CN110222381B - Method, system, medium and terminal for generating dynamic installation guide file for PCB assembly - Google Patents
Method, system, medium and terminal for generating dynamic installation guide file for PCB assembly Download PDFInfo
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- CN110222381B CN110222381B CN201910424503.4A CN201910424503A CN110222381B CN 110222381 B CN110222381 B CN 110222381B CN 201910424503 A CN201910424503 A CN 201910424503A CN 110222381 B CN110222381 B CN 110222381B
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
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Abstract
The invention provides a method, a system, a medium and a terminal for generating a dynamic installation guide file for PCB assembly, which comprise the following steps: acquiring PCB design data, BOM data and mounting process data; determining components required by the PCB based on the PCB design data and the BOM data to obtain a three-dimensional device model of each component; based on the PCB design data, the BOM data and the installation process data, generating operation data for distributing the three-dimensional device model to the whole installation process on the PCB; based on the operation data, dynamically simulating the installation process, and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file. According to the invention, the installation process of the PCB assembly is generated and displayed in a dynamic mode, so that the installation flow of the PCBA can be effectively and intuitively embodied, the understanding deviation is effectively reduced, the understanding efficiency is improved, the installation error in the installation process is avoided, the reject ratio of products is reduced, the production efficiency is effectively improved, and the material cost is saved.
Description
Technical Field
The invention belongs to the technical field of PCB assembly, and particularly relates to a method, a system, a medium and a terminal for generating a dynamic installation guide file for PCB assembly.
Background
Along with the development of electronic products in industry, these concepts of intelligent factories have entered the whole manufacturing industry, rapid and efficient ways bring revolutionary changes to the manufacturing industry, along with the increasing requirements of people on electronic products, the functions of the electronic products are more and more intelligent, the design of the PCBA board of the electronic products is more and more complex and diversified, the requirements of industry on manufacturing are also more and more high, rapid and efficient production of finished products are continuously required, the importance of PCB board installation and generation in production is self-evident, and the problem of how to improve the installation efficiency of the PCB board becomes an important breakthrough direction for improving the production capacity.
At present, the installation guide files for installing the PCB in the industry are mainly in document forms (at present, most of the files are in picture forms, text forms and data forms), the files in the forms need a great deal of time for staff to read and understand, understanding deviation is easy to generate according to subjective understanding of the staff, and the operation repetition rate for small models is high, so that the PCB is assembled with the following problems: the installation efficiency is low; the error in installation, high product yield and increased material loss are caused by the understanding deviation.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, the present invention aims to provide a method, a system, a medium and a terminal for generating a dynamic installation guide file for PCB assembly, which can effectively and intuitively embody an installation process of a PCBA by generating an installation process of PCB assembly and displaying the installation process in a dynamic form, effectively reduce understanding deviation, improve understanding efficiency, avoid installation errors in the installation process, reduce reject ratio of products, thereby reducing material loss, avoiding reworking phenomenon, effectively improve production efficiency, and save material cost.
To achieve the above and other related objects, the present invention provides a method for generating a dynamic installation guide file for PCB assembly, comprising the steps of: acquiring PCB design data, BOM data and mounting process data; determining components required by a PCB based on the PCB design data and the BOM data to obtain a three-dimensional device model of each component; generating operation data for distributing the three-dimensional device model to the whole installation process on the PCB board based on the PCB design data, the BOM data and the installation process data; and dynamically simulating the installation process based on the operation data, and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file.
In an embodiment of the present invention, generating the operation data for distributing the three-dimensional device model to the entire mounting process on the PCB board further includes the steps of: based on the PCB design data and the mounting process data, obtaining the mounting process and requirements of each component, and determining the assembly flow and process route of the component; distributing each three-dimensional device model to a corresponding position on the PCB according to the assembly flow and the process route based on the PCB design data and the BOM data; performing checksum adjustment on each three-dimensional device model on the PCB to obtain an accurate PCBA; and based on the PCBA, automatically generating and distributing the three-dimensional device model to the operation data of the whole installation process on the PCB according to the process route.
In an embodiment of the present invention, performing checksum adjustment on each of the three-dimensional device models on the PCB board includes the steps of: judging whether the appearance of the three-dimensional device model is correct or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing; judging whether the deviation and the direction angle of the three-dimensional device model on the PCB are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, automatically adjusting; judging whether the size, the pin number and the polarity mark of the three-dimensional device model are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing.
In an embodiment of the present invention, the PCB design data includes all design data of the PCB board, and material information and coordinate data of the components.
In an embodiment of the present invention, the BOM data includes material information of the PCB board, and quantity information and bit number information of the components.
In an embodiment of the present invention, the mounting process data includes first and last location information, mounting order, mounting mode, notice and mounting requirement of the components.
In one embodiment of the present invention, the obtaining the three-dimensional device model includes the steps of: extracting data information of the components based on the BOM data; directly linking a three-dimensional device model database to obtain the three-dimensional device model based on the data information; if the data information is not in the three-dimensional device model database, editing the components to obtain component editing data, and acquiring the three-dimensional device model based on the component editing data.
The invention provides a dynamic installation guide file generation system for PCB assembly, which comprises a first acquisition module, a second acquisition module, a data generation module and a data conversion module; the first acquisition module is used for acquiring PCB design data, BOM data and installation process data; the second acquisition module is used for determining components required by the PCB based on the PCB design data and the BOM data so as to acquire a three-dimensional device model of each component; the data generation module is used for generating operation data for distributing the three-dimensional device model to the whole installation flow on the PCB based on the PCB design data, the BOM data and the installation process data; the data conversion module is used for dynamically simulating the installation process based on the operation data and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file.
The present invention provides a storage medium having stored thereon a computer program which, when executed by a processor, implements the above-described dynamic installation index file generation method for PCB assembly.
The invention provides a terminal, comprising: a processor and a memory; the memory is used for storing a computer program; the processor is used for executing the computer program stored in the memory so that the terminal can execute the dynamic installation guide file generation method for PCB assembly.
As described above, the method, system, medium and terminal for generating the dynamic installation guide file for PCB assembly have the following beneficial effects:
through generating the installation process of PCB assembly and showing with dynamic form, can effectively audio-visual embody PCBA's installation procedure, effectively reduced understanding deviation, improve understanding efficiency, avoid the installation process to appear the installation mistake, reduced the defective rate of product to reduce the loss of material, avoid reworking the phenomenon, effectively improved production efficiency, practiced thrift the material cost.
Drawings
Fig. 1 is a flowchart of a method for generating a dynamic installation guide file for PCB assembly according to an embodiment of the present invention.
Fig. 2 is a schematic diagram showing the structure of a dynamic installation guide file generation system for PCB assembly according to the present invention in one embodiment.
Fig. 3 is a schematic structural diagram of a terminal according to an embodiment of the invention.
FIG. 4 is a flow chart illustrating checksum adjustment in accordance with an embodiment of the present invention.
Description of element reference numerals
201. First acquisition module
202. Second acquisition module
203. Data generation module
204. Data conversion module
31. Processor and method for controlling the same
32. Memory device
S1 to S4 steps
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict.
It should be noted that the illustrations provided in the following embodiments merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings and are not drawn according to the number, shape and size of the components in actual implementation, and the form, number and proportion of the components in actual implementation may be arbitrarily changed, and the layout of the components may be more complicated.
The method, the system, the medium and the terminal for generating the dynamic installation guide file for the PCB assembly can effectively and intuitively embody the installation flow of the PCBA by generating the installation process of the PCB assembly and displaying in a dynamic form, effectively reduce the understanding deviation, improve the understanding efficiency, avoid the installation error in the installation process and reduce the reject ratio of products, thereby reducing the loss of materials, avoiding reworking, effectively improving the production efficiency and saving the material cost.
As shown in fig. 1, in an embodiment, the method for generating a dynamic installation guide file for PCB assembly of the present invention includes the following steps:
and S1, acquiring PCB design data, BOM data and mounting process data.
In an embodiment of the present invention, the PCB design data includes all design data of the PCB board, and material information and coordinate data of the components.
In an embodiment of the present invention, the BOM data includes material information of the PCB board, and quantity information and bit number information of the components.
In an embodiment of the present invention, the mounting process data includes information of a first and a last positions of the components, a mounting sequence, a mounting manner, notes, and mounting requirements.
And S2, determining components required by the PCB based on the PCB design data and the BOM data so as to acquire a three-dimensional device model of each component.
In an embodiment of the present invention, obtaining the three-dimensional device model includes the steps of: extracting data information of the components based on the BOM data; directly linking a three-dimensional device model database to obtain the three-dimensional device model based on the data information; if the data information is not in the three-dimensional device model database, editing the components to obtain component editing data, and acquiring the three-dimensional device model based on the component editing data.
The component editing data includes length, width, height, pin data, pin size, pin coordinates and polarity point marks of the component.
And S3, generating operation data for distributing the three-dimensional device model to the whole installation process on the PCB based on the PCB design data, the BOM data and the installation process data.
In an implementation of the present invention, generating the operation data for distributing the three-dimensional device model to the entire mounting process on the PCB board further includes the steps of:
(11) And based on the PCB design data and the mounting process data, obtaining the mounting process and the requirement of each component, and determining the assembly flow and the process route of the component.
Specifically, associating the mounting process data according to the component data in the PCB design data to obtain the mounting process and requirement of each component; and associating and distributing assembly flow and process rules, and determining the assembly flow and process route of the components.
(12) And distributing each three-dimensional device model to a corresponding position on the PCB board (acquiring a three-dimensional PCB design model) according to the assembly flow and the process route based on the PCB design data and the BOM data.
Specifically, based on the coordinate data in the PCB design data and the bit number information in the BOM data, the three-dimensional device model of each component is automatically distributed to the corresponding position on the PCB according to the assembly flow and the process route.
(13) And checking and adjusting each three-dimensional device model on the PCB to obtain an accurate PCBA.
Specifically, whether the three-dimensional device model is placed on the PCB is checked to be correct, and meanwhile, in the checking process, the coordinate position and the direction angle of the three-dimensional device model on the PCB are automatically adjusted to obtain the PCBA with accurate assembly.
Further, in the embodiment of the invention, the verification operation and the adjustment operation for placing the three-dimensional device model on the PCB board are performed alternately, namely, automatic adjustment is realized in the verification process.
It should be noted that when the three-dimensional device model is not matched with the PCB board, that is, the three-dimensional device model is not correctly placed on the PCB board, the following two possibilities exist:
(1) The three-dimensional device model selects or creates an error.
Specifically, there are two ways to obtain the three-dimensional device model according to the above description: based on the BOM data, extracting data information (similar to the editing data) of the component, and then based on the data information (such as package information of resistors), directly linking a three-dimensional device model database to select a three-dimensional device model corresponding to the component, and importing the three-dimensional device model to the PCB, wherein when the three-dimensional device model corresponding to the component is selected in the three-dimensional device model database, the phenomenon that the three-dimensional device model is selected to be wrong due to data information input errors can occur; and the other is to edit the component to obtain component editing data, acquire the three-dimensional component model based on the component editing data, and possibly generate the phenomenon of creating errors of the three-dimensional component model due to component editing data errors.
(2) The PCB design data, i.e., raw data errors.
Specifically, in the process of designing a PCB, a component may be directly copied from another PCB design circuit, for example, the PCB design at this time needs a resistor with a resistance value of 10k and a package size of 0805, but the PCB design may be copied from another PCB design circuit by a resistor with a resistance value of 10k and a package size of 0603, and at this time, an error is caused in the PCB design, that is, an error occurs in the original data, so when a mismatch phenomenon occurs, an operation of confirming the correctness of the PCB design data is needed.
In an embodiment of the present invention, performing checksum adjustment on each of the three-dimensional device models on the PCB board includes the following steps:
(21) Judging whether the appearance of the three-dimensional device model is correct or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing.
Specifically, by combining PCB graphic data, namely original data, in the PCB design data, confirming the appearance of the three-dimensional device model distributed on the PCB, so as to preliminarily judge whether the three-dimensional device model is wrong in selection or creation; if the appearance of the three-dimensional device model is different from the original data, firstly performing an operation of confirming the correctness of the edited data; if the editing data are correct and the verification of the appearance is still different, further carrying out the operation of confirming the correctness of the original data.
(22) Judging whether the deviation and the direction angle of the three-dimensional device model on the PCB are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, automatically adjusting.
Specifically, comparing the three-dimensional device model with PCB graphic data, namely original data, in the PCB design data to judge whether the position of the three-dimensional device model on the PCB coincides with a two-dimensional plane of a component corresponding to the three-dimensional device model on the PCB, namely whether the offset and the direction angle are consistent; and if the offset is inconsistent or the direction angle is inconsistent, performing corresponding automatic adjustment operation.
If the offset is inconsistent, automatically adding an offset into the offset coordinate according to the coordinate position of the three-dimensional device model on the PCB and the comparison of the original data; and if the direction angles are inconsistent, automatically adjusting the angle of the three-dimensional device model according to the direction angle of the three-dimensional device model on the PCB and the comparison of the original data.
Further, the judging order of whether the offset is consistent with the judging order of whether the direction angle is consistent is not fixed, and whether the offset is consistent can be judged firstly, and then whether the direction angle is consistent is judged; or judging whether the direction angles are consistent or not, and then judging whether the offsets are consistent or not according to the situation.
(23) Judging whether the size, the pin number and the polarity mark of the three-dimensional device model are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing.
Specifically, comparing the three-dimensional device model distributed on the PCB with PCB graphic data, namely original data, in the PCB design data, and checking the size, the pin number and the polarity marks of the three-dimensional device model, so as to further judge whether the three-dimensional device model is selected or created with errors; if the size of the three-dimensional device model is inconsistent with the original data or the pin number of the three-dimensional device model is inconsistent with the original data, or the polarity mark of the three-dimensional device model is inconsistent with the original data, the operations of confirming the correctness of the editing data and the original data of the component are required to be carried out; if the size, pin number or polarity mark of the three-dimensional device model is inconsistent with the original data, firstly confirming the correctness of the edited data; if the editing data is correct and the size, the pin number or the polarity marks are not consistent, further carrying out the operation of confirming the correctness of the original data.
Further, the order of consistency determination for size, pin count, polarity labels is also not fixed, as the case may be.
It should be noted that, the original data on the PCB board (pad) includes: the appearance, size, position information, direction angle information, pin number, polarity flag, etc. of the component.
It should be noted that the order of steps (21), (22), and (23) is not fixed, and the arrangement mode includes five other steps (21) - (23) - (22), (22) - (21) - (23), (22) - (23) - (21) - (22), and (23) - (22) - (21) except the order according to steps (21) - (22) - (23), so long as the purpose of checking and adjusting each three-dimensional device model on the PCB board can be finally achieved, thereby obtaining an accurate PCBA board.
As shown in fig. 4, in one embodiment, the present invention performs checksum adjustment on each of the three-dimensional device models on the PCB board in the order of (21) - (22) - (23); this order is mainly taken into consideration for convenience of actual inspection, and is performed in order from the time of seeing the problem at a glance to the time of finding it in detail. For example, if the component corresponding to the three-dimensional device model is two completely different components from the component corresponding to the two-dimensional plane of the component on the PCB by confirming the appearance of the three-dimensional device model (executing step (21)), then the subsequent judgment and adjustment of the offset and the direction angle and the judgment of the size, the pin number and the polarity mark of the three-dimensional device model (executing step (22) and step (23)) are not needed; if the three-dimensional device model is confirmed to be identical to the original data in appearance (the step (21) is executed, and the original data is confirmed to be correct), but the position and the angle of the three-dimensional device model on the PCB are judged to be inconsistent with the original data, the position and the angle of the three-dimensional device model on the PCB are required to be consistent with the original data correspondingly through offset adjustment (the step (22) is executed), so that the subsequent series of checking operations are facilitated (the step (23) is executed); in addition, in the present embodiment, when the step (22) is performed, the judgment order to be adopted is: firstly judging whether the offset is consistent or not, and then judging whether the direction angle is consistent or not, wherein the judging order is not fixed and cannot be used as a condition for limiting the invention; when the step (23) is executed, the judgment sequence adopted is as follows: the method comprises the steps of judging whether the sizes and the pin numbers are consistent, and judging whether the polarity marks are consistent, wherein the judging sequence is not fixed and is not used as a condition for limiting the invention.
It should be noted that, in addition to the above-mentioned series of automatic verification and automatic adjustment operations performed on each three-dimensional device model on the PCB board, it may be further checked by a manual inspection operation to determine whether the PCB board conforms to the design, whether the three-dimensional device model is selected or created correctly, and whether the coordinate position and the direction angle of the three-dimensional device model on the PCB board are correct, and if not, the corresponding modification is required.
Specifically, in an embodiment, the step of performing checksum adjustment on each of the three-dimensional device models on the PCB board may be summarized as follows: opening installation verification (key name for realizing verification function); performing automatic installation verification, and automatically completing the step (21), the step (22) and the step (23) by software, and reporting which three-dimensional device models are not matched with the PCB assembly; and (3) confirming an automatic matching result and confirming a mismatch reason (namely whether the three-dimensional device model is selected or created or the PCB design data is wrong).
(14) And based on the PCBA, automatically generating and distributing operation data of the whole installation process of the three-dimensional device model on the PCB according to the process route.
Specifically, based on the PCBA, according to the process route, operating the installation rule can automatically generate and distribute the operation data of the whole installation process of the three-dimensional device model on the PCB.
The mounting rule is obtained according to the mounting process data, that is, the industry (production line) has many mounting rules for components, for example: firstly, low components are installed, and then high components are installed; for another example: firstly Chip components and then complex components; there are also rules for designing or specifying the requirements or regulations on the production line for the PCBA board to be produced. Collectively referred to as installation rules.
And S4, dynamically simulating the installation process based on the operation data, and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file.
Specifically, according to the operation data, the installation process (including the installation position, sequence, installation method, etc. of the three-dimensional device model on the PCB board) is dynamically simulated, and the installation process is converted into dynamic data (such as data format that can be used by industries such as animation or video) to output a required dynamic installation guide file.
It should be noted that, the protection scope of the method for generating the dynamic installation guide file for PCB assembly according to the present invention is not limited to the order of executing the steps listed in the present embodiment, and all the solutions implemented by adding or removing steps and replacing steps according to the prior art according to the principles of the present invention are included in the protection scope of the present invention.
As shown in fig. 2, in an embodiment, the dynamic installation guide file generating system for PCB assembly of the present invention includes a first acquisition module 201, a second acquisition module 202, a data generation module 203, and a data conversion module 204.
The first obtaining module 201 is configured to obtain PCB design data, BOM data, and mounting process data.
The second obtaining module 202 is configured to determine components required by the PCB based on the PCB design data and the BOM data, so as to obtain a three-dimensional device model of each component.
The data generating module 203 is configured to generate job data for distributing the three-dimensional device model to an entire installation process on the PCB board based on the PCB design data, the BOM data, and the installation process data.
The data conversion module 204 is configured to dynamically simulate the installation process based on the job data, and convert the installation process into dynamic data to output a corresponding dynamic installation guide file.
It should be noted that, it should be understood that the division of the modules of the above apparatus is merely a division of a logic function, and may be fully or partially integrated into a physical entity or may be physically separated. And these modules may all be implemented in software in the form of calls by the processing element; or can be realized in hardware; the method can also be realized in a form of calling software by a processing element, and the method can be realized in a form of hardware by a part of modules. For example, the x module may be a processing element that is set up separately, may be implemented in a chip of the apparatus, or may be stored in a memory of the apparatus in the form of program code, and the function of the x module may be called and executed by a processing element of the apparatus. The implementation of the other modules is similar. In addition, all or part of the modules can be integrated together or can be independently implemented. The processing element described herein may be an integrated circuit having signal processing capabilities. In implementation, each step of the above method or each module above may be implemented by an integrated logic circuit of hardware in a processor element or an instruction in a software form.
For example, the modules above may be one or more integrated circuits configured to implement the methods above, such as: one or more application specific integrated circuits (Application Specific Integrated Circuit, abbreviated as ASIC), or one or more microprocessors (Digital Singnal Processor, abbreviated as DSP), or one or more field programmable gate arrays (Field Programmable Gate Array, abbreviated as FPGA), or the like. For another example, when a module above is implemented in the form of a processing element scheduler code, the processing element may be a general-purpose processor, such as a central processing unit (Central Processing Unit, CPU) or other processor that may invoke the program code. For another example, the modules may be integrated together and implemented in the form of a system-on-a-chip (SOC).
The storage medium of the present invention stores a computer program which, when executed by a processor, implements the dynamic installation guide file generation method for PCB assembly described above. The storage medium includes: various media capable of storing program codes, such as ROM, RAM, magnetic disk, U-disk, memory card, or optical disk.
As shown in fig. 3, the terminal of the present invention includes a processor 31 and a memory 32.
The memory 32 is used for storing a computer program. Preferably, the memory 32 includes: various media capable of storing program codes, such as ROM, RAM, magnetic disk, U-disk, memory card, or optical disk.
The processor 31 is connected to the memory 32 and is configured to execute a computer program stored in the memory 32, so that the terminal performs the method for generating a dynamic installation guide file for PCB assembly as described above.
Preferably, the processor 31 may be a general-purpose processor, including a central processing unit (Central Processing Unit, abbreviated as CPU), a network processor (Network Processor, abbreviated as NP), etc.; but also digital signal processors (Digital Signal Processor, DSP for short), application specific integrated circuits (Application Specific Integrated Circuit, ASIC for short), field programmable gate arrays (Field Programmable Gate Array, FPGA for short) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.
It should be noted that, the dynamic installation guide file generating system for PCB assembly of the present invention may implement the dynamic installation guide file generating method for PCB assembly of the present invention, but the implementation device of the dynamic installation guide file generating method for PCB assembly of the present invention includes, but is not limited to, the structure of the dynamic installation guide file generating system for PCB assembly listed in this embodiment, and all structural modifications and substitutions of the prior art made according to the principles of the present invention are included in the protection scope of the present invention.
In summary, the method, the system, the medium and the terminal for generating the dynamic installation guide file for the PCB assembly can effectively and intuitively embody the installation flow of the PCBA by generating the installation process of the PCB assembly and displaying the installation flow in a dynamic mode, effectively reduce the understanding deviation, improve the understanding efficiency, avoid the installation error in the installation process, reduce the reject ratio of products, thereby reducing the loss of materials, avoiding reworking, effectively improving the production efficiency and saving the material cost.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (8)
1. A method for generating a dynamic installation guide file for PCB assembly, comprising the steps of:
acquiring PCB design data, BOM data and mounting process data; the BOM data comprises material information of the PCB and quantity information and bit number information of components;
determining components required by a PCB based on the PCB design data and the BOM data to obtain a three-dimensional device model of each component; the three-dimensional device model acquisition comprises the following steps:
extracting data information of the components based on the BOM data;
directly linking a three-dimensional device model database to obtain the three-dimensional device model based on the data information; if the data information is not in the three-dimensional device model database, editing the components to obtain component editing data, and acquiring the three-dimensional device model based on the component editing data; the component editing data comprise length, width, height, pin data, pin size, pin coordinates and polarity point marks of the component;
generating operation data for distributing the three-dimensional device model to the whole installation process on the PCB board based on the PCB design data, the BOM data and the installation process data;
and dynamically simulating the installation process based on the operation data, and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file.
2. The dynamic installation guide file generation method for PCB assembly of claim 1, wherein: generating job data that allocates the three-dimensional device model to the entire mounting process on the PCB board further includes the steps of:
based on the PCB design data and the mounting process data, obtaining the mounting process and requirements of each component, and determining the assembly flow and process route of the component;
distributing each three-dimensional device model to a corresponding position on the PCB according to the assembly flow and the process route based on the PCB design data and the BOM data;
performing checksum adjustment on each three-dimensional device model on the PCB to obtain an accurate PCBA;
and based on the PCBA, automatically generating and distributing the three-dimensional device model to the operation data of the whole installation process on the PCB according to the process route.
3. The dynamic installation guide file generation method for PCB assembly according to claim 2, wherein: the method for verifying and adjusting each three-dimensional device model on the PCB comprises the following steps of:
judging whether the appearance of the three-dimensional device model is correct or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing;
judging whether the deviation and the direction angle of the three-dimensional device model on the PCB are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, automatically adjusting;
judging whether the size, the pin number and the polarity mark of the three-dimensional device model are consistent or not based on the PCB design data and the data information of the three-dimensional device model; if not, confirming the correctness of the editing data of the components and the PCB design data and carrying out corresponding correction processing.
4. The dynamic installation guide file generation method for PCB assembly according to claim 1 or 2, wherein: the PCB design data comprise all the design data of the PCB and the material information and coordinate data of the components.
5. The dynamic installation guide file generation method for PCB assembly according to claim 1 or 2, wherein: the installation process data comprises the head and tail position information, the installation sequence, the installation mode, notes and installation requirements of the components.
6. The dynamic installation guide file generation system for PCB assembly is characterized by comprising a first acquisition module, a second acquisition module, a data generation module and a data conversion module;
the first acquisition module is used for acquiring PCB design data, BOM data and installation process data; the BOM data comprises material information of the PCB and quantity information and bit number information of components;
the second acquisition module is used for determining components required by the PCB based on the PCB design data and the BOM data so as to acquire a three-dimensional device model of each component; the three-dimensional device model acquisition comprises the following steps:
extracting data information of the components based on the BOM data;
directly linking a three-dimensional device model database to obtain the three-dimensional device model based on the data information; if the data information is not in the three-dimensional device model database, editing the components to obtain component editing data, and acquiring the three-dimensional device model based on the component editing data; the component editing data comprise length, width, height, pin data, pin size, pin coordinates and polarity point marks of the component; the data generation module is used for generating operation data for distributing the three-dimensional device model to the whole installation process on the PCB based on the PCB design data, the BOM data and the installation process data;
the data conversion module is used for dynamically simulating the installation process based on the operation data and converting the installation process into dynamic data so as to output a corresponding dynamic installation guide file.
7. A storage medium having stored thereon a computer program, which when executed by a processor, implements the dynamic installation instruction file generation method for PCB assembly of any one of claims 1 to 5.
8. A terminal, comprising: a processor and a memory;
the memory is used for storing a computer program;
the processor is configured to execute the computer program stored in the memory to cause the terminal to execute the dynamic installation guide file generation method for PCB assembly of any one of claims 1 to 5.
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| CN111739162B (en) * | 2020-08-10 | 2020-12-04 | 成都智明达电子股份有限公司 | Automatic PCBA accurate three-dimensional model generation method based on ECAD interface |
| CN112822939B (en) * | 2021-02-03 | 2022-07-29 | 上海望友信息科技有限公司 | Electronic component forming method and system, electronic equipment and storage medium |
| CN113343660B (en) * | 2021-06-17 | 2023-05-12 | 东风柳州汽车有限公司 | Assembly file creation system and method |
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