ATE109278T1 - Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe. - Google Patents
Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe.Info
- Publication number
- ATE109278T1 ATE109278T1 AT87114529T AT87114529T ATE109278T1 AT E109278 T1 ATE109278 T1 AT E109278T1 AT 87114529 T AT87114529 T AT 87114529T AT 87114529 T AT87114529 T AT 87114529T AT E109278 T1 ATE109278 T1 AT E109278T1
- Authority
- AT
- Austria
- Prior art keywords
- packaged substrate
- investigation
- substrate
- land
- fixed assembly
- Prior art date
Links
- 238000011835 investigation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 8
- 238000003384 imaging method Methods 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/70—Determining position or orientation of objects or cameras
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30148—Semiconductor; IC; Wafer
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP61236499A JPH0820229B2 (ja) | 1986-10-03 | 1986-10-03 | 実装基板検査装置 |
JP61256995A JPH07120420B2 (ja) | 1986-10-30 | 1986-10-30 | 実装基板検査装置 |
JP61256994A JP2664141B2 (ja) | 1986-10-30 | 1986-10-30 | 実装基板検査装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
ATE109278T1 true ATE109278T1 (de) | 1994-08-15 |
Family
ID=27332376
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AT87114529T ATE109278T1 (de) | 1986-10-03 | 1987-10-05 | Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe. |
Country Status (5)
Country | Link |
---|---|
US (2) | US4953100A (de) |
EP (1) | EP0263473B1 (de) |
AT (1) | ATE109278T1 (de) |
DE (1) | DE3750285T2 (de) |
HK (1) | HK36696A (de) |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4953100A (en) * | 1986-10-03 | 1990-08-28 | Omron Tateisi Electronics Co. | Apparatus for inspecting packaged electronic device |
US5093797A (en) * | 1987-01-13 | 1992-03-03 | Omron Tateisi Electronics Co. | Apparatus for inspecting packaged electronic device |
JP2517637B2 (ja) * | 1988-02-15 | 1996-07-24 | キヤノン株式会社 | マ―ク位置検出方法及びそれが適用される装置 |
KR920006031B1 (ko) * | 1988-05-09 | 1992-07-27 | 다떼이시 덴끼 가부시끼 가이샤 | 기판등의 검사장치 및 그 동작방법 |
JPH01284743A (ja) * | 1988-05-10 | 1989-11-16 | Toshiba Corp | 半導体装置の樹脂モールドの外観検査方法とその検査装置 |
JPH02140886A (ja) * | 1988-11-21 | 1990-05-30 | Omron Tateisi Electron Co | 画像の前処理装置 |
US5027417A (en) * | 1989-03-31 | 1991-06-25 | Dainippon Screen Mfg. Co., Ltd. | Method of and apparatus for inspecting conductive pattern on printed board |
US5144681A (en) * | 1989-03-31 | 1992-09-01 | Dainnippon Screen Mfg. Co., Ltd. | Method of and apparatus for inspecting conductive pattern on printed board |
JPH03188358A (ja) * | 1989-12-19 | 1991-08-16 | Hajime Sangyo Kk | 物体の表面検査装置 |
JP3092809B2 (ja) * | 1989-12-21 | 2000-09-25 | 株式会社日立製作所 | 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置 |
EP0435660B1 (de) * | 1989-12-29 | 1997-06-04 | Canon Kabushiki Kaisha | Bildverarbeitungsverfahren zur Bewertung von Objekten und Vorrichtung zur Qualitätsprüfung zur Durchführung des Verfahrens |
US5243665A (en) * | 1990-03-07 | 1993-09-07 | Fmc Corporation | Component surface distortion evaluation apparatus and method |
US5197105A (en) * | 1990-05-30 | 1993-03-23 | Dainippon Screen Mfg. Co. Ltd. | Method of reading optical image of inspected surface and image reading system employabale therein |
GB9021444D0 (en) * | 1990-10-02 | 1990-11-14 | Delco Electronic Overseas Corp | Light mask |
US5598345A (en) * | 1990-11-29 | 1997-01-28 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for inspecting solder portions |
SG45181A1 (en) * | 1991-07-22 | 1998-01-16 | Omron Tateisi Electronics Co | Teaching method and system for mounted component inspection |
US5237622A (en) * | 1991-12-04 | 1993-08-17 | Micron Technology, Inc. | Semiconductor pick-and-place machine automatic calibration apparatus |
GB2262339B (en) * | 1991-12-13 | 1995-09-06 | Honda Motor Co Ltd | Method of inspecting the surface of a workpiece |
US5495535A (en) * | 1992-01-31 | 1996-02-27 | Orbotech Ltd | Method of inspecting articles |
DE69331433T2 (de) * | 1992-10-22 | 2002-10-02 | Advanced Interconnection Tech | Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten |
US5392360A (en) * | 1993-04-28 | 1995-02-21 | International Business Machines Corporation | Method and apparatus for inspection of matched substrate heatsink and hat assemblies |
US5566244A (en) * | 1993-11-22 | 1996-10-15 | Honda Giken Kogyo Kabushiki Kaisha | Method of inspecting a workpiece surface including a picturing system with a shortened focal plane |
MY127829A (en) * | 1996-05-30 | 2006-12-29 | Sony Emcs Malaysia Sdn Bhd | Mounting system. |
IE80676B1 (en) * | 1996-08-02 | 1998-11-18 | M V Research Limited | A measurement system |
DE19653403C2 (de) * | 1996-10-21 | 2001-05-10 | Koenig & Bauer Ag | Verfahren zum Transport von Bogen |
JPH10143660A (ja) | 1996-11-11 | 1998-05-29 | Hitachi Ltd | 欠陥判定処理方法およびその装置 |
KR19980039109A (ko) * | 1996-11-27 | 1998-08-17 | 배순훈 | 클린칭 검사기능을 갖는 자삽경로 작성장치와 그 검사방법 |
US6047084A (en) * | 1997-11-18 | 2000-04-04 | Motorola, Inc. | Method for determining accuracy of a circuit assembly process and machine employing the same |
JP2000326495A (ja) * | 1999-05-24 | 2000-11-28 | Matsushita Electric Ind Co Ltd | クリーム半田印刷の検査方法 |
US6542630B1 (en) | 1999-09-14 | 2003-04-01 | Teradyne, Inc. | Inspecting component placement relative to component pads |
JP3870872B2 (ja) * | 2002-08-06 | 2007-01-24 | オムロン株式会社 | 検査データ作成方法およびこの方法を用いた基板検査装置 |
DE10261865A1 (de) * | 2002-12-20 | 2004-07-15 | Uwe Braun Sonnenlichtleitsysteme Lichtsysteme Gmbh | Verfahren, Vorrichtung und Computerprogramm zur optischen Oberflächenerfassung |
GB0324638D0 (en) * | 2003-10-22 | 2003-11-26 | Gore W L & Ass Uk | An on-line inspection system |
CN1662132B (zh) * | 2004-02-26 | 2010-08-18 | 欧姆龙株式会社 | 安装错误检测方法和采用该方法的基板检测装置 |
JP4165538B2 (ja) * | 2004-07-21 | 2008-10-15 | オムロン株式会社 | 部品実装検査方法および部品実装検査装置 |
JP4935109B2 (ja) * | 2005-03-17 | 2012-05-23 | オムロン株式会社 | 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置 |
JP4595705B2 (ja) * | 2005-06-22 | 2010-12-08 | オムロン株式会社 | 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置 |
WO2010085257A1 (en) * | 2009-01-24 | 2010-07-29 | Hewlett-Packard Devlopment Company, L.P. | System and method for enhancing security printing |
US11084225B2 (en) | 2018-04-02 | 2021-08-10 | Nanotronics Imaging, Inc. | Systems, methods, and media for artificial intelligence process control in additive manufacturing |
US11209795B2 (en) | 2019-02-28 | 2021-12-28 | Nanotronics Imaging, Inc. | Assembly error correction for assembly lines |
US10481579B1 (en) * | 2019-02-28 | 2019-11-19 | Nanotronics Imaging, Inc. | Dynamic training for assembly lines |
CN110534411B (zh) * | 2019-08-21 | 2021-07-13 | 大同新成新材料股份有限公司 | 一种芯片硅的加工方法 |
CN114450135A (zh) | 2019-09-10 | 2022-05-06 | 纳米电子成像有限公司 | 用于制造过程的系统、方法和介质 |
KR20220133712A (ko) * | 2021-03-25 | 2022-10-05 | 현대자동차주식회사 | 차량의 품질 관리 시스템 및 그 방법 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IT1129509B (it) * | 1980-01-14 | 1986-06-04 | Tasco Spa | Procedimento ed apparecchiatura per il ritrovamento in tempo reale di difetti in oggetti industriali |
US4379308A (en) * | 1980-02-25 | 1983-04-05 | Cooper Industries, Inc. | Apparatus for determining the parameters of figures on a surface |
DE3070433D1 (en) * | 1980-12-18 | 1985-05-09 | Ibm | Method for the inspection and automatic sorting of objects with configurations of fixed dimensional tolerances, and device for carrying out the method |
US4473842A (en) * | 1981-07-06 | 1984-09-25 | Tokyo Shibaura Denki Kabushiki Kaisha | Apparatus and method for examining printed circuit board provided with electronic parts |
JPS5863838A (ja) * | 1981-10-14 | 1983-04-15 | Fuji Electric Co Ltd | 欠陥検出回路 |
US4589139A (en) * | 1982-02-04 | 1986-05-13 | Nippon Kogaku K. K. | Apparatus for detecting defects in pattern |
JPS58201185A (ja) * | 1982-05-19 | 1983-11-22 | Toshiba Corp | 位置検出装置 |
DE3347645C1 (de) * | 1983-12-30 | 1985-10-10 | Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen | Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt |
JPS60263807A (ja) * | 1984-06-12 | 1985-12-27 | Dainippon Screen Mfg Co Ltd | プリント配線板のパタ−ン欠陥検査装置 |
FI73329B (fi) * | 1984-08-29 | 1987-05-29 | Halton Oy | Anordning foer identifiering och registrering av flaskor och/eller flaskkorgar. |
US4794647A (en) * | 1985-04-08 | 1988-12-27 | Northern Telecom Limited | Automatic optical inspection system |
US4707734A (en) * | 1985-06-17 | 1987-11-17 | The Perkin-Elmer Corporation | Coarse flaw detector for printed circuit board inspection |
JPS6261390A (ja) * | 1985-09-11 | 1987-03-18 | 興和株式会社 | プリント基板検査方法およびその装置 |
JPH0762868B2 (ja) * | 1985-10-02 | 1995-07-05 | 株式会社日立製作所 | プリント基板の配線パターン欠陥検査方法 |
JPS62173731A (ja) * | 1986-01-28 | 1987-07-30 | Toshiba Corp | 被検査物の表面検査装置 |
US4953100A (en) * | 1986-10-03 | 1990-08-28 | Omron Tateisi Electronics Co. | Apparatus for inspecting packaged electronic device |
US4760444A (en) * | 1987-07-22 | 1988-07-26 | Csd International, Inc. | Machine visual inspection device and method |
US4876656A (en) * | 1987-08-28 | 1989-10-24 | Motorola Inc. | Circuit location sensor for component placement apparatus |
-
1987
- 1987-10-05 US US07/104,149 patent/US4953100A/en not_active Expired - Lifetime
- 1987-10-05 AT AT87114529T patent/ATE109278T1/de not_active IP Right Cessation
- 1987-10-05 EP EP87114529A patent/EP0263473B1/de not_active Expired - Lifetime
- 1987-10-05 DE DE3750285T patent/DE3750285T2/de not_active Expired - Fee Related
-
1990
- 1990-05-09 US US07/513,227 patent/US5027295A/en not_active Expired - Lifetime
-
1996
- 1996-02-29 HK HK36696A patent/HK36696A/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
HK36696A (en) | 1996-03-08 |
EP0263473B1 (de) | 1994-07-27 |
DE3750285T2 (de) | 1995-03-30 |
US4953100A (en) | 1990-08-28 |
DE3750285D1 (de) | 1994-09-01 |
EP0263473A2 (de) | 1988-04-13 |
EP0263473A3 (en) | 1990-10-10 |
US5027295A (en) | 1991-06-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ATE109278T1 (de) | Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe. | |
EP0385625A3 (de) | Verfahren und Gerät zur Prüfung von Substraten | |
ATE25151T1 (de) | Untersuchungs- und pruefungsverfahren fuer eine elektrische vorrichtung in der art einer integrierten oder gedruckten schaltung. | |
NO871159D0 (no) | Fremgangsmaate og apparatur for forbedret sar - avbildning (syntisert aperturradar) for skipsklassifisering. | |
DE69116270D1 (de) | Verfahren und vorrichtung zur bestimmung der position von mindestens einer anschlussfahne eines elektronischen bauelements | |
DE3750919D1 (de) | Verfahren und Vorrichtung zur Verarbeitung eines Bildes gemäss eines Korrekturniveaus. | |
KR900000653B1 (en) | Object observation method and apparatus of small gap | |
DE3852890D1 (de) | Verfahren und vorrichtung zur schnellen, hochauflösenden, dreidimensionalen abbildung eines gegenstandes an einer untersuchungsstation. | |
DE3789741T2 (de) | Verfahren und Vorrichtung zur Gradationskorrektur eines durch Bilddaten wiedergegebenen Bildes. | |
DE3751775D1 (de) | Elektronischer Verschluss für eine elektronische Kamera und Verfahren zur Verwendung eines CCD Bildsensors als elektronischer Verschluss für eine solche Kamera | |
DE3882788T2 (de) | Gerät zur Verarbeitung eines Röntgenstrahlbildes. | |
DE3874705D1 (de) | Verfahren zur bewegungsabschaetzung mit mehreren prediktoren fuer punkte eines elektronischen bildes. | |
DE3751412D1 (de) | Verfahren und Vorrichtung zur Bildverarbeitung mit Gradationskorrektur des Bildsignals. | |
DE69024025T2 (de) | Verfahren und Vorrichtung zur Druckbildverbesserung. | |
DE3850889D1 (de) | Apparat zum Untersuchen einer bestückten elektronischen Vorrichtung. | |
DE3852134T2 (de) | Vorrichtung und verfahren zur aufbereitung von abgetasteten mikrofilmbildern. | |
DE3777311D1 (de) | Verfahren und vorrichtung zur signaluebertragung zwischen modulen einer elektronischen anordnung. | |
EP0381067A3 (de) | Verfahren zur C.A.D.-Modellspeicherung auf Videobildern mit Addierung der Unordnung | |
DE69005444T2 (de) | Verfahren und vorrichtung zur fixierung eines elektronischen schaltungssubstrates auf einem träger. | |
DE3769356D1 (de) | Bildverarbeitungsvorrichtung zur schaetzung der verschiebung in bildern befindlicher objekte. | |
DE3767034D1 (de) | Reinigungsverfahren fuer den fotoleitertraeger eines bilderzeugungsgeraetes. | |
DE3687902D1 (de) | Verfahren und vorrichtung fuer photolackverarbeitung. | |
GB9308923D0 (en) | Electronic counter-measures method and apparatus for towing by an aircraft | |
JPS5666093A (en) | Method and device for positioning electronic part on printed board | |
DE3687903D1 (de) | Verfahren und vorrichtung fuer photolackverarbeitung. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RER | Ceased as to paragraph 5 lit. 3 law introducing patent treaties |