SG119193A1 - Apparatus for processing wafers - Google Patents

Apparatus for processing wafers

Info

Publication number
SG119193A1
SG119193A1 SG200304037A SG200304037A SG119193A1 SG 119193 A1 SG119193 A1 SG 119193A1 SG 200304037 A SG200304037 A SG 200304037A SG 200304037 A SG200304037 A SG 200304037A SG 119193 A1 SG119193 A1 SG 119193A1
Authority
SG
Singapore
Prior art keywords
wafer
transporter
wafer processing
processing modules
coupled
Prior art date
Application number
SG200304037A
Other languages
English (en)
Inventor
Jae Heon Park
Original Assignee
Silicon Valley Group
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Silicon Valley Group filed Critical Silicon Valley Group
Publication of SG119193A1 publication Critical patent/SG119193A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Weting (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
SG200304037A 1998-12-30 1999-12-02 Apparatus for processing wafers SG119193A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/223,111 US6616394B1 (en) 1998-12-30 1998-12-30 Apparatus for processing wafers

Publications (1)

Publication Number Publication Date
SG119193A1 true SG119193A1 (en) 2006-02-28

Family

ID=22835091

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200304037A SG119193A1 (en) 1998-12-30 1999-12-02 Apparatus for processing wafers

Country Status (9)

Country Link
US (2) US6616394B1 (de)
EP (1) EP1142002B1 (de)
JP (3) JP4384817B2 (de)
KR (1) KR100567857B1 (de)
AT (1) ATE308798T1 (de)
AU (1) AU1933900A (de)
DE (1) DE69928126T2 (de)
SG (1) SG119193A1 (de)
WO (1) WO2000041222A1 (de)

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US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers
DE10143722C2 (de) * 2001-08-31 2003-07-03 Infineon Technologies Ag Verfahren und Vorrichtung zur Sortierung von Wafern
ATE339773T1 (de) * 2001-11-29 2006-10-15 Diamond Semiconductor Group Ll Waferhandhabungsvorrichtung und verfahren dafür
US7022436B2 (en) 2003-01-14 2006-04-04 Asml Netherlands B.V. Embedded etch stop for phase shift masks and planar phase shift masks to reduce topography induced and wave guide effects
JP2004257980A (ja) * 2003-02-27 2004-09-16 Mire Kk 半導体素子テスト用ハンドラ
US7371022B2 (en) 2004-12-22 2008-05-13 Sokudo Co., Ltd. Developer endpoint detection in a track lithography system
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7699021B2 (en) 2004-12-22 2010-04-20 Sokudo Co., Ltd. Cluster tool substrate throughput optimization
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
KR100621775B1 (ko) * 2005-04-15 2006-09-15 삼성전자주식회사 기판 세정장치
US7489982B2 (en) * 2006-09-15 2009-02-10 Wafertech, Llc Method and software for conducting efficient lithography WPH / lost time analysis in semiconductor manufacturing
US7738987B2 (en) * 2006-11-28 2010-06-15 Tokyo Electron Limited Device and method for controlling substrate processing apparatus
US7694688B2 (en) 2007-01-05 2010-04-13 Applied Materials, Inc. Wet clean system design
US7950407B2 (en) * 2007-02-07 2011-05-31 Applied Materials, Inc. Apparatus for rapid filling of a processing volume
US20080279672A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods of stack to array work-piece transfer for photovoltaic factory
US20080279658A1 (en) * 2007-05-11 2008-11-13 Bachrach Robert Z Batch equipment robots and methods within equipment work-piece transfer for photovoltaic factory
US20080292433A1 (en) * 2007-05-11 2008-11-27 Bachrach Robert Z Batch equipment robots and methods of array to array work-piece transfer for photovoltaic factory
US8322300B2 (en) * 2008-02-07 2012-12-04 Sunpower Corporation Edge coating apparatus with movable roller applicator for solar cell substrates
US8795032B2 (en) 2008-06-04 2014-08-05 Ebara Corporation Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
US8535968B1 (en) * 2011-01-31 2013-09-17 Miasole High speed aligning of photovoltaic cells
US9606532B2 (en) * 2014-01-29 2017-03-28 Taiwan Semiconductor Manufacturing Company Limited Method and manufacturing system

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US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
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JP3779393B2 (ja) * 1996-09-06 2006-05-24 東京エレクトロン株式会社 処理システム
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US5928389A (en) 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
TW466579B (en) 1996-11-01 2001-12-01 Tokyo Electron Ltd Method and apparatus for processing substrate
TW353777B (en) 1996-11-08 1999-03-01 Tokyo Electron Ltd Treatment device
JPH10144599A (ja) 1996-11-11 1998-05-29 Tokyo Electron Ltd 回転処理装置およびその洗浄方法
JP3579228B2 (ja) 1997-01-24 2004-10-20 大日本スクリーン製造株式会社 基板処理装置
SG71082A1 (en) 1997-01-30 2000-03-21 Tokyo Electron Ltd Method and apparatus for coating resist and developing the coated resist
JP4080021B2 (ja) * 1997-03-19 2008-04-23 大日本スクリーン製造株式会社 基板処理装置
JPH10261692A (ja) * 1997-03-19 1998-09-29 Dainippon Screen Mfg Co Ltd 基板処理装置
JP3600710B2 (ja) * 1997-05-28 2004-12-15 大日本スクリーン製造株式会社 基板処理装置
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US6616394B1 (en) * 1998-12-30 2003-09-09 Silicon Valley Group Apparatus for processing wafers

Also Published As

Publication number Publication date
JP4384817B2 (ja) 2009-12-16
ATE308798T1 (de) 2005-11-15
KR20010103544A (ko) 2001-11-23
JP2008022023A (ja) 2008-01-31
DE69928126T2 (de) 2006-07-13
DE69928126D1 (de) 2005-12-08
JP4823012B2 (ja) 2011-11-24
KR100567857B1 (ko) 2006-04-05
US6616394B1 (en) 2003-09-09
EP1142002B1 (de) 2005-11-02
US7004708B2 (en) 2006-02-28
JP2007088487A (ja) 2007-04-05
AU1933900A (en) 2000-07-24
US20040107014A1 (en) 2004-06-03
WO2000041222A1 (en) 2000-07-13
JP2002534802A (ja) 2002-10-15
EP1142002A1 (de) 2001-10-10

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