DE3850889D1 - Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung. - Google Patents

Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung.

Info

Publication number
DE3850889D1
DE3850889D1 DE3850889T DE3850889T DE3850889D1 DE 3850889 D1 DE3850889 D1 DE 3850889D1 DE 3850889 T DE3850889 T DE 3850889T DE 3850889 T DE3850889 T DE 3850889T DE 3850889 D1 DE3850889 D1 DE 3850889D1
Authority
DE
Germany
Prior art keywords
unit
alarm
packaged
substrate
packaged substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE3850889T
Other languages
English (en)
Other versions
DE3850889T2 (de
Inventor
Shigeki Omron Tateis Kobayashi
Teruhisa Omron Tateisi Yotsuya
Yasuaki Omron Tateisi Tanimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP62005276A external-priority patent/JPS63173172A/ja
Priority claimed from JP62005274A external-priority patent/JPH07120421B2/ja
Priority claimed from JP62005275A external-priority patent/JPH07122901B2/ja
Priority claimed from JP62005273A external-priority patent/JP2692068B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of DE3850889D1 publication Critical patent/DE3850889D1/de
Publication of DE3850889T2 publication Critical patent/DE3850889T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
DE3850889T 1987-01-13 1988-01-13 Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung. Expired - Lifetime DE3850889T2 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP62005276A JPS63173172A (ja) 1987-01-13 1987-01-13 実装基板検査装置
JP62005274A JPH07120421B2 (ja) 1987-01-13 1987-01-13 実装基板検査装置
JP62005275A JPH07122901B2 (ja) 1987-01-13 1987-01-13 実装基板検査装置
JP62005273A JP2692068B2 (ja) 1987-01-13 1987-01-13 実装基板検査結果出力装置

Publications (2)

Publication Number Publication Date
DE3850889D1 true DE3850889D1 (de) 1994-09-08
DE3850889T2 DE3850889T2 (de) 1995-04-13

Family

ID=27454266

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3850889T Expired - Lifetime DE3850889T2 (de) 1987-01-13 1988-01-13 Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung.

Country Status (4)

Country Link
US (1) US5093797A (de)
EP (1) EP0277502B1 (de)
AT (1) ATE109571T1 (de)
DE (1) DE3850889T2 (de)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3543689A (en) * 1988-05-09 1989-11-29 Omron Tateisi Electronics Co. Substrate examining apparatus and method of operating same
FR2640050B1 (fr) * 1988-12-06 1991-03-29 Bull Sa Procede pour le controle d'une carte de circuit imprime equipee notamment le controle des composants de la carte et appareillage pour la mise en oeuvre de ce procede
JP2941308B2 (ja) 1989-07-12 1999-08-25 株式会社日立製作所 検査システムおよび電子デバイスの製造方法
US6185324B1 (en) 1989-07-12 2001-02-06 Hitachi, Ltd. Semiconductor failure analysis system
JP2986868B2 (ja) * 1990-03-14 1999-12-06 株式会社日立製作所 外観検査方法及びその装置
JP2928331B2 (ja) * 1990-05-14 1999-08-03 東京エレクトロン株式会社 プローバのアライメント装置及び方法
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
JPH07306883A (ja) * 1994-05-12 1995-11-21 Fujitsu Ltd パターン評価支援装置
JP3418497B2 (ja) * 1996-04-16 2003-06-23 松下電器産業株式会社 部品認識方法
JPH10143660A (ja) 1996-11-11 1998-05-29 Hitachi Ltd 欠陥判定処理方法およびその装置
US6330354B1 (en) * 1997-05-01 2001-12-11 International Business Machines Corporation Method of analyzing visual inspection image data to find defects on a device
JP2001289614A (ja) * 2000-01-31 2001-10-19 Omron Corp 変位センサ
US7062080B2 (en) * 2001-11-26 2006-06-13 Omron Corporation Method of inspecting curved surface and device for inspecting printed circuit board
DE10210033A1 (de) * 2002-03-07 2003-10-02 Agro Federkernproduktion Ek Verfahren zur Herstellung eines Federkerns und Vorrichtung zur Durchführung des Verfahrens
KR100486410B1 (ko) * 2002-04-29 2005-04-29 주식회사 미르기술 회로기판 검사장치용 자동티칭방법
US8588511B2 (en) * 2002-05-22 2013-11-19 Cognex Corporation Method and apparatus for automatic measurement of pad geometry and inspection thereof
US7383525B2 (en) * 2004-01-09 2008-06-03 Matsushita Electric Industrial Co., Ltd. Design review output apparatus, design review support apparatus, design review system, design review output method, and design review support method
US20090228328A1 (en) * 2006-04-27 2009-09-10 Jonathan Cagan Method and Apparatus for Quantifying Aesthetic Preferences in Product Design Using Production Rules
KR101750521B1 (ko) 2015-07-27 2017-07-03 주식회사 고영테크놀러지 기판 검사 장치 및 방법
DE102015115065A1 (de) * 2015-09-08 2017-03-09 Asm Assembly Systems Gmbh & Co. Kg Teachen von Bestückpositionen

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3872243A (en) * 1971-05-18 1975-03-18 Image Analysing Computers Ltd Method and apparatus for checking measurements made in image analysis systems
DE2138238A1 (de) * 1971-07-30 1973-02-08 Siemens Ag Verfahren und einrichtung zum pruefen von objekten bestimmter flaechenhafter oder raeumlicher konfiguration bei vorzugsweise gedruckten schaltungstraegern, elektrischen baugruppen oder dergleichen
US4345312A (en) * 1979-04-13 1982-08-17 Hitachi, Ltd. Method and device for inspecting the defect of a pattern represented on an article
US4379308A (en) * 1980-02-25 1983-04-05 Cooper Industries, Inc. Apparatus for determining the parameters of figures on a surface
DE3175773D1 (en) * 1980-06-10 1987-02-05 Fujitsu Ltd Pattern position recognition apparatus
GB2086061B (en) * 1980-10-13 1985-05-22 Marconi Instruments Ltd Automatic test systems
US4473842A (en) * 1981-07-06 1984-09-25 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus and method for examining printed circuit board provided with electronic parts
US4589139A (en) * 1982-02-04 1986-05-13 Nippon Kogaku K. K. Apparatus for detecting defects in pattern
JPS58201185A (ja) * 1982-05-19 1983-11-22 Toshiba Corp 位置検出装置
US4642813A (en) * 1983-04-18 1987-02-10 Object Recognition Systems, Inc. Electro-optical quality control inspection of elements on a product
JPS60123978A (ja) * 1983-12-08 1985-07-02 Kubota Ltd 色信号分離装置
DE3427981A1 (de) * 1984-07-28 1986-02-06 Telefunken electronic GmbH, 7100 Heilbronn Verfahren zur fehlererkennung an definierten strukturen
JPS61170224A (ja) * 1985-01-21 1986-07-31 住友電気工業株式会社 架空送電線路の事故点検出方法及び装置
JP2602201B2 (ja) * 1985-04-12 1997-04-23 株式会社日立製作所 被検査パターンの欠陥検査方法
US4707734A (en) * 1985-06-17 1987-11-17 The Perkin-Elmer Corporation Coarse flaw detector for printed circuit board inspection
JPS6261390A (ja) * 1985-09-11 1987-03-18 興和株式会社 プリント基板検査方法およびその装置
JPS62180250A (ja) * 1986-02-05 1987-08-07 Omron Tateisi Electronics Co 部品実装基板の検査方法
US4953100A (en) * 1986-10-03 1990-08-28 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device

Also Published As

Publication number Publication date
US5093797A (en) 1992-03-03
DE3850889T2 (de) 1995-04-13
ATE109571T1 (de) 1994-08-15
EP0277502B1 (de) 1994-08-03
EP0277502A1 (de) 1988-08-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)