DE69011361D1 - Method and device for examining printed circuits. - Google Patents

Method and device for examining printed circuits.

Info

Publication number
DE69011361D1
DE69011361D1 DE69011361T DE69011361T DE69011361D1 DE 69011361 D1 DE69011361 D1 DE 69011361D1 DE 69011361 T DE69011361 T DE 69011361T DE 69011361 T DE69011361 T DE 69011361T DE 69011361 D1 DE69011361 D1 DE 69011361D1
Authority
DE
Germany
Prior art keywords
pcb
printed circuits
examining
examining printed
hue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69011361T
Other languages
German (de)
Other versions
DE69011361T2 (en
Inventor
Shigeki Kobayashi
Norihito Yamamoto
Koichi Tanaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp, Omron Tateisi Electronics Co filed Critical Omron Corp
Application granted granted Critical
Publication of DE69011361D1 publication Critical patent/DE69011361D1/en
Publication of DE69011361T2 publication Critical patent/DE69011361T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

Abstract

Disclosed is a method of and apparatus for inspecting a printed circuit board (PCB) for the nature of its soldered parts comprising three ring-shaped light sources which project light of different hues, the highest light source being any hue other than red, to a part mounted on a PCB at different angles and heights from above, a camera to record the reflected images, and a procedure used to check the recorded patterns to determine if the soldering is acceptable.
DE69011361T 1989-03-02 1990-03-01 Method and device for examining printed circuits. Expired - Fee Related DE69011361T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1051317A JPH02231510A (en) 1989-03-02 1989-03-02 Substrate inspection device

Publications (2)

Publication Number Publication Date
DE69011361D1 true DE69011361D1 (en) 1994-09-15
DE69011361T2 DE69011361T2 (en) 1995-04-27

Family

ID=12883540

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69011361T Expired - Fee Related DE69011361T2 (en) 1989-03-02 1990-03-01 Method and device for examining printed circuits.

Country Status (5)

Country Link
US (1) US5032735A (en)
EP (1) EP0385474B1 (en)
JP (1) JPH02231510A (en)
AT (1) ATE109895T1 (en)
DE (1) DE69011361T2 (en)

Families Citing this family (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE68929062T2 (en) * 1988-05-09 2000-03-16 Omron Tateisi Electronics Co Device for testing printed circuit boards
JP2953736B2 (en) * 1990-03-20 1999-09-27 松下電器産業株式会社 Solder shape inspection method
DE4139189C2 (en) * 1990-11-29 2003-08-28 Matsushita Electric Ind Co Ltd Device for optical solder joint testing
JP3113731B2 (en) * 1991-05-17 2000-12-04 キヤノン株式会社 Component mounting inspection method, inspection device thereof, and substrate inspected by the inspection device
JP3015185B2 (en) * 1992-01-28 2000-03-06 日本鋼管株式会社 Measuring device for degree of alloying of galvanized steel sheet
US5424838A (en) * 1993-03-01 1995-06-13 Siu; Bernard Microelectronics inspection system
US5302836A (en) * 1992-07-16 1994-04-12 Bernard Siu High speed image acquisition for microelectronics inspection
TW401008U (en) 1993-04-21 2000-08-01 Omron Tateisi Electronics Co Visual inspection support device and substrate inspection device
US5923430A (en) * 1993-06-17 1999-07-13 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
US5844249A (en) * 1993-12-24 1998-12-01 Hoechst Aktiengesellschaft Apparatus for detecting defects of wires on a wiring board wherein optical sensor includes a film of polymer non-linear optical material
DE9401711U1 (en) * 1994-02-02 1995-06-01 Kratzer Automatisierung Gmbh Imaging device
WO1997002465A1 (en) * 1995-06-30 1997-01-23 Ultrapointe Corporation Method for characterizing defects on semiconductor wafers
JP3322801B2 (en) * 1996-08-01 2002-09-09 三井金属鉱業株式会社 Resist scattering inspection apparatus and method
KR19980039100A (en) * 1996-11-27 1998-08-17 배순훈 Uninserted inspection device and method using the clinching direction of parts
US6148114A (en) * 1996-11-27 2000-11-14 Ultrapointe Corporation Ring dilation and erosion techniques for digital image processing
DE19709939A1 (en) * 1997-03-11 1998-09-17 Atg Test Systems Gmbh Method and device for testing printed circuit boards
US6118540A (en) * 1997-07-11 2000-09-12 Semiconductor Technologies & Instruments, Inc. Method and apparatus for inspecting a workpiece
US6072898A (en) 1998-01-16 2000-06-06 Beaty; Elwin M. Method and apparatus for three dimensional inspection of electronic components
JP4332656B2 (en) * 1998-01-26 2009-09-16 ラトックシステムエンジニアリング株式会社 Defect inspection method and defect inspection apparatus
JPH11237210A (en) * 1998-02-19 1999-08-31 Komatsu Ltd Inspecting equipment of semiconductor package
KR100281881B1 (en) 1998-07-01 2001-02-15 윤종용 cream solder inspection apparatus and the method thereof
TW495060U (en) * 1998-07-24 2002-07-11 Inventec Corp Brightness test device of liquid crystal display panel
KR100345001B1 (en) * 1998-08-27 2002-07-19 삼성전자 주식회사 Illuminating and optical apparatus for inspecting the welding state of printed circuit board
SE514859C2 (en) * 1999-01-18 2001-05-07 Mydata Automation Ab Method and apparatus for examining objects on a substrate by taking pictures of the substrate and analyzing them
US6552783B1 (en) * 2000-06-28 2003-04-22 Teradyne, Inc. Optical system
KR100465785B1 (en) * 2000-07-14 2005-01-13 삼성전자주식회사 Apparatus for inspecting PCB soldering
EP1220596A1 (en) * 2000-12-29 2002-07-03 Icos Vision Systems N.V. A method and an apparatus for measuring positions of contact elements of an electronic component
DE10128476C2 (en) * 2001-06-12 2003-06-12 Siemens Dematic Ag Optical sensor device for the visual detection of substrates
JP3551188B2 (en) * 2002-01-10 2004-08-04 オムロン株式会社 Surface condition inspection method and substrate inspection device
US7019826B2 (en) * 2003-03-20 2006-03-28 Agilent Technologies, Inc. Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection
US7352892B2 (en) * 2003-03-20 2008-04-01 Micron Technology, Inc. System and method for shape reconstruction from optical images
US20040184653A1 (en) * 2003-03-20 2004-09-23 Baer Richard L. Optical inspection system, illumination apparatus and method for use in imaging specular objects based on illumination gradients
US7171037B2 (en) * 2003-03-20 2007-01-30 Agilent Technologies, Inc. Optical inspection system and method for displaying imaged objects in greater than two dimensions
KR100557526B1 (en) * 2003-05-19 2006-03-03 삼성전기주식회사 System for analyzing the surface of PCB using RGB color and method thereof
JP3867724B2 (en) * 2004-02-27 2007-01-10 オムロン株式会社 Surface condition inspection method, surface condition inspection apparatus and substrate inspection apparatus using the method
US20060086773A1 (en) * 2004-10-27 2006-04-27 Sanftleben Henry M Technique for optical inspection system verification
JP4123271B2 (en) * 2005-11-28 2008-07-23 船井電機株式会社 LCD module brightness measuring device
JP4978424B2 (en) * 2007-10-25 2012-07-18 オムロン株式会社 Inspection result confirmation method and inspection result confirmation system for component mounting inspection
JP4510066B2 (en) 2007-11-06 2010-07-21 日東電工株式会社 Wiring circuit board manufacturing method and inspection method
US8077307B2 (en) * 2008-04-09 2011-12-13 Orbotech Ltd. Illumination system for optical inspection
JP2010177628A (en) * 2009-02-02 2010-08-12 Omron Corp Method and system for settling inspection result of mounted component
JP6115012B2 (en) * 2011-08-30 2017-04-19 富士通株式会社 Inspection device, inspection method, and inspection program
US9933371B2 (en) * 2014-01-08 2018-04-03 Yamaha Hatsudoki Kabushiki Kaisha Visual inspection apparatus and visual inspection method
CN106226326B (en) * 2016-08-24 2019-09-24 环旭电子股份有限公司 The method and system for detecting SIP mould group surface defect, revealing copper surface defect
US20190227002A1 (en) * 2018-01-24 2019-07-25 Corning Incorporated Apparatus and methods for inspecting damage intensity
CN108490332B (en) * 2018-02-02 2021-01-08 深圳麦逊电子有限公司 Automatic micro-needle testing jig
JP7087533B2 (en) * 2018-03-26 2022-06-21 住友電気工業株式会社 Surface condition inspection device and surface condition inspection method
KR102112053B1 (en) * 2018-08-01 2020-05-18 주식회사 뷰온 An Apparatus and Method for Inspecting Surface Defect using Image Sensor
US20220252524A1 (en) * 2019-07-26 2022-08-11 Fuji Corporation Inspection device
US11282187B2 (en) * 2019-08-19 2022-03-22 Ricoh Company, Ltd. Inspection system, inspection apparatus, and method using multiple angle illumination
CN114295627B (en) * 2021-12-31 2022-10-18 广东炬森智能装备有限公司 Full-automatic detection device and detection method for flexible circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5792989A (en) * 1980-12-01 1982-06-09 Kiyoshi Nagata Transmission and receiving system for stereoscopic color television
US4500203A (en) * 1982-09-30 1985-02-19 Owens-Illinois, Inc. Method and apparatus for inspecting articles
JPS61293657A (en) * 1985-06-21 1986-12-24 Matsushita Electric Works Ltd Method for inspecting soldering appearance
JPH0619243B2 (en) * 1985-09-19 1994-03-16 株式会社トプコン Coordinate measuring method and apparatus thereof
JPS62127617A (en) * 1985-11-29 1987-06-09 Fujitsu Ltd Inspecting instrument for linear body
EP0236738A3 (en) * 1986-02-05 1988-12-21 OMRON Corporation Input method for reference printed circuit board assembly data to an image processing printed circuit board assembly automatic inspection apparatus
JPS62194444A (en) * 1986-02-17 1987-08-26 Omron Tateisi Electronics Co Apparatus for inspecting parts mounting board
US4876455A (en) * 1988-02-25 1989-10-24 Westinghouse Electric Corp. Fiber optic solder joint inspection system
DE68929062T2 (en) * 1988-05-09 2000-03-16 Omron Tateisi Electronics Co Device for testing printed circuit boards
JP2688361B2 (en) * 1988-08-02 1997-12-10 正己 山川 Photoelectric sensor
EP0370527B1 (en) * 1988-11-24 1994-02-02 Omron Tateisi Electronics Co. Method of and apparatus for inspecting substrate
JPH0745971B2 (en) * 1992-10-15 1995-05-17 リンナイ株式会社 Automatic bath equipment

Also Published As

Publication number Publication date
DE69011361T2 (en) 1995-04-27
EP0385474A3 (en) 1991-09-04
EP0385474B1 (en) 1994-08-10
JPH02231510A (en) 1990-09-13
US5032735A (en) 1991-07-16
EP0385474A2 (en) 1990-09-05
ATE109895T1 (en) 1994-08-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee