GB2197132B - Metal-core printed circuit boards and process for making same - Google Patents

Metal-core printed circuit boards and process for making same

Info

Publication number
GB2197132B
GB2197132B GB8720758A GB8720758A GB2197132B GB 2197132 B GB2197132 B GB 2197132B GB 8720758 A GB8720758 A GB 8720758A GB 8720758 A GB8720758 A GB 8720758A GB 2197132 B GB2197132 B GB 2197132B
Authority
GB
United Kingdom
Prior art keywords
metal
printed circuit
circuit boards
making same
core printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8720758A
Other versions
GB2197132A (en
GB8720758D0 (en
Inventor
Helmut Karla
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Publication of GB8720758D0 publication Critical patent/GB8720758D0/en
Publication of GB2197132A publication Critical patent/GB2197132A/en
Application granted granted Critical
Publication of GB2197132B publication Critical patent/GB2197132B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0373—Conductors having a fine structure, e.g. providing a plurality of contact points with a structured tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1476—Same or similar kind of process performed in phases, e.g. coarse patterning followed by fine patterning
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
GB8720758A 1986-09-16 1987-09-03 Metal-core printed circuit boards and process for making same Expired - Lifetime GB2197132B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863631426 DE3631426A1 (en) 1986-09-16 1986-09-16 A PCB WITH METAL CORE, AND METHOD FOR THE PRODUCTION THEREOF

Publications (3)

Publication Number Publication Date
GB8720758D0 GB8720758D0 (en) 1987-10-07
GB2197132A GB2197132A (en) 1988-05-11
GB2197132B true GB2197132B (en) 1990-01-10

Family

ID=6309654

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8720758A Expired - Lifetime GB2197132B (en) 1986-09-16 1987-09-03 Metal-core printed circuit boards and process for making same

Country Status (4)

Country Link
EP (1) EP0260483A3 (en)
JP (1) JPS6377195A (en)
DE (1) DE3631426A1 (en)
GB (1) GB2197132B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19826023C2 (en) * 1998-06-10 2001-01-25 Siemens Ag Multi-layer electrical circuit arrangement
CN113079645B (en) * 2021-03-30 2023-01-24 上海大学 Pressing method for aluminum-based sandwich printed circuit board

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2453788A1 (en) * 1973-11-21 1975-05-22 Litton Industries Inc METHOD OF MANUFACTURING CIRCUIT PANELS WITH PRINTED CIRCUITS
DE2739494B2 (en) * 1977-08-30 1980-10-16 Fuba, Hans Kolbe & Co, 3202 Bad Salzuflen Process for manufacturing electrical circuit boards
JPS5690598A (en) * 1979-12-24 1981-07-22 Hitachi Ltd Method of hardening insulating layer for iron plate core printed circuit board
JPS57162497A (en) * 1981-03-31 1982-10-06 Hitachi Chemical Co Ltd Method of producing metal core-filled insulating substrate
US4571322A (en) * 1982-11-29 1986-02-18 General Electric Company Method for providing insulated holes in conducting substrate
JPS60149189A (en) * 1983-12-14 1985-08-06 松下電工株式会社 Metal base laminated board
JPS60149196A (en) * 1984-01-17 1985-08-06 ソニー株式会社 Printed board and method of producing same
US4544577A (en) * 1984-04-26 1985-10-01 E. F. Johnson Company Process for metallization of dielectric substrate through holes

Also Published As

Publication number Publication date
JPS6377195A (en) 1988-04-07
GB2197132A (en) 1988-05-11
DE3631426C2 (en) 1988-06-23
DE3631426A1 (en) 1988-03-24
GB8720758D0 (en) 1987-10-07
EP0260483A2 (en) 1988-03-23
EP0260483A3 (en) 1988-07-20

Similar Documents

Publication Publication Date Title
GB2195269B (en) Process for making substrates for printed circuit boards
EP0231737A3 (en) Continuous process for the manufacture of printed circuit boards
EP0249688A3 (en) Printed circuit board
GB2229042B (en) Printed circuit boards
ZA846088B (en) Printed circuit boards
GB8307142D0 (en) Printed circuit boards
EP0231795A3 (en) Method for making printed circuit boards
GB8500906D0 (en) Printed circuit boards
ZA873846B (en) Method for manufacture of printed circuit boards
GB2183189B (en) Printed circuit boards
GB8412606D0 (en) Printed circuit boards
ZA873844B (en) Method for manufacture of printed circuit boards
EP0268497A3 (en) Printed circuit board
GB8620789D0 (en) Printed circuit board
GB8304280D0 (en) Printed circuit boards
GB8630392D0 (en) Producing printed circuit boards
GB8308882D0 (en) Printed circuit boards
GB8707929D0 (en) Printed circuit boards
GB8705543D0 (en) Printed circuit board
GB8715744D0 (en) Printed circuit boards
GB2197132B (en) Metal-core printed circuit boards and process for making same
GB8908155D0 (en) Printed circuit boards
GB8815275D0 (en) Method of manufacturing printed circuit boards
ZA846089B (en) Printed circuit boards
ZA873845B (en) Method for manufacture of printed circuit boards

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee