AU6341396A - Method for characterizing defects on semiconductor wafers - Google Patents

Method for characterizing defects on semiconductor wafers

Info

Publication number
AU6341396A
AU6341396A AU63413/96A AU6341396A AU6341396A AU 6341396 A AU6341396 A AU 6341396A AU 63413/96 A AU63413/96 A AU 63413/96A AU 6341396 A AU6341396 A AU 6341396A AU 6341396 A AU6341396 A AU 6341396A
Authority
AU
Australia
Prior art keywords
semiconductor wafers
characterizing defects
characterizing
defects
wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU63413/96A
Inventor
Ken K Lee
Bruce W. Worster
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ultrapointe Corp
Original Assignee
Ultrapointe Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ultrapointe Corp filed Critical Ultrapointe Corp
Publication of AU6341396A publication Critical patent/AU6341396A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
AU63413/96A 1995-06-30 1996-06-28 Method for characterizing defects on semiconductor wafers Abandoned AU6341396A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US49716295A 1995-06-30 1995-06-30
US497162 1995-06-30
PCT/US1996/010962 WO1997002465A1 (en) 1995-06-30 1996-06-28 Method for characterizing defects on semiconductor wafers

Publications (1)

Publication Number Publication Date
AU6341396A true AU6341396A (en) 1997-02-05

Family

ID=23975719

Family Applications (1)

Application Number Title Priority Date Filing Date
AU63413/96A Abandoned AU6341396A (en) 1995-06-30 1996-06-28 Method for characterizing defects on semiconductor wafers

Country Status (2)

Country Link
AU (1) AU6341396A (en)
WO (1) WO1997002465A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6453264B1 (en) * 1997-04-30 2002-09-17 Southwest Research Institute Surface flaw detection using spatial raman-based imaging
US6987873B1 (en) * 1998-07-08 2006-01-17 Applied Materials, Inc. Automatic defect classification with invariant core classes
US6407373B1 (en) * 1999-06-15 2002-06-18 Applied Materials, Inc. Apparatus and method for reviewing defects on an object
EP1519318A4 (en) * 2002-06-28 2008-11-19 Fujitsu Ltd Three-dimensional image comparing program, three-dimensionalimage comparing method, and three-dimensional image comparing device
CN114599934A (en) * 2019-10-31 2022-06-07 卡尔蔡司Smt有限责任公司 FIB-SEM 3D tomography for measuring shape deviation of HAR structures
CN110927170B (en) * 2019-12-04 2022-03-08 中国工程物理研究院激光聚变研究中心 Defect determination method, device and system
CN113295616A (en) * 2021-03-30 2021-08-24 浙江大学杭州国际科创中心 Comprehensive test method for SiC wafer and epitaxial layer structure thereof
CN113655066A (en) * 2021-08-13 2021-11-16 南方海洋科学与工程广东省实验室(湛江) Device, system and method for detecting damage of net cage
CN115711900A (en) * 2022-11-30 2023-02-24 安测半导体技术(江苏)有限公司 Wafer test detection method based on neural network

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5030008A (en) * 1988-10-11 1991-07-09 Kla Instruments, Corporation Method and apparatus for the automated analysis of three-dimensional objects
JPH02231510A (en) * 1989-03-02 1990-09-13 Omron Tateisi Electron Co Substrate inspection device
US5289267A (en) * 1991-10-04 1994-02-22 Kms Fusion, Inc. Electro-optical system for gauging surface profile deviations
US5355212A (en) * 1993-07-19 1994-10-11 Tencor Instruments Process for inspecting patterned wafers

Also Published As

Publication number Publication date
WO1997002465A1 (en) 1997-01-23

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