DE69005444D1 - Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger. - Google Patents

Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger.

Info

Publication number
DE69005444D1
DE69005444D1 DE90901806T DE69005444T DE69005444D1 DE 69005444 D1 DE69005444 D1 DE 69005444D1 DE 90901806 T DE90901806 T DE 90901806T DE 69005444 T DE69005444 T DE 69005444T DE 69005444 D1 DE69005444 D1 DE 69005444D1
Authority
DE
Germany
Prior art keywords
carrier
fixing
electronic circuit
circuit substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE90901806T
Other languages
English (en)
Other versions
DE69005444T2 (de
Inventor
Pierre Coques
Pascal Deneau
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of DE69005444D1 publication Critical patent/DE69005444D1/de
Publication of DE69005444T2 publication Critical patent/DE69005444T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Hooks, Suction Cups, And Attachment By Adhesive Means (AREA)
DE69005444T 1989-01-25 1990-01-24 Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger. Expired - Fee Related DE69005444T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8900891A FR2642224B1 (fr) 1989-01-25 1989-01-25 Procede et dispositif de fixation d'un substrat de circuit electronique sur un support
PCT/EP1990/000133 WO1990009090A1 (en) 1989-01-25 1990-01-24 Method and device for fastening an electronic circuit substrate onto a support

Publications (2)

Publication Number Publication Date
DE69005444D1 true DE69005444D1 (de) 1994-02-03
DE69005444T2 DE69005444T2 (de) 1994-05-19

Family

ID=9378080

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69005444T Expired - Fee Related DE69005444T2 (de) 1989-01-25 1990-01-24 Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger.

Country Status (5)

Country Link
US (1) US5157828A (de)
EP (1) EP0455658B1 (de)
DE (1) DE69005444T2 (de)
FR (1) FR2642224B1 (de)
WO (1) WO1990009090A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2691871A1 (fr) * 1992-06-02 1993-12-03 Alcatel Espace Procédé d'assemblage par collage sous vide des circuits hybrides et assemblages obtenus par ce procédé.
US5548091A (en) * 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
DE29603390U1 (de) * 1996-02-24 1997-06-26 Bosch Gmbh Robert Elektronisches Steuergerät
US6460245B1 (en) 1996-03-07 2002-10-08 Tessera, Inc. Method of fabricating semiconductor chip assemblies
US5796050A (en) * 1997-02-05 1998-08-18 International Business Machines Corporation Flexible board having adhesive in surface channels
US6884313B2 (en) * 2001-01-08 2005-04-26 Fujitsu Limited Method and system for joining and an ultra-high density interconnect
US6866741B2 (en) * 2001-01-08 2005-03-15 Fujitsu Limited Method for joining large substrates
US6800169B2 (en) * 2001-01-08 2004-10-05 Fujitsu Limited Method for joining conductive structures and an electrical conductive article
EP2093043B2 (de) * 2008-02-22 2019-11-20 Lm Glasfiber A/S Verfahren und Vorrichtung zur Entdeckung eines Lecks in einem VARTM-Prozess
US20140374608A1 (en) * 2013-06-19 2014-12-25 Canon Kabushiki Kaisha Radiation detection apparatus and method of manufacturing the same
FR3104546A1 (fr) * 2019-12-17 2021-06-18 Airbus Defence And Space Sas Procédé d’assemblage d’une pluralité d’équipements sur une structure de satellite et structure de satellite portant une pluralité d’équipements

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1445156A (fr) * 1964-08-27 1966-07-08 Bosch Gmbh Robert Dispositif à élément semi-conducteur, disposé dans une capsule électriquement conductrice et monté sur une pièce servant d'appui et d'évacuateur de chaleur
US4478882A (en) * 1982-06-03 1984-10-23 Italtel Societa Italiana Telecomunicazioni S.P.A. Method for conductively interconnecting circuit components on opposite surfaces of a dielectric layer
JPS62156931A (ja) * 1985-12-28 1987-07-11 Ibiden Co Ltd 多層プリント配線板の製造方法及びこれに使用する装置
DE8601294U1 (de) * 1986-01-20 1986-03-06 Telefunken electronic GmbH, 74072 Heilbronn Gerät zum Auftragen von Kleber
US5032426A (en) * 1989-05-15 1991-07-16 Enthone, Incorporated Method and apparatus for applying liquid coatings on the surface of printed circuit boards
US5034083A (en) * 1989-10-16 1991-07-23 Xerox Corporation Process and apparatus for assembling smaller scanning or printing arrays together to form an extended array

Also Published As

Publication number Publication date
EP0455658B1 (de) 1993-12-22
FR2642224B1 (fr) 1991-04-19
DE69005444T2 (de) 1994-05-19
WO1990009090A1 (en) 1990-08-09
FR2642224A1 (fr) 1990-07-27
EP0455658A1 (de) 1991-11-13
US5157828A (en) 1992-10-27

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee