ATE67618T1 - Verfahren zur untersuchung von leiterplatten mittels arithmetischen vergleichs von mehreren bildern in verschiedenen farben. - Google Patents

Verfahren zur untersuchung von leiterplatten mittels arithmetischen vergleichs von mehreren bildern in verschiedenen farben.

Info

Publication number
ATE67618T1
ATE67618T1 AT87101522T AT87101522T ATE67618T1 AT E67618 T1 ATE67618 T1 AT E67618T1 AT 87101522 T AT87101522 T AT 87101522T AT 87101522 T AT87101522 T AT 87101522T AT E67618 T1 ATE67618 T1 AT E67618T1
Authority
AT
Austria
Prior art keywords
circuit board
printed circuit
component parts
category
base printed
Prior art date
Application number
AT87101522T
Other languages
English (en)
Inventor
Shigeki Kobayashi
Igadera Department
Yoshio Tateisi
Toshio Yagawa
Shunji Utsunomiya
Hideaki Takahara
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of ATE67618T1 publication Critical patent/ATE67618T1/de

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/102—Video camera

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Biochemistry (AREA)
  • Toxicology (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
AT87101522T 1986-02-05 1987-02-05 Verfahren zur untersuchung von leiterplatten mittels arithmetischen vergleichs von mehreren bildern in verschiedenen farben. ATE67618T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP61023292A JPS62180250A (ja) 1986-02-05 1986-02-05 部品実装基板の検査方法
EP87101522A EP0231941B1 (de) 1986-02-05 1987-02-05 Verfahren zur Untersuchung von Leiterplatten mittels arithmetischen Vergleichs von mehreren Bildern in verschiedenen Farben

Publications (1)

Publication Number Publication Date
ATE67618T1 true ATE67618T1 (de) 1991-10-15

Family

ID=12106530

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87101522T ATE67618T1 (de) 1986-02-05 1987-02-05 Verfahren zur untersuchung von leiterplatten mittels arithmetischen vergleichs von mehreren bildern in verschiedenen farben.

Country Status (4)

Country Link
EP (1) EP0231941B1 (de)
JP (1) JPS62180250A (de)
AT (1) ATE67618T1 (de)
DE (1) DE3773005D1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0236738A3 (de) * 1986-02-05 1988-12-21 OMRON Corporation Verfahren zur Dateneingabe einer bestückten gedruckten Referenzleiterplatte für die Bildverarbeitung eines automatischen Prüfgerätes für bestückte gedruckte Leiterplatten
US5093797A (en) * 1987-01-13 1992-03-03 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
JP2696878B2 (ja) * 1988-02-12 1998-01-14 オムロン株式会社 基板の検査方法およびその装置
DE68929481T2 (de) * 1988-05-09 2004-06-09 Omron Corp. Vorrichtung und Verfahren zur Anzeige der Ergebnisse einer Leiterplattenprüfung
US5039868A (en) * 1988-11-24 1991-08-13 Omron Corporation Method of and apparatus for inspecting printed circuit boards and the like
EP0370527B1 (de) * 1988-11-24 1994-02-02 Omron Tateisi Electronics Co. Verfahren und Gerät zur Inspektion von Schichten
DE69331433T2 (de) * 1992-10-22 2002-10-02 Advanced Interconnection Technology, Inc. Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten
CN1308893C (zh) * 2001-05-02 2007-04-04 良瑞科技股份有限公司 生成电路板检验系统中使用的电路板特征调色板的方法
US7062080B2 (en) 2001-11-26 2006-06-13 Omron Corporation Method of inspecting curved surface and device for inspecting printed circuit board
EP1314974B1 (de) * 2001-11-26 2005-02-02 Omron Corporation Methode zur Prüfung einer gekrümmten Oberfläche und Vorrichtung zur Prüfung einer Leiterplatte
KR100557526B1 (ko) * 2003-05-19 2006-03-03 삼성전기주식회사 Ｒｇｂ 컬러를 이용한 인쇄회로기판의 표면 상태 분석시스템 및 방법
CN100492410C (zh) * 2004-07-05 2009-05-27 松下电器产业株式会社 生成部件图像的方法
EP1763843A1 (de) 2004-07-05 2007-03-21 Matsushita Electric Industrial Co., Ltd. Verfahren zur erzeugung des bildes von komponenten
WO2009120951A2 (en) * 2008-03-28 2009-10-01 Nordson Corporation Automated conformal coating inspection system and methods of use
US8077307B2 (en) 2008-04-09 2011-12-13 Orbotech Ltd. Illumination system for optical inspection
JP5003610B2 (ja) * 2008-06-30 2012-08-15 パナソニック株式会社 基板検査方法
JP5832167B2 (ja) * 2010-07-13 2015-12-16 富士機械製造株式会社 部品有無判定装置及び部品有無判定方法
DE102013104679A1 (de) * 2013-05-07 2014-11-13 Witrins S.R.O. Verfahren und Vorrichtung zur optischen Analyse eines PCBs
CN118858326A (zh) * 2024-07-08 2024-10-29 深圳市宏联电路有限公司 一种多层线路板检测系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3976383A (en) * 1975-02-28 1976-08-24 The Bendix Corporation Visual method of locating faults in printed circuit boards
US4330712A (en) * 1979-02-01 1982-05-18 Hajime Industries Ltd. Inspection apparatus for defects on patterns
JPS59206705A (ja) * 1983-05-11 1984-11-22 Dainippon Screen Mfg Co Ltd パタ−ン検査方法
DE3422395A1 (de) * 1983-06-16 1985-01-17 Hitachi, Ltd., Tokio/Tokyo Verfahren und vorrichtung zum ermitteln von verdrahtungsmustern
JPS6014748A (ja) * 1983-07-07 1985-01-25 ウシオ電機株式会社 ハロゲン電球
JPS60123978A (ja) * 1983-12-08 1985-07-02 Kubota Ltd 色信号分離装置
JPS60169985A (ja) * 1984-02-15 1985-09-03 Hitachi Ltd 色彩抽出装置

Also Published As

Publication number Publication date
EP0231941A2 (de) 1987-08-12
JPS62180250A (ja) 1987-08-07
DE3773005D1 (de) 1991-10-24
EP0231941B1 (de) 1991-09-18
EP0231941A3 (en) 1988-03-02

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