DE69011361D1 - Verfahren und Einrichtung zur Untersuchung von gedruckten Schaltungen. - Google Patents
Verfahren und Einrichtung zur Untersuchung von gedruckten Schaltungen.Info
- Publication number
- DE69011361D1 DE69011361D1 DE69011361T DE69011361T DE69011361D1 DE 69011361 D1 DE69011361 D1 DE 69011361D1 DE 69011361 T DE69011361 T DE 69011361T DE 69011361 T DE69011361 T DE 69011361T DE 69011361 D1 DE69011361 D1 DE 69011361D1
- Authority
- DE
- Germany
- Prior art keywords
- pcb
- printed circuits
- examining
- examining printed
- hue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- General Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Pathology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- General Engineering & Computer Science (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Emergency Protection Circuit Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1051317A JPH02231510A (ja) | 1989-03-02 | 1989-03-02 | 基板検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE69011361D1 true DE69011361D1 (de) | 1994-09-15 |
DE69011361T2 DE69011361T2 (de) | 1995-04-27 |
Family
ID=12883540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69011361T Expired - Fee Related DE69011361T2 (de) | 1989-03-02 | 1990-03-01 | Verfahren und Einrichtung zur Untersuchung von gedruckten Schaltungen. |
Country Status (5)
Country | Link |
---|---|
US (1) | US5032735A (de) |
EP (1) | EP0385474B1 (de) |
JP (1) | JPH02231510A (de) |
AT (1) | ATE109895T1 (de) |
DE (1) | DE69011361T2 (de) |
Families Citing this family (51)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE68929062T2 (de) * | 1988-05-09 | 2000-03-16 | Omron Tateisi Electronics Co | Vorrichtung zum Prüfen von Leiterplatten |
JP2953736B2 (ja) * | 1990-03-20 | 1999-09-27 | 松下電器産業株式会社 | 半田の形状検査方法 |
DE4139189C2 (de) * | 1990-11-29 | 2003-08-28 | Matsushita Electric Ind Co Ltd | Vorrichtung zur optischen Lötstellenprüfung |
JP3113731B2 (ja) * | 1991-05-17 | 2000-12-04 | キヤノン株式会社 | 部品実装検査方法及びその検査装置並びに該検査装置により検査された基板 |
JP3015185B2 (ja) * | 1992-01-28 | 2000-03-06 | 日本鋼管株式会社 | 亜鉛メッキ鋼板の合金化度測定装置 |
US5424838A (en) * | 1993-03-01 | 1995-06-13 | Siu; Bernard | Microelectronics inspection system |
US5302836A (en) * | 1992-07-16 | 1994-04-12 | Bernard Siu | High speed image acquisition for microelectronics inspection |
WO1994024518A1 (en) | 1993-04-21 | 1994-10-27 | Omron Corporation | Visual inspection support apparatus, substrate inspection apparatus, and soldering inspection and correction methods using the same apparatuses |
US5923430A (en) * | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
US5844249A (en) * | 1993-12-24 | 1998-12-01 | Hoechst Aktiengesellschaft | Apparatus for detecting defects of wires on a wiring board wherein optical sensor includes a film of polymer non-linear optical material |
DE9401711U1 (de) * | 1994-02-02 | 1995-06-01 | Kratzer Automatisierung GmbH, 85716 Unterschleißheim | Abbildungsvorrichtung |
AU6341396A (en) * | 1995-06-30 | 1997-02-05 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
JP3322801B2 (ja) * | 1996-08-01 | 2002-09-09 | 三井金属鉱業株式会社 | レジスト飛散検査装置および方法 |
KR19980039100A (ko) * | 1996-11-27 | 1998-08-17 | 배순훈 | 부품의 클린칭 방향을 이용한 미삽 검사장치 및 방법 |
US6148114A (en) * | 1996-11-27 | 2000-11-14 | Ultrapointe Corporation | Ring dilation and erosion techniques for digital image processing |
DE19709939A1 (de) * | 1997-03-11 | 1998-09-17 | Atg Test Systems Gmbh | Verfahren und Vorrichtung zum Prüfen von Leiterplatten |
US6118540A (en) * | 1997-07-11 | 2000-09-12 | Semiconductor Technologies & Instruments, Inc. | Method and apparatus for inspecting a workpiece |
US6072898A (en) | 1998-01-16 | 2000-06-06 | Beaty; Elwin M. | Method and apparatus for three dimensional inspection of electronic components |
JP4332656B2 (ja) * | 1998-01-26 | 2009-09-16 | ラトックシステムエンジニアリング株式会社 | 欠陥検査方法および欠陥検査装置 |
JPH11237210A (ja) * | 1998-02-19 | 1999-08-31 | Komatsu Ltd | 半導体パッケージの検査装置 |
KR100281881B1 (ko) | 1998-07-01 | 2001-02-15 | 윤종용 | 인쇄회로기판의크림솔더검사장치및검사방법 |
TW495060U (en) * | 1998-07-24 | 2002-07-11 | Inventec Corp | Brightness test device of liquid crystal display panel |
KR100345001B1 (ko) * | 1998-08-27 | 2002-07-19 | 삼성전자 주식회사 | 기판 납땜 검사용 조명 및 광학 장치 |
SE514859C2 (sv) * | 1999-01-18 | 2001-05-07 | Mydata Automation Ab | Förfarande och anordning för undersökning av objekt på ett substrat genom att ta bilder av substratet och analysera dessa |
US6552783B1 (en) * | 2000-06-28 | 2003-04-22 | Teradyne, Inc. | Optical system |
KR100465785B1 (ko) * | 2000-07-14 | 2005-01-13 | 삼성전자주식회사 | Pcb용 납땜검사장치 |
EP1220596A1 (de) * | 2000-12-29 | 2002-07-03 | Icos Vision Systems N.V. | Verfahren und Einrichtung zur Lageerfassung der Anschlusskontakte elektronischer Bauelemente |
DE10128476C2 (de) * | 2001-06-12 | 2003-06-12 | Siemens Dematic Ag | Optische Sensorvorrichtung zur visuellen Erfassung von Substraten |
JP3551188B2 (ja) * | 2002-01-10 | 2004-08-04 | オムロン株式会社 | 表面状態検査方法および基板検査装置 |
US20040184653A1 (en) * | 2003-03-20 | 2004-09-23 | Baer Richard L. | Optical inspection system, illumination apparatus and method for use in imaging specular objects based on illumination gradients |
US7352892B2 (en) * | 2003-03-20 | 2008-04-01 | Micron Technology, Inc. | System and method for shape reconstruction from optical images |
US7019826B2 (en) * | 2003-03-20 | 2006-03-28 | Agilent Technologies, Inc. | Optical inspection system, apparatus and method for reconstructing three-dimensional images for printed circuit board and electronics manufacturing inspection |
US7171037B2 (en) * | 2003-03-20 | 2007-01-30 | Agilent Technologies, Inc. | Optical inspection system and method for displaying imaged objects in greater than two dimensions |
KR100557526B1 (ko) * | 2003-05-19 | 2006-03-03 | 삼성전기주식회사 | Rgb 컬러를 이용한 인쇄회로기판의 표면 상태 분석시스템 및 방법 |
JP3867724B2 (ja) * | 2004-02-27 | 2007-01-10 | オムロン株式会社 | 表面状態検査方法およびその方法を用いた表面状態検査装置ならびに基板検査装置 |
US20060086773A1 (en) * | 2004-10-27 | 2006-04-27 | Sanftleben Henry M | Technique for optical inspection system verification |
JP4123271B2 (ja) * | 2005-11-28 | 2008-07-23 | 船井電機株式会社 | 液晶モジュール輝度測定装置 |
JP4978424B2 (ja) * | 2007-10-25 | 2012-07-18 | オムロン株式会社 | 部品実装検査の検査結果確認方法および検査結果確認システム |
JP4510066B2 (ja) | 2007-11-06 | 2010-07-21 | 日東電工株式会社 | 配線回路基板の製造方法および検査方法 |
US8077307B2 (en) * | 2008-04-09 | 2011-12-13 | Orbotech Ltd. | Illumination system for optical inspection |
JP2010177628A (ja) * | 2009-02-02 | 2010-08-12 | Omron Corp | 実装部品の検査結果確定方法および検査結果確定システム |
JP6115012B2 (ja) * | 2011-08-30 | 2017-04-19 | 富士通株式会社 | 検査装置、検査方法及び検査プログラム |
JP6116710B2 (ja) * | 2014-01-08 | 2017-04-19 | ヤマハ発動機株式会社 | 外観検査装置および外観検査方法 |
CN106226326B (zh) * | 2016-08-24 | 2019-09-24 | 环旭电子股份有限公司 | 检测sip模组表面缺陷、露铜表面缺陷的方法及系统 |
WO2019147730A1 (en) * | 2018-01-24 | 2019-08-01 | Corning Incorporated | Apparatus and methods for inspecting damage intensity |
CN108490332B (zh) * | 2018-02-02 | 2021-01-08 | 深圳麦逊电子有限公司 | 自动微针测试治具 |
JP7087533B2 (ja) * | 2018-03-26 | 2022-06-21 | 住友電気工業株式会社 | 表面状態検査装置及び表面状態検査方法 |
KR102112053B1 (ko) * | 2018-08-01 | 2020-05-18 | 주식회사 뷰온 | 이미지 센서를 이용한 표면결함 검사장치 및 검사방법 |
US20220252524A1 (en) * | 2019-07-26 | 2022-08-11 | Fuji Corporation | Inspection device |
US11282187B2 (en) * | 2019-08-19 | 2022-03-22 | Ricoh Company, Ltd. | Inspection system, inspection apparatus, and method using multiple angle illumination |
CN114295627B (zh) * | 2021-12-31 | 2022-10-18 | 广东炬森智能装备有限公司 | 一种柔性线路板的全自动检测装置及检测方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5792989A (en) * | 1980-12-01 | 1982-06-09 | Kiyoshi Nagata | Transmission and receiving system for stereoscopic color television |
US4500203A (en) * | 1982-09-30 | 1985-02-19 | Owens-Illinois, Inc. | Method and apparatus for inspecting articles |
JPS61293657A (ja) * | 1985-06-21 | 1986-12-24 | Matsushita Electric Works Ltd | 半田付け外観検査方法 |
JPH0619243B2 (ja) * | 1985-09-19 | 1994-03-16 | 株式会社トプコン | 座標測定方法及びその装置 |
JPS62127617A (ja) * | 1985-11-29 | 1987-06-09 | Fujitsu Ltd | 線状物体検査装置 |
US4894790A (en) * | 1986-02-05 | 1990-01-16 | Omron Tateisi Electronics Co. | Input method for reference printed circuit board assembly data to an image processing printed circuit board assembly automatic inspection apparatus |
JPS62194444A (ja) * | 1986-02-17 | 1987-08-26 | Omron Tateisi Electronics Co | 部品実装基板検査装置 |
US4876455A (en) * | 1988-02-25 | 1989-10-24 | Westinghouse Electric Corp. | Fiber optic solder joint inspection system |
DE68929062T2 (de) * | 1988-05-09 | 2000-03-16 | Omron Tateisi Electronics Co | Vorrichtung zum Prüfen von Leiterplatten |
JP2688361B2 (ja) * | 1988-08-02 | 1997-12-10 | 正己 山川 | 光電センサ |
EP0370527B1 (de) * | 1988-11-24 | 1994-02-02 | Omron Tateisi Electronics Co. | Verfahren und Gerät zur Inspektion von Schichten |
JPH0745971B2 (ja) * | 1992-10-15 | 1995-05-17 | リンナイ株式会社 | 自動風呂装置 |
-
1989
- 1989-03-02 JP JP1051317A patent/JPH02231510A/ja active Pending
-
1990
- 1990-03-01 EP EP90104019A patent/EP0385474B1/de not_active Expired - Lifetime
- 1990-03-01 US US07/486,019 patent/US5032735A/en not_active Expired - Lifetime
- 1990-03-01 DE DE69011361T patent/DE69011361T2/de not_active Expired - Fee Related
- 1990-03-01 AT AT90104019T patent/ATE109895T1/de active
Also Published As
Publication number | Publication date |
---|---|
EP0385474A2 (de) | 1990-09-05 |
ATE109895T1 (de) | 1994-08-15 |
DE69011361T2 (de) | 1995-04-27 |
EP0385474A3 (de) | 1991-09-04 |
JPH02231510A (ja) | 1990-09-13 |
US5032735A (en) | 1991-07-16 |
EP0385474B1 (de) | 1994-08-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |