CN103886156B - Method for inspecting dislocation of bit numbers and devices in PCB designs - Google Patents
Method for inspecting dislocation of bit numbers and devices in PCB designs Download PDFInfo
- Publication number
- CN103886156B CN103886156B CN201410124276.0A CN201410124276A CN103886156B CN 103886156 B CN103886156 B CN 103886156B CN 201410124276 A CN201410124276 A CN 201410124276A CN 103886156 B CN103886156 B CN 103886156B
- Authority
- CN
- China
- Prior art keywords
- item
- array
- dislocation
- pcb
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000013461 design Methods 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000007689 inspection Methods 0.000 claims abstract description 22
- 239000006185 dispersion Substances 0.000 claims description 5
- 230000000052 comparative effect Effects 0.000 claims description 3
- 238000013507 mapping Methods 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 238000001514 detection method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 208000010086 Hypertelorism Diseases 0.000 description 2
- 206010020771 Hypertelorism of orbit Diseases 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000012937 correction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Abstract
The invention discloses a method for inspecting dislocation of bit numbers and devices in PCB designs. The method is characterized in that the devices or the bit numbers in the designs are selected and grouped according to the intervals between the devices or the bit numbers, and the intelligent grouping mode is more similar to layout and the industry habit for adjusting the bit numbers and user receiving standards; the bit numbers and the devices are rapidly matched through the coordinate value fuzzy means, two-dimensional indexes are mapped for the bit numbers and the devices respectively, it can be avoided that inspecting can not be conducted due to the fact that the distance between the devices and the bit numbers is too large, various dislocation situations can be inspected, and accurate positioning can be achieved when results are displayed. By the adoption of the method, the bit numbers in each design can be inspected within 20 seconds in average, time and labor are saved, accuracy is high, and the missing inspection phenomenon does not exist.
Description
Technical field
The present invention relates to pcb technical field of circuit design, the inspection of device item dislocation in more particularly, to a kind of pcb design
Method.
Background technology
Pcb (printed circuit board), Chinese is printed circuit board, also known as printed circuit board (PCB), track
Road plate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.Now
Pcb design develops towards high speed, highdensity direction, and competition is also increasingly fierce.Pcb plate becomes increasingly complex, and it carries above
Device encapsulation number is also more and more huger, in the device layout of pcb, always has carelessness unavoidably, by the item mark of device in pcb
Wrong position, causes a hidden trouble for debugging later, production, test etc., and item misplaces sometimes for paying huge cost, seriously then
Burn out integrated chip.Therefore, the inspection of pcb item is requisite program, but does not have effective item reviewing party at present
Method, main or rely on quality inspection Shi Jinhang manpower investigation, the item inspection of averagely every kind of design need to consume 30 minutes, time-consuming takes
Power, and accuracy rate is low, when have detection leakage phenomenon to occur.
Content of the invention
It is an object of the invention to the inspection method that in designing by a kind of pcb, device item misplaces, to solve above back of the body
The problem that scape technology segment is mentioned.
For reaching this purpose, the present invention employs the following technical solutions:
The inspection method of device item dislocation in a kind of pcb design, it comprises the steps:
A, the integrated device to many pins and adapter individually select and shield；
B, screening item information are simultaneously categorized as the overall array of front item and the overall array of reverse side item；
C, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and reverse side item are total
Body array is referred to as item array；
D, backup item array are as interim groups of operands；
E, take one of interim groups of operands item successively, and be worth the amount of outward expansion at least preset value with character boundary
Do recurrence in pcb plate face to select, wherein, preset value size is different because of the difference of design specification or unit；
F, judge the number of selector, if the number of recurrence device is not less than 2, sets up recurrence two-dimensional array, deposit by group
Enter new item array, and delete the item of selection, update interim groups of operands, otherwise this item is added discrete array,
And delete this item, return to step d from interim groups of operands；
The final interim groups of operands of g, process is discrete array, and adapter and integrated device element are inserted array；
Take each group of item array, mapping device array successively；
H, it is each group of item array according to cartesian coordinate system and dispersion number group sets up item two-dimensional array and device two
Dimension array, with described preset value as radix, is obscured the coordinate figure of device and item by the multiple of preset value；
I, generation index ranks identical item two-dimensional array and device two-dimensional array；
J, the item index of more every group of device and device index, storage comparative result；
K, choose whether as needed according to above-mentioned steps, in the way of device recurrence selects, reexamine dislocation；
L, the item collecting dislocation and device, and export dislocation report.
Especially, described step c specifically includes: the device item to the front of pcb plate and the device item difference of reverse side
Process, select all items when front face with the overall mode selecting, and be front item and reverse side item sets up one-dimensional position
Count group is the overall array of front item and the overall array of reverse side item.
Especially, described step d specifically includes: backup item array is as interim groups of operands, and is each item
Set up one and item border of the same size, wherein, described border is rectangle.
Especially, described step h specifically includes: is each group of item according to cartesian coordinate system according to cartesian coordinate system
Array and dispersion number group set up item two-dimensional array and device two-dimensional array, with 5mil as radix, respectively item and device are entered
Row coordinate Fuzzy Processing, with 5mil as radix, is obscured the coordinate figure of device and item by the multiple of 5mil, until it has identical
Line number or columns, if last still no ranks mate, judge dislocation.
Especially, also include before described step k: to single file, the device of single-row item or multiple lines and multiple rows is indexed comparing
Right, and record all items not corresponded or device.
The method that in pcb design proposed by the present invention, the inspection method of device item dislocation uses recurrence to select is according to device
Or the spacing of item is selected to the device in design or item and is grouped, this intelligent packet mode is closer to layout and tune
The usage of trade of whole item and user receive standard；With coordinate figure obfuscation means Rapid matching item and device, it is item
And device maps 2-d index respectively, situation about cannot check because of device and item hypertelorism can be avoided, also can check
Various misalignment, can accurately position when result shows.The present invention averagely to the item inspection of every kind of design 20 seconds with
Interior can complete (because machine performance is different slightly difference), time saving and energy saving, and accuracy rate is high, no detection leakage phenomenon.
Brief description
Fig. 1 is the inspection method flow chart of device item dislocation in pcb design provided in an embodiment of the present invention.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.It is understood that tool described herein
Body embodiment is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, for the ease of retouching
State, in accompanying drawing, illustrate only part related to the present invention rather than full content.
Refer to shown in Fig. 1, Fig. 1 is the inspection method of device item dislocation in pcb design provided in an embodiment of the present invention
Flow chart.
In pcb design in the present embodiment, the inspection method of device item dislocation specifically includes following steps:
Step s101, the integrated device to many pins and adapter individually select and shield.Such devices quantity is few, takies
Area ratio is big, can produce interference, it is shielded and is included into discrete array, can improve the accurate of inspection during to device recurrence
Property.
Step s102, screening item information are simultaneously categorized as the overall array of front item and the overall array of reverse side item.
Step s103, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and anti-
Item overall array in face is referred to as item array.
The device item of the device item to the front of pcb plate and reverse side is processed respectively, is selected with the overall mode selecting
All items when front face, and for front item and reverse side item set up one-dimensional item array be the overall array of front item and
The overall array of reverse side item.
Step s104, backup item array are as interim groups of operands.Back up item array as interim groups of operands, and
Set up one and item border of the same size for item, be rectangle in border described in the present embodiment.
Step s105, take one of interim groups of operands item successively, and at least pre- with character boundary value outward expansion
If the amount of value is done recurrence in pcb plate face and selected, wherein, preset value size is different because of the difference of design specification or unit.
Item and device are a kind of relations of succession, think that item is the subassembly of device in the present invention, and device is
Father's part.During recurrence selects, go to select with the amount of character boundary extension at least preset value for boundary.Preset value size
Different because of the difference of design specification or unit, in the present embodiment, preset value selects 5mil (mil).
Step s106, judge the number of selector, if the number of recurrence device is not less than 2, set up recurrence two-dimemsional number
Group, is stored in new item array by group, and deletes the item of selection, updates interim groups of operands, otherwise adds this item
Discrete array, and delete this item, return to step s104 from interim groups of operands.
The final interim groups of operands of step s107, process is discrete array, and adapter and integrated device element are inserted
Enter array；Take each group of item array, mapping device array successively.
Step s108, according to cartesian coordinate system for each group of item array and dispersion number group set up item two-dimensional array and
Device two-dimensional array, with described preset value as radix, is obscured the coordinate figure of device and item by the multiple of preset value.
According to cartesian coordinate system and grouped item and corresponding device correspond to each group of item array and from
Scattered array sets up item two-dimensional array and device two-dimensional array, with 5mil as radix, carries out coordinate mould to item and device respectively
Paste is processed, and with 5mil as radix, obscures the coordinate figure of device and item by the multiple of 5mil, until it has identical line number or row
Number, if last still no ranks mate, judges dislocation.To single file, the device of single-row item or multiple lines and multiple rows is indexed comparing,
And record all items not corresponded or device.
Obscure stage, the height typically at least 30mil of item in coordinate, obscured for radix with 5mil, not only can
Avoid floating-point operation, be also to take into account efficiency and computer (pc) performance simultaneously.Coordinate obscures initially, first the coordinate of device is entered
Row 2*5mil obscures, and this step excludes manual mask placement device coordinate offset, and 2*5mil is to take into account the minimum dimension of device simultaneously.So
Afterwards the ranks value of device and item is compared, if silk-screen line number be more than device line number, the fuzzy quantity doubling, that is,
5mil.Equally, line number or the more object of columns will be blurred, and this step is prevented effectively from missing inspection, if item adjustment specification, should
Step can check any dislocation.
Step s109, generation index ranks identical item two-dimensional array and device two-dimensional array.
Step s1010, the item index of more every group of device and device index, storage comparative result.
It is to be operated in the way of indexing strict comparison in the index check and correction stage, any index not corresponded all will be registered as
Dislocation, it is to avoid any missing inspection, improves and checks accuracy.
Step s1011, choose whether as needed according to above-mentioned steps, in the way of device recurrence selects, reexamine mistake
Position.
If pcb device layout is sparse in design, or device size is much larger than the size of character, the then mode of device recurrence
Going is device and item is grouped, and compensate for the excessive recurrence of item spacing and selects inaccurate phenomenon.Because of continuing of device and item
Hold relation, can be arbitrarily with device or item for recurrence object, same design increased test mode, and improve result can
By property.
Step s1012, the item collecting dislocation and device, and export dislocation report.
Technical scheme is selected to the device in design or item according to the spacing of device or item and is divided
Group, this intelligent packet mode receives standard closer to the usage of trade of layout and adjustment item and user；With coordinate figure mould
Gelatinizing means Rapid matching item and device, are item and device maps 2-d index respectively, can avoid because of device and item
Hypertelorism and situation about cannot check, also can check various misalignment, can accurately position when result shows.The present invention
The average item inspection to every kind of design can complete (because machine performance is different slightly difference) within 20 seconds, and save time province
Power, and accuracy rate is high, no detection leakage phenomenon.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore although being carried out to the present invention by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
Other Equivalent embodiments more can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (5)
1. the inspection method that in a kind of pcb design, device item misplaces is it is characterised in that comprise the steps:
A, the integrated device to many pins and adapter individually select and shield；
B, screening item information are simultaneously categorized as the overall array of front item and the overall array of reverse side item；
C, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and reverse side item totally count
Group is referred to as item array；
D, backup item array are as interim groups of operands；
E, take one of interim groups of operands item successively, and the amount being worth outward expansion at least preset value with character boundary exists
Pcb plate face is done recurrence and is selected, and wherein, preset value size is different because of the difference of design specification or unit；
F, judge the number of selector, if the number of recurrence device is not less than 2, sets up recurrence two-dimensional array, be stored in newly by group
Item array, and delete the item of selection, update interim groups of operands, otherwise this item is added discrete array, and from
This item, return to step d is deleted in interim groups of operands；
The final interim groups of operands of g, process is discrete array, and adapter and integrated device element are inserted array；Successively
Take each group of item array, mapping device array；
H, it is that each group of item array and dispersion number group set up item two-dimensional array and device two dimension battle array according to cartesian coordinate system
Row, with described preset value as radix, are obscured the coordinate figure of device and item by the multiple of preset value；
I, generation index ranks identical item two-dimensional array and device two-dimensional array；
J, the item index of more every group of device and device index, storage comparative result；
K, choose whether as needed by device recurrence select in the way of reexamine dislocation；
L, the item collecting dislocation and device, and export dislocation report.
2. in pcb according to claim 1 design the inspection method of device item dislocation it is characterised in that described step c
Specifically include: the device item to the front of pcb plate and the device item of reverse side are processed respectively, selected with the overall mode selecting
All items when front face, and for front item and reverse side item set up one-dimensional item array be the overall array of front item and
The overall array of reverse side item.
3. in pcb according to claim 1 design the inspection method of device item dislocation it is characterised in that described step d
Specifically include: backup item array as interim groups of operands, and for each item set up one of the same size with item
Border, wherein, described border is rectangle.
4. in the pcb design according to one of claims 1 to 3 the inspection method of device item dislocation it is characterised in that institute
State step h to specifically include: according to cartesian coordinate system for each group of item array and dispersion number group set up item two-dimensional array and
Device two-dimensional array, with 5mil as radix, carries out coordinate Fuzzy Processing to item and device respectively, with 5mil as radix, presses
The multiple of 5mil obscures the coordinate figure of device and item, until it has identical line number or columns, if last still no ranks mate,
Then judge dislocation.
5. in pcb according to claim 4 design the inspection method of device item dislocation it is characterised in that described step k
Also include: to single file, the device of single-row item or multiple lines and multiple rows is indexed comparing, and records all items not corresponded before
Or device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410124276.0A CN103886156B (en) | 2014-03-28 | 2014-03-28 | Method for inspecting dislocation of bit numbers and devices in PCB designs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410124276.0A CN103886156B (en) | 2014-03-28 | 2014-03-28 | Method for inspecting dislocation of bit numbers and devices in PCB designs |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103886156A CN103886156A (en) | 2014-06-25 |
| CN103886156B true CN103886156B (en) | 2017-02-01 |
Family
ID=50955047
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410124276.0A Active CN103886156B (en) | 2014-03-28 | 2014-03-28 | Method for inspecting dislocation of bit numbers and devices in PCB designs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103886156B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110633177A (en) * | 2018-06-25 | 2019-12-31 | 中兴通讯股份有限公司 | Method and device for acquiring equipment information, server and storage medium |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87108179A (en) * | 1986-12-29 | 1988-07-27 | 莫托罗拉公司 | Check that printed substrate has the method for omitting or misplacing element |
| CN101959370A (en) * | 2010-10-12 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Method for preventing marking position numbers of devices in wrong positions in PCB |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02164000A (en) * | 1988-12-16 | 1990-06-25 | Tdk Corp | Correction of dislocation of mounted electronic component |
| US20030025906A1 (en) * | 2001-08-06 | 2003-02-06 | Beamworks Ltd. | Optical inspection of solder joints |
-
2014
- 2014-03-28 CN CN201410124276.0A patent/CN103886156B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87108179A (en) * | 1986-12-29 | 1988-07-27 | 莫托罗拉公司 | Check that printed substrate has the method for omitting or misplacing element |
| CN101959370A (en) * | 2010-10-12 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Method for preventing marking position numbers of devices in wrong positions in PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103886156A (en) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11719648B2 (en) | Method for smart conversion and calibration of coordinate | |
| CN102930114B (en) | Electronic product EDA designs the visible detection method of manufacturability | |
| CN103681988B (en) | A kind of LED standard square sheet and preparation method thereof | |
| CN109946319A (en) | Printed circuit board checking device, determine screen process press defect type method and computer can interpretation recording medium | |
| CN102683165B (en) | Intelligent defect screening and sampling method | |
| CN110222381B (en) | Method, system, medium and terminal for generating dynamic installation guide file for PCB assembly | |
| CN108694265A (en) | Intelligent pre-diagnosis system and method for failure risk of design layout | |
| CN106093050A (en) | A kind of for intelligent electric energy meter PCB encapsulation, the automatic checkout system of components and parts | |
| CN104459366A (en) | Electronic device, efficiency classification system and method, and voltage automatic correction system | |
| CN108133103A (en) | A kind of Electronic Design DFM detecting systems, method and medium | |
| CN109048313A (en) | The screw locking method and device of a kind of electronic equipment | |
| CN103886156B (en) | Method for inspecting dislocation of bit numbers and devices in PCB designs | |
| CN108984575A (en) | A kind of three dimension system IC wafers test probe station data structure store method | |
| CN108037433B (en) | Screening method and device for integrated circuit test data | |
| CN103645197B (en) | The detection method of chip defect | |
| CN117234825A (en) | Intelligent testing system for touch performance of medium-and-large-size touch screen | |
| CN104637833A (en) | Crystal grain selection method and bad crystal map generation method | |
| CN108811483A (en) | Populated circuit board detecting system and populated circuit board detection method | |
| CN1979500A (en) | Part arrangement automatical checking system and method | |
| CN103116617A (en) | Processing method of integrated circuit testing data | |
| CN106226637A (en) | A kind of Short method of testing | |
| CN103793544B (en) | System and method for analyzing of defect position | |
| CN109409664A (en) | A kind of design specification detection method and system | |
| CN206517662U (en) | Edges of boards wad cutter error-proof structure | |
| CN203519782U (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: No. 11-3 Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee after: Wuxi Synchronous Electronic Technology Co.,Ltd. Guo jiahuodiqu after: Zhong Guo Address before: Room C508, No. 18 Qingyuan Road, Wuxi National High tech Industrial Development Zone, Wuxi City, Jiangsu Province, 214135 Patentee before: P.C.B.A. ELECTRONIC (WUXI) LTD. Guo jiahuodiqu before: Zhong Guo |
|
| CP03 | Change of name, title or address |