GB8729387D0 - Printed circuit board & method for inspecting printed circuit boards for missing/misplaced components - Google Patents

Printed circuit board & method for inspecting printed circuit boards for missing/misplaced components

Info

Publication number
GB8729387D0
GB8729387D0 GB878729387A GB8729387A GB8729387D0 GB 8729387 D0 GB8729387 D0 GB 8729387D0 GB 878729387 A GB878729387 A GB 878729387A GB 8729387 A GB8729387 A GB 8729387A GB 8729387 D0 GB8729387 D0 GB 8729387D0
Authority
GB
United Kingdom
Prior art keywords
printed circuit
missing
circuit board
inspecting
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878729387A
Other versions
GB2211667A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB8729387D0 publication Critical patent/GB8729387D0/en
Publication of GB2211667A publication Critical patent/GB2211667A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/168—Wrong mounting prevention
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
  • Inspection Of Paper Currency And Valuable Securities (AREA)
GB8729387A 1986-12-29 1987-12-16 Method for inspecting printed circuit boards for missing or misplaced components Withdrawn GB2211667A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US94731686A 1986-12-29 1986-12-29

Publications (2)

Publication Number Publication Date
GB8729387D0 true GB8729387D0 (en) 1988-01-27
GB2211667A GB2211667A (en) 1989-07-05

Family

ID=25485947

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8729387A Withdrawn GB2211667A (en) 1986-12-29 1987-12-16 Method for inspecting printed circuit boards for missing or misplaced components

Country Status (4)

Country Link
JP (1) JPS63177600A (en)
KR (1) KR880008731A (en)
CN (1) CN87108179A (en)
GB (1) GB2211667A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833521B2 (en) * 1995-05-18 1998-12-09 日本電気株式会社 Wiring board
US6190759B1 (en) 1998-02-18 2001-02-20 International Business Machines Corporation High optical contrast resin composition and electronic package utilizing same
US7248355B2 (en) * 2004-09-13 2007-07-24 Hewlett-Packard Development Company, L.P. Using special visibility materials proximate candidate component locations to enhance recognition
JP4834449B2 (en) * 2006-04-18 2011-12-14 富士機械製造株式会社 Electronic component mounting head and electronic component mounting apparatus
US10420269B2 (en) * 2013-09-17 2019-09-17 Fuji Corporation Mounting inspection device
CN103969265A (en) * 2014-03-26 2014-08-06 宋剑锋 Application method of ultraviolet light in circuit board overhauling station
CN103886156B (en) * 2014-03-28 2017-02-01 无锡市同步电子科技有限公司 Method for inspecting dislocation of bit numbers and devices in PCB designs
CN104570424B (en) * 2015-01-30 2017-12-22 京东方科技集团股份有限公司 The assemble method and assembling equipment of liquid crystal display die set
KR20180015983A (en) * 2016-08-04 2018-02-14 주식회사 고영테크놀러지 Apparatus and method for inspection and correction of faults on a printed circuit board
CN110012613B (en) * 2019-03-27 2022-04-05 阳程（佛山）科技有限公司 Single or multiple PCS PCB or FPC serial line calibration and positioning tin printing method
US20240032199A1 (en) 2020-12-01 2024-01-25 Signfy Holding B.V. A method for making a lighting device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL45626A (en) * 1973-10-09 1976-10-31 Hughes Aircraft Co Hybrid microcircuit fabrication aid
JPS5726379Y2 (en) * 1978-09-21 1982-06-08
JPS55156482U (en) * 1979-04-26 1980-11-11

Also Published As

Publication number Publication date
CN87108179A (en) 1988-07-27
GB2211667A (en) 1989-07-05
JPS63177600A (en) 1988-07-21
KR880008731A (en) 1988-08-31

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)