JPS54143290A - Soldered part inspecting device - Google Patents

Soldered part inspecting device

Info

Publication number
JPS54143290A
JPS54143290A JP5167678A JP5167678A JPS54143290A JP S54143290 A JPS54143290 A JP S54143290A JP 5167678 A JP5167678 A JP 5167678A JP 5167678 A JP5167678 A JP 5167678A JP S54143290 A JPS54143290 A JP S54143290A
Authority
JP
Japan
Prior art keywords
ray
substrate
converter
state
soldered part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5167678A
Other languages
Japanese (ja)
Inventor
Takeshi Sawa
Haruyuki Makino
Hidenori Shinoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP5167678A priority Critical patent/JPS54143290A/en
Publication of JPS54143290A publication Critical patent/JPS54143290A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/18—Investigating the presence of flaws defects or foreign matter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
    • G01N23/02—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material
    • G01N23/06—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption
    • G01N23/083—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by transmitting the radiation through the material and measuring the absorption the radiation being X-rays

Landscapes

  • Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Toxicology (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)

Abstract

PURPOSE:To perform nondestructive inspection easily and in a short time, and enhance the reliability, by radiating X-ray onto printed substrate and judging the state of soldering according to the state of X-ray transmission. CONSTITUTION:A printed substrate 11 is placed on a plane of a base 12. X-ray transmitted from X-ray irradiation apparatus 13 through the substrate 11 is detected by a TV camera 14, and obtained video signals are successively supplied into a converter 15 and an electronic computer 16, which are designed to judge the quality of the soldered parts. The converter 15 quantizes the signals into, for instance, 250 steps according to the strength of signal. The computer 16 stores and processes such picture image data. Thus, approval or rejection of the soldered part in the substrate 11 may be decided.
JP5167678A 1978-04-28 1978-04-28 Soldered part inspecting device Pending JPS54143290A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5167678A JPS54143290A (en) 1978-04-28 1978-04-28 Soldered part inspecting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5167678A JPS54143290A (en) 1978-04-28 1978-04-28 Soldered part inspecting device

Publications (1)

Publication Number Publication Date
JPS54143290A true JPS54143290A (en) 1979-11-08

Family

ID=12893473

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5167678A Pending JPS54143290A (en) 1978-04-28 1978-04-28 Soldered part inspecting device

Country Status (1)

Country Link
JP (1) JPS54143290A (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6079253A (en) * 1983-09-30 1985-05-07 シ−メンス，アクチエンゲゼルシヤフト Method and device for memorizing measuring data from sputtering-crater
EP0236001A2 (en) * 1986-02-20 1987-09-09 Irt Corporation Method and apparatus for performing automated circuit board quality inspection
US4872187A (en) * 1987-02-27 1989-10-03 Hitachi, Ltd. X-ray tomographic imaging system and method
EP0355128A1 (en) * 1987-10-30 1990-02-28 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5081656A (en) * 1987-10-30 1992-01-14 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5259012A (en) * 1990-08-30 1993-11-02 Four Pi Systems Corporation Laminography system and method with electromagnetically directed multipath radiation source
US5493594A (en) * 1988-08-26 1996-02-20 Hitachi, Ltd. Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection
US5836504A (en) * 1994-08-08 1998-11-17 Kabushiki Kaisha Kobe Seiko Sho Method and apparatus for soldering inspection of a surface mounted circuit board

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037899B2 (en) * 1983-09-30 1991-02-04 Siemens Ag
JPS6079253A (en) * 1983-09-30 1985-05-07 シ−メンス，アクチエンゲゼルシヤフト Method and device for memorizing measuring data from sputtering-crater
EP0236001A2 (en) * 1986-02-20 1987-09-09 Irt Corporation Method and apparatus for performing automated circuit board quality inspection
JPS62219632A (en) * 1986-02-20 1987-09-26 アイア−ルテイ−・コ−ポレ−シヨン Apparatus and method for automatic inspection of soldering state of circuit board
US4809308A (en) * 1986-02-20 1989-02-28 Irt Corporation Method and apparatus for performing automated circuit board solder quality inspections
US4872187A (en) * 1987-02-27 1989-10-03 Hitachi, Ltd. X-ray tomographic imaging system and method
US5081656A (en) * 1987-10-30 1992-01-14 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US4926452A (en) * 1987-10-30 1990-05-15 Four Pi Systems Corporation Automated laminography system for inspection of electronics
EP0355128A1 (en) * 1987-10-30 1990-02-28 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5097492A (en) * 1987-10-30 1992-03-17 Four Pi Systems Corporation Automated laminography system for inspection of electronics
US5291535A (en) * 1987-10-30 1994-03-01 Four Pi Systems Corporation Method and apparatus for detecting excess/insufficient solder defects
JPH06100451B2 (en) * 1987-10-30 1994-12-12 フォー・ピー・アイ・システムズ・コーポレーション Automatic laminograph system for electronics inspection.
US5561696A (en) * 1987-10-30 1996-10-01 Hewlett-Packard Company Method and apparatus for inspecting electrical connections
US5621811A (en) * 1987-10-30 1997-04-15 Hewlett-Packard Co. Learning method and apparatus for detecting and controlling solder defects
US5493594A (en) * 1988-08-26 1996-02-20 Hitachi, Ltd. Method and apparatus for inspection of solder joints by x-ray fluoroscopic imaging
US5259012A (en) * 1990-08-30 1993-11-02 Four Pi Systems Corporation Laminography system and method with electromagnetically directed multipath radiation source
US5836504A (en) * 1994-08-08 1998-11-17 Kabushiki Kaisha Kobe Seiko Sho Method and apparatus for soldering inspection of a surface mounted circuit board
US5687209A (en) * 1995-04-11 1997-11-11 Hewlett-Packard Co. Automatic warp compensation for laminographic circuit board inspection

Similar Documents

Publication Publication Date Title
DE3772411D1 (en) METHOD AND DEVICE FOR CARRYING OUT THE GOOD EXAMINATION OF PRINTED CIRCUITS.
JPS54143290A (en) Soldered part inspecting device
JPS6472540A (en) Radiation microscope and method for detecting light emitted from defect in dielectric layer of integrated circuit device
HK1033019A1 (en) Electronic assembly video inspection method
DE69011361D1 (en) Method and device for examining printed circuits.
EP0263473A3 (en) Apparatus for inspecting packaged electronic device
EP0728399A4 (en) Method and apparatus for inspecting printed circuit boards at different magnifications
DE3850889D1 (en) Apparatus for examining a populated electronic device.
KR20040099590A (en) System for analyzing the surface of PCB using RGB color and method thereof
JPS59218938A (en) Method for testing wiring pattern of printed board
JPH0645799A (en) Check device of printed board
JPS6168676A (en) Test method of packaged printed board part
CN112595732B (en) Welding spot quality detection method based on ultra-wideband microwave
JPS58132648A (en) Automatic inspecting method for printed plug board and device thereof
Palees et al. Quality Control of Metallization of Holes of Printed-Circuit Cards Using INTROMET Equipment
JPS5794636A (en) Defect detecting device of disk substrate
JPS63124947A (en) Inspecting method for soldering state
JPS58200141A (en) Inspection of substrate
JPH04348210A (en) Inspecting apparatus of mounted printed board
JPS5398870A (en) Shape inspecting apparatus
JPS5724572A (en) Method and device for inspection of picture defect of solid state image pick up plate
JPH04279808A (en) Paste solder printing condition inspection device
JPS62194700A (en) Inspection of printed board
Palees et al. Quality Control of Metallization of Holes of Printed-Circuit Cards Using INTROMET Equipment[[Previously Titled: Quality Control of the Metallization of Printed circuits With Instruments INTROMET.]]
JPS5492774A (en) Method and apparatus for detecting objects