DE3750285T2 - Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe. - Google Patents

Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe.

Info

Publication number
DE3750285T2
DE3750285T2 DE3750285T DE3750285T DE3750285T2 DE 3750285 T2 DE3750285 T2 DE 3750285T2 DE 3750285 T DE3750285 T DE 3750285T DE 3750285 T DE3750285 T DE 3750285T DE 3750285 T2 DE3750285 T2 DE 3750285T2
Authority
DE
Germany
Prior art keywords
packaged substrate
examining
substrate
land
fixed assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE3750285T
Other languages
English (en)
Other versions
DE3750285D1 (de
Inventor
Teruhisa Omron Tateisi Yotuya
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP61236499A external-priority patent/JPH0820229B2/ja
Priority claimed from JP61256995A external-priority patent/JPH07120420B2/ja
Priority claimed from JP61256994A external-priority patent/JP2664141B2/ja
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Application granted granted Critical
Publication of DE3750285D1 publication Critical patent/DE3750285D1/de
Publication of DE3750285T2 publication Critical patent/DE3750285T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
DE3750285T 1986-10-03 1987-10-05 Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe. Expired - Fee Related DE3750285T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61236499A JPH0820229B2 (ja) 1986-10-03 1986-10-03 実装基板検査装置
JP61256995A JPH07120420B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置
JP61256994A JP2664141B2 (ja) 1986-10-30 1986-10-30 実装基板検査装置

Publications (2)

Publication Number Publication Date
DE3750285D1 DE3750285D1 (de) 1994-09-01
DE3750285T2 true DE3750285T2 (de) 1995-03-30

Family

ID=27332376

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3750285T Expired - Fee Related DE3750285T2 (de) 1986-10-03 1987-10-05 Gerät zur Untersuchung einer elektronischen Vorrichtung in fester Baugruppe.

Country Status (5)

Country Link
US (2) US4953100A (de)
EP (1) EP0263473B1 (de)
AT (1) ATE109278T1 (de)
DE (1) DE3750285T2 (de)
HK (1) HK36696A (de)

Families Citing this family (44)

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ATE109278T1 (de) * 1986-10-03 1994-08-15 Omron Tateisi Electronics Co Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe.
US5093797A (en) * 1987-01-13 1992-03-03 Omron Tateisi Electronics Co. Apparatus for inspecting packaged electronic device
JP2517637B2 (ja) * 1988-02-15 1996-07-24 キヤノン株式会社 マ―ク位置検出方法及びそれが適用される装置
DE68929481T2 (de) * 1988-05-09 2004-06-09 Omron Corp. Vorrichtung und Verfahren zur Anzeige der Ergebnisse einer Leiterplattenprüfung
JPH01284743A (ja) * 1988-05-10 1989-11-16 Toshiba Corp 半導体装置の樹脂モールドの外観検査方法とその検査装置
JPH02140886A (ja) * 1988-11-21 1990-05-30 Omron Tateisi Electron Co 画像の前処理装置
US5144681A (en) * 1989-03-31 1992-09-01 Dainnippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
US5027417A (en) * 1989-03-31 1991-06-25 Dainippon Screen Mfg. Co., Ltd. Method of and apparatus for inspecting conductive pattern on printed board
JPH03188358A (ja) * 1989-12-19 1991-08-16 Hajime Sangyo Kk 物体の表面検査装置
JP3092809B2 (ja) * 1989-12-21 2000-09-25 株式会社日立製作所 検査方法、並びに検査プログラムデータの自動作成機能を有する検査装置
DE69030869T2 (de) * 1989-12-29 1997-10-16 Canon Kk Bildverarbeitungsverfahren zur Bewertung von Objekten und Vorrichtung zur Qualitätsprüfung zur Durchführung des Verfahrens
US5243665A (en) * 1990-03-07 1993-09-07 Fmc Corporation Component surface distortion evaluation apparatus and method
US5197105A (en) * 1990-05-30 1993-03-23 Dainippon Screen Mfg. Co. Ltd. Method of reading optical image of inspected surface and image reading system employabale therein
GB9021444D0 (en) * 1990-10-02 1990-11-14 Delco Electronic Overseas Corp Light mask
US5598345A (en) * 1990-11-29 1997-01-28 Matsushita Electric Industrial Co., Ltd. Method and apparatus for inspecting solder portions
EP0526080B1 (de) * 1991-07-22 1996-10-02 Omron Corporation Lehrmethode und System zur Kontrolle der angeschlossenen Bauteile
US5237622A (en) * 1991-12-04 1993-08-17 Micron Technology, Inc. Semiconductor pick-and-place machine automatic calibration apparatus
GB2262339B (en) * 1991-12-13 1995-09-06 Honda Motor Co Ltd Method of inspecting the surface of a workpiece
US5495535A (en) * 1992-01-31 1996-02-27 Orbotech Ltd Method of inspecting articles
EP0594146B1 (de) * 1992-10-22 2002-01-09 Advanced Interconnection Technology, Inc. Einrichtung zur automatischen optischen Prüfung von Leiterplatten mit darin verlegten Drähten
US5392360A (en) * 1993-04-28 1995-02-21 International Business Machines Corporation Method and apparatus for inspection of matched substrate heatsink and hat assemblies
US5566244A (en) * 1993-11-22 1996-10-15 Honda Giken Kogyo Kabushiki Kaisha Method of inspecting a workpiece surface including a picturing system with a shortened focal plane
MY127829A (en) * 1996-05-30 2006-12-29 Sony Emcs Malaysia Sdn Bhd Mounting system.
IE80676B1 (en) * 1996-08-02 1998-11-18 M V Research Limited A measurement system
DE19653403C2 (de) 1996-10-21 2001-05-10 Koenig & Bauer Ag Verfahren zum Transport von Bogen
JPH10143660A (ja) 1996-11-11 1998-05-29 Hitachi Ltd 欠陥判定処理方法およびその装置
KR19980039109A (ko) * 1996-11-27 1998-08-17 배순훈 클린칭 검사기능을 갖는 자삽경로 작성장치와 그 검사방법
US6047084A (en) * 1997-11-18 2000-04-04 Motorola, Inc. Method for determining accuracy of a circuit assembly process and machine employing the same
JP2000326495A (ja) * 1999-05-24 2000-11-28 Matsushita Electric Ind Co Ltd クリーム半田印刷の検査方法
US6542630B1 (en) * 1999-09-14 2003-04-01 Teradyne, Inc. Inspecting component placement relative to component pads
JP3870872B2 (ja) * 2002-08-06 2007-01-24 オムロン株式会社 検査データ作成方法およびこの方法を用いた基板検査装置
DE10261865A1 (de) * 2002-12-20 2004-07-15 Uwe Braun Sonnenlichtleitsysteme Lichtsysteme Gmbh Verfahren, Vorrichtung und Computerprogramm zur optischen Oberflächenerfassung
GB0324638D0 (en) * 2003-10-22 2003-11-26 Gore W L & Ass Uk An on-line inspection system
CN1662132B (zh) * 2004-02-26 2010-08-18 欧姆龙株式会社 安装错误检测方法和采用该方法的基板检测装置
JP4165538B2 (ja) * 2004-07-21 2008-10-15 オムロン株式会社 部品実装検査方法および部品実装検査装置
JP4935109B2 (ja) * 2005-03-17 2012-05-23 オムロン株式会社 基板検査装置並びにその検査ロジック設定方法および検査ロジック設定装置
JP4595705B2 (ja) * 2005-06-22 2010-12-08 オムロン株式会社 基板検査装置並びにそのパラメータ設定方法およびパラメータ設定装置
EP2382532B1 (de) * 2009-01-24 2020-10-21 Hewlett-Packard Development Company, L.P. System und verfahren für verbesserten sicherheitsdruck
US11084225B2 (en) 2018-04-02 2021-08-10 Nanotronics Imaging, Inc. Systems, methods, and media for artificial intelligence process control in additive manufacturing
US11209795B2 (en) 2019-02-28 2021-12-28 Nanotronics Imaging, Inc. Assembly error correction for assembly lines
US10481579B1 (en) * 2019-02-28 2019-11-19 Nanotronics Imaging, Inc. Dynamic training for assembly lines
CN110534411B (zh) * 2019-08-21 2021-07-13 大同新成新材料股份有限公司 一种芯片硅的加工方法
KR20220054673A (ko) 2019-09-10 2022-05-03 나노트로닉스 이미징, 인코포레이티드 제조 공정을 위한 시스템, 방법 및 매체
KR20220133712A (ko) * 2021-03-25 2022-10-05 현대자동차주식회사 차량의 품질 관리 시스템 및 그 방법

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1129509B (it) * 1980-01-14 1986-06-04 Tasco Spa Procedimento ed apparecchiatura per il ritrovamento in tempo reale di difetti in oggetti industriali
US4379308A (en) * 1980-02-25 1983-04-05 Cooper Industries, Inc. Apparatus for determining the parameters of figures on a surface
DE3070433D1 (en) * 1980-12-18 1985-05-09 Ibm Method for the inspection and automatic sorting of objects with configurations of fixed dimensional tolerances, and device for carrying out the method
US4473842A (en) * 1981-07-06 1984-09-25 Tokyo Shibaura Denki Kabushiki Kaisha Apparatus and method for examining printed circuit board provided with electronic parts
JPS5863838A (ja) * 1981-10-14 1983-04-15 Fuji Electric Co Ltd 欠陥検出回路
US4589139A (en) * 1982-02-04 1986-05-13 Nippon Kogaku K. K. Apparatus for detecting defects in pattern
JPS58201185A (ja) * 1982-05-19 1983-11-22 Toshiba Corp 位置検出装置
DE3347645C1 (de) * 1983-12-30 1985-10-10 Dr.-Ing. Ludwig Pietzsch Gmbh & Co, 7505 Ettlingen Verfahren und Einrichtung zum opto-elektronischen Pruefen eines Flaechenmusters an einem Objekt
JPS60263807A (ja) * 1984-06-12 1985-12-27 Dainippon Screen Mfg Co Ltd プリント配線板のパタ−ン欠陥検査装置
FI73329B (fi) * 1984-08-29 1987-05-29 Halton Oy Anordning foer identifiering och registrering av flaskor och/eller flaskkorgar.
US4794647A (en) * 1985-04-08 1988-12-27 Northern Telecom Limited Automatic optical inspection system
US4707734A (en) * 1985-06-17 1987-11-17 The Perkin-Elmer Corporation Coarse flaw detector for printed circuit board inspection
JPS6261390A (ja) * 1985-09-11 1987-03-18 興和株式会社 プリント基板検査方法およびその装置
JPH0762868B2 (ja) * 1985-10-02 1995-07-05 株式会社日立製作所 プリント基板の配線パターン欠陥検査方法
JPS62173731A (ja) * 1986-01-28 1987-07-30 Toshiba Corp 被検査物の表面検査装置
ATE109278T1 (de) * 1986-10-03 1994-08-15 Omron Tateisi Electronics Co Gerät zur untersuchung einer elektronischen vorrichtung in fester baugruppe.
US4760444A (en) * 1987-07-22 1988-07-26 Csd International, Inc. Machine visual inspection device and method
US4876656A (en) * 1987-08-28 1989-10-24 Motorola Inc. Circuit location sensor for component placement apparatus

Also Published As

Publication number Publication date
ATE109278T1 (de) 1994-08-15
EP0263473B1 (de) 1994-07-27
US5027295A (en) 1991-06-25
EP0263473A3 (en) 1990-10-10
DE3750285D1 (de) 1994-09-01
US4953100A (en) 1990-08-28
EP0263473A2 (de) 1988-04-13
HK36696A (en) 1996-03-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee