KR870008499A - 회로 기판 검사 장치 및 그 방법 - Google Patents

회로 기판 검사 장치 및 그 방법 Download PDF

Info

Publication number
KR870008499A
KR870008499A KR870001425A KR870001425A KR870008499A KR 870008499 A KR870008499 A KR 870008499A KR 870001425 A KR870001425 A KR 870001425A KR 870001425 A KR870001425 A KR 870001425A KR 870008499 A KR870008499 A KR 870008499A
Authority
KR
South Korea
Prior art keywords
circuit board
ray
measurement
image
electronic
Prior art date
Application number
KR870001425A
Other languages
English (en)
Inventor
아담스 죤
아모로소 2세 쥬안
액스포드 폴
에이취. 보울즈 필립
쥬하 마이크
규엔 반
프레스키트 챨스
로스 에드
톰슨 도우그
터너 폴
Original Assignee
데일 더블유. 호온백
아이 알 티 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=25260392&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR870008499(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 데일 더블유. 호온백, 아이 알 티 코포레이션 filed Critical 데일 더블유. 호온백
Publication of KR870008499A publication Critical patent/KR870008499A/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0006—Industrial image inspection using a design-rule based approach
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/304—Contactless testing of printed or hybrid circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10116—X-ray image
    • G06T2207/10121—Fluoroscopy
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30141—Printed circuit board [PCB]
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30152—Solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S378/00—X-ray or gamma ray systems or devices
    • Y10S378/901—Computer tomography program or processor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • General Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)

Abstract

내용 없음

Description

회로 기판 검사 장치 및 그 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제 2 도는 제 1 도의 시스템의 주구성 부품의 블럭 다이어그램.
제 3 도는 제 1 도 및 2도의 시스템의 작동 흐름도.
제 4 도는 검사 리스트 프로그램의 블럭 다이어그램.

Claims (19)

  1. 납땜 연결부를 가진 회로기판 선택부의 구조적 특성을 측정하기 위한 장치에 있어서, X선 빔을 제공하기 위한 X선 수단과, 회로 기판을 수용하며 상기 X선 빔내에 회로기판을 선택적으로 배치시키기 위한 다중-축 배치 수단과, 회로기판을 통해 전달되는 상기 X선 빔으로부터의 X선을 검출하여 전자 이메지를 제공하기 위한 이메징 수단과, 상기 전자 이메지를 그레이 스케일의 코드화 이메지로 변환시키기 위한 처리수단과, 측정 알고리즘이 라이브러리로부터의 선택된 측정 알고리즘에 의한 상기 그레이 스케일 코드화 이메지상의 예정된 연산 측정을 이행하며, 소정의 구조 특성에 따르는 예정의 측정 표준으로부터의 상기 그레이 스케일 코드화 이메지의 상기 측정의 변화에 따르는 출력을 제공하기 위한 연산수단을 구비하는 것을 특징으로 하는 회로기판 검사장치.
  2. 제 1 항에 있어서, 상기 X선 빔에서의 X선의 에너지 스펙트럼을 수정하기 위한 필터를 더 구비하는 것을 특징으로 하는 회로기판 검사장치.
  3. 제 1 항에 있어서, 상기 이메징 수단은 고형 검출기를 구비하는 것을 특징으로 하는 회로기판 검사장치.
  4. 제 1 항에 있어서, 상기 이메징 수단은, 회로기판을 통해 전달되는 X선 강도에 대응하는 광이메지를 제공하기 위한 광이메징 수단과; 상기 광 이메지를 관련 전기 이메지로 변환 시키기 위한 전자 이메징 수단을 구비하는 것을 특징으로 하는 회로기판 검사장치.
  5. 제 4 항에 있어서, 상기 광이메징 수단은, 상기 회로 기판을 통해 전달되는 X선을 수신하기 위해 배치되는 신티레이팅 스크린을 구비하는 것을 특징으로 하는 회로기판 검사장치.
  6. 제 4 항에 있어서, 상기 전자 이메징 수단은, 비데오 카메라와, 상기 광 이메징 수단에서 상기 비데오 카메라로 상기 광이메지를 반사시키기 위해 상기 비데오 카메라에 인접하게 장착된 반사 수단을 구비하는 것을 특징으로 하는 회로기판 검사장치.
  7. 제 1 항에 있어서, 상기 처리 수단은 고속 디지탈 그레이 스케일 이메지 처리기를 구비하는 것을 특징으로 하는 회로기판 검사장치.
  8. 제 1 항에 있어서, 상기 다중-축 배치 시스템은, 예정된 위치 신호를 제공하기 위해 상기 연산 수단에 의해 발생되는 지시신호에 응답하는 제어 수단과, X, Y 및 Z수직축상에 장착되며 각축에서 회전하는 회로기판을 이동시키기 위해 상기 위치신호에 응답하는 이동 테이블을 구비하는 것을 특징으로 하는 회로기판 검사장치.
  9. 제 1 항에 있어서, 상기 X선 수단은 전자 X-선 소오스를 구비하는 것을 특징으로 하는 회로기판 검사장치.
  10. 제 1 항에 있어서, 상기 그레이 스케일 코드화 이메지는 회로 기판의 뢴트겐 밀도를 나타내는 것을 특징으로 하는 회로기판 검사장치.
  11. 제 1 항에 있어서, 상기 연산 수단은 상기 출력단에 상기 측정이 상기 예정된 측정 표준내인가를 나타내는 표식을 제공하는 것을 특징으로 하는 회로기판 검사장치.
  12. 제 1 항에 있어서, 상기 출력은 또다른 회로 기판의 제어를 처리하기 위해 측정 데이타를 포함하는 것을 특징으로 하는 회로기판 검사장치.
  13. 제 1 항에 있어서, 상기 출력은 테스트하에서 회로기판의 품질을 제어하기 위한 측정 데이타를 포함하는 것을 특징으로 하는 회로기판 검사장치.
  14. 제 1 항에 있어서, 상기 장치는 전자 및 기계장치 및 소자를 측정하는 것을 특징으로 하는 회로기판 검사장치.
  15. 납땜 연결부를 이용하며, 상부에 소자를 가진 회로기판의 구조적 특성을 결정하기 위한 방법에 있어서 회로기판을 X선 소오스 빔에 최적으로 노출시키기 위해 다중축 배치 수단에 의해 조정될 수 있는 회로 기판을 지지하는 단계와, 상기 회로기판을 침투하기에 충분한 에너지를 가진 X선 빔에 회로기판을 노출시키는 단계와, 회로기판을 통해 전달되는 X선을 검출하며 전자 이메지를 제공하는 단계와, 상기 전자 이메지를 그레이 스케일 코드화 이메지로 변환시키는 단계와, 결정되는 구조 특성에 의해 측정 알고리즘의 라이브러리로부터 선택된 최소한 한 측정 알고리즘을 사용하여 상기 그레이 스케일 코드화 이메지에 대해 예정된 연산 측정을 이행하는 단계와, 소정의 구조 특성에 대응하는 예정된 측정 표준으로부터 상기 연산 측정의 변화에 따르는 출력을 제공하는 단계를 구비하는 것을 특징으로 하는 회로기판 검사방법.
  16. 제15항에 있어서, 상기 출력은 상기 측정이 상기 예정된 측정 표준내 인가의 표식으로서의 제품 재질 제어 데이타를 포함하는 것을 특징으로 하는 회로기판 검사방법.
  17. 제15항에 있어서, 상기 출력은 조사된 회로기판 소자의 구조특성에 관련된 정량 데이타를 포함하는 것을 특징으로 하는 회로기판 검사방법.
  18. 제15항에 있어서, 검출단계는, 회로기판을 통과하는 X선 통로에 신티레이팅 스크린을 배치시키며, 여기서 상기 신티레이팅 스크린은 회로기판을 통과하는 X선의 광 이메지를 발생시키는 단계와, 비데오 이메징 시스템으로 상기 신티레이팅 스크린에 의해 발생되는 광이메지를 시청하는 단계와, 상기 비데오 이메징 시스템에 의해 관찰되는 광이메지에 대한 전자 신호를 제공하는 단계를 구비하는 것을 특징으로 하는 회로기판 검사방법.
  19. 제15항에 있어서, 예정된 연산측정을 이행하는 단계는, 이미 구성된 알고리즘의 라이브러리로부터 하나 또는 그 이상의 측정 알고리즘을 선택하는 단계와, 상기 알고리즘에 부합되는 X선 검출을 제어하는 단계와, 상기 측정치를 전자 기억 수단에 기록시키는 단계를 구비하는 것을 특징으로 하는 회로기판 검사방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR870001425A 1986-02-20 1987-02-20 회로 기판 검사 장치 및 그 방법 KR870008499A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/831,997 US4809308A (en) 1986-02-20 1986-02-20 Method and apparatus for performing automated circuit board solder quality inspections
US831.997 1986-09-26

Publications (1)

Publication Number Publication Date
KR870008499A true KR870008499A (ko) 1987-09-26

Family

ID=25260392

Family Applications (1)

Application Number Title Priority Date Filing Date
KR870001425A KR870008499A (ko) 1986-02-20 1987-02-20 회로 기판 검사 장치 및 그 방법

Country Status (6)

Country Link
US (2) US4809308A (ko)
EP (1) EP0236001B1 (ko)
JP (1) JP2790804B2 (ko)
KR (1) KR870008499A (ko)
AT (1) ATE66744T1 (ko)
DE (1) DE3772411D1 (ko)

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0752162B2 (ja) * 1987-02-27 1995-06-05 株式会社日立製作所 Ｘ線断層撮影装置
US5029222A (en) * 1987-09-02 1991-07-02 Fujitsu Limited Photoelectron image projection apparatus
US4926452A (en) * 1987-10-30 1990-05-15 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
JP2853854B2 (ja) * 1988-04-13 1999-02-03 東京エレクトロン 株式会社 検査装置
JPH0821605B2 (ja) * 1988-04-18 1996-03-04 東京エレクトロン株式会社 Ｘ線検査装置
EP0354782B1 (en) * 1988-08-12 1996-11-27 Sumitomo Wiring Systems, Ltd. Image processor for detecting incomplete articles
JP2934455B2 (ja) * 1988-08-26 1999-08-16 株式会社日立製作所 Ｘ線透過画像によるはんだ付部の検査方法及びその装置
US4999785A (en) * 1989-01-12 1991-03-12 Robotic Vision Systems, Inc. Method and apparatus for evaluating defects of an object
JPH02300860A (ja) * 1989-05-15 1990-12-13 Nec Corp 半導体装置のマウントヌレ性定量測定装置
US5113425A (en) * 1989-06-02 1992-05-12 Glenbrook Technologies, Inc. X-ray inspection system for electronic components
EP0407685B1 (en) * 1989-07-14 1995-06-28 Hitachi, Ltd. Method for inspection of solder joints by x-ray fluoroscopic image and apparatus therefor
US5164994A (en) * 1989-12-21 1992-11-17 Hughes Aircraft Company Solder joint locator
US5182775A (en) * 1990-01-12 1993-01-26 Kawasaki Jukogyo Kabushiki Kaisha Method of processing radiographic image data for detecting a welding defect
US5042055A (en) * 1990-03-12 1991-08-20 Art Wirt X-ray threaded pipe joint analysis system
JP2986868B2 (ja) * 1990-03-14 1999-12-06 株式会社日立製作所 外観検査方法及びその装置
US5202932A (en) * 1990-06-08 1993-04-13 Catawa Pty. Ltd. X-ray generating apparatus and associated method
US5012502A (en) * 1990-06-18 1991-04-30 Irt Corporation Method for determining degree of interconnection of solder joints using X-ray inspection
US5199054A (en) * 1990-08-30 1993-03-30 Four Pi Systems Corporation Method and apparatus for high resolution inspection of electronic items
US5259012A (en) * 1990-08-30 1993-11-02 Four Pi Systems Corporation Laminography system and method with electromagnetically directed multipath radiation source
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
DE4222804A1 (de) * 1991-07-10 1993-04-01 Raytheon Co Einrichtung und verfahren zur automatischen visuellen pruefung elektrischer und elektronischer baueinheiten
JP3092828B2 (ja) * 1992-04-30 2000-09-25 株式会社日立製作所 Ｘ線透過像検出によるはんだ付け検査方法とその装置
GB9214114D0 (en) * 1992-07-03 1992-08-12 Ibm X-ray inspection apparatus for electronic circuits
US5600303A (en) * 1993-01-15 1997-02-04 Technology International Incorporated Detection of concealed explosives and contraband
JP3051279B2 (ja) * 1993-05-13 2000-06-12 シャープ株式会社 バンプ外観検査方法およびバンプ外観検査装置
US5541856A (en) * 1993-11-08 1996-07-30 Imaging Systems International X-ray inspection system
CA2113752C (en) * 1994-01-19 1999-03-02 Stephen Michael Rooks Inspection system for cross-sectional imaging
US5500886A (en) * 1994-04-06 1996-03-19 Thermospectra X-ray position measuring and calibration device
US5594770A (en) * 1994-11-18 1997-01-14 Thermospectra Corporation Method and apparatus for imaging obscured areas of a test object
US7068270B1 (en) * 1994-12-02 2006-06-27 Texas Instruments Incorporated Design of integrated circuit package using parametric solids modeller
CA2211258C (en) * 1995-01-31 2000-12-26 United Parcel Service Of America, Inc. Method and apparatus for separating foreground from background in images containing text
US5583904A (en) * 1995-04-11 1996-12-10 Hewlett-Packard Co. Continuous linear scan laminography system and method
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection
US5524132A (en) * 1995-05-12 1996-06-04 International Business Machines Corporation Process for revealing defects in testpieces using attenuated high-energy x-rays to form images in reusable photographs
JPH0933599A (ja) * 1995-05-15 1997-02-07 Hitachi Ltd パターン検査方法および検査装置
US6058223A (en) * 1996-06-27 2000-05-02 The Johns Hopkins University Video-centroid integrated circuit
WO1997017605A1 (de) * 1995-11-06 1997-05-15 Macrotron Process Technologies Gmbh Verfahren und schaltungsanordnung zur prüfung von lötstellen
US5838568A (en) * 1996-06-28 1998-11-17 International Business Machines Corporation Heated circuit assembly tester and method
JPH10267628A (ja) * 1997-01-23 1998-10-09 Hitachi Ltd ３次元形状検出方法およびその装置並びに基板の製造方法
JP3848723B2 (ja) 1997-03-31 2006-11-22 株式会社日立製作所 半導体装置の実装構造体及びその検査方法
DE29716196U1 (de) * 1997-04-14 1997-11-13 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 80636 München Vorrichtung zur Inspektion von Testobjekten
CA2289721A1 (en) * 1997-05-05 1998-11-12 Macrotron Process Technologies Gmbh Process and circuitry for inspecting welding points
US6023680A (en) * 1997-05-15 2000-02-08 Panasonic Technologies, Inc. Methods, apparatus and computer program products for automated visual inspection
US6414713B1 (en) * 1997-12-25 2002-07-02 Casio Computer Co., Ltd. Commodity image data processors, recording mediums which contain a commodity image data processing program, and image pickup aiding apparatus
US6633663B1 (en) * 1998-05-05 2003-10-14 International Business Machines Corporation Method and system for determining component dimensional information
US7612890B2 (en) * 1998-06-30 2009-11-03 Lockheed Martin Corporation System and method for controlling wafer temperature
US7545509B2 (en) * 1998-06-30 2009-06-09 Lockheed Martin Corporation System and method for online control of paper elasticity and thickness
US6633384B1 (en) * 1998-06-30 2003-10-14 Lockheed Martin Corporation Method and apparatus for ultrasonic laser testing
US6657733B1 (en) * 1998-06-30 2003-12-02 Lockheed Martin Corporation Method and apparatus for detecting ultrasonic surface displacements using post-collection optical amplification
US6643002B2 (en) * 2000-07-14 2003-11-04 Lockheed Martin Corporation System and method for locating and positioning an ultrasonic signal generator for testing purposes
US7342665B2 (en) * 1998-06-30 2008-03-11 Drake Jr Thomas E System and method for control of paint thickness
US7561281B2 (en) * 1998-06-30 2009-07-14 Lockheed Martin Corporation System and method for controlling tube thickness
US6314201B1 (en) 1998-10-16 2001-11-06 Agilent Technologies, Inc. Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography
US6229872B1 (en) * 1998-12-22 2001-05-08 United Technologies Corporation Method and apparatus for use in inspection of objects
US6201850B1 (en) 1999-01-26 2001-03-13 Agilent Technologies, Inc. Enhanced thickness calibration and shading correction for automatic X-ray inspection
TW419634B (en) 1999-02-02 2001-01-21 Ind Tech Res Inst Automatic detection system and method using bar code positioning
US7286241B2 (en) * 1999-06-24 2007-10-23 Lockheed Martin Corporation System and method for high-speed laser detection of ultrasound
US6944262B2 (en) 1999-12-01 2005-09-13 Massie Ronald E Dental and orthopedic densitometry modeling system and method
US6381301B1 (en) 1999-12-01 2002-04-30 Ronald E. Massie Dental and orthopedic densitometry modeling system and method
US8073101B2 (en) * 1999-12-01 2011-12-06 Massie Ronald E Digital modality modeling for medical and dental applications
US8126112B2 (en) * 1999-12-01 2012-02-28 Massie Ronald E Osseo classification system and method
DE10007306A1 (de) * 2000-02-17 2001-08-23 Macrotron Process Technologies Röntgensystem
US6496559B1 (en) * 2000-06-28 2002-12-17 Advanced Micro Devices, Inc. Sample preparation for inspection of ball contacts and internal vias
JP3877501B2 (ja) * 2000-07-07 2007-02-07 松下電器産業株式会社 部品認識データ作成方法及び作成装置並びに電子部品実装装置及び記録媒体
US6373917B1 (en) * 2000-08-30 2002-04-16 Agilent Technologies, Inc. Z-axis elimination in an X-ray laminography system using image magnification for Z plane adjustment
JP4176977B2 (ja) * 2000-09-28 2008-11-05 矢崎総業株式会社 端子金具の検査装置
US6442234B1 (en) * 2000-10-03 2002-08-27 Advanced Micro Devices, Inc. X-ray inspection of ball contacts and internal vias
US20040240616A1 (en) * 2003-05-30 2004-12-02 Applied Nanotechnologies, Inc. Devices and methods for producing multiple X-ray beams from multiple locations
US6980627B2 (en) * 2000-10-06 2005-12-27 Xintek, Inc. Devices and methods for producing multiple x-ray beams from multiple locations
US7082182B2 (en) * 2000-10-06 2006-07-25 The University Of North Carolina At Chapel Hill Computed tomography system for imaging of human and small animal
JP2002119499A (ja) * 2000-10-18 2002-04-23 Konica Corp 放射線画像処理装置及び放射線画像用カセッテ
US6324249B1 (en) 2001-03-21 2001-11-27 Agilent Technologies, Inc. Electronic planar laminography system and method
JP2002310946A (ja) * 2001-04-17 2002-10-23 Shimadzu Corp 放射線検査装置
DE10153379B4 (de) * 2001-10-30 2008-05-15 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zur Röntgenprüfung eines Rades
US6847900B2 (en) * 2001-12-17 2005-01-25 Agilent Technologies, Inc. System and method for identifying solder joint defects
EP2538205B1 (en) * 2002-01-28 2020-08-19 Smiths Heimann GmbH X-ray inspection system and method
US6751294B1 (en) * 2002-08-08 2004-06-15 Advanced Micro Devices, Inc. Prevention of parametic or functional changes to silicon semiconductor device properties during x-ray inspection
NL1022515C2 (nl) * 2003-01-29 2004-08-03 Vitronics Soltec B V Inrichting en werkwijze voor correctief solderen.
US7231013B2 (en) 2003-03-21 2007-06-12 Agilent Technologies, Inc. Precise x-ray inspection system utilizing multiple linear sensors
US20040260495A1 (en) * 2003-06-17 2004-12-23 General Electric Company Inspection method using a database of techniques to manage inspection parameters
US7330528B2 (en) * 2003-08-19 2008-02-12 Agilent Technologies, Inc. System and method for parallel image reconstruction of multiple depth layers of an object under inspection from radiographic images
US7392924B2 (en) * 2004-06-18 2008-07-01 Integrated Device Technology, Inc. Automated ball mounting process and system with solder ball testing
KR20070050007A (ko) * 2004-06-18 2007-05-14 인테그레이티드 디바이스 테크놀로지, 인코포레이티드 솔더 볼 테스팅을 구비한 자동화된 볼 마운팅 방법 및시스템
DE102004049439A1 (de) * 2004-10-08 2006-04-13 Feinfocus Gmbh Bohrvorrichtung zum Bohren von Kontaktierungsbohrungen zum Verbinden von Kontaktierungsflächen von Mehrschicht-Leiterplatten
US7245692B2 (en) * 2005-04-25 2007-07-17 The University Of North Carolina At Chapel Hill X-ray imaging systems and methods using temporal digital signal processing for reducing noise and for obtaining multiple images simultaneously
US8155262B2 (en) * 2005-04-25 2012-04-10 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for multiplexing computed tomography
WO2006126617A1 (ja) * 2005-05-24 2006-11-30 National University Corporation Hokkaido University 損傷評価装置および損傷評価方法
JP2007107966A (ja) * 2005-10-12 2007-04-26 Shimadzu Corp Ｘ線検査装置
JP4742902B2 (ja) * 2006-02-17 2011-08-10 株式会社島津製作所 Ｘ線検査装置
US7760930B2 (en) * 2006-02-21 2010-07-20 Taiwan Semiconductor Manufacturing Company, Ltd. Translation engine of defect pattern recognition
US7529338B2 (en) * 2006-02-22 2009-05-05 Focalspot, Inc. Method and apparatus for inspecting circuit boards
US8189893B2 (en) * 2006-05-19 2012-05-29 The University Of North Carolina At Chapel Hill Methods, systems, and computer program products for binary multiplexing x-ray radiography
EP2082863A1 (en) * 2008-01-22 2009-07-29 Inergy Automotive Systems Research (SA) Method for detecting defects in a plastic fuel tank by radiography
US8131107B2 (en) * 2008-05-12 2012-03-06 General Electric Company Method and system for identifying defects in NDT image data
US9146196B2 (en) * 2008-07-10 2015-09-29 Nordson Corporation Automated fillet inspection system with closed loop feedback and methods of use
US7989769B2 (en) * 2008-08-21 2011-08-02 Rockwell Automation Technologies, Inc. In-cabinet thermal monitoring method and system
US8600003B2 (en) * 2009-01-16 2013-12-03 The University Of North Carolina At Chapel Hill Compact microbeam radiation therapy systems and methods for cancer treatment and research
US8358739B2 (en) 2010-09-03 2013-01-22 The University Of North Carolina At Chapel Hill Systems and methods for temporal multiplexing X-ray imaging
CN103035547B (zh) * 2011-09-29 2015-04-01 中芯国际集成电路制造(北京)有限公司 检测标记的设备和方法以及半导体器件加工系统
US8837808B2 (en) * 2012-12-20 2014-09-16 Kinsus Interconnect Technology Corp. Method of final defect inspection
US8547548B1 (en) * 2012-12-20 2013-10-01 Kinsus Interconnect Technology Corp. Final defect inspection system
KR101351809B1 (ko) * 2013-02-20 2014-01-27 테크밸리 주식회사 판상 피검사물의 엑스선 검사시스템 및 방법
CN103235396A (zh) * 2013-04-07 2013-08-07 西安交通大学 多自由度光路调节系统
GB2534509B (en) * 2013-10-21 2020-04-08 Yxlon Int Gmbh Method for rotating a test object in an X-ray inspection system
EP2927946A1 (en) * 2014-04-04 2015-10-07 Nordson Corporation X-ray inspection apparatus for inspecting semiconductor wafers
KR101654825B1 (ko) * 2014-07-08 2016-09-22 (주)자비스 기판의 밀집 검사 부위의 엑스레이 검사 방법
US20160110859A1 (en) * 2014-10-17 2016-04-21 Macronix International Co., Ltd. Inspection method for contact by die to database
US10980494B2 (en) 2014-10-20 2021-04-20 The University Of North Carolina At Chapel Hill Systems and related methods for stationary digital chest tomosynthesis (s-DCT) imaging
US10835199B2 (en) 2016-02-01 2020-11-17 The University Of North Carolina At Chapel Hill Optical geometry calibration devices, systems, and related methods for three dimensional x-ray imaging
US10338032B2 (en) * 2016-11-22 2019-07-02 Gm Global Technology Operations Llc. Automated quality determination of joints
JP6682467B2 (ja) * 2017-03-21 2020-04-15 名古屋電機工業株式会社 検査装置、検査方法および検査プログラム
KR20200108895A (ko) 2018-01-22 2020-09-21 젠셀랩, 엘엘씨 다중 에너지 분해를 이용한 피사체의 엑스레이 이미징 방법
CA3092996C (en) 2018-03-14 2024-05-28 Monsanto Technology Llc Systems and methods for imaging seeds using multiple cameras
WO2019183002A2 (en) 2018-03-19 2019-09-26 Xenselab Llc X-ray tomography
JP7157948B2 (ja) * 2018-04-25 2022-10-21 パナソニックＩｐマネジメント株式会社 部品実装ライン、部品実装方法及び品質管理システム
BR112020023799A2 (pt) 2018-06-11 2021-03-30 Monsanto Technology Llc Classificação de sementes
CN108896904A (zh) * 2018-07-09 2018-11-27 武汉瑞莱保能源技术有限公司 一种微型电路板故障检测机器人
US11630095B2 (en) * 2019-11-13 2023-04-18 Monsanto Technology Llc X-ray seed imaging system, cabinet x-ray device, and methods of evaluating seeds
CN111521626A (zh) * 2020-05-13 2020-08-11 南京华宝工程检测有限公司 一种压力管道焊接质量的x射线检测方法
US11815349B2 (en) 2020-08-06 2023-11-14 Bruker Nano, Inc. Methods and systems for inspecting integrated circuits based on X-rays
CN112014404A (zh) * 2020-08-27 2020-12-01 Oppo（重庆）智能科技有限公司 组件检测方法、装置、系统、电子设备及存储介质
CN113298793B (zh) * 2021-06-03 2023-11-24 中国电子科技集团公司第十四研究所 一种基于多视角模板匹配的电路板表面缺陷检测的方法
USD981565S1 (en) 2021-06-21 2023-03-21 Xenselab Llc Medical imaging apparatus
CN113791090A (zh) * 2021-09-14 2021-12-14 慧镕电子系统工程股份有限公司 一种回收电路板焊接缺陷快速检定系统及方法
WO2023107988A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting router technology
WO2023107992A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting oven technology
WO2023107993A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Pcba router test vehicle
WO2023107986A1 (en) * 2021-12-07 2023-06-15 Jabil Inc. Self correcting wave soldering machine
KR102548690B1 (ko) * 2022-05-27 2023-06-28 (주)나노드림 테이프릴의 칩 카운터 시스템
CN115861307B (zh) * 2023-02-21 2023-04-28 深圳市百昌科技有限公司 基于人工智能的筋膜枪供电驱动板焊接故障检测方法

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2475596A (en) * 1945-08-13 1949-07-12 Raytheon Mfg Co Method of examining welded surfaces
US3454762A (en) * 1966-02-01 1969-07-08 Gen Dynamics Corp X-ray inspection device with specimen carrying means rotationally mounted on vertically disposed carriage wheel
JPS4934385A (ko) * 1972-07-28 1974-03-29
US3889053A (en) * 1973-10-30 1975-06-10 Westinghouse Electric Corp Contactless test system
US3949229A (en) * 1974-06-24 1976-04-06 Albert Richard D X-ray scanning method and apparatus
DE2600266A1 (de) * 1976-01-07 1977-07-14 Philips Patentverwaltung Anordnung zur ermittlung der absorption einer strahlung
US4028728A (en) * 1976-04-02 1977-06-07 Western Electric Company, Inc. Method of and video system for identifying different light-reflective surface areas on articles
US4144457A (en) * 1976-04-05 1979-03-13 Albert Richard D Tomographic X-ray scanning system
JPS52128190A (en) * 1976-04-21 1977-10-27 Nec Corp Inspection device for x ray fluoroscopic adhering layer
US4064440A (en) * 1976-06-22 1977-12-20 Roder Frederick L X-ray or gamma-ray examination device for moving objects
JPS5327479A (en) * 1976-08-26 1978-03-14 Nec Corp Xxray t ester for bonded surface
JPS5443290A (en) * 1977-09-13 1979-04-05 Mitsui Petrochem Ind Ltd Production of copolymer
JPS54143290A (en) * 1978-04-28 1979-11-08 Toshiba Corp Soldered part inspecting device
US4344146A (en) * 1980-05-08 1982-08-10 Chesebrough-Pond's Inc. Video inspection system
US4349739A (en) * 1980-07-28 1982-09-14 American Science And Engineering, Inc. Micro-calcification detection
US4415980A (en) * 1981-03-02 1983-11-15 Lockheed Missiles & Space Co., Inc. Automated radiographic inspection system
US4441207A (en) * 1982-01-19 1984-04-03 Environmental Research Institute Of Michigan Design rule checking using serial neighborhood processors
US4510616A (en) * 1982-01-19 1985-04-09 The Environmental Research Institute Of Michigan Design rule checking using serial neighborhood processors
US4500202A (en) * 1982-05-24 1985-02-19 Itek Corporation Printed circuit board defect detection of detecting maximum line width violations
US4549306A (en) * 1982-08-23 1985-10-22 Ball Corporation Sheet metal evaluator
JPS5975140A (ja) * 1982-10-22 1984-04-27 Toshiba Corp 欠陥検査装置及び方法
EP0123229B1 (en) * 1983-04-15 1988-11-09 Hitachi, Ltd. Method and apparatus for detecting defects of printed circuit patterns
US4536239A (en) * 1983-07-18 1985-08-20 Nicolet Instrument Corporation Multi-layer circuit board inspection system
US4578810A (en) * 1983-08-08 1986-03-25 Itek Corporation System for printed circuit board defect detection
US4794647A (en) * 1985-04-08 1988-12-27 Northern Telecom Limited Automatic optical inspection system
US4776022A (en) * 1985-04-09 1988-10-04 Aoi Systems, Inc. System for printed circuit board defect detection
US4668982A (en) * 1985-06-17 1987-05-26 The Perkin-Elmer Corporation Misregistration/distortion correction scheme
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
US4811410A (en) * 1986-12-08 1989-03-07 American Telephone And Telegraph Company Linescan inspection system for circuit boards
IT1234033B (it) * 1989-03-17 1992-04-24 I M S Internazionale Medico Sc Apparecchiatura per eseguire mammografie
US5012502A (en) * 1990-06-18 1991-04-30 Irt Corporation Method for determining degree of interconnection of solder joints using X-ray inspection

Also Published As

Publication number Publication date
EP0236001B1 (en) 1991-08-28
USRE35423E (en) 1997-01-14
EP0236001A3 (en) 1988-08-10
DE3772411D1 (de) 1991-10-02
JP2790804B2 (ja) 1998-08-27
ATE66744T1 (de) 1991-09-15
JPS62219632A (ja) 1987-09-26
US4809308A (en) 1989-02-28
EP0236001A2 (en) 1987-09-09

Similar Documents

Publication Publication Date Title
KR870008499A (ko) 회로 기판 검사 장치 및 그 방법
US6201850B1 (en) Enhanced thickness calibration and shading correction for automatic X-ray inspection
CA1323453C (en) Automated laminography system for inspection of electronics
US6314201B1 (en) Automatic X-ray determination of solder joint and view delta Z values from a laser mapped reference surface for circuit board inspection using X-ray laminography
JPH02138855A (ja) Ｘ線透過画像によるはんだ付部の検査方法及びその装置
US8077827B2 (en) Method for thickness calibration and measuring thickness of material
US6872949B2 (en) Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method
JPH0663959B2 (ja) 坪量分布を測定する方法および装置
JPH05217689A (ja) Ｘ線撮影装置およびｘ線撮影方法
JP3933548B2 (ja) Ｘ線検査装置、ｘ線検査方法およびｘ線検査制御プログラム
JPH01265145A (ja) Ｘ線検査装置
JP4340373B2 (ja) 接合検査装置、方法、及び接合検査方法を実行するプログラムを記録した記録媒体
JP3308629B2 (ja) Ｘ線ラインセンサ透視装置
JPH06118029A (ja) Ｘ線検査装置およびｘ線検査方法
JP2661577B2 (ja) 半田付け外観検査方法および装置
KR100300586B1 (ko) X－ray를이용한인쇄회로기판의단층검사장치및검사방법
JPH0743329B2 (ja) 内部欠陥検査方法及びその装置
WO2024117099A1 (ja) 検査装置
JP2001153817A (ja) Ｘ線断層撮像装置
JPH0618450A (ja) 平面サンプル用断層撮影装置
JP2889931B2 (ja) 金属材料検査方法及び金属材料検査装置
JP2000249532A (ja) Ｘ線検査方法およびその装置
JPH10227734A (ja) 密度分布測定装置及び方法
JP2001141672A (ja) Ｘ線撮像処理装置
KR100339008B1 (ko) Ｘ-선을 이용한 ｐｃｂ의 단층 검사방법

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal