B2004100372231 A CNB2004100372231 A CN B2004100372231A CN 200410037223 A CN200410037223 A CN 200410037223A CN 100411147 C CN100411147 C CN 100411147C
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China
Prior art keywords
film
silicon oxide
oxide film
gate electrode
effect transistor
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Chinese (zh)
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CN1542974A (zh
Inventor
筱原正昭
渡部浩三
大和田福夫
青山卓史
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Renesas Electronics Corp
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Renesas Technology Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B43/00—EEPROM devices comprising charge-trapping gate insulators
    • H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices

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  • Non-Volatile Memory (AREA)
  • Semiconductor Memories (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
CNB2004100372231A 2003-04-28 2004-04-27 半导体器件及其制造方法 Expired - Lifetime CN100411147C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP124244/2003 2003-04-28
JP2003124244 2003-04-28
JP2004020210A JP4477886B2 (ja) 2003-04-28 2004-01-28 半導体装置の製造方法
JP020210/2004 2004-01-28

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CN1542974A CN1542974A (zh) 2004-11-03
CN100411147C true CN100411147C (zh) 2008-08-13

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US (2) US7118972B2 (enExample)
JP (1) JP4477886B2 (enExample)
KR (1) KR20040093404A (enExample)
CN (1) CN100411147C (enExample)
TW (1) TWI350589B (enExample)

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US7091089B2 (en) * 2004-06-25 2006-08-15 Freescale Semiconductor, Inc. Method of forming a nanocluster charge storage device
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US7183159B2 (en) * 2005-01-14 2007-02-27 Freescale Semiconductor, Inc. Method of forming an integrated circuit having nanocluster devices and non-nanocluster devices
JP5001522B2 (ja) * 2005-04-20 2012-08-15 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
KR100684899B1 (ko) * 2005-05-18 2007-02-20 삼성전자주식회사 비휘발성 기억 장치
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JP4316540B2 (ja) * 2005-06-24 2009-08-19 株式会社東芝 不揮発性半導体記憶装置及び不揮発性半導体記憶装置の製造方法
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JP2007109954A (ja) * 2005-10-14 2007-04-26 Sharp Corp 半導体記憶装置、その製造方法及びその動作方法
KR20070053071A (ko) * 2005-11-19 2007-05-23 삼성전자주식회사 다층의 터널링층을 포함한 비휘발성 메모리 소자
JP5013050B2 (ja) * 2006-06-14 2012-08-29 富士通セミコンダクター株式会社 半導体装置の製造方法
US7432158B1 (en) 2006-07-25 2008-10-07 Freescale Semiconductor, Inc. Method for retaining nanocluster size and electrical characteristics during processing
US7445984B2 (en) 2006-07-25 2008-11-04 Freescale Semiconductor, Inc. Method for removing nanoclusters from selected regions
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JP5059437B2 (ja) * 2007-02-06 2012-10-24 株式会社Ｇｅｎｕｓｉｏｎ 不揮発性半導体記憶装置
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JP5278320B2 (ja) 2007-07-31 2013-09-04 富士通セミコンダクター株式会社 半導体装置及びその製造方法
US7745344B2 (en) * 2007-10-29 2010-06-29 Freescale Semiconductor, Inc. Method for integrating NVM circuitry with logic circuitry
US8394683B2 (en) * 2008-01-15 2013-03-12 Micron Technology, Inc. Methods of forming semiconductor constructions, and methods of forming NAND unit cells
JP2009224425A (ja) * 2008-03-14 2009-10-01 Renesas Technology Corp 不揮発性半導体記憶装置の製造方法および不揮発性半導体記憶装置
US20100127331A1 (en) * 2008-11-26 2010-05-27 Albert Ratnakumar Asymmetric metal-oxide-semiconductor transistors
US8692310B2 (en) 2009-02-09 2014-04-08 Spansion Llc Gate fringing effect based channel formation for semiconductor device
JP5202473B2 (ja) 2009-08-18 2013-06-05 シャープ株式会社 半導体装置の製造方法
JP5550286B2 (ja) * 2009-08-26 2014-07-16 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP5331618B2 (ja) 2009-08-28 2013-10-30 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US20110147837A1 (en) * 2009-12-23 2011-06-23 Hafez Walid M Dual work function gate structures
JP5610930B2 (ja) * 2010-08-30 2014-10-22 三菱電機株式会社 半導体装置
CN103187368B (zh) * 2011-12-31 2015-06-03 中芯国际集成电路制造(上海)有限公司 嵌入式闪存中晶体管的形成方法
JP6045873B2 (ja) * 2012-10-05 2016-12-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8871598B1 (en) * 2013-07-31 2014-10-28 Freescale Semiconductor, Inc. Non-volatile memory (NVM) and high-k and metal gate integration using gate-first methodology
US9076681B2 (en) 2013-09-27 2015-07-07 Taiwan Semiconductor Manufacturing Company, Ltd. Memory devices and method of fabricating same
US9082651B2 (en) 2013-09-27 2015-07-14 Taiwan Semiconductor Manufacturing Company, Ltd. Memory devices and method of forming same
US8999833B1 (en) * 2013-10-04 2015-04-07 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for controlling gate dimensions of memory devices
US9559177B2 (en) 2013-12-03 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Memory devices and method of fabricating same
US9524982B2 (en) * 2015-03-09 2016-12-20 Kabushiki Kaisha Toshiba Semiconductor device
US9773733B2 (en) * 2015-03-26 2017-09-26 Mie Fujitsu Semiconductor Limited Semiconductor device
JP6385873B2 (ja) * 2015-03-30 2018-09-05 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP5934416B1 (ja) * 2015-06-01 2016-06-15 株式会社フローディア メモリセルおよび不揮発性半導体記憶装置
JP6683488B2 (ja) * 2016-02-03 2020-04-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6880595B2 (ja) * 2016-08-10 2021-06-02 セイコーエプソン株式会社 半導体装置及びその製造方法
CN106298795A (zh) * 2016-10-10 2017-01-04 上海华虹宏力半导体制造有限公司 改善存储器装置中记忆体单元和高压器件漏电的方法
JP2018166133A (ja) 2017-03-28 2018-10-25 ルネサスエレクトロニクス株式会社 半導体装置およびその動作方法
JP6875188B2 (ja) * 2017-04-25 2021-05-19 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6824115B2 (ja) * 2017-06-19 2021-02-03 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
KR102639431B1 (ko) 2019-04-15 2024-02-22 양쯔 메모리 테크놀로지스 씨오., 엘티디. 프로세서 및 이종 메모리를 갖는 통합 반도체 디바이스 및 이를 형성하는 방법
CN110731012B (zh) 2019-04-15 2021-01-29 长江存储科技有限责任公司 具有处理器和异构存储器的一体化半导体器件及其形成方法
KR20250099267A (ko) 2019-04-15 2025-07-01 양쯔 메모리 테크놀로지스 씨오., 엘티디. 프로세서 및 동적 랜덤 액세스 메모리를 갖는 본디드 반도체 장치 및 이를 형성하는 방법
CN110720143B (zh) 2019-04-30 2021-01-29 长江存储科技有限责任公司 具有处理器和nand闪存的键合半导体器件及其形成方法
JP7311615B2 (ja) * 2019-04-30 2023-07-19 長江存儲科技有限責任公司 プロセッサおよびｎａｎｄフラッシュメモリを有する接合半導体デバイスならびにそれを形成する方法
CN112582408A (zh) * 2020-12-09 2021-03-30 长江先进存储产业创新中心有限责任公司 一种半导体器件及其制作方法
CN113097138B (zh) * 2021-03-27 2023-04-18 长江存储科技有限责任公司 半导体器件及其制造方法
US12433014B2 (en) * 2022-04-12 2025-09-30 Globalfoundries U.S. Inc. Structure having different gate dielectric widths in different regions of substrate

Citations (4)

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JPH06181293A (ja) * 1992-12-14 1994-06-28 Seiko Epson Corp 半導体装置及びその製造方法
US5329482A (en) * 1991-10-07 1994-07-12 Sony Corporation Semiconductor memory device and method for producing it
JPH07176729A (ja) * 1993-12-17 1995-07-14 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2000150662A (ja) * 1998-09-08 2000-05-30 Denso Corp 半導体装置および該半導体装置の製造方法

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US5329482A (en) * 1991-10-07 1994-07-12 Sony Corporation Semiconductor memory device and method for producing it
JPH06181293A (ja) * 1992-12-14 1994-06-28 Seiko Epson Corp 半導体装置及びその製造方法
JPH07176729A (ja) * 1993-12-17 1995-07-14 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP2000150662A (ja) * 1998-09-08 2000-05-30 Denso Corp 半導体装置および該半導体装置の製造方法

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CN1542974A (zh) 2004-11-03
TWI350589B (en) 2011-10-11
US20040212019A1 (en) 2004-10-28
US7663179B2 (en) 2010-02-16
US20060214256A1 (en) 2006-09-28
US7118972B2 (en) 2006-10-10
JP4477886B2 (ja) 2010-06-09
TW200503272A (en) 2005-01-16
KR20040093404A (ko) 2004-11-05
JP2004349680A (ja) 2004-12-09

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