CN105551334A - Chip mounter simulation teaching system and teaching method - Google Patents
Chip mounter simulation teaching system and teaching method Download PDFInfo
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- CN105551334A CN105551334A CN201610072223.8A CN201610072223A CN105551334A CN 105551334 A CN105551334 A CN 105551334A CN 201610072223 A CN201610072223 A CN 201610072223A CN 105551334 A CN105551334 A CN 105551334A
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Abstract
The invention discloses a chip mounter simulation teaching system which is a simulation experiment system based on the Unigraphics NX8.0 and the software of a higher edition. The chip mounter simulation teaching system mainly comprises a chip mounter three-dimension simulation model, a member database, and a system user manual; an interface column comprises the system user manual, a PCB board column, a chip mounter three-dimension virtual model column, a mounting simulation column, an exporting column and a shortest path column. The chip mounter simulation teaching system is friendly in the user interface, flexible and convenient in operation method, strong in functions, simple in operation process and easy to master and is a strong tool for performing the simulation experiment of the chip mounter. The chip mounter simulation teaching system is used for teaching, technical training for operation staff and SMT technology development and has significance for the development of the China electronic information industry.
Description
Technical field
The present invention relates to Virtual Simulative Experiment technical field, especially relate to chip mounter emulation, specifically chip mounter simulation teaching system and teaching method.
Background technology
Along with the fast development of domestic electron trade, China oneself become Electronic products manufacturing big country of the world, and surface mounting technology (SMT) occupies very important position in the production of electronic product.Surface element device mounts on PCB by SMT, the process that between PCB with components and parts, realization machinery and electronics are connected is made by wave-soldering or Reflow Soldering heating, as chief component and the agent technology of electrical interconnection technology, become the main flow of modern electrical interconnection technique, be described as " the third time revolution of Electronic Assembly Foundation ".
SMT is a comprehensive system engineering technology, and its coverage comprises substrate, design, equipment, components and parts, packaging technology, production auxiliary materials and management etc.To operation site, SMT equipment and SMT technique require that voltage will be stablized, prevent electromagnetic interference (EMI), electrostatic prevention, good illumination and toxic emission facility be had, have special requirement to the temperature, humidity, air cleanliness etc. of operating environment, operating personnel also should through professional technique training.
Chip mounter is the key equipment in SMT production line, mainly complete the attachment function of components and parts, the placement accuracy of chip mounter and stability will directly have influence on quality and the performance of institute's processing circuit board, but, because chip mounter is very expensive, so chip mounter may be used for technical training hardly.
Summary of the invention
In order to solve the problem being difficult at present carry out chip mounter technical training, the object of the invention is to, a kind of chip mounter simulation teaching system is provided, makes user by the dummy model of chip mounter and simulation operations thereof, the requisite skill of chip mounter operation and maintenance can be learnt.
Chip mounter simulation teaching system of the present invention, is the simulating experimental system based on UnigraphicsNX8.0 and above version software, mainly comprises:
The chip mounter three dimensional virtual models of d solid modeling software modeling is used, for analogue simulation paster process as template model machine according to the chip mounter selected;
Extract the Component library of the chip mounter three dimensional virtual models of BOM table and coordinate file in PCB file by Protel99se drawing software, the content of extraction is mainly used in writing paster program;
Chip mounter simulation teaching system user manual: the basic usage setting forth chip mounter simulation teaching system, introduces its function and operation instructions, and its operating process of connected applications presented example;
The main interface content of system mainly comprises:
A) system user handbook: for learning the basic usage of chip mounter simulation teaching system, function and operation instructions, chip mounter knowledge, chip mounter programming knowledge, the application example of viewing demonstration operating process.
B) pcb board: BOM table and the components and parts coordinate file of checking the required PCB file of pcb board three-dimensional model, chip mounter programming, complete the extraction of BOM table and coordinate file in PCB file by Protel99se drawing software;
C) chip mounter three dimensional virtual models: the structure of checking chip mounter three dimensional virtual models;
D) attachment emulation: simulation paster process.
In technical scheme of the present invention, chip mounter three dimensional virtual models independently carries out modeling with d solid modeling software to frame, PCB transport sector, control system, attachment kinematic system and feeder system, then according to the complete machine that assembled in sequence is from bottom to top formed.
Further, in chip mounter three dimensional virtual models, frame comprises the rigid structure of pedestal, cover and control system master station, and assembling time space is too crowded or space is spacious to avoid to have suitable proportional sizes, and pedestal has the rigidity of enough support complete machine weight;
PCB transport sector mainly comprises the rail plate for pcb board motion, and rail plate is fixed in frame, coordinates and carry out size with pcb board to mate with frame;
Control system comprises master station and optical camera, and master station arranges function button, emergency stop switch, display screen, alarm; There is the paster program of writing in the computer control system of master station, control chip mounter three dimensional virtual models each several part and run according to program; Rigid structure and the pedestal of master station connect together; Internal body is assemblied in after optical camera Independent modeling;
Attachment kinematic system forms primarily of the suction nozzle box of X axis guide rail, Y-axis guide rail, placement head, suction nozzle, placement suction nozzle, X axis guide rail, Y-axis guide rail and placement head are assembled into one, realize the movement of placement head in X axis and Y-axis, so that placement head draws suction nozzle from suction nozzle box, all component is arranged according to chip mounter actual state, realizes all participation and mounts the rational kinematic constraint of moving parts and cooperation of mutually moving;
Feeder system is made up of materials vehicle and loader, materials vehicle is loaded in frame, also can move freely between frame and material room from frame unloading, to come and go material room handling loader in time, materials vehicle arranges the screens of coupling all size loader; Loader is for loading the chip components and parts of braid formula packaging, and loader is loaded on materials vehicle, is placed in the corresponding screens of materials vehicle according to different specifications.
In the present invention, components and parts coordinate file is TXT file.And for building the d solid modeling choice of software PRO/E software of chip mounter three dimensional virtual models.
Further, chip mounter simulation teaching system of the present invention also comprises the computing module for calculating the shortest time needed for chip mounter three dimensional virtual models analogue simulation paster process.
The method of the chip mounter simulated teaching provided of the present invention applies above-mentioned chip mounter simulation teaching system, comprising:
1) open UnigraphicsNX, enter interface;
2) user clicks each content as required, carries out learning, analogue simulation paster process.
This chip mounter simulation teaching system, has friendly user interface, flexible mode of operation, its design function and operation steps are all from practical standpoint, and powerful, operation steps is terse, being easy to grasp, is the powerful carrying out chip mounter emulation experiment.There is powerful paster process simulation function.User, without the need to manual editing's paster order, also without the need to the coordinate that relates in manual extraction paster process and location parameter, only need click instruction button, just can extract the desired parameters such as coordinate file, BOM table, component information and paster shortest path.Native system makes full use of UG secondary exploitation technology, and involved agreement and interface function are all the UGOPEN universal standard and canonical schema, conveniently again develops.
The problem that the method utilizing tutoring system to carry out simulated teaching overcomes traditional experiment teaching human and material resources, financial resources have high input, more the enforcement of Distance Teaching experiment provides condition and technical support, also for the quality of long-distance education provides sound assurance.The Virtual Simulation of further investigation chip mounter process for making, deepens learner to the understanding of chip mounter knowledge and understanding, for learner independent carry out study factor and create good condition.The present invention may be used for teaching, the technical training of operating personnel and the technical research of SMT, has positive meaning to the development of the electronics and information industry of China.
Accompanying drawing explanation
Fig. 1 is the main surface chart of system.
Fig. 2 is chip mounter d solid modeling functions of modules constitutional diagram.
Fig. 3 is chip mounter three dimensional virtual models stereographic map.
Fig. 4 is the concise and to the point forms of motion figure of chip mounter.
Fig. 5 checks PCB and component information sectional drawing.
Fig. 6 is the patch location sectional drawing inputting each components and parts.
Fig. 7 checks shortest path result of calculation sectional drawing.
Embodiment
Chip mounter is as the optical, mechanical and electronic integration Hi-Tech equipment be made up of computing machine, precision optical machinery, ball screw, line slideway, linear motor, harmonic drive, optics and vacuum system and various sensor, and its each system has independently function.
When modeling with movable arm type chip mounter for research object, the Modeling and Design method of " function modoularization subregion " of employing carries out solid model modeling to the part of chip mounter, and the part focused on from each part is trickle is set about, and Seiko manufacture is large with little spelling; Consider assemble time part between there is certain constraint condition, all early stage part add must design man-hour thorough.
After the modeling of part, just carrying out the preparation that whole solid model is set up, when assembling, should carry out with the assembling route of " from bottom to up ".From surface constraints to spatial development, and host and guest's factor of constraint mutually must be considered clear, finally realizes the function combination of module.
Before carrying out modeling, the consideration to frame, PCB transport sector, control section (comprising master control system, visual system), five functional modules such as attachment kinematic system, feeder system etc.:
1. frame: frame, as all parts being used for installing and support attachment, will think about the problem using and distribute in space, avoid assembling time space too crowded or space is spacious before modeling.
The stressed of pedestal is very large, and all also will considering when modeling makes it have enough rigidity.
Too much requirement can not done, even if because can revise after mounting in early stage in outward appearance aspect yet.
2. PCB transport sector: do not have too many particular/special requirement, coordinate with frame, and suitable mating can be carried out with pcb board.
3. control section: comprise master station and optical camera, master station arranges function button, emergency stop switch, display screen, alarm.Appropriate adjustment can be done as required and modify after assembling.
4. kinematic system is mounted: mounting device, as current emphasis motion parts, by the standard coordinated as all motions, will note the dimension pairings with other parts when modeling.Especially when X-axis guide rail moves with Y-axis guide rail, coordinate placement head to absorption of chip components and parts etc. all to size mate require very strict.
5. feeder system is made up of materials vehicle and loader, and materials vehicle can be dismantled from body, also has the requirement of coupling after the upper fuselage of materials vehicle assembling that modeling fashion material is complete.Material device will be considered to the convenient absorption of suction nozzle after material loading.
Concrete modeling: for building the d solid modeling choice of software PRO/E software of chip mounter three dimensional virtual models.
Frame comprises the rigid body portion of pedestal, cover and control system.Frame is the bone of entire machine, allly will determine " build " of complete machine when carrying out bone and moulding.According to suitable Proportionality design size, and stressed problem to be fully taken into account, reach the effect that frame is succinct, sturdy, practical.
PCB transport sector mainly comprises the rail plate for pcb board motion, and two guide rails are separately fixed at left side and the right side of rack rail base, and pcb board left and right sides is close to respectively and is placed on inside guide rail two, and wherein guide rail width is slightly larger than pcb board width.
Control section comprises master station and optical camera, and master station, containing computer control system, has the devices such as function button, emergency stop switch, display screen, alarm above.When Modling model at first using control desk as independently module, but find that it is placed on pedestal side and seems it is not good-looking especially when assembling afterwards, determine the part rigid structure of control desk and pedestal to connect together so final, seem one integrated mass, visually neatly unification.Optical camera belongs to midline detect system, should be independent, but the emphasis considering emulation is not here, so classified as control section.But because it is assemblied in internal body, certainly independently create when Modling model, during assembling be also easy to it to put to assigned address like this.
Mounting system is the most crucial functional module of whole chip mounter, and this system is primarily of key component compositions such as X axis guide rail, Y-axis guide rail, placement head, suction nozzles.X axis guide rail, Y-axis guide rail and placement head are assembled into one, realize the movement of placement head in X axis and Y-axis, so that placement head draws suction nozzle from suction nozzle box, all component is arranged according to chip mounter actual state, realizes all participation and mounts the rational kinematic constraint of moving parts and cooperation of mutually moving; Very strict owing to mating between each assembly, mutually restrict, convected motion is more, so will include overall consideration at the Modeling and Design initial stage.Dimensional requirement also will be mated very much, although be that model is set up, also will embody the feature of this high precision machines of chip mounter.Complete movement locus requires that the establishment participated in has the mutual motion of rational kinematic constraint and tacit agreement to coordinate.
Feeder system is made up of materials vehicle and loader, and materials vehicle can move freely after main frame unloading, and generally the instant material room that is returned to carries out the dismounting of material and reloads; Loader is then directly loaded on materials vehicle, places in different screens onboard according to different specifications.
Materials vehicle needs when modeling to consider factors, and the pin on such as screens groove must be corresponding with the counterbore size of loader bottom surface, and the placement location of charging tray also needs corresponding with loader etc.Loader is loaded in the appointment occupy-place of materials vehicle after installing material, general occupy-place can with digital 1,2,3 ... mark, part occupy-place also has dividing of R & L, as 5L/5R, represents that these No. 5 occupy-places can load two loaders.
Overall assembling it should be noted that the distribution in space.Each parts will be placed in the position of setting and environment and go.Have strict restriction relation when assembling between part and part in PRO/E software, so must which parts clear and definite be main bodys, which parts be objects, is whom who produce constraint to.Distribute the order retrained between all parts, searching and revising parts after convenient.
What modeling obtained according to the method described above is chip mounter three dimensional virtual models is as Fig. 3, and the combination of chip mounter d solid modeling functions of modules is as Fig. 2.Fig. 3 shows chip mounter materials vehicle 1, loader material trough 2, outer end cap 3, rail plate 4, upper end cover 5, alarm 6, placement head 7, suction nozzle 8, display 9, gantry base 11, material wheel 12 and under-chassis 13.Described rail plate 4 is separately fixed on the left of base 11 and right side, pcb board 10 left and right sides is close to respectively and is placed on rail plate 4 liang of inner sides, wherein rail plate 4 width is slightly larger than pcb board width, outer end cap 3 two ends are separately fixed in upper end cover 5 by bolt, the width of pcb board 10 that upper end cover 5 and rail plate 4 joining place gap ensure to be greater than rail plate 4 and use.
The chip mounter Component library that the present invention sets up, utilizes TXT file to carry out the storage of component information, according to the arrangement information needing reasonable distribution components and parts of actual production, realizes the shortizationest running period of chip mounter.First set up text and input the patch location of each components and parts, then Saving and Closing.Use Protel99se drawing software to set up the quick botton of quick information extraction, click successively and open and inquire about results needed.
Chip mounter paster motion process virtual with set up chip mounter three dimensional virtual models for rely on, according to chip mounter motion principle carry out emulation reference design.Namely premised on the actual production of chip mounter, take functional module as simulation object, set up a main line at whole simulation process, get hold of part with the coordinated movement of various economic factors of entirety to carry out feeder system motion simulation, the transport sector motion simulation of chip mounter and to mount motion simulation.
The three-dimensional paster process need parts of chip mounter have coordinated according to very careful mode of motion, period comprises a large amount of motions, as simple PCB motion in orbit just comprises several motion stages: upper plate before this, then inductor detects rear plank and enters body, located voluntarily by after optical centering systems axiol-ogy MARK point, ejecting plate etc. after paster.The motion of feeder system: needed to extract all for this model plank from material room with material before processing PCB, then upper corresponding loader is loaded according to material loading inventory, and loader will be placed in the materials vehicle occupy-place of specifying, be finally that materials vehicle is loaded on chip mounter fuselage.Chip mounter paster motion process virtual with set up model for rely on, according to chip mounter motion principle carry out emulation reference design.Namely premised on the actual production of chip mounter, take functional module as simulation object, set up a main line at whole simulation process, get hold of part with the coordinated movement of various economic factors of entirety to carry out feeder system motion simulation, the transport sector motion simulation of chip mounter and to mount motion simulation.In the process of whole design of Simulation, the problems such as the continuous motion cooperation according to parts and assembly constraint are needed repeatedly to test the motion of model, and the irrationality that discovery wherein exists, with the order constantly adjusting motion simulation, coordinate with the assembling and motion that strengthen each several part intermodule, allow emulation closer to real experiment.
The forms of motion of chip mounter as shown in Figure 4.As seen in Figure 4, pcb board used is placed in rail plate " recessed " type groove, when experiment simulation starts to carry out, pcb board is put into rail plate and is run along X-direction on the left of upper end cover, carries out sensor detection simultaneously, enters body, optical centering, looks for MARK point location, simultaneously, loader tote truck is loaded on body, placement head draws suction nozzle, suction nozzle suction, and CCD identifies material, then carry out attachment PCB to move, last pcb board completes lower plate action on the right side of upper end cover.
Feeder system motion simulation:
When carrying out this motion process, owing to materials vehicle there being a lot of occupy-place, part occupy-place also has dividing, as 7L represents the L screens of these No. 7 occupy-places, so all loaders will load in strict accordance with material loading inventory of R & L.Equally, materials vehicle also will be loaded into according to material loading inventory the TBL(CM402 that fuselage specifies and is divided into 1A/1B, 2A/2B).When materials vehicle and fuselage load complete completely, whole charge motion also just finishes.
Transport sector motion simulation:
In the motion simulation of this link, in order to the whole motion path of clear display PCB, select three pieces of PCB, in (1,2,3) three crucial positions, motion has been carried out to it respectively and dissect.1 position is upper plate, and under the observing and controlling of inductor A, plank is allowed to enter body; 2 positions are location, and under the observing and controlling of inductor B, plank enters the pasting area of setting, waits CCD to be subjected to the scanning of MARK point on plate, and paster carries out in this position.3 positions are that plank is downloaded, and indicate that paster terminates.Whole process only has the translation in horizontal direction, and key is to get hold of sequential, is strict to the time controling of each key position, so just can increase work efficiency.
Attachment motion simulation:
(1) mount in advance: be divided into 1. and 2. two movement step:
1. mounting head carries optical centering device CCD and carries out optical centering to printed circuit board MARK point, is analyzed, to ensure to mount path accurately pasting area visual identity by microsystem.
2. an important action is also had to be that placement head can select the suction nozzle of corresponding size to pick up according to the setting of program automatically in pre-attachment.
(2) mount: be divided into 1., 2., 3. three movement step:
1. suction nozzle suction.According to the setting of program, suction nozzle moves in corresponding occupy-place, draws the components and parts on this occupy-place loader, in order to the optimization to motion path, generally suction nozzle absorbing material is strict sequencing, and which type of which inhales and expect the distribution of device and the setting of program on main billboard in moment.
2. components and parts are through CCD optical detection.This process is to ensure that whether the material picked up is consistent with processing request, also having judgement in addition to the polarity of device.If undesirable, then material is thrown to material casting box (not to the modeling of material casting box in the present invention, so this process only takes in theory, being do not embody in realistic simulation) by suction nozzle automatically.By the optical detection identification to material, to the statistical study of material casting rate, can effective production control, improve the quality of production.
3. paster motion simulation.Select three suction nozzles to draw three chip components and parts respectively in the design, mount on plank after CCD optical detection.Placement head to drive the motion path of suction nozzle to be through program optimization.Whole paster process is controlled by microcomputer entirely, and knows the state of display paster over the display, comprises paster sum, paster number, paster speed etc., gives monitoring on a macro scale to whole process.
Choosing the position shown in A, B, C is virtual pad, the chip components and parts picked up is mounted these three welding disking areas above, reach the effect of accurate paster in analog simulation.Alarm is a part for control system, when paster makes a mistake time or when can not reach the effect of program setting, alarm is opened automatically.In normal conditions, green light is normal prompting of producing, and green light height is according to then illustrating the unimpeded of production line; If there is red light, then point out paster process to occur mistake, need immediately to check, common are and lack material, chip identification mistake etc., serious have clamp, collide first-class.When there is amber light, representing to produce and waiting for.In reality is produced, paster operation is " bottleneck operation " often, when one piece of plank is by paster time, the plank that another block has finished printing enters chip mounter by transport sector, at this moment will occur " rear operation wait ", along with amber light flicker, so often have when occurring that amber light produces wait.
Finally, the motion process of simulation is changed into visual video file (* .mpg) form and derives by the function that can animated video be utilized in PRO/E to catch.In click tools hurdle---" playback ", click again " catching " in the control dialog box of " animation " by name that obtain, video file can be derived by step, complete the visual Simulation scheme of motion simulation.
Specifically in artificial teaching method, comprising:
1) open UnigraphicsNX, enter interface;
See Fig. 1.The main interface of chip mounter simulation teaching system of the present invention comprises: A) system user handbook; B) pcb board; C) chip mounter three dimensional virtual models; D) attachment emulation.System user handbook mainly includes again: the basic usage of system, system basic functions, operation instructions and presented example.
2) user clicks each content as required, carries out learning, analogue simulation paster process.Also the video file of analogue simulation paster process or the shortest time needed for computer sim-ulation simulation paster process can be derived.
(1) check each components and parts coordinate: click " zuobiaodialog " button, eject " coordinate " dialog box, click " each part coordinates is checked in click " button, the text checked containing each components and parts coordinate can be opened;
(2) BOM table and PCB three-dimensional model in PCB file is checked: click " PCB " button, component information and pcb board three-dimensional model dialog box are checked in ejection, click " checking " button, eject the text containing component information, click " determination " button, eject the text containing component information and PCB three-dimensional model, as Fig. 5.
(3) shortest path calculates: the patch location first inputting each components and parts in D:a.txt text, as Fig. 6, preserves and closes.Click " Theshortestdistance " button, eject distance and check dialog box, click " determination " button, open D:b.txt text, check shortest path result of calculation, as Fig. 7.In order to the accuracy of the result, one group of data can be inserted again and again check.Shortest path is actual is shortest time needed for chip mounter paster.
(4) click three-dimensional model button, check chip mounter three-dimensional model.
(5) click motion simulation button, play by video jukebox software and check that chip mounter paster course motion emulates.
Claims (7)
1. chip mounter simulation teaching system, is the simulating experimental system based on UnigraphicsNX8.0 and above version software, mainly comprises:
The chip mounter three dimensional virtual models of d solid modeling software modeling is used, for analogue simulation paster process as template model machine according to the chip mounter selected;
Extract the Component library of the chip mounter three dimensional virtual models of BOM table and coordinate file in PCB file by Protel99se drawing software, the content of extraction is mainly used in writing paster program;
Chip mounter simulation teaching system user manual: the basic usage setting forth chip mounter simulation teaching system, introduces its function and operation instructions, and its operating process of connected applications presented example;
The main interface content of system mainly comprises:
A) system user handbook: for learning the basic usage of chip mounter simulation teaching system, function and operation instructions, chip mounter knowledge, chip mounter programming knowledge, the application example of viewing demonstration operating process;
B) pcb board: BOM table and the components and parts coordinate file of checking the required PCB file of pcb board three-dimensional model, chip mounter programming, complete the extraction of BOM table and coordinate file in PCB file by Protel99se drawing software;
C) chip mounter three dimensional virtual models: the structure of checking chip mounter three dimensional virtual models;
D) attachment emulation: simulation paster process.
2. chip mounter simulation teaching system according to claim 1, it is characterized in that: chip mounter three dimensional virtual models independently carries out modeling with d solid modeling software to frame, PCB transport sector, control system, attachment kinematic system and feeder system, then according to the complete machine that assembled in sequence is from bottom to top formed.
3. chip mounter simulation teaching system according to claim 2, it is characterized in that: in chip mounter three dimensional virtual models, frame comprises the rigid structure of pedestal, cover and control system master station, assembling time space is too crowded or space is spacious to avoid to have suitable proportional sizes, and pedestal has the rigidity of enough support complete machine weight;
PCB transport sector mainly comprises the rail plate for pcb board motion, and rail plate is fixed in frame, coordinates and carry out size with pcb board to mate with frame;
Control system comprises master station and optical camera, and master station arranges function button, emergency stop switch, display screen, alarm; There is the paster program of writing in the computer control system of master station, control chip mounter three dimensional virtual models each several part and run according to program; Rigid structure and the pedestal of master station connect together; Internal body is assemblied in after optical camera Independent modeling;
Attachment kinematic system forms primarily of the suction nozzle box of X axis guide rail, Y-axis guide rail, placement head, suction nozzle, placement suction nozzle, X axis guide rail, Y-axis guide rail and placement head are assembled into one, realize the movement of placement head in X axis and Y-axis, so that placement head draws suction nozzle from suction nozzle box, all component is arranged according to chip mounter actual state, realizes all participation and mounts the rational kinematic constraint of moving parts and cooperation of mutually moving;
Feeder system is made up of materials vehicle and loader, materials vehicle is loaded in frame, also can move freely between frame and material room from frame unloading, to come and go material room handling loader in time, materials vehicle arranges the screens of coupling all size loader; Loader is for loading the chip components and parts of braid formula packaging, and loader is loaded on materials vehicle, is placed in the corresponding screens of materials vehicle according to different specifications.
4. chip mounter simulation teaching system according to claim 1, is characterized in that: components and parts coordinate file is TXT file.
5. chip mounter simulation teaching system according to claim 1, is characterized in that: d solid modeling choice of software PRO/E software.
6. chip mounter simulation teaching system according to claim 1, is characterized in that: also comprise the computing module for calculating the shortest time needed for chip mounter three dimensional virtual models analogue simulation paster process.
7. the chip mounter simulation teaching system of claim 1 is used for the method for simulated teaching, comprising:
1) open UnigraphicsNX, enter interface;
2) user clicks each content as required, carries out learning, analogue simulation paster process.
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| CN107133724A (en) * | 2017-04-18 | 2017-09-05 | 冀月斌 | A kind of chip mounter imports bearing calibration and the system of creation data |
| CN110136533A (en) * | 2019-06-21 | 2019-08-16 | 宁波工程学院 | SMT technique Virtual Simulative Experiment teaching method |
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| CN110823475A (en) * | 2019-11-12 | 2020-02-21 | 南京熊猫电子制造有限公司 | Chip mounter suction nozzle check out test set |
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| CN113518551A (en) * | 2021-04-19 | 2021-10-19 | 珠海诚质兴电子有限公司 | SMT paster production simulation system based on big data analysis |
| CN113887158A (en) * | 2021-12-06 | 2022-01-04 | 山东科技大学 | Virtual simulation teaching method, system and computer equipment |
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| CN117098388A (en) * | 2023-10-18 | 2023-11-21 | 深圳硬之城信息技术有限公司 | BOM list-based intelligent manufacturing method, device, equipment and storage medium |
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| CN113518551A (en) * | 2021-04-19 | 2021-10-19 | 珠海诚质兴电子有限公司 | SMT paster production simulation system based on big data analysis |
| CN113518551B (en) * | 2021-04-19 | 2022-02-11 | 珠海诚质兴电子有限公司 | SMT paster production simulation system based on big data analysis |
| CN113887158A (en) * | 2021-12-06 | 2022-01-04 | 山东科技大学 | Virtual simulation teaching method, system and computer equipment |
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| CN117098388A (en) * | 2023-10-18 | 2023-11-21 | 深圳硬之城信息技术有限公司 | BOM list-based intelligent manufacturing method, device, equipment and storage medium |
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