ATE66744T1 - Verfahren und vorrichtung zur ausfuehrung der gueteuntersuchung von gedruckten schaltungen. - Google Patents

Verfahren und vorrichtung zur ausfuehrung der gueteuntersuchung von gedruckten schaltungen.

Info

Publication number
ATE66744T1
ATE66744T1 AT87301332T AT87301332T ATE66744T1 AT E66744 T1 ATE66744 T1 AT E66744T1 AT 87301332 T AT87301332 T AT 87301332T AT 87301332 T AT87301332 T AT 87301332T AT E66744 T1 ATE66744 T1 AT E66744T1
Authority
AT
Austria
Prior art keywords
circuit board
rays
imaging system
transmitted
ray
Prior art date
Application number
AT87301332T
Other languages
English (en)
Inventor
John Adams
Paul Axford
Philip H Bowles
Van Nguyen
Charles Preskitt
Ed Ross
Doug Thompson
Paul Turner
Juan Amoroso Jr
Mike Juha
Original Assignee
Irt Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25260392&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=ATE66744(T1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Irt Corp filed Critical Irt Corp
Application granted granted Critical
Publication of ATE66744T1 publication Critical patent/ATE66744T1/de

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10116—X-ray image
    • G06T2207/10121—Fluoroscopy
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S378/00—X-ray or gamma ray systems or devices
    • Y10S378/901—Computer tomography program or processor
AT87301332T 1986-02-20 1987-02-17 Verfahren und vorrichtung zur ausfuehrung der gueteuntersuchung von gedruckten schaltungen. ATE66744T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/831,997 US4809308A (en) 1986-02-20 1986-02-20 Method and apparatus for performing automated circuit board solder quality inspections
EP87301332A EP0236001B1 (de) 1986-02-20 1987-02-17 Verfahren und Vorrichtung zur Ausführung der Güteuntersuchung von gedruckten Schaltungen

Publications (1)

Publication Number Publication Date
ATE66744T1 true ATE66744T1 (de) 1991-09-15

Family

ID=25260392

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87301332T ATE66744T1 (de) 1986-02-20 1987-02-17 Verfahren und vorrichtung zur ausfuehrung der gueteuntersuchung von gedruckten schaltungen.

Country Status (6)

Country Link
US (2) US4809308A (de)
EP (1) EP0236001B1 (de)
JP (1) JP2790804B2 (de)
KR (1) KR870008499A (de)
AT (1) ATE66744T1 (de)
DE (1) DE3772411D1 (de)

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752162B2 (ja) * 1987-02-27 1995-06-05 株式会社日立製作所 Ｘ線断層撮影装置
US5029222A (en) * 1987-09-02 1991-07-02 Fujitsu Limited Photoelectron image projection apparatus
US4926452A (en) * 1987-10-30 1990-05-15 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
JP2853854B2 (ja) * 1988-04-13 1999-02-03 東京エレクトロン 株式会社 検査装置
JPH0821605B2 (ja) * 1988-04-18 1996-03-04 東京エレクトロン株式会社 Ｘ線検査装置
EP0354782B1 (de) * 1988-08-12 1996-11-27 Sumitomo Wiring Systems, Ltd. Bildverarbeitungsgerät zur Erkennung von unvollständigen Gegenständen
JP2934455B2 (ja) * 1988-08-26 1999-08-16 株式会社日立製作所 Ｘ線透過画像によるはんだ付部の検査方法及びその装置
US4999785A (en) * 1989-01-12 1991-03-12 Robotic Vision Systems, Inc. Method and apparatus for evaluating defects of an object
JPH02300860A (ja) * 1989-05-15 1990-12-13 Nec Corp 半導体装置のマウントヌレ性定量測定装置
US5113425A (en) * 1989-06-02 1992-05-12 Glenbrook Technologies, Inc. X-ray inspection system for electronic components
EP0407685B1 (de) * 1989-07-14 1995-06-28 Hitachi, Ltd. Verfahren und Vorrichtung zur Untersuchung von Lötstellen mittels eines röntgenfluoroskopischen Bildes
US5164994A (en) * 1989-12-21 1992-11-17 Hughes Aircraft Company Solder joint locator
US5182775A (en) * 1990-01-12 1993-01-26 Kawasaki Jukogyo Kabushiki Kaisha Method of processing radiographic image data for detecting a welding defect
US5042055A (en) * 1990-03-12 1991-08-20 Art Wirt X-ray threaded pipe joint analysis system
JP2986868B2 (ja) * 1990-03-14 1999-12-06 株式会社日立製作所 外観検査方法及びその装置
US5202932A (en) * 1990-06-08 1993-04-13 Catawa Pty. Ltd. X-ray generating apparatus and associated method
US5012502A (en) * 1990-06-18 1991-04-30 Irt Corporation Method for determining degree of interconnection of solder joints using X-ray inspection
US5259012A (en) * 1990-08-30 1993-11-02 Four Pi Systems Corporation Laminography system and method with electromagnetically directed multipath radiation source
US5199054A (en) * 1990-08-30 1993-03-30 Four Pi Systems Corporation Method and apparatus for high resolution inspection of electronic items
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
JPH05223532A (ja) * 1991-07-10 1993-08-31 Raytheon Co 自動視覚検査システム
JP3092828B2 (ja) * 1992-04-30 2000-09-25 株式会社日立製作所 Ｘ線透過像検出によるはんだ付け検査方法とその装置
GB9214114D0 (en) * 1992-07-03 1992-08-12 Ibm X-ray inspection apparatus for electronic circuits
US5692029A (en) * 1993-01-15 1997-11-25 Technology International Incorporated Detection of concealed explosives and contraband
JP3051279B2 (ja) * 1993-05-13 2000-06-12 シャープ株式会社 バンプ外観検査方法およびバンプ外観検査装置
US5541856A (en) * 1993-11-08 1996-07-30 Imaging Systems International X-ray inspection system
CA2113752C (en) * 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging
US5500886A (en) * 1994-04-06 1996-03-19 Thermospectra X-ray position measuring and calibration device
US5594770A (en) * 1994-11-18 1997-01-14 Thermospectra Corporation Method and apparatus for imaging obscured areas of a test object
US7068270B1 (en) * 1994-12-02 2006-06-27 Texas Instruments Incorporated Design of integrated circuit package using parametric solids modeller
EP0807297B1 (de) * 1995-01-31 1999-09-29 United Parcel Service Of America, Inc. Verfahren und gerät zum trennen des vordergrunds und hintergrunds in textenthaltenden bildern
US5583904A (en) * 1995-04-11 1996-12-10 Hewlett-Packard Co. Continuous linear scan laminography system and method
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection
US5524132A (en) * 1995-05-12 1996-06-04 International Business Machines Corporation Process for revealing defects in testpieces using attenuated high-energy x-rays to form images in reusable photographs
JPH0933599A (ja) * 1995-05-15 1997-02-07 Hitachi Ltd パターン検査方法および検査装置
US6058223A (en) * 1996-06-27 2000-05-02 The Johns Hopkins University Video-centroid integrated circuit
US6185273B1 (en) * 1995-11-06 2001-02-06 Macrotron Process Technologies Gmbh Process and circuit arrangement for testing solder joints
US5838568A (en) * 1996-06-28 1998-11-17 International Business Machines Corporation Heated circuit assembly tester and method
JPH10267628A (ja) * 1997-01-23 1998-10-09 Hitachi Ltd ３次元形状検出方法およびその装置並びに基板の製造方法
JP3848723B2 (ja) 1997-03-31 2006-11-22 株式会社日立製作所 半導体装置の実装構造体及びその検査方法
DE29716196U1 (de) * 1997-04-14 1997-11-13 Fraunhofer Ges Forschung Vorrichtung zur Inspektion von Testobjekten
ATE246803T1 (de) * 1997-05-05 2003-08-15 Macrotron Process Technologies Verfahren und schaltungsanordnung zur prüfung von lötstellen
US6023680A (en) * 1997-05-15 2000-02-08 Panasonic Technologies, Inc. Methods, apparatus and computer program products for automated visual inspection
US6414713B1 (en) * 1997-12-25 2002-07-02 Casio Computer Co., Ltd. Commodity image data processors, recording mediums which contain a commodity image data processing program, and image pickup aiding apparatus
US6633663B1 (en) * 1998-05-05 2003-10-14 International Business Machines Corporation Method and system for determining component dimensional information
US7561281B2 (en) * 1998-06-30 2009-07-14 Lockheed Martin Corporation System and method for controlling tube thickness
US7342665B2 (en) * 1998-06-30 2008-03-11 Drake Jr Thomas E System and method for control of paint thickness
US6633384B1 (en) * 1998-06-30 2003-10-14 Lockheed Martin Corporation Method and apparatus for ultrasonic laser testing
US6657733B1 (en) * 1998-06-30 2003-12-02 Lockheed Martin Corporation Method and apparatus for detecting ultrasonic surface displacements using post-collection optical amplification
US7612890B2 (en) * 1998-06-30 2009-11-03 Lockheed Martin Corporation System and method for controlling wafer temperature
US7545509B2 (en) * 1998-06-30 2009-06-09 Lockheed Martin Corporation System and method for online control of paper elasticity and thickness
US6314201B1 (en) 1998-10-16 2001-11-06 Agilent Technologies, Inc. Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography
US6229872B1 (en) * 1998-12-22 2001-05-08 United Technologies Corporation Method and apparatus for use in inspection of objects
US6201850B1 (en) 1999-01-26 2001-03-13 Agilent Technologies, Inc. Enhanced thickness calibration and shading correction for automatic X-ray inspection
TW419634B (en) 1999-02-02 2001-01-21 Ind Tech Res Inst Automatic detection system and method using bar code positioning
US7286241B2 (en) * 1999-06-24 2007-10-23 Lockheed Martin Corporation System and method for high-speed laser detection of ultrasound
US8073101B2 (en) * 1999-12-01 2011-12-06 Massie Ronald E Digital modality modeling for medical and dental applications
US6381301B1 (en) 1999-12-01 2002-04-30 Ronald E. Massie Dental and orthopedic densitometry modeling system and method
US6944262B2 (en) 1999-12-01 2005-09-13 Massie Ronald E Dental and orthopedic densitometry modeling system and method
US8126112B2 (en) * 1999-12-01 2012-02-28 Massie Ronald E Osseo classification system and method
DE10007306A1 (de) * 2000-02-17 2001-08-23 Macrotron Process Technologies Röntgensystem
US6496559B1 (en) * 2000-06-28 2002-12-17 Advanced Micro Devices, Inc. Sample preparation for inspection of ball contacts and internal vias
JP3877501B2 (ja) * 2000-07-07 2007-02-07 松下電器産業株式会社 部品認識データ作成方法及び作成装置並びに電子部品実装装置及び記録媒体
AU2002222956A1 (en) * 2000-07-14 2002-01-30 Lockheed Martin Corporation System and method for locating and positioning an ultrasonic signal generator for testing purposes
US6373917B1 (en) * 2000-08-30 2002-04-16 Agilent Technologies, Inc. Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment
JP4176977B2 (ja) * 2000-09-28 2008-11-05 矢崎総業株式会社 端子金具の検査装置
US6442234B1 (en) * 2000-10-03 2002-08-27 Advanced Micro Devices, Inc. X-ray inspection of ball contacts and internal vias
US20040240616A1 (en) * 2003-05-30 2004-12-02 Applied Nanotechnologies, Inc. Devices and methods for producing multiple X-ray beams from multiple locations
US7082182B2 (en) * 2000-10-06 2006-07-25 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
US6980627B2 (en) * 2000-10-06 2005-12-27 Xintek, Inc. Devices and methods for producing multiple x-ray beams from multiple locations
JP2002119499A (ja) * 2000-10-18 2002-04-23 Konica Corp 放射線画像処理装置及び放射線画像用カセッテ
US6324249B1 (en) 2001-03-21 2001-11-27 Agilent Technologies, Inc. Electronic planar laminography system and method
JP2002310946A (ja) * 2001-04-17 2002-10-23 Shimadzu Corp 放射線検査装置
DE10153379B4 (de) * 2001-10-30 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Röntgenprüfung eines Rades
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
EP2538205B1 (de) * 2002-01-28 2020-08-19 Smiths Heimann GmbH Röntgenbildprüfsystem und Verfahren
US6751294B1 (en) * 2002-08-08 2004-06-15 Advanced Micro Devices, Inc. Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection
NL1022515C2 (nl) * 2003-01-29 2004-08-03 Vitronics Soltec B V Inrichting en werkwijze voor correctief solderen.
US7231013B2 (en) 2003-03-21 2007-06-12 Agilent Technologies, Inc. Precise x-ray inspection system utilizing multiple linear sensors
US20040260495A1 (en) * 2003-06-17 2004-12-23 General Electric Company Inspection method using a database of techniques to manage inspection parameters
US7330528B2 (en) * 2003-08-19 2008-02-12 Agilent Technologies, Inc. System and method for parallel image reconstruction of multiple depth layers of an object under inspection from radiographic images
US7392924B2 (en) * 2004-06-18 2008-07-01 Integrated Device Technology, Inc. Automated ball mounting process and system with solder ball testing
KR20070050007A (ko) * 2004-06-18 2007-05-14 인테그레이티드 디바이스 테크놀로지, 인코포레이티드 솔더 볼 테스팅을 구비한 자동화된 볼 마운팅 방법 및시스템
DE102004049439A1 (de) * 2004-10-08 2006-04-13 Feinfocus Gmbh Bohrvorrichtung zum Bohren von Kontaktierungsbohrungen zum Verbinden von Kontaktierungsflächen von Mehrschicht-Leiterplatten
US8155262B2 (en) * 2005-04-25 2012-04-10 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for multiplexing computed tomography
WO2006116365A2 (en) * 2005-04-25 2006-11-02 The University Of North Carolina At Chapel Hill X-ray imaging using temporal digital signal processing
WO2006126617A1 (ja) * 2005-05-24 2006-11-30 National University Corporation Hokkaido University 損傷評価装置および損傷評価方法
JP2007107966A (ja) * 2005-10-12 2007-04-26 Shimadzu Corp Ｘ線検査装置
JP4742902B2 (ja) * 2006-02-17 2011-08-10 株式会社島津製作所 Ｘ線検査装置
US7760930B2 (en) * 2006-02-21 2010-07-20 Taiwan Semiconductor Manufacturing Company, Ltd. Translation engine of defect pattern recognition
US7529338B2 (en) * 2006-02-22 2009-05-05 Focalspot, Inc. Method and apparatus for inspecting circuit boards
US8189893B2 (en) * 2006-05-19 2012-05-29 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for binary multiplexing x-ray radiography
EP2082863A1 (de) * 2008-01-22 2009-07-29 Inergy Automotive Systems Research (SA) Verfahren zum Erkennen von Defekten in einem Plastikkraftstoffbehälter durch Radiographie
US8131107B2 (en) * 2008-05-12 2012-03-06 General Electric Company Method and system for identifying defects in NDT image data
US9146196B2 (en) 2008-07-10 2015-09-29 Nordson Corporation Automated fillet inspection system with closed loop feedback and methods of use
US7989769B2 (en) * 2008-08-21 2011-08-02 Rockwell Automation Technologies, Inc. In-cabinet thermal monitoring method and system
US8600003B2 (en) * 2009-01-16 2013-12-03 The University Of North Carolina At Chapel Hill Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8358739B2 (en) 2010-09-03 2013-01-22 The University Of North Carolina At Chapel Hill Systems and methods for temporal multiplexing X-ray imaging
CN103035547B (zh) * 2011-09-29 2015-04-01 中芯国际集成电路制造(北京)有限公司 检测标记的设备和方法以及半导体器件加工系统
US8547548B1 (en) * 2012-12-20 2013-10-01 Kinsus Interconnect Technology Corp. Final defect inspection system
US8837808B2 (en) * 2012-12-20 2014-09-16 Kinsus Interconnect Technology Corp. Method of final defect inspection
KR101351809B1 (ko) * 2013-02-20 2014-01-27 테크밸리 주식회사 판상 피검사물의 엑스선 검사시스템 및 방법
CN103235396A (zh) * 2013-04-07 2013-08-07 西安交通大学 多自由度光路调节系统
KR102252257B1 (ko) * 2013-10-21 2021-05-17 익슬론 인터나치오날 게엠베하 X-레이 검사 시스템 및 x-레이 검사 시스템에 의해서 테스트 대상을 회전시키는 방법
EP2927944A1 (de) * 2014-04-04 2015-10-07 Nordson Corporation Röntgeninspektionsvorrichtung zum Prüfen von Halbleiterscheiben
KR101654825B1 (ko) * 2014-07-08 2016-09-22 (주)자비스 기판의 밀집 검사 부위의 엑스레이 검사 방법
US20160110859A1 (en) * 2014-10-17 2016-04-21 Macronix International Co., Ltd. Inspection method for contact by die to database
US10980494B2 (en) 2014-10-20 2021-04-20 The University Of North Carolina At Chapel Hill Systems and related methods for stationary digital chest tomosynthesis (s-DCT) imaging
US10835199B2 (en) 2016-02-01 2020-11-17 The University Of North Carolina At Chapel Hill Optical geometry calibration devices, systems, and related methods for three dimensional x-ray imaging
US10338032B2 (en) 2016-11-22 2019-07-02 Gm Global Technology Operations Llc. Automated quality determination of joints
JP6682467B2 (ja) * 2017-03-21 2020-04-15 名古屋電機工業株式会社 検査装置、検査方法および検査プログラム
IL275987B1 (en) 2018-01-22 2024-04-01 Xenselab Llc Methods for X-ray imaging of an object by using multiple-energy decomposition
EP3764766A4 (de) 2018-03-14 2022-02-23 Monsanto Technology LLC Samenabbildung
EP3768167A2 (de) 2018-03-19 2021-01-27 Xenselab Llc Röntgentomografie
JP7157948B2 (ja) * 2018-04-25 2022-10-21 パナソニックＩｐマネジメント株式会社 部品実装ライン、部品実装方法及び品質管理システム
MX2020013129A (es) 2018-06-11 2021-02-18 Monsanto Technology Llc Seleccion de semillas.
CN108896904A (zh) * 2018-07-09 2018-11-27 武汉瑞莱保能源技术有限公司 一种微型电路板故障检测机器人
AU2020383497A1 (en) * 2019-11-13 2022-05-26 Monsanto Technology Llc X-ray seed imaging system, cabinet x-ray device, and methods of evaluating seeds
CN111521626A (zh) * 2020-05-13 2020-08-11 南京华宝工程检测有限公司 一种压力管道焊接质量的x射线检测方法
US11815349B2 (en) 2020-08-06 2023-11-14 Bruker Nano, Inc. Methods and systems for inspecting integrated circuits based on X-rays
CN112014404A (zh) * 2020-08-27 2020-12-01 Oppo（重庆）智能科技有限公司 组件检测方法、装置、系统、电子设备及存储介质
CN113298793B (zh) * 2021-06-03 2023-11-24 中国电子科技集团公司第十四研究所 一种基于多视角模板匹配的电路板表面缺陷检测的方法
USD981565S1 (en) 2021-06-21 2023-03-21 Xenselab Llc Medical imaging apparatus
CN113791090A (zh) * 2021-09-14 2021-12-14 慧镕电子系统工程股份有限公司 一种回收电路板焊接缺陷快速检定系统及方法
WO2023107988A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting router technology
WO2023107993A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Pcba router test vehicle
WO2023107992A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting oven technology
WO2023107986A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting wave soldering machine
KR102548690B1 (ko) * 2022-05-27 2023-06-28 (주)나노드림 테이프릴의 칩 카운터 시스템
CN115861307B (zh) * 2023-02-21 2023-04-28 深圳市百昌科技有限公司 基于人工智能的筋膜枪供电驱动板焊接故障检测方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2475596A (en) * 1945-08-13 1949-07-12 Raytheon Mfg Co Method of examining welded surfaces
US3454762A (en) * 1966-02-01 1969-07-08 Gen Dynamics Corp X-ray inspection device with specimen carrying means rotationally mounted on vertically disposed carriage wheel
JPS4934385A (de) * 1972-07-28 1974-03-29
US3889053A (en) * 1973-10-30 1975-06-10 Westinghouse Electric Corp Contactless test system
US3949229A (en) * 1974-06-24 1976-04-06 Albert Richard D X-ray scanning method and apparatus
DE2600266A1 (de) * 1976-01-07 1977-07-14 Philips Patentverwaltung Anordnung zur ermittlung der absorption einer strahlung
US4028728A (en) * 1976-04-02 1977-06-07 Western Electric Company, Inc. Method of and video system for identifying different light-reflective surface areas on articles
US4144457A (en) * 1976-04-05 1979-03-13 Albert Richard D Tomographic X-ray scanning system
JPS52128190A (en) * 1976-04-21 1977-10-27 Nec Corp Inspection device for x ray fluoroscopic adhering layer
US4064440A (en) * 1976-06-22 1977-12-20 Roder Frederick L X-ray or gamma-ray examination device for moving objects
JPS5327479A (en) * 1976-08-26 1978-03-14 Nec Corp Xxray t ester for bonded surface
JPS5443290A (en) * 1977-09-13 1979-04-05 Mitsui Petrochem Ind Ltd Production of copolymer
JPS54143290A (en) * 1978-04-28 1979-11-08 Toshiba Corp Soldered part inspecting device
US4344146A (en) * 1980-05-08 1982-08-10 Chesebrough-Pond's Inc. Video inspection system
US4349739A (en) * 1980-07-28 1982-09-14 American Science And Engineering, Inc. Micro-calcification detection
US4415980A (en) * 1981-03-02 1983-11-15 Lockheed Missiles & Space Co., Inc. Automated radiographic inspection system
US4441207A (en) * 1982-01-19 1984-04-03 Environmental Research Institute Of Michigan Design rule checking using serial neighborhood processors
US4510616A (en) * 1982-01-19 1985-04-09 The Environmental Research Institute Of Michigan Design rule checking using serial neighborhood processors
US4500202A (en) * 1982-05-24 1985-02-19 Itek Corporation Printed circuit board defect detection of detecting maximum line width violations
US4549306A (en) * 1982-08-23 1985-10-22 Ball Corporation Sheet metal evaluator
JPS5975140A (ja) * 1982-10-22 1984-04-27 Toshiba Corp 欠陥検査装置及び方法
DE3475106D1 (en) * 1983-04-15 1988-12-15 Hitachi Ltd Method and apparatus for detecting defects of printed circuit patterns
US4536239A (en) * 1983-07-18 1985-08-20 Nicolet Instrument Corporation Multi-layer circuit board inspection system
US4578810A (en) * 1983-08-08 1986-03-25 Itek Corporation System for printed circuit board defect detection
US4794647A (en) * 1985-04-08 1988-12-27 Northern Telecom Limited Automatic optical inspection system
US4776022A (en) * 1985-04-09 1988-10-04 Aoi Systems, Inc. System for printed circuit board defect detection
US4668982A (en) * 1985-06-17 1987-05-26 The Perkin-Elmer Corporation Misregistration/distortion correction scheme
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
US4811410A (en) * 1986-12-08 1989-03-07 American Telephone And Telegraph Company Linescan inspection system for circuit boards
IT1234033B (it) * 1989-03-17 1992-04-24 I M S Internazionale Medico Sc Apparecchiatura per eseguire mammografie
US5012502A (en) * 1990-06-18 1991-04-30 Irt Corporation Method for determining degree of interconnection of solder joints using X-ray inspection

Also Published As

Publication number Publication date
EP0236001A2 (de) 1987-09-09
EP0236001A3 (en) 1988-08-10
JP2790804B2 (ja) 1998-08-27
KR870008499A (ko) 1987-09-26
JPS62219632A (ja) 1987-09-26
US4809308A (en) 1989-02-28
USRE35423E (en) 1997-01-14
DE3772411D1 (de) 1991-10-02
EP0236001B1 (de) 1991-08-28

Similar Documents

Publication Publication Date Title
ATE66744T1 (de) Verfahren und vorrichtung zur ausfuehrung der gueteuntersuchung von gedruckten schaltungen.
DE3850889D1 (de) Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung.
DE29823250U1 (de) Schaltungsanordnung zur Prüfung von Lötstellen
KR20040099590A (ko) Ｒｇｂ 컬러를 이용한 인쇄회로기판의 표면 상태 분석시스템 및 방법
JP3179874B2 (ja) 画像検査装置のティーチング方法とティーチング装置
JP3203397B2 (ja) はんだ付け状態検査装置とはんだ付け状態検査方法
JP3690786B2 (ja) Ｘ線断層撮像装置
JP3680675B2 (ja) 印刷検査装置の検査用データの作成方法
ATE24058T1 (de) Verfahren und geraet zur punkt zu punkt videobildverarbeitung waehrend einer tomographischen abtastung und/oder eines vergleichs von statischen bildern.
EP0407685B1 (de) Verfahren und Vorrichtung zur Untersuchung von Lötstellen mittels eines röntgenfluoroskopischen Bildes
JPH0618450A (ja) 平面サンプル用断層撮影装置
JP3492707B2 (ja) クリーム半田部の高さ分布及び体積の測定方法
JPS63124947A (ja) はんだ付状態検査方法
JPH0743329B2 (ja) 内部欠陥検査方法及びその装置
JPH0599643A (ja) はんだ付部のｘ線検査方法
JPH08189906A (ja) 半田付け外観検査方法および装置
JPH02143108A (ja) 螢光ｘ線非破壊検査装置
JPS6312944A (ja) 実装部品の不良検査装置
JPH02276902A (ja) 高さ検査装置
JPS62123338A (ja) 高密度実装基板の検査装置
Nameth How to Use Automated X‐ray Inspection for Process Monitoring and Control
JP2004055599A (ja) 実装基板の検査方法およびその装置
JPS59165183A (ja) パタ−ン認識装置
JPH0618451A (ja) 平面サンプル用断層撮影方法
Dussoulier Optimization of Nondestructive Control of Ceramic Pieces for Aeronautical Turbines