CN103886156A - Method for inspecting dislocation of bit numbers and devices in PCB designs - Google Patents
Method for inspecting dislocation of bit numbers and devices in PCB designs Download PDFInfo
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- CN103886156A CN103886156A CN201410124276.0A CN201410124276A CN103886156A CN 103886156 A CN103886156 A CN 103886156A CN 201410124276 A CN201410124276 A CN 201410124276A CN 103886156 A CN103886156 A CN 103886156A
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- 238000013461 design Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000007689 inspection Methods 0.000 claims abstract description 20
- 239000006185 dispersion Substances 0.000 claims description 6
- 230000000052 comparative effect Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims description 3
- 238000010168 coupling process Methods 0.000 claims description 3
- 238000005859 coupling reaction Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 238000012216 screening Methods 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 3
- 208000010086 Hypertelorism Diseases 0.000 description 2
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- 238000012360 testing method Methods 0.000 description 2
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Abstract
The invention discloses a method for inspecting dislocation of bit numbers and devices in PCB designs. The method is characterized in that the devices or the bit numbers in the designs are selected and grouped according to the intervals between the devices or the bit numbers, and the intelligent grouping mode is more similar to layout and the industry habit for adjusting the bit numbers and user receiving standards; the bit numbers and the devices are rapidly matched through the coordinate value fuzzy means, two-dimensional indexes are mapped for the bit numbers and the devices respectively, it can be avoided that inspecting can not be conducted due to the fact that the distance between the devices and the bit numbers is too large, various dislocation situations can be inspected, and accurate positioning can be achieved when results are displayed. By the adoption of the method, the bit numbers in each design can be inspected within 20 seconds in average, time and labor are saved, accuracy is high, and the missing inspection phenomenon does not exist.
Description
Technical field
The present invention relates to PCB circuit design technique field, relate in particular to the inspection method of device item dislocation in a kind of PCB design.
Background technology
PCB (Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed-wiring board (PWB), is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.PCB design is now towards high speed, highdensity future development, and competition is also day by day fierce.Pcb board becomes increasingly complex, the device package number that it carries is above also more and more huger, in the time of the device layout of PCB, always there is unavoidably carelessness, the item of device in PCB is mislabeled to position, for debugging afterwards, production, test etc. cause a hidden trouble, item dislocation needs to pay huge cost sometimes, seriously burns out integrated chip.Therefore, the PCB item inspection program that is absolutely necessary, but do not have at present effective item inspection method, mainly still rely on quality inspection Shi Jinhang manpower investigation, the item inspection of average every kind of design need consume 30 minutes, wastes time and energy, and accuracy rate is low, time have undetected phenomenon to occur.
Summary of the invention
The object of the invention is to, by the inspection method of device item dislocation in a kind of PCB design, solve the problem that above background technology part is mentioned.
For reaching this object, the present invention by the following technical solutions:
An inspection method for device item dislocation in PCB design, it comprises the steps:
A, integrated device and connector to many pins are selected and are shielded separately;
B, screening item information are also categorized as the overall array of front item and the overall array of reverse side item;
C, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and the overall array of reverse side item are referred to as item array;
D, backup item array are as interim groups of operands;
E, get an item in interim groups of operands successively, and outwards expand at least the amount of preset value with character boundary value and do recurrence at pcb board face and select, wherein, preset value size because of the difference of design specifications or unit different;
F, judge the number of selector, if being not less than 2, the number of recurrence device sets up recurrence two-dimensional array, deposit new item array in by group, and delete the item selected, upgrade interim groups of operands, otherwise this item is added to discrete array, and delete this item from interim groups of operands, return to step D;
G, to process final interim groups of operands be discrete array, and connector and integrated device element are inserted to array; Get successively each group item data group, mapper number of packages group;
H, be that each group item array and dispersion number are set up vertical item two-dimensional array and device two-dimensional array according to Cartesian coordinates, take described preset value as radix, by the coordinate figure of the fuzzy device of the multiple of preset value and item;
I, item two-dimensional array and device two-dimensional array that generating indexes ranks are identical;
The item index of J, more every group of device and device index, storage comparative result;
K, as required select whether according to above-mentioned steps, with device recurrence select mode reexamine dislocation;
L, the item that gathers dislocation and device, and output borrow report.
Especially, described step C specifically comprises: the positive device item to pcb board and the device item of reverse side are processed respectively, select all items when front face by the mode that entirety is selected, and to set up one dimension item array for front item and reverse side item be the overall array of front item and the overall array of reverse side item.
Especially, described step D specifically comprises: back up item array as interim groups of operands, and set up one and item border of the same size for each item, wherein, described border is rectangle.
Especially, described step H specifically comprises: be that each group item array and dispersion number are set up vertical item two-dimensional array and device two-dimensional array according to cartesian coordinate system according to Cartesian coordinates, take 5mil as radix, respectively item and device are carried out to coordinate Fuzzy Processing, take 5mil as radix, by the coordinate figure of the fuzzy device of the multiple of 5mil and item, until it has identical line number or columns, if finally, still without ranks coupling, judge dislocation.
Especially, before described step K, also comprise: the device to the single-row item of single file or multiple lines and multiple rows carries out index comparison, and records all items that do not conform to or device.
The inspection method that in the PCB design that the present invention proposes, device item misplaces is used the method that recurrence is selected according to the spacing of device or item, device or item in design are selected and divided into groups, and the usage of trade and user that this intelligent packet mode more approaches layout and adjustment item receive standard; Use coordinate figure obfuscation means Rapid matching item and device, for item and device shine upon respectively 2-d index, can avoid the situation that cannot check because of device and item hypertelorism, also can check various misalignment, in the time that result shows, can accurately locate.The present invention on average to the item inspection of every kind of design in 20 seconds, can complete (because of machine performance different slightly variant), time saving and energy saving, and accuracy rate is high, without undetected phenomenon.
Accompanying drawing explanation
The inspection method process flow diagram of device item dislocation during the PCB that Fig. 1 provides for the embodiment of the present invention designs.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.Be understandable that, specific embodiment described herein is only for explaining the present invention, but not limitation of the invention.It also should be noted that, for convenience of description, in accompanying drawing, only show part related to the present invention but not full content.
Please refer to shown in Fig. 1 the inspection method process flow diagram of device item dislocation during the PCB that Fig. 1 provides for the embodiment of the present invention designs.
In the present embodiment, in PCB design, the inspection method of device item dislocation specifically comprises the steps:
Step S101, integrated device and connector to many pins are selected and are shielded separately.Such devices quantity is few, and area occupied ratio is large, during to device recurrence, can produce interference, to its shielding and be included into discrete array, can improve the accuracy of inspection.
Step S102, screening item information are also categorized as the overall array of front item and the overall array of reverse side item.
Step S103, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and the overall array of reverse side item are referred to as item array.
Positive device item to pcb board and the device item of reverse side are processed respectively, select all items when front face by the mode that entirety is selected, and to set up one dimension item array for front item and reverse side item be the overall array of front item and the overall array of reverse side item.
Step S104, backup item array are as interim groups of operands.Backing up item array as interim groups of operands, and set up one and item border of the same size for item, is rectangle in border described in the present embodiment.
Step S105, get an item in interim groups of operands successively, and outwards expand at least the amount of preset value with character boundary value and do recurrence at pcb board face and select, wherein, preset value size because of the difference of design specifications or unit different.
Item and device are a kind of relations of succession, think that in the present invention item is the subassembly of device, and device are father's parts.In the process of selecting in recurrence, the amount of expanding preset value at least take character boundary goes to select as boundary.Preset value size is because of the difference difference of design specifications or unit, and in the present embodiment, preset value is selected 5mil(mil).
Step S106, judge the number of selector, if being not less than 2, the number of recurrence device sets up recurrence two-dimensional array, deposit new item array in by group, and delete the item selected, upgrade interim groups of operands, otherwise this item is added to discrete array, and delete this item from interim groups of operands, return to step S104.
Step S107, to process final interim groups of operands be discrete array, and connector and integrated device element are inserted to array; Get successively each group item data group, mapper number of packages group.
Step S108, be that each group item array and dispersion number are set up vertical item two-dimensional array and device two-dimensional array according to Cartesian coordinates, take described preset value as radix, by the coordinate figure of the fuzzy device of the multiple of preset value and item.
Correspond to each group item array and the vertical item two-dimensional array of dispersion number establishment and device two-dimensional array according to cartesian coordinate system and the item dividing into groups and corresponding device, take 5mil as radix, respectively item and device are carried out to coordinate Fuzzy Processing, take 5mil as radix, press the fuzzy device of multiple of 5mil and the coordinate figure of item, until it has identical line number or columns, if finally still without ranks coupling, judge dislocation.Device to the single-row item of single file or multiple lines and multiple rows carries out index comparison, and records all items that do not conform to or device.
In the fuzzy stage of coordinate, the height of item 30mil at least conventionally, carries out fuzzyly take 5mil as radix, not only can avoid floating-point operation, is also to take into account efficiency and computing machine (PC) performance simultaneously.Coordinate is fuzzy initial, first the coordinate of device is carried out to 2*5mil fuzzy, and this step is got rid of manual mask placement device coordinate offset, and 2*5mil is to take into account the minimum dimension of device simultaneously.Then the ranks value of device and item is compared, if silk-screen line number more than the line number of device, the fuzzy quantity doubling, i.e. 5mil.Equally, the more object of line number or columns will be by fuzzy, and it is undetected that this step is effectively avoided, if item is adjusted standard, this step can be checked through any dislocation.
Step S109, item two-dimensional array and device two-dimensional array that generating indexes ranks are identical.
The item index of step S1010, more every group of device and device index, storage comparative result.
Be to operate in the mode of the strict comparison of index in the index check and correction stage, any index not conforming to all will be registered as dislocation, avoid any undetected, improve and check accuracy.
Step S1011, as required select whether according to above-mentioned steps, with device recurrence select mode reexamine dislocation.
If PCB device layout is more sparse in design, or device size is much larger than the size of character, and the mode of device recurrence goes to divide into groups for device and item, has made up the excessive recurrence of item spacing and has selected inaccurate phenomenon.Because of the inheritance of device and item, can be arbitrarily take device or item as recurrence object, same design has increased test mode, has improved the reliability of result.
Step S1012, the item that gathers dislocation and device, and output borrow report.
Technical scheme of the present invention is selected and divides into groups device or item in design according to the spacing of device or item, and the usage of trade and user that this intelligent packet mode more approaches layout and adjustment item receive standard; Use coordinate figure obfuscation means Rapid matching item and device, for item and device shine upon respectively 2-d index, can avoid the situation that cannot check because of device and item hypertelorism, also can check various misalignment, in the time that result shows, can accurately locate.The present invention on average to the item inspection of every kind of design in 20 seconds, can complete (because of machine performance different slightly variant), time saving and energy saving, and accuracy rate is high, without undetected phenomenon.
Note, above are only preferred embodiment of the present invention and institute's application technology principle.Skilled person in the art will appreciate that and the invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious variations, readjust and substitute and can not depart from protection scope of the present invention.Therefore, although the present invention is described in further detail by above embodiment, the present invention is not limited only to above embodiment, in the situation that not departing from the present invention's design, can also comprise more other equivalent embodiment, and scope of the present invention is determined by appended claim scope.
Claims (5)
1. an inspection method for device item dislocation in PCB design, is characterized in that, comprises the steps:
A, integrated device and connector to many pins are selected and are shielded separately;
B, screening item information are also categorized as the overall array of front item and the overall array of reverse side item;
C, set up the overall array of front item and the overall array of reverse side item, the overall array of front item and the overall array of reverse side item are referred to as item array;
D, backup item array are as interim groups of operands;
E, get an item in interim groups of operands successively, and outwards expand at least the amount of preset value with character boundary value and do recurrence at pcb board face and select, wherein, preset value size because of the difference of design specifications or unit different;
F, judge the number of selector, if being not less than 2, the number of recurrence device sets up recurrence two-dimensional array, deposit new item array in by group, and delete the item selected, upgrade interim groups of operands, otherwise this item is added to discrete array, and delete this item from interim groups of operands, return to step D;
G, to process final interim groups of operands be discrete array, and connector and integrated device element are inserted to array; Get successively each group item data group, mapper number of packages group;
H, be that each group item array and dispersion number are set up vertical item two-dimensional array and device two-dimensional array according to Cartesian coordinates, take described preset value as radix, by the coordinate figure of the fuzzy device of the multiple of preset value and item;
I, item two-dimensional array and device two-dimensional array that generating indexes ranks are identical;
The item index of J, more every group of device and device index, storage comparative result;
K, as required select whether according to above-mentioned steps, with device recurrence select mode reexamine dislocation;
L, the item that gathers dislocation and device, and output borrow report.
2. the inspection method of device item dislocation in PCB design according to claim 1, it is characterized in that, described step C specifically comprises: the positive device item to pcb board and the device item of reverse side are processed respectively, select all items when front face by the mode that entirety is selected, and to set up one dimension item array for front item and reverse side item be the overall array of front item and the overall array of reverse side item.
3. the inspection method of device item dislocation in PCB design according to claim 1, it is characterized in that, described step D specifically comprises: backup item array is as interim groups of operands, and sets up one and item border of the same size for each item, wherein, described border is rectangle.
4. according to the inspection method of device item dislocation in the PCB design one of claims 1 to 3 Suo Shu, it is characterized in that, described step H specifically comprises: be that each group item array and dispersion number are set up vertical item two-dimensional array and device two-dimensional array according to Cartesian coordinates, take 5mil as radix, respectively item and device are carried out to coordinate Fuzzy Processing, take 5mil as radix, press the fuzzy device of multiple of 5mil and the coordinate figure of item, until it has identical line number or columns, if finally, still without ranks coupling, judge dislocation.
5. the inspection method of device item dislocation in PCB design according to claim 4, is characterized in that, also comprises: the device to the single-row item of single file or multiple lines and multiple rows carries out index comparison, and records all items that do not conform to or device before described step K.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410124276.0A CN103886156B (en) | 2014-03-28 | 2014-03-28 | Method for inspecting dislocation of bit numbers and devices in PCB designs |
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| CN201410124276.0A CN103886156B (en) | 2014-03-28 | 2014-03-28 | Method for inspecting dislocation of bit numbers and devices in PCB designs |
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| CN103886156B CN103886156B (en) | 2017-02-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110633177A (en) * | 2018-06-25 | 2019-12-31 | 中兴通讯股份有限公司 | Method and device for acquiring equipment information, server and storage medium |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87108179A (en) * | 1986-12-29 | 1988-07-27 | 莫托罗拉公司 | Check that printed substrate has the method for omitting or misplacing element |
| JPH02164000A (en) * | 1988-12-16 | 1990-06-25 | Tdk Corp | Correction of dislocation of mounted electronic component |
| US20030025906A1 (en) * | 2001-08-06 | 2003-02-06 | Beamworks Ltd. | Optical inspection of solder joints |
| CN101959370A (en) * | 2010-10-12 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Method for preventing marking position numbers of devices in wrong positions in PCB |
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2014
- 2014-03-28 CN CN201410124276.0A patent/CN103886156B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87108179A (en) * | 1986-12-29 | 1988-07-27 | 莫托罗拉公司 | Check that printed substrate has the method for omitting or misplacing element |
| JPH02164000A (en) * | 1988-12-16 | 1990-06-25 | Tdk Corp | Correction of dislocation of mounted electronic component |
| US20030025906A1 (en) * | 2001-08-06 | 2003-02-06 | Beamworks Ltd. | Optical inspection of solder joints |
| CN101959370A (en) * | 2010-10-12 | 2011-01-26 | 浪潮电子信息产业股份有限公司 | Method for preventing marking position numbers of devices in wrong positions in PCB |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110633177A (en) * | 2018-06-25 | 2019-12-31 | 中兴通讯股份有限公司 | Method and device for acquiring equipment information, server and storage medium |
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Address after: No. 11-3 Hongyi Road, Xinwu District, Wuxi City, Jiangsu Province, 214028 Patentee after: Wuxi Synchronous Electronic Technology Co.,Ltd. Country or region after: China Address before: Room C508, No. 18 Qingyuan Road, Wuxi National High tech Industrial Development Zone, Wuxi City, Jiangsu Province, 214135 Patentee before: P.C.B.A. ELECTRONIC (WUXI) LTD. Country or region before: China |
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