ATE308798T1 - Vorrichtung zur scheibenbehandlung - Google Patents

Vorrichtung zur scheibenbehandlung

Info

Publication number
ATE308798T1
ATE308798T1 AT99963012T AT99963012T ATE308798T1 AT E308798 T1 ATE308798 T1 AT E308798T1 AT 99963012 T AT99963012 T AT 99963012T AT 99963012 T AT99963012 T AT 99963012T AT E308798 T1 ATE308798 T1 AT E308798T1
Authority
AT
Austria
Prior art keywords
wafer
transporter
wafer processing
processing modules
coupled
Prior art date
Application number
AT99963012T
Other languages
English (en)
Inventor
Jae Heon Park
Original Assignee
Silicon Valley Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Valley Group filed Critical Silicon Valley Group
Application granted granted Critical
Publication of ATE308798T1 publication Critical patent/ATE308798T1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0458—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
AT99963012T 1998-12-30 1999-12-02 Vorrichtung zur scheibenbehandlung ATE308798T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/223,111 US6616394B1 (en) 1998-12-30 1998-12-30 Apparatus for processing wafers
PCT/US1999/028753 WO2000041222A1 (en) 1998-12-30 1999-12-02 Apparatus for processing wafers

Publications (1)

Publication Number Publication Date
ATE308798T1 true ATE308798T1 (de) 2005-11-15

Family

ID=22835091

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99963012T ATE308798T1 (de) 1998-12-30 1999-12-02 Vorrichtung zur scheibenbehandlung

Country Status (9)

Country Link
US (2) US6616394B1 (de)
EP (1) EP1142002B1 (de)
JP (3) JP4384817B2 (de)
KR (1) KR100567857B1 (de)
AT (1) ATE308798T1 (de)
AU (1) AU1933900A (de)
DE (1) DE69928126T2 (de)
SG (1) SG119193A1 (de)
WO (1) WO2000041222A1 (de)

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US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
DE10143722C2 (de) * 2001-08-31 2003-07-03 Infineon Technologies Ag Verfahren und Vorrichtung zur Sortierung von Wafern
JP4327599B2 (ja) * 2001-11-29 2009-09-09 ダイアモンド セミコンダクタ グループ エルエルシー ウエーハ取り扱い装置及び方法
US7022436B2 (en) 2003-01-14 2006-04-04 Asml Netherlands B.V. Embedded etch stop for phase shift masks and planar phase shift masks to reduce topography induced and wave guide effects
JP2004257980A (ja) * 2003-02-27 2004-09-16 Mire Kk 半導体素子テスト用ハンドラ
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7396412B2 (en) 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
KR100621775B1 (ko) * 2005-04-15 2006-09-15 삼성전자주식회사 기판 세정장치
US7489982B2 (en) * 2006-09-15 2009-02-10 Wafertech, Llc Method and software for conducting efficient lithography WPH / lost time analysis in semiconductor manufacturing
US7738987B2 (en) * 2006-11-28 2010-06-15 Tokyo Electron Limited Device and method for controlling substrate processing apparatus
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US8322300B2 (en) * 2008-02-07 2012-12-04 Sunpower Corporation Edge coating apparatus with movable roller applicator for solar cell substrates
KR101958874B1 (ko) * 2008-06-04 2019-03-15 가부시키가이샤 에바라 세이사꾸쇼 기판처리장치, 기판처리방법, 기판 파지기구, 및 기판 파지방법
US8535968B1 (en) * 2011-01-31 2013-09-17 Miasole High speed aligning of photovoltaic cells
US9606532B2 (en) * 2014-01-29 2017-03-28 Taiwan Semiconductor Manufacturing Company Limited Method and manufacturing system

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US5766824A (en) 1993-07-16 1998-06-16 Semiconductor Systems, Inc. Method and apparatus for curing photoresist
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US5928389A (en) 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
TW466579B (en) 1996-11-01 2001-12-01 Tokyo Electron Ltd Method and apparatus for processing substrate
TW353777B (en) 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH10144599A (ja) 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
JP3579228B2 (ja) 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
SG71082A1 (en) 1997-01-30 2000-03-21 Tokyo Electron Ltd Method and apparatus for coating resist and developing the coated resist
JPH10261692A (ja) * 1997-03-19 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4080021B2 (ja) * 1997-03-19 2008-04-23 大日本スクリーン製造株式会社 基板処理装置
JP3600710B2 (ja) * 1997-05-28 2004-12-15 大日本スクリーン製造株式会社 基板処理装置
JPH113851A (ja) 1997-06-11 1999-01-06 Tokyo Electron Ltd 液処理装置及び液処理方法
US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers

Also Published As

Publication number Publication date
US7004708B2 (en) 2006-02-28
SG119193A1 (en) 2006-02-28
JP2007088487A (ja) 2007-04-05
JP2002534802A (ja) 2002-10-15
WO2000041222A1 (en) 2000-07-13
AU1933900A (en) 2000-07-24
US6616394B1 (en) 2003-09-09
JP4384817B2 (ja) 2009-12-16
EP1142002B1 (de) 2005-11-02
DE69928126D1 (de) 2005-12-08
EP1142002A1 (de) 2001-10-10
DE69928126T2 (de) 2006-07-13
JP2008022023A (ja) 2008-01-31
KR20010103544A (ko) 2001-11-23
KR100567857B1 (ko) 2006-04-05
JP4823012B2 (ja) 2011-11-24
US20040107014A1 (en) 2004-06-03

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