ATE308798T1 - Vorrichtung zur scheibenbehandlung - Google Patents

Vorrichtung zur scheibenbehandlung

Info

Publication number
ATE308798T1
ATE308798T1 AT99963012T AT99963012T ATE308798T1 AT E308798 T1 ATE308798 T1 AT E308798T1 AT 99963012 T AT99963012 T AT 99963012T AT 99963012 T AT99963012 T AT 99963012T AT E308798 T1 ATE308798 T1 AT E308798T1
Authority
AT
Austria
Prior art keywords
wafer
transporter
wafer processing
processing modules
coupled
Prior art date
Application number
AT99963012T
Other languages
English (en)
Inventor
Jae Heon Park
Original Assignee
Silicon Valley Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Valley Group filed Critical Silicon Valley Group
Application granted granted Critical
Publication of ATE308798T1 publication Critical patent/ATE308798T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT99963012T 1998-12-30 1999-12-02 Vorrichtung zur scheibenbehandlung ATE308798T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/223,111 US6616394B1 (en) 1998-12-30 1998-12-30 Apparatus for processing wafers
PCT/US1999/028753 WO2000041222A1 (en) 1998-12-30 1999-12-02 Apparatus for processing wafers

Publications (1)

Publication Number Publication Date
ATE308798T1 true ATE308798T1 (de) 2005-11-15

Family

ID=22835091

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99963012T ATE308798T1 (de) 1998-12-30 1999-12-02 Vorrichtung zur scheibenbehandlung

Country Status (9)

Country Link
US (2) US6616394B1 (de)
EP (1) EP1142002B1 (de)
JP (3) JP4384817B2 (de)
KR (1) KR100567857B1 (de)
AT (1) ATE308798T1 (de)
AU (1) AU1933900A (de)
DE (1) DE69928126T2 (de)
SG (1) SG119193A1 (de)
WO (1) WO2000041222A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
DE10143722C2 (de) * 2001-08-31 2003-07-03 Infineon Technologies Ag Verfahren und Vorrichtung zur Sortierung von Wafern
US7059817B2 (en) * 2001-11-29 2006-06-13 Axcelis Technologies, Inc. Wafer handling apparatus and method
US7022436B2 (en) 2003-01-14 2006-04-04 Asml Netherlands B.V. Embedded etch stop for phase shift masks and planar phase shift masks to reduce topography induced and wave guide effects
JP2004257980A (ja) * 2003-02-27 2004-09-16 Mire Kk 半導体素子テスト用ハンドラ
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
KR100621775B1 (ko) * 2005-04-15 2006-09-15 삼성전자주식회사 기판 세정장치
US7489982B2 (en) * 2006-09-15 2009-02-10 Wafertech, Llc Method and software for conducting efficient lithography WPH / lost time analysis in semiconductor manufacturing
US7738987B2 (en) * 2006-11-28 2010-06-15 Tokyo Electron Limited Device and method for controlling substrate processing apparatus
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US8322300B2 (en) * 2008-02-07 2012-12-04 Sunpower Corporation Edge coating apparatus with movable roller applicator for solar cell substrates
KR101958874B1 (ko) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
US8535968B1 (en) * 2011-01-31 2013-09-17 Miasole High speed aligning of photovoltaic cells
US9606532B2 (en) * 2014-01-29 2017-03-28 Taiwan Semiconductor Manufacturing Company Limited Method and manufacturing system

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1009462A (en) * 1963-03-05 1965-11-10 Short Brothers & Harland Ltd Improvements in apparatus for classifying and otherwise handling articles
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US5177514A (en) 1988-02-12 1993-01-05 Tokyo Electron Limited Apparatus for coating a photo-resist film and/or developing it after being exposed
KR970003907B1 (ko) 1988-02-12 1997-03-22 도오교오 에레구토론 가부시끼 가이샤 기판처리 장치 및 기판처리 방법
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5061144A (en) 1988-11-30 1991-10-29 Tokyo Electron Limited Resist process apparatus
JP2849458B2 (ja) * 1990-07-03 1999-01-20 キヤノン株式会社 半導体装置の製造方法および製造装置
NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
DE634699T1 (de) 1993-07-16 1996-02-15 Semiconductor Systems Inc Gruppiertes fotolithografisches System.
US5766824A (en) 1993-07-16 1998-06-16 Semiconductor Systems, Inc. Method and apparatus for curing photoresist
US5626675A (en) 1993-11-18 1997-05-06 Tokyo Electron Limited Resist processing apparatus, substrate processing apparatus and method of transferring a processed article
JPH07245285A (ja) 1994-03-03 1995-09-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH07297258A (ja) 1994-04-26 1995-11-10 Tokyo Electron Ltd 板状体の搬送装置
JP3213748B2 (ja) * 1994-08-04 2001-10-02 東京エレクトロン株式会社 処理システム
US5826129A (en) 1994-06-30 1998-10-20 Tokyo Electron Limited Substrate processing system
JP3033009B2 (ja) 1994-09-09 2000-04-17 東京エレクトロン株式会社 処理装置
JP3592771B2 (ja) * 1994-12-07 2004-11-24 大日本スクリーン製造株式会社 基板処理装置
TW297910B (de) 1995-02-02 1997-02-11 Tokyo Electron Co Ltd
JP3069945B2 (ja) 1995-07-28 2000-07-24 東京エレクトロン株式会社 処理装置
US5788868A (en) 1995-09-04 1998-08-04 Dainippon Screen Mfg. Co., Ltd. Substrate transfer method and interface apparatus
TW317644B (de) 1996-01-26 1997-10-11 Tokyo Electron Co Ltd
JP3571471B2 (ja) 1996-09-03 2004-09-29 東京エレクトロン株式会社 処理方法，塗布現像処理システム及び処理システム
JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
TW353772B (en) 1996-09-09 1999-03-01 Tokyo Electron Ltd Workpiece relaying apparatus
US5928389A (en) 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
SG67433A1 (en) 1996-11-01 1999-09-21 Tokyo Electron Ltd Method and apparatus for processing substrate
TW353777B (en) 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH10144599A (ja) 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
JP3579228B2 (ja) 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
TW389949B (en) 1997-01-30 2000-05-11 Tokyo Electron Ltd Method and apparatus for coating and development of the photo-resist solution
JP4080021B2 (ja) * 1997-03-19 2008-04-23 大日本スクリーン製造株式会社 基板処理装置
JPH10261692A (ja) * 1997-03-19 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3600710B2 (ja) * 1997-05-28 2004-12-15 大日本スクリーン製造株式会社 基板処理装置
JPH113851A (ja) 1997-06-11 1999-01-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers

Also Published As

Publication number Publication date
DE69928126D1 (de) 2005-12-08
SG119193A1 (en) 2006-02-28
JP4823012B2 (ja) 2011-11-24
DE69928126T2 (de) 2006-07-13
US7004708B2 (en) 2006-02-28
KR100567857B1 (ko) 2006-04-05
JP4384817B2 (ja) 2009-12-16
EP1142002A1 (de) 2001-10-10
JP2002534802A (ja) 2002-10-15
JP2007088487A (ja) 2007-04-05
US20040107014A1 (en) 2004-06-03
KR20010103544A (ko) 2001-11-23
US6616394B1 (en) 2003-09-09
EP1142002B1 (de) 2005-11-02
WO2000041222A1 (en) 2000-07-13
JP2008022023A (ja) 2008-01-31
AU1933900A (en) 2000-07-24

Similar Documents

Publication Publication Date Title
DE69928126D1 (de) Vorrichtung zur scheibenbehandlung
TW352453B (en) Method and apparatus for priority based scheduling of wafer processing with a multiple chamber semiconductor wafer processing tool
CA2283185A1 (en) Assay device processing instrument
KR890010722A (ko) 서로 다른 시스템으로 작동하는 데이타 처리 시스템에 있어서, 자원을 분할하여 변경 가능하게 실행하기 위한 장치 및 방법
DE50005750D1 (de) System zur automatisierten behandlung von fluiden, mit aneinanderreihbaren, austauschbaren prozessmodulen
WO2003039382A3 (en) System for processing tissue
WO1998027650A3 (en) Method and apparatus for n choose m device selection
TW322201U (en) Semiconductor treatment system and method for exchanging and treating substrate
AU7262596A (en) Method and apparatus for chemical processing semiconductor wafers
HK1013153A1 (en) Apparatus for processing instructions in a computing system.
DE59707020D1 (de) Vorrichtung zum Transportieren flacher Produkte zu Weiterverarbeitungseinrichtungen oder Auslagestationen
DE60144093D1 (de) Verfahren und system zum bearbeiten von briefen und flachen gegenständen in einem einzigen umlauf
GB2354844A (en) Distributed control system for a semiconductor wafer processing machine
WO2000068971A3 (de) Anlage zur bearbeitung von wafern
TWI257118B (en) System and method for scheduling the movement of wafers in a wafer-processing tool
AU2003294674A1 (en) Device and method for transporting wafer-shaped articles
DE69024045D1 (de) Kodierungsverfahren und Vorrichtung zur Pipeline- und Parallelverarbeitung.
CA2146243A1 (en) General analysis system
DE60022518D1 (de) Maschine zur behandlung von gegenständen
ATE180585T1 (de) Verfahren zum betreiben eines datenübertragungssystems
TW200707620A (en) Distributed control sheet transfer system
KR900012279A (ko) 데이타 처리 시스템에서의 오퍼랜드 이용도를 증가시키는 장치 및 방법
WO2000059003A3 (de) Anlage zur fertigung von halbleiterprodukten
DK0725042T3 (da) Fremgangsmåde, som gør brug af fikserede kulturer, til behandling af udledningsvand på biofiltre eller andre indretninger
TW428219B (en) Accommodating apparatus and substrate processing system

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties