AU2342600A - Vertical geometry ingan led - Google Patents
Vertical geometry ingan ledInfo
- Publication number
- AU2342600A AU2342600A AU23426/00A AU2342600A AU2342600A AU 2342600 A AU2342600 A AU 2342600A AU 23426/00 A AU23426/00 A AU 23426/00A AU 2342600 A AU2342600 A AU 2342600A AU 2342600 A AU2342600 A AU 2342600A
- Authority
- AU
- Australia
- Prior art keywords
- vertical geometry
- quantum well
- emitting diode
- light emitting
- ingan led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09154363 | 1998-09-16 | ||
| US09/154,363 US6459100B1 (en) | 1998-09-16 | 1998-09-16 | Vertical geometry ingan LED |
| PCT/US1999/021362 WO2000021144A2 (en) | 1998-09-16 | 1999-09-16 | VERTICAL GEOMETRY InGaN LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2342600A true AU2342600A (en) | 2000-04-26 |
Family
ID=22551059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU23426/00A Abandoned AU2342600A (en) | 1998-09-16 | 1999-09-16 | Vertical geometry ingan led |
Country Status (11)
| Country | Link |
|---|---|
| US (5) | US6459100B1 (enExample) |
| EP (1) | EP1116282B1 (enExample) |
| JP (2) | JP4405085B2 (enExample) |
| KR (1) | KR100639170B1 (enExample) |
| CN (1) | CN1206744C (enExample) |
| AT (1) | ATE459105T1 (enExample) |
| AU (1) | AU2342600A (enExample) |
| CA (1) | CA2344391C (enExample) |
| DE (1) | DE69942065D1 (enExample) |
| TW (1) | TW475275B (enExample) |
| WO (1) | WO2000021144A2 (enExample) |
Families Citing this family (135)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825501B2 (en) | 1997-08-29 | 2004-11-30 | Cree, Inc. | Robust Group III light emitting diode for high reliability in standard packaging applications |
| US6201262B1 (en) * | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
| US6459100B1 (en) * | 1998-09-16 | 2002-10-01 | Cree, Inc. | Vertical geometry ingan LED |
| AU2001239182A1 (en) * | 2000-02-15 | 2001-08-27 | Osram Opto Semiconductors Gmbh | Semiconductor component which emits radiation, and method for producing the same |
| DE10006738C2 (de) * | 2000-02-15 | 2002-01-17 | Osram Opto Semiconductors Gmbh | Lichtemittierendes Bauelement mit verbesserter Lichtauskopplung und Verfahren zu seiner Herstellung |
| GB2361354B (en) * | 2000-04-13 | 2004-06-30 | Arima Optoelectronics Corp | White light emitting diode with single asymmetric quantum well in active layer |
| DE20111659U1 (de) * | 2000-05-23 | 2001-12-13 | OSRAM Opto Semiconductors GmbH & Co. oHG, 93049 Regensburg | Bauelement für die Optoelektronik |
| KR20010000545A (ko) * | 2000-10-05 | 2001-01-05 | 유태경 | 펌핑 층이 집적된 다 파장 AlGaInN계 반도체LED 소자 및 그 제조 방법 |
| DE10056475B4 (de) | 2000-11-15 | 2010-10-07 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement auf GaN-Basis mit verbesserter p-Leitfähigkeit und Verfahren zu dessen Herstellung |
| US8507361B2 (en) | 2000-11-27 | 2013-08-13 | Soitec | Fabrication of substrates with a useful layer of monocrystalline semiconductor material |
| FR2840731B3 (fr) * | 2002-06-11 | 2004-07-30 | Soitec Silicon On Insulator | Procede de fabrication d'un substrat comportant une couche utile en materiau semi-conducteur monocristallin de proprietes ameliorees |
| US6906352B2 (en) * | 2001-01-16 | 2005-06-14 | Cree, Inc. | Group III nitride LED with undoped cladding layer and multiple quantum well |
| US6800876B2 (en) | 2001-01-16 | 2004-10-05 | Cree, Inc. | Group III nitride LED with undoped cladding layer (5000.137) |
| US6791119B2 (en) * | 2001-02-01 | 2004-09-14 | Cree, Inc. | Light emitting diodes including modifications for light extraction |
| US6649942B2 (en) * | 2001-05-23 | 2003-11-18 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device |
| US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
| US7692182B2 (en) * | 2001-05-30 | 2010-04-06 | Cree, Inc. | Group III nitride based quantum well light emitting device structures with an indium containing capping structure |
| KR100422944B1 (ko) * | 2001-05-31 | 2004-03-12 | 삼성전기주식회사 | 반도체 엘이디(led) 소자 |
| CN1505843B (zh) * | 2001-06-15 | 2010-05-05 | 克里公司 | 在SiC衬底上形成的GaN基LED |
| US7211833B2 (en) | 2001-07-23 | 2007-05-01 | Cree, Inc. | Light emitting diodes including barrier layers/sublayers |
| US6740906B2 (en) * | 2001-07-23 | 2004-05-25 | Cree, Inc. | Light emitting diodes including modifications for submount bonding |
| US20030090103A1 (en) * | 2001-11-09 | 2003-05-15 | Thomas Becker | Direct mailing device |
| TW517403B (en) * | 2002-01-10 | 2003-01-11 | Epitech Technology Corp | Nitride light emitting diode and manufacturing method for the same |
| CA2474883A1 (en) * | 2002-02-08 | 2003-08-14 | Cree, Inc. | Methods of treating a silicon carbide substrate for improved epitaxial deposition |
| JP4150527B2 (ja) * | 2002-02-27 | 2008-09-17 | 日鉱金属株式会社 | 結晶の製造方法 |
| JP4457564B2 (ja) * | 2002-04-26 | 2010-04-28 | 沖電気工業株式会社 | 半導体装置の製造方法 |
| GB2416920B (en) * | 2002-07-08 | 2006-09-27 | Sumitomo Chemical Co | Epitaxial substrate for compound semiconductor light - emitting device, method for producing the same and light - emitting device |
| SG115549A1 (en) * | 2002-07-08 | 2005-10-28 | Sumitomo Chemical Co | Epitaxial substrate for compound semiconductor light emitting device, method for producing the same and light emitting device |
| KR100583163B1 (ko) * | 2002-08-19 | 2006-05-23 | 엘지이노텍 주식회사 | 질화물 반도체 및 그 제조방법 |
| KR100906921B1 (ko) * | 2002-12-09 | 2009-07-10 | 엘지이노텍 주식회사 | 발광 다이오드 제조 방법 |
| US6900067B2 (en) * | 2002-12-11 | 2005-05-31 | Lumileds Lighting U.S., Llc | Growth of III-nitride films on mismatched substrates without conventional low temperature nucleation layers |
| EP1830416B1 (en) | 2002-12-20 | 2011-06-08 | Cree Inc. | Methods of forming semiconductor devices including mesa structures and multiple passivation layers and related devices |
| US6917057B2 (en) * | 2002-12-31 | 2005-07-12 | Gelcore Llc | Layered phosphor coatings for LED devices |
| US6952024B2 (en) * | 2003-02-13 | 2005-10-04 | Cree, Inc. | Group III nitride LED with silicon carbide cladding layer |
| US6987281B2 (en) | 2003-02-13 | 2006-01-17 | Cree, Inc. | Group III nitride contact structures for light emitting devices |
| US7170097B2 (en) * | 2003-02-14 | 2007-01-30 | Cree, Inc. | Inverted light emitting diode on conductive substrate |
| US7123637B2 (en) * | 2003-03-20 | 2006-10-17 | Xerox Corporation | Nitride-based laser diode with GaN waveguide/cladding layer |
| US7531380B2 (en) * | 2003-04-30 | 2009-05-12 | Cree, Inc. | Methods of forming light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof |
| US7087936B2 (en) * | 2003-04-30 | 2006-08-08 | Cree, Inc. | Methods of forming light-emitting devices having an antireflective layer that has a graded index of refraction |
| US7714345B2 (en) | 2003-04-30 | 2010-05-11 | Cree, Inc. | Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same |
| CN1802755B (zh) * | 2003-05-09 | 2012-05-16 | 克里公司 | 通过离子注入进行隔离的led制造方法 |
| KR20110042249A (ko) * | 2003-06-04 | 2011-04-25 | 유명철 | 수직 구조 화합물 반도체 디바이스의 제조 방법 |
| KR101034055B1 (ko) * | 2003-07-18 | 2011-05-12 | 엘지이노텍 주식회사 | 발광 다이오드 및 그 제조방법 |
| US20050104072A1 (en) | 2003-08-14 | 2005-05-19 | Slater David B.Jr. | Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
| US7291529B2 (en) * | 2003-11-12 | 2007-11-06 | Cree, Inc. | Methods of processing semiconductor wafer backsides having light emitting devices (LEDs) thereon |
| US20050194584A1 (en) * | 2003-11-12 | 2005-09-08 | Slater David B.Jr. | LED fabrication via ion implant isolation |
| US7115908B2 (en) * | 2004-01-30 | 2006-10-03 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device with reduced polarization fields |
| US7615689B2 (en) * | 2004-02-12 | 2009-11-10 | Seminis Vegatable Seeds, Inc. | Methods for coupling resistance alleles in tomato |
| KR100664980B1 (ko) * | 2004-03-11 | 2007-01-09 | 삼성전기주식회사 | 모노리식 백색 발광소자 |
| KR100764457B1 (ko) * | 2004-03-18 | 2007-10-05 | 삼성전기주식회사 | 모노리식 백색 발광소자 |
| EP1749308A4 (en) * | 2004-04-28 | 2011-12-28 | Verticle Inc | SEMICONDUCTOR COMPONENTS WITH VERTICAL STRUCTURE |
| US7592634B2 (en) * | 2004-05-06 | 2009-09-22 | Cree, Inc. | LED fabrication via ion implant isolation |
| TWI433343B (zh) * | 2004-06-22 | 2014-04-01 | 維帝克股份有限公司 | 具有改良光輸出的垂直構造半導體裝置 |
| KR100616600B1 (ko) * | 2004-08-24 | 2006-08-28 | 삼성전기주식회사 | 수직구조 질화물 반도체 발광소자 |
| KR100649496B1 (ko) * | 2004-09-14 | 2006-11-24 | 삼성전기주식회사 | 질화물 반도체 발광소자 및 제조방법 |
| US8174037B2 (en) | 2004-09-22 | 2012-05-08 | Cree, Inc. | High efficiency group III nitride LED with lenticular surface |
| US7737459B2 (en) | 2004-09-22 | 2010-06-15 | Cree, Inc. | High output group III nitride light emitting diodes |
| US8513686B2 (en) * | 2004-09-22 | 2013-08-20 | Cree, Inc. | High output small area group III nitride LEDs |
| US7259402B2 (en) * | 2004-09-22 | 2007-08-21 | Cree, Inc. | High efficiency group III nitride-silicon carbide light emitting diode |
| US7432536B2 (en) * | 2004-11-04 | 2008-10-07 | Cree, Inc. | LED with self aligned bond pad |
| TWI389334B (zh) * | 2004-11-15 | 2013-03-11 | Verticle Inc | 製造及分離半導體裝置之方法 |
| KR100662191B1 (ko) * | 2004-12-23 | 2006-12-27 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 및 그 제조방법 |
| US8288942B2 (en) * | 2004-12-28 | 2012-10-16 | Cree, Inc. | High efficacy white LED |
| US7378288B2 (en) * | 2005-01-11 | 2008-05-27 | Semileds Corporation | Systems and methods for producing light emitting diode array |
| CN100401541C (zh) * | 2005-01-14 | 2008-07-09 | 财团法人工业技术研究院 | 一种量子点/量子阱发光二极管 |
| US7951632B1 (en) * | 2005-01-26 | 2011-05-31 | University Of Central Florida | Optical device and method of making |
| DE102005009060A1 (de) | 2005-02-28 | 2006-09-07 | Osram Opto Semiconductors Gmbh | Modul mit strahlungsemittierenden Halbleiterkörpern |
| US7446345B2 (en) * | 2005-04-29 | 2008-11-04 | Cree, Inc. | Light emitting devices with active layers that extend into opened pits |
| US20060267043A1 (en) * | 2005-05-27 | 2006-11-30 | Emerson David T | Deep ultraviolet light emitting devices and methods of fabricating deep ultraviolet light emitting devices |
| KR100750932B1 (ko) * | 2005-07-31 | 2007-08-22 | 삼성전자주식회사 | 기판 분해 방지막을 사용한 단결정 질화물계 반도체 성장및 이를 이용한 고품위 질화물계 발광소자 제작 |
| JP4367393B2 (ja) * | 2005-09-30 | 2009-11-18 | 日立電線株式会社 | 透明導電膜を備えた半導体発光素子 |
| CN100485979C (zh) * | 2005-10-17 | 2009-05-06 | 鸿富锦精密工业(深圳)有限公司 | 发光元件、平面光源及直下式背光模组 |
| US7829909B2 (en) * | 2005-11-15 | 2010-11-09 | Verticle, Inc. | Light emitting diodes and fabrication methods thereof |
| JP2009530798A (ja) | 2006-01-05 | 2009-08-27 | イルミテックス, インコーポレイテッド | Ledから光を導くための独立した光学デバイス |
| US8101961B2 (en) * | 2006-01-25 | 2012-01-24 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with growth substrates |
| JP2007214378A (ja) * | 2006-02-09 | 2007-08-23 | Rohm Co Ltd | 窒化物系半導体素子 |
| JP2007220865A (ja) * | 2006-02-16 | 2007-08-30 | Sumitomo Chemical Co Ltd | 3族窒化物半導体発光素子およびその製造方法 |
| JP2007281257A (ja) * | 2006-04-07 | 2007-10-25 | Toyoda Gosei Co Ltd | Iii族窒化物半導体発光素子 |
| WO2007116517A1 (ja) | 2006-04-10 | 2007-10-18 | Fujitsu Limited | 化合物半導体構造とその製造方法 |
| WO2007139894A2 (en) | 2006-05-26 | 2007-12-06 | Cree Led Lighting Solutions, Inc. | Solid state light emitting device and method of making same |
| BRPI0712439B1 (pt) | 2006-05-31 | 2019-11-05 | Cree, Inc. | dispositivo de iluminação e método de iluminação |
| US7646024B2 (en) * | 2006-08-18 | 2010-01-12 | Cree, Inc. | Structure and method for reducing forward voltage across a silicon carbide-group III nitride interface |
| EP2070123A2 (en) | 2006-10-02 | 2009-06-17 | Illumitex, Inc. | Led system and method |
| KR20090119862A (ko) * | 2007-01-22 | 2009-11-20 | 크리 엘이디 라이팅 솔루션즈, 인크. | 고장 내성 발광기, 고장 내성 발광기를 포함하는 시스템 및 고장 내성 발광기를 제조하는 방법 |
| CN102683376A (zh) | 2007-01-22 | 2012-09-19 | 科锐公司 | 高压发光体、发光体及照明装置 |
| KR100818466B1 (ko) * | 2007-02-13 | 2008-04-02 | 삼성전기주식회사 | 반도체 발광소자 |
| KR100849826B1 (ko) * | 2007-03-29 | 2008-07-31 | 삼성전기주식회사 | 발광소자 및 이를 포함하는 패키지 |
| US9484499B2 (en) * | 2007-04-20 | 2016-11-01 | Cree, Inc. | Transparent ohmic contacts on light emitting diodes with carrier substrates |
| US20080283864A1 (en) * | 2007-05-16 | 2008-11-20 | Letoquin Ronan P | Single Crystal Phosphor Light Conversion Structures for Light Emitting Devices |
| US7851343B2 (en) * | 2007-06-14 | 2010-12-14 | Cree, Inc. | Methods of forming ohmic layers through ablation capping layers |
| KR100891761B1 (ko) * | 2007-10-19 | 2009-04-07 | 삼성전기주식회사 | 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지 |
| US7482674B1 (en) * | 2007-12-17 | 2009-01-27 | The United States Of America As Represented By The Secretary Of The Navy | Crystalline III-V nitride films on refractory metal substrates |
| WO2009100358A1 (en) | 2008-02-08 | 2009-08-13 | Illumitex, Inc. | System and method for emitter layer shaping |
| JP5085369B2 (ja) | 2008-02-18 | 2012-11-28 | 日本オクラロ株式会社 | 窒化物半導体発光装置及びその製造方法 |
| CN101728451B (zh) * | 2008-10-21 | 2013-10-30 | 展晶科技(深圳)有限公司 | 半导体光电元件 |
| TW201034256A (en) | 2008-12-11 | 2010-09-16 | Illumitex Inc | Systems and methods for packaging light-emitting diode devices |
| US8013414B2 (en) * | 2009-02-18 | 2011-09-06 | Alpha & Omega Semiconductor, Inc. | Gallium nitride semiconductor device with improved forward conduction |
| US20110012141A1 (en) | 2009-07-15 | 2011-01-20 | Le Toquin Ronan P | Single-color wavelength-converted light emitting devices |
| EP2464760A4 (en) | 2009-08-12 | 2013-08-28 | Univ Georgia State Res Found | HIGH PRESSURE CVP DEVICES, METHODS AND COMPOSITIONS MANUFACTURED THEREWITH |
| US8585253B2 (en) | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
| US8449128B2 (en) | 2009-08-20 | 2013-05-28 | Illumitex, Inc. | System and method for a lens and phosphor layer |
| WO2011084478A1 (en) * | 2009-12-15 | 2011-07-14 | Lehigh University | Nitride based devices including a symmetrical quantum well active layer having a central low bandgap delta-layer |
| US8536615B1 (en) | 2009-12-16 | 2013-09-17 | Cree, Inc. | Semiconductor device structures with modulated and delta doping and related methods |
| US8604461B2 (en) | 2009-12-16 | 2013-12-10 | Cree, Inc. | Semiconductor device structures with modulated doping and related methods |
| JP5392104B2 (ja) * | 2010-01-15 | 2014-01-22 | 住友電気工業株式会社 | 発光装置 |
| US8575592B2 (en) * | 2010-02-03 | 2013-11-05 | Cree, Inc. | Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses |
| US9991427B2 (en) * | 2010-03-08 | 2018-06-05 | Cree, Inc. | Photonic crystal phosphor light conversion structures for light emitting devices |
| CN101908591A (zh) * | 2010-06-23 | 2010-12-08 | 山东华光光电子有限公司 | 一种SiC衬底LED的欧姆接触电极制备方法 |
| US20120153297A1 (en) * | 2010-07-30 | 2012-06-21 | The Regents Of The University Of California | Ohmic cathode electrode on the backside of nonpolar m-plane (1-100) and semipolar (20-21) bulk gallium nitride substrates |
| US8969890B2 (en) | 2010-11-04 | 2015-03-03 | Koninklijke Philips N.V. | Solid state light emitting devices based on crystallographically relaxed structures |
| CN102064251B (zh) * | 2010-11-23 | 2012-12-05 | 吉林大学 | 一种大功率SiC衬底垂直结构发光管及其制备方法 |
| TWI458129B (zh) | 2010-12-21 | 2014-10-21 | Lextar Electronics Corp | 發光二極體晶片結構及其製造方法 |
| TWI495154B (zh) | 2012-12-06 | 2015-08-01 | Genesis Photonics Inc | 半導體結構 |
| US10121822B2 (en) | 2013-12-02 | 2018-11-06 | Nanyang Technological University | Light-emitting device and method of forming the same |
| JP6198004B2 (ja) * | 2014-02-19 | 2017-09-20 | 豊田合成株式会社 | Iii族窒化物半導体発光素子およびその製造方法 |
| US10797204B2 (en) | 2014-05-30 | 2020-10-06 | Cree, Inc. | Submount based light emitter components and methods |
| TW201601343A (zh) * | 2014-06-30 | 2016-01-01 | 新世紀光電股份有限公司 | 半導體結構 |
| US9985168B1 (en) | 2014-11-18 | 2018-05-29 | Cree, Inc. | Group III nitride based LED structures including multiple quantum wells with barrier-well unit interface layers |
| CN105449063B (zh) * | 2016-01-22 | 2017-11-14 | 西安中为光电科技有限公司 | 提高紫外led紫外光纯度的结构及其方法 |
| TWI703726B (zh) | 2016-09-19 | 2020-09-01 | 新世紀光電股份有限公司 | 含氮半導體元件 |
| US12100696B2 (en) | 2017-11-27 | 2024-09-24 | Seoul Viosys Co., Ltd. | Light emitting diode for display and display apparatus having the same |
| US10892296B2 (en) | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting device having commonly connected LED sub-units |
| US11527519B2 (en) | 2017-11-27 | 2022-12-13 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US10892297B2 (en) | 2017-11-27 | 2021-01-12 | Seoul Viosys Co., Ltd. | Light emitting diode (LED) stack for a display |
| US11282981B2 (en) | 2017-11-27 | 2022-03-22 | Seoul Viosys Co., Ltd. | Passivation covered light emitting unit stack |
| US10748881B2 (en) | 2017-12-05 | 2020-08-18 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US10886327B2 (en) | 2017-12-14 | 2021-01-05 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11552057B2 (en) | 2017-12-20 | 2023-01-10 | Seoul Viosys Co., Ltd. | LED unit for display and display apparatus having the same |
| US11522006B2 (en) | 2017-12-21 | 2022-12-06 | Seoul Viosys Co., Ltd. | Light emitting stacked structure and display device having the same |
| US11552061B2 (en) | 2017-12-22 | 2023-01-10 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| US11114499B2 (en) | 2018-01-02 | 2021-09-07 | Seoul Viosys Co., Ltd. | Display device having light emitting stacked structure |
| US10784240B2 (en) | 2018-01-03 | 2020-09-22 | Seoul Viosys Co., Ltd. | Light emitting device with LED stack for display and display apparatus having the same |
| CN108321265A (zh) * | 2018-01-31 | 2018-07-24 | 映瑞光电科技(上海)有限公司 | 一种led外延结构及其制备方法 |
| CN109037410A (zh) * | 2018-08-10 | 2018-12-18 | 厦门乾照光电股份有限公司 | 发光二极管的半导体芯片及其电流扩展层和制造方法 |
| US11393948B2 (en) | 2018-08-31 | 2022-07-19 | Creeled, Inc. | Group III nitride LED structures with improved electrical performance |
Family Cites Families (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4313125A (en) | 1979-06-21 | 1982-01-26 | Bell Telephone Laboratories, Incorporated | Light emitting semiconductor devices |
| US4862471A (en) | 1988-04-22 | 1989-08-29 | University Of Colorado Foundation, Inc. | Semiconductor light emitting device |
| FR2633812B1 (fr) | 1988-07-11 | 1991-05-24 | Millet | Armature de sac a dos |
| US5043513A (en) * | 1990-03-07 | 1991-08-27 | Mobil Oil Corp. | Catalytic hydrodealkylation of aromatics |
| US5334277A (en) | 1990-10-25 | 1994-08-02 | Nichia Kagaky Kogyo K.K. | Method of vapor-growing semiconductor crystal and apparatus for vapor-growing the same |
| US5433169A (en) | 1990-10-25 | 1995-07-18 | Nichia Chemical Industries, Ltd. | Method of depositing a gallium nitride-based III-V group compound semiconductor crystal layer |
| US5290393A (en) | 1991-01-31 | 1994-03-01 | Nichia Kagaku Kogyo K.K. | Crystal growth method for gallium nitride-based compound semiconductor |
| JPH088217B2 (ja) | 1991-01-31 | 1996-01-29 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法 |
| US5146465A (en) | 1991-02-01 | 1992-09-08 | Apa Optics, Inc. | Aluminum gallium nitride laser |
| US5319657A (en) | 1991-10-08 | 1994-06-07 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser of modulation doping quantum well structure with stopper against dopant dispersion and manufacturing method thereof |
| US5306662A (en) | 1991-11-08 | 1994-04-26 | Nichia Chemical Industries, Ltd. | Method of manufacturing P-type compound semiconductor |
| JP2576819Y2 (ja) * | 1992-07-13 | 1998-07-16 | オイレス工業株式会社 | ステアリングコラム用軸受装置 |
| US5578839A (en) | 1992-11-20 | 1996-11-26 | Nichia Chemical Industries, Ltd. | Light-emitting gallium nitride-based compound semiconductor device |
| US5432808A (en) * | 1993-03-15 | 1995-07-11 | Kabushiki Kaisha Toshiba | Compound semicondutor light-emitting device |
| EP1450415A3 (en) | 1993-04-28 | 2005-05-04 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor device |
| US5604135A (en) * | 1994-08-12 | 1997-02-18 | Cree Research, Inc. | Method of forming green light emitting diode in silicon carbide |
| US5523589A (en) | 1994-09-20 | 1996-06-04 | Cree Research, Inc. | Vertical geometry light emitting diode with group III nitride active layer and extended lifetime |
| US5777350A (en) | 1994-12-02 | 1998-07-07 | Nichia Chemical Industries, Ltd. | Nitride semiconductor light-emitting device |
| SE504916C2 (sv) * | 1995-01-18 | 1997-05-26 | Ericsson Telefon Ab L M | Förfarande för att åstadkomma en ohmsk kontakt jämte halvledarkomponent försedd med dylik ohmsk kontakt |
| US5585648A (en) | 1995-02-03 | 1996-12-17 | Tischler; Michael A. | High brightness electroluminescent device, emitting in the green to ultraviolet spectrum, and method of making the same |
| US5661074A (en) | 1995-02-03 | 1997-08-26 | Advanced Technology Materials, Inc. | High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same |
| DE69637304T2 (de) | 1995-03-17 | 2008-08-07 | Toyoda Gosei Co., Ltd. | Lichtemittierende Halbleitervorrichtung bestehend aus einer III-V Nitridverbindung |
| US5679965A (en) | 1995-03-29 | 1997-10-21 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact, non-nitride buffer layer and methods of fabricating same |
| US5670798A (en) * | 1995-03-29 | 1997-09-23 | North Carolina State University | Integrated heterostructures of Group III-V nitride semiconductor materials including epitaxial ohmic contact non-nitride buffer layer and methods of fabricating same |
| JP3728332B2 (ja) | 1995-04-24 | 2005-12-21 | シャープ株式会社 | 化合物半導体発光素子 |
| JPH08316581A (ja) * | 1995-05-18 | 1996-11-29 | Sanyo Electric Co Ltd | 半導体装置および半導体発光素子 |
| CN1264262C (zh) | 1995-11-06 | 2006-07-12 | 日亚化学工业株式会社 | 氮化物半导体器件 |
| JP3409958B2 (ja) * | 1995-12-15 | 2003-05-26 | 株式会社東芝 | 半導体発光素子 |
| US6017774A (en) * | 1995-12-24 | 2000-01-25 | Sharp Kabushiki Kaisha | Method for producing group III-V compound semiconductor and fabricating light emitting device using such semiconductor |
| JP2830814B2 (ja) * | 1996-01-19 | 1998-12-02 | 日本電気株式会社 | 窒化ガリウム系化合物半導体の結晶成長方法、及び半導体レーザの製造方法 |
| US5923690A (en) * | 1996-01-25 | 1999-07-13 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device |
| US5900647A (en) * | 1996-02-05 | 1999-05-04 | Sharp Kabushiki Kaisha | Semiconductor device with SiC and GaAlInN |
| US5874747A (en) * | 1996-02-05 | 1999-02-23 | Advanced Technology Materials, Inc. | High brightness electroluminescent device emitting in the green to ultraviolet spectrum and method of making the same |
| JP3754120B2 (ja) * | 1996-02-27 | 2006-03-08 | 株式会社東芝 | 半導体発光装置 |
| JP3448450B2 (ja) | 1996-04-26 | 2003-09-22 | 三洋電機株式会社 | 発光素子およびその製造方法 |
| US5684309A (en) | 1996-07-11 | 1997-11-04 | North Carolina State University | Stacked quantum well aluminum indium gallium nitride light emitting diodes |
| JPH1093192A (ja) | 1996-07-26 | 1998-04-10 | Toshiba Corp | 窒化ガリウム系化合物半導体レーザ及びその製造方法 |
| US5987048A (en) * | 1996-07-26 | 1999-11-16 | Kabushiki Kaisha Toshiba | Gallium nitride-based compound semiconductor laser and method of manufacturing the same |
| JP3688843B2 (ja) * | 1996-09-06 | 2005-08-31 | 株式会社東芝 | 窒化物系半導体素子の製造方法 |
| JP3304787B2 (ja) * | 1996-09-08 | 2002-07-22 | 豊田合成株式会社 | 半導体発光素子及びその製造方法 |
| JP3767031B2 (ja) * | 1996-09-10 | 2006-04-19 | 松下電器産業株式会社 | 半導体発光素子およびその製造方法 |
| JPH10145006A (ja) | 1996-09-10 | 1998-05-29 | Toshiba Corp | 化合物半導体素子 |
| US6057565A (en) * | 1996-09-26 | 2000-05-02 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a non-stoichiometric compound layer and manufacturing method thereof |
| JP3419280B2 (ja) * | 1996-11-05 | 2003-06-23 | 日亜化学工業株式会社 | 発光装置 |
| JPH10145500A (ja) * | 1996-11-15 | 1998-05-29 | Oki Electric Ind Co Ltd | 構内電話システム |
| CN1964093B (zh) * | 1997-01-09 | 2012-06-27 | 日亚化学工业株式会社 | 氮化物半导体元器件 |
| US5898185A (en) * | 1997-01-24 | 1999-04-27 | International Business Machines Corporation | Hybrid organic-inorganic semiconductor light emitting diodes |
| JP3316838B2 (ja) * | 1997-01-31 | 2002-08-19 | 日亜化学工業株式会社 | 発光装置 |
| JPH10261816A (ja) | 1997-03-19 | 1998-09-29 | Fujitsu Ltd | 半導体発光素子及びその製造方法 |
| JP3683669B2 (ja) * | 1997-03-21 | 2005-08-17 | 株式会社リコー | 半導体発光素子 |
| US5923946A (en) * | 1997-04-17 | 1999-07-13 | Cree Research, Inc. | Recovery of surface-ready silicon carbide substrates |
| US5923940A (en) | 1997-07-24 | 1999-07-13 | Xerox Corporation | Cleaning brush having fibers of different lengths |
| US6015979A (en) * | 1997-08-29 | 2000-01-18 | Kabushiki Kaisha Toshiba | Nitride-based semiconductor element and method for manufacturing the same |
| US6201262B1 (en) * | 1997-10-07 | 2001-03-13 | Cree, Inc. | Group III nitride photonic devices on silicon carbide substrates with conductive buffer interlay structure |
| JP3216596B2 (ja) * | 1998-01-08 | 2001-10-09 | 日亜化学工業株式会社 | 窒化ガリウム系化合物半導体発光素子 |
| US6459100B1 (en) * | 1998-09-16 | 2002-10-01 | Cree, Inc. | Vertical geometry ingan LED |
-
1998
- 1998-09-16 US US09/154,363 patent/US6459100B1/en not_active Expired - Lifetime
-
1999
- 1999-09-16 JP JP2000575174A patent/JP4405085B2/ja not_active Expired - Lifetime
- 1999-09-16 DE DE69942065T patent/DE69942065D1/de not_active Expired - Lifetime
- 1999-09-16 EP EP99967073A patent/EP1116282B1/en not_active Expired - Lifetime
- 1999-09-16 WO PCT/US1999/021362 patent/WO2000021144A2/en not_active Ceased
- 1999-09-16 KR KR1020017003470A patent/KR100639170B1/ko not_active Expired - Lifetime
- 1999-09-16 TW TW088116006A patent/TW475275B/zh not_active IP Right Cessation
- 1999-09-16 AU AU23426/00A patent/AU2342600A/en not_active Abandoned
- 1999-09-16 AT AT99967073T patent/ATE459105T1/de not_active IP Right Cessation
- 1999-09-16 CA CA2344391A patent/CA2344391C/en not_active Expired - Lifetime
- 1999-09-16 CN CNB998122734A patent/CN1206744C/zh not_active Expired - Lifetime
-
2000
- 2000-01-05 US US09/477,982 patent/US6610551B1/en not_active Expired - Lifetime
-
2002
- 2002-04-03 US US10/115,522 patent/US7034328B2/en not_active Ceased
-
2007
- 2007-09-26 JP JP2007249520A patent/JP4625979B2/ja not_active Expired - Lifetime
-
2008
- 2008-04-24 US US12/108,604 patent/USRE42007E1/en not_active Expired - Lifetime
-
2010
- 2010-11-09 US US12/942,673 patent/USRE45517E1/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CA2344391C (en) | 2012-02-07 |
| US20020121642A1 (en) | 2002-09-05 |
| CN1413362A (zh) | 2003-04-23 |
| JP4625979B2 (ja) | 2011-02-02 |
| JP2002527890A (ja) | 2002-08-27 |
| WO2000021144A3 (en) | 2000-07-27 |
| EP1116282A2 (en) | 2001-07-18 |
| TW475275B (en) | 2002-02-01 |
| US20040232433A1 (en) | 2004-11-25 |
| DE69942065D1 (de) | 2010-04-08 |
| USRE45517E1 (en) | 2015-05-19 |
| KR100639170B1 (ko) | 2006-10-27 |
| KR20010075185A (ko) | 2001-08-09 |
| JP2008004970A (ja) | 2008-01-10 |
| US7034328B2 (en) | 2006-04-25 |
| EP1116282B1 (en) | 2010-02-24 |
| US6610551B1 (en) | 2003-08-26 |
| ATE459105T1 (de) | 2010-03-15 |
| CN1206744C (zh) | 2005-06-15 |
| WO2000021144A9 (en) | 2000-11-23 |
| US6459100B1 (en) | 2002-10-01 |
| WO2000021144A2 (en) | 2000-04-13 |
| JP4405085B2 (ja) | 2010-01-27 |
| USRE42007E1 (en) | 2010-12-28 |
| CA2344391A1 (en) | 2000-04-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| AU2342600A (en) | Vertical geometry ingan led | |
| MY128599A (en) | Group iii nitride led with undoped cladding layer. | |
| WO2003036691A3 (en) | Method of making diode having reflective layer | |
| US7015512B2 (en) | High power flip chip LED | |
| US6633120B2 (en) | LED lamps | |
| US20070278502A1 (en) | Semiconductor Light Emitting Device | |
| CA2200305A1 (en) | Vertical geometry light emitting diode with group iii nitride active layer and extended lifetime | |
| USRE44429E1 (en) | Light-emitting semiconductor device having enhanced brightness | |
| US8378461B2 (en) | Light-emitting devices having an active region with electrical contacts coupled to opposing surfaces thereof | |
| WO2003038874A8 (en) | Diode having vertical structure and method of manufacturing the same | |
| WO2002037579A3 (en) | Group iii nitride light emitting devices with gallium-free layers | |
| MY134719A (en) | Phosphor-coated light emitting diodes including tapered sidewalls, and fabrication methods therefor | |
| TW200512952A (en) | Light emitting diodes in series connection and method of making the same | |
| MY129574A (en) | Group iii nitride led with undoped cladding layer and multiple quantum well | |
| TW200625679A (en) | Group Ⅲ nitride based quantum well light emitting device structures with an indium containing capping structure | |
| US7714345B2 (en) | Light-emitting devices having coplanar electrical contacts adjacent to a substrate surface opposite an active region and methods of forming the same | |
| EP0971421A3 (en) | White color light emitting diode and neutral color light emitting diode | |
| US20140110742A1 (en) | Light emitting device | |
| US20220045253A1 (en) | Light emitting diode packages | |
| MY143405A (en) | N-type nitride semiconductor laminate and semiconductor device using same | |
| US20070257268A1 (en) | Semiconductor Light Emitting Device | |
| TW200644281A (en) | Light-emitting device | |
| WO2004015784A3 (en) | A light emitting diode | |
| KR101645858B1 (ko) | 형광체 시트를 이용한 패시브형 발광소자 | |
| US6396862B1 (en) | LED with spreading layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |