WO2023274076A1 - 硅片输送分散装置 - Google Patents

硅片输送分散装置 Download PDF

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Publication number
WO2023274076A1
WO2023274076A1 PCT/CN2022/101206 CN2022101206W WO2023274076A1 WO 2023274076 A1 WO2023274076 A1 WO 2023274076A1 CN 2022101206 W CN2022101206 W CN 2022101206W WO 2023274076 A1 WO2023274076 A1 WO 2023274076A1
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WIPO (PCT)
Prior art keywords
silicon wafer
belt
assembly
bracket
clamping
Prior art date
Application number
PCT/CN2022/101206
Other languages
English (en)
French (fr)
Inventor
李宏
陈宏�
王俊
景健
张江水
张广犬
黄游
刘哲
方勇健
Original Assignee
杭州中为光电技术有限公司
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Publication date
Application filed by 杭州中为光电技术有限公司 filed Critical 杭州中为光电技术有限公司
Priority to US17/887,454 priority Critical patent/US11728186B2/en
Publication of WO2023274076A1 publication Critical patent/WO2023274076A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present application relates to the technical field of silicon wafer processing, in particular to a silicon wafer conveying and dispersing device.
  • the silicon wafer conveying and dispersing device is used to transport the silicon wafers to the designated area, and then divide them into slices.
  • the relevant silicon wafer conveying and dispersing device places the silicon wafer in the magazine, and then puts it into the conveying assembly for transmission. Since the magazine does not hold the silicon wafer, along the conveying direction of the conveying assembly, the silicon wafer in the front will press against the silicon wafer in the back. There is no gap between the silicon wafers, and it is difficult to separate the silicon wafers during blowing, which requires a large blowing force, which will cause damage to the silicon wafers, and the small wires on the front silicon wafers are cut Particles can cause cracks or shattering of the underlying silicon wafer.
  • the present application provides a silicon wafer conveying and dispersing device, comprising:
  • a transport assembly capable of transporting silicon wafers
  • the clamping assembly is arranged on both sides of the conveying assembly, an accommodating area capable of accommodating the silicon wafer is formed between the clamping assembly and the conveying assembly, and the clamping assembly can clamping and transporting the silicon wafer;
  • a water spraying assembly the water spraying assembly is arranged on the clamping assembly, the transfer assembly cooperates with the clamping assembly to transfer the silicon wafer to the transfer assembly close to the water spray assembly At one end, the water spray assembly can blow water on the silicon wafer, so as to separate the silicon wafer from adjacent silicon wafers.
  • the clamping component includes a first bracket, a first belt, a second bracket and a second belt, the first bracket and the second bracket are respectively arranged on both sides of the transmission component,
  • the first belt is sleeved outside the first bracket and can be driven outside the first bracket
  • the second belt is sleeved outside the second bracket and can be driven outside the second bracket , the cooperation between the first belt and the second belt can clamp the silicon wafer.
  • the clamping assembly further includes a clamping driving unit, the clamping driving unit is connected to the first bracket and the second bracket respectively, and the clamping driving unit can drive the first The first support and the second support move to change the volume of the accommodation area.
  • the transmission assembly includes a third drive unit, a third belt and a third bracket, the third belt is sleeved on the outside of the third bracket, and the third drive unit can drive the first Three-belt transmission.
  • a buffer area is provided at one end of the third belt close to the water spray assembly, and the first belt, the second belt and the third belt can transfer the silicon wafer from the The storage area is transferred to the buffer area, and the first belt and the second belt release the clamping of the silicon wafer in the buffer area, and the water spray assembly The silicon wafer is blown with water.
  • the third belt is one, and sub-belts are provided on both sides of the third belt, and the sub-belts form the buffer zone.
  • the third belt is one, and one end of the third belt close to the water spray assembly forms the buffer area, and one end of the clamping assembly is provided with a guide, and the guide The wafers entering the buffer area can be directed.
  • the water spray assembly includes a first nozzle and a second nozzle.
  • the first nozzle and the second nozzle are respectively connected to the The distances are different, and the first nozzle is located away from the clamping assembly relative to the second nozzle.
  • Fig. 1 is a schematic structural diagram of a silicon wafer conveying and dispersing device according to one or more embodiments.
  • FIG. 2 is a partial enlarged view of A in FIG. 1 .
  • Fig. 3 is a schematic structural diagram of a silicon wafer conveying and dispersing device according to one or more embodiments.
  • FIG. 4 is a partial enlarged view of B in FIG. 3 .
  • Fig. 5 is a schematic structural diagram of a silicon wafer conveying and dispersing device according to one or more embodiments.
  • FIG. 6 is a partially enlarged view at point C in FIG. 5 .
  • Silicon wafer conveying and dispersing device 10. Clamping assembly; 101. Accommodating area; 11. First bracket; 111. Cooperating part; 12. Second bracket; 13. First belt; 131. First end; 132 , the second end; 14, the first drive unit; 141, the first motor; 142, the first drive wheel; 1421, the first connector; 143, the first driven wheel; 15, the second belt; 16, the second drive Unit; 161, second motor; 162, second driving wheel; 1621, second connector; 163, second driven wheel; 17, first support plate; 19, clamping drive unit; 191, clamping guide rail; 192 , the clamping driver; 20, the transmission assembly; 21, the third drive unit; 211, the third drive wheel; 2111, the third connector; 212, the third driven wheel; 213, the third motor; 214, the first wheel ; Five connectors; 2226, the sixth connector; 23, the third bracket; 231, the third support plate; 30, the spray assembly; 31, the first nozzle; 32, the second nozzle; 40, the guide part; 200, silicon
  • a component when a component is said to be “mounted on” another component, it may be directly on the other component or there may be an intervening component.
  • a component When a component is said to be “set on” another component, it may be set directly on the other component or there may be an intervening component at the same time.
  • a component When a component is said to be “fixed” to another component, it may be directly fixed to the other component or there may be an intervening component at the same time.
  • the silicon wafer conveying and dispersing device 100 provided by the present application is used for conveying and separating silicon wafers 200 .
  • the silicon wafer conveying and dispersing device 100 includes a clamping assembly 10 , a conveying assembly 20 and a water spraying assembly 30 .
  • the clamping assembly 10 is arranged on both sides of the conveying assembly 20, and an accommodating area 101 is formed between the clamping assembly 10 and the conveying assembly 20.
  • the silicon wafer 200 is placed in the accommodating area 101, and the conveying assembly 20 can be driven.
  • the clamping assembly 10 The silicon wafer 200 is clamped and can be transported with the transport assembly 20 , so that the silicon wafer 200 is clamped while being transported to an end close to the water spray assembly 30 .
  • the water spray assembly 30 is connected to the clamping assembly 10 and is used for blowing water on the silicon wafer 200 so that the silicon wafer 200 can be separated from adjacent silicon wafers 200 .
  • the silicon wafer 200 is clamped by the clamping assembly 10, so that the front silicon wafer 200 will not exert force on the rear silicon wafer 200, so that the gap between the silicon wafers 200 and the silicon wafer 200 will not be against each other, Reduce the blowing force of the subsequent blowing sheet, easily separate the silicon wafer 200 when blowing water, and protect the silicon wafer 200 from being damaged by a large blowing force. At the same time, it can protect the silicon wafer 200 from the front silicon wafer 200. The silicon wafer 200 will not be worn by the fine particles on the previous silicon wafer 200, so that the integrity of the silicon wafer 200 can be maintained, and the silicon wafer 200 can be prevented from being cracked or broken.
  • the clamping component 10 includes a first bracket 11 and a second bracket 12 parallel to each other, and the first bracket 11 and the second bracket 12 are respectively disposed on two sides of the transmission component 20 .
  • the clamping assembly 10 also includes a first belt 13, a first drive unit 14, a second belt 15 and a second drive unit 16, the first drive unit 14 is connected to the first bracket 11, and the second drive unit 16 is connected to the second bracket 12.
  • the first belt 13 and the second belt 15 are arranged on both sides of the silicon wafer 200 , the first drive unit 14 can drive the first belt 13 for transmission, and the second drive unit 16 can drive the second belt 15 for transmission.
  • the first belt 13 and the second belt 15 can not only clamp the silicon wafer 200 , but also cooperate with the transport assembly 20 to transport the silicon wafer 200 .
  • the first driving unit 14 includes a first motor 141, a first driving wheel 142 and a first driven wheel 143.
  • the first driving wheel 142 is arranged on the end of the first bracket 11 away from the water spray assembly 30.
  • the first The driven wheel 143 is located at the end of the first support 11 away from the first driving wheel 142
  • the first belt 13 is located at the outside of the first support 11, the first driving wheel 142 and the first driven wheel 143
  • the output shaft of the first motor 141 Connected to the first driving wheel 142 for driving the first driving wheel 142 to rotate, the first driving wheel 142 drives the first driven wheel 143 to rotate through the first belt 13 .
  • a rotary cylinder may also be used to drive the first driving wheel 142 to rotate.
  • the second driving unit 16 includes a second motor 161, a second driving wheel 162 and a second driven wheel 163, the second driving wheel 162 is arranged at the end of the second bracket 12 away from the water spray assembly 30, and the second The driven wheel 163 is arranged on the second bracket 12 away from the end of the second driving wheel 162, the second belt 15 is arranged on the outside of the second bracket 12, the second driving wheel 162 and the second driven wheel 163, and the output shaft of the second motor 161 Connected to the second driving wheel 162 for driving the second driving wheel 162 to rotate, the second driving wheel 162 drives the second driven wheel 163 to rotate through the second belt 15 .
  • a rotary cylinder can also be used to drive the second driving wheel 162 to rotate.
  • the inner side of the first support 11 is provided with a first support plate 17, and the first support plate 17 is located between the first support 11 and the first belt 13 to support the first belt 13; the inner side of the second support 12 is provided with The second support plate (not shown in the figure), the second support plate is disposed between the second bracket 12 and the second belt 15 , so that the first belt 13 and the second belt 15 can better clamp the silicon wafer 200 .
  • the first belt 13 is arranged on one side of the first bracket 11
  • the second belt 15 is arranged on one side of the second bracket 12 .
  • One end of the first driving wheel 142 and the first driven wheel 143 away from the first support 11 is provided with a first connecting piece 1421, and one end of the first connecting piece 1421 arranged on the first driving wheel 142 is fixedly connected with the first support 11 , the other end is rotationally connected with the first driving wheel 142 for supporting the first driving wheel 142, one end of the first connecting member 1421 arranged on the first driven wheel 143 is fixedly connected with the first bracket 11, and the other end is connected with the first
  • the driven wheel 143 is rotatably connected to support the first driven wheel 143 .
  • One end of the second driving wheel 162 and the second driven wheel 163 away from the second bracket 12 is provided with a second connecting piece 1621, and one end of the second connecting piece 1621 arranged on the second driving wheel 162 is fixedly connected with the second bracket 12 , the other end is rotationally connected with the second driving wheel 162 for supporting the second driving wheel 162, one end of the second connecting member 1621 arranged on the second driven wheel 163 is fixedly connected with the second bracket 12, and the other end is connected with the second
  • the driven wheel 163 is rotatably connected to support the second driven wheel 163 .
  • the clamping assembly 10 also includes a clamping drive unit 19, the clamping drive unit 19 is respectively connected to the first bracket 11 and the second bracket 12, so that the first bracket 11 and the second bracket 12 can move toward or away from each other to change the capacity. Therefore, before receiving the silicon wafer 200, the first bracket 11 and the second bracket 12 are loosened, so that the first belt 13 and the second belt 15 are loosened, and the silicon wafer 200 enters, and then the silicon wafer is clamped 200.
  • the clamping drive unit 19 includes a clamping guide rail 191 and a clamping drive member 192, the clamping guide rail 191 is respectively connected to the first support 11 and the second support 12, and the clamping drive member 192 is respectively connected to the first support 11 and the second support 12.
  • the first bracket 11 and the second bracket 12 are respectively provided with a matching part 111, and each matching part 111 moves along the clamping guide rail 191 respectively, and the clamping driver 192 drives the first bracket 11 and the second bracket 12 to move along the Move along the width direction of the first support 11 and the second support 12.
  • the width direction of the first bracket 11 and the second bracket 12 in this application refers to the direction of the connecting line between the center of the first bracket 11 and the center of the second bracket 12 .
  • clamping drive units 19 there are two clamping drive units 19, one clamping drive unit 19 is connected to the first bracket 11, and the other is connected to the second bracket 12; there are four clamping guide rails 191, two of which clamp Tight guide rails 191 are arranged close to both ends of the first bracket 11 respectively, and there are also two matching parts 111 on the first bracket 11, so that the movement of the first bracket 11 is smoother, and the other two clamping guide rails 191 are respectively close to the second bracket 12
  • the two ends of the second bracket 12 are provided with two matching parts 111, so that the movement of the second bracket 12 is smoother.
  • the clamping driver 192 is two air cylinders, the telescopic axis of one cylinder is connected to the first bracket 11 , and the telescopic axis of the other cylinder is connected to the second bracket 12 to respectively drive the first bracket 11 and the second bracket 12 to move.
  • the number of clamping guide rails 191 can be 2, 3, 5 or more, and the number of clamping drivers 192 can also be 3, 4 or more. It can also be a motor.
  • the transmission assembly 20 includes a third drive unit 21, a third belt 22 and a third support 23, the third belt 22 is sheathed outside the third support 23, the third drive unit 21 can drive the third belt 22 for transmission, and the silicon wafer 200 is placed On the third belt 22.
  • the third driving unit 21 includes a third driving wheel 211 and a third driven wheel 212, the third driving wheel 211 and the third driven wheel 212 are respectively arranged at both ends of the third support 23, and the third belt 22 is sleeved on the third driving wheel. Besides the wheel 211 and the third driven wheel 212 , the third driving wheel 211 drives the third driven wheel 212 to rotate through the third belt 22 .
  • the third drive unit 21 also includes a third motor 213, a first wheel 214 and a drive shaft 215, the output shaft of the third motor 213 is provided with a rotating wheel, and the rotating wheel drives the first wheel 214 to rotate through a belt , the first wheel 214 is connected to the third driving wheel 211 through the transmission shaft 215, thereby driving the third driving wheel 211 to rotate.
  • the third motor 213 can also be replaced by a rotary cylinder, and the third motor 213 can also directly drive the first wheel 214 to rotate.
  • Both sides of the third driving wheel 211 and the third driven wheel 212 are provided with a third connecting piece 2111, one end of the third connecting piece 2111 on the third driving wheel 211 is fixedly connected with the third bracket 23, and the other end is fixedly connected with the third support 23.
  • the third driving wheel 211 is rotationally connected to support the third driving wheel 211.
  • One end of the third connecting member 2111 arranged on the third driven wheel 212 is fixedly connected with the third bracket 23, and the other end is rotated with the third driven wheel 212. connected to support the third driven wheel 212.
  • the third support 23 is provided with a third support plate 231 towards the side of the first support 11 and the second support 12, and the third support plate 231 is arranged between the third support 23 and the third belt 22, so as to support the third belt 22. support.
  • One end of the third belt 22 near the water spray assembly 30 is provided with a buffer area 221, and the first belt 13 and the second belt 15 transmit the silicon wafer 200 to the buffer area 221.
  • the first belt 13 and the second belt 15 Release the clamping of the silicon wafer 200 . That is to say, the first belt 13 has a first end 131 opposite to it, the second belt 15 has a second end 132 opposite to it, the second end 132 is far away from the water spray assembly 30 relative to the first end 131, and the buffer zone 221 is opposite to the first end 131.
  • the first belt 13 and the second belt 15 protrude toward a direction away from the second end 132 .
  • the water spray assembly 30 blows water on the silicon chip 200 in the buffer area 221. At this time, the silicon chip 200 breaks away from the clamping effect of the first belt 13 and the second belt 15, and the water spray assembly 30 blows water, so that the silicon chip 200 is fan-shaped. Pour into inserting machine head (not shown).
  • Such arrangement makes the silicon wafer 200 detach from the first belt 13 and the second belt 15 after entering the buffer area 221 , so that the silicon wafer 200 can be dumped toward the silicon wafer 200 away from the rear, thereby smoothly splitting into pieces.
  • the silicon wafer 200 When the transfer assembly 20 lifted the silicon wafer 200 from the material frame, the silicon wafer 200 was vertically placed on the third belt 22, and was synchronously conveyed through the third belt 22, the first belt 13 and the second belt 15, and the silicon The sheet is conveyed vertically to the buffer area 221; or, the silicon wafer 200 is placed obliquely on the third belt 22, and is synchronously conveyed through the third belt 22, the first belt 13 and the second belt 15, and the silicon wafer 200 is obliquely be delivered to the buffer area 221; or the silicon chip 200 is placed vertically on the third belt 22 first, and is synchronously conveyed through the third belt 22, the first belt 13 and the second belt 15, and when it is close to the buffer area 221, the silicon chip 200 is fed into buffer 221 obliquely.
  • the method for inclining the silicon wafer 200 is to first drive the third drive unit 21, and then drive the first drive unit 14 and the second drive unit 16, so that the third belt 22 runs ahead of the first belt 13 and the second belt 15, or , utilize the first drive unit 14 and the second drive unit 16 to drive the first belt 13 and the second belt 15 to move in reverse for a certain distance, or, when the silicon wafer 200 is vertically transported close to the buffer area 221, slow down the second belt The speed of the first belt 13 and the second belt 15 , or stop the transmission of the first belt 13 and the second belt 15 , so that the silicon wafer 200 is arranged obliquely toward the second end 132 at a certain angle.
  • FIG. 1 and FIG. 2 there is one third belt 22 , and one or more sub-belts 222 are provided on both sides of the end of the third belt 22 near the water spray assembly 30 , and the sub-belts 222 form a buffer area 221 .
  • This setting facilitates smooth sharding.
  • the third belt 22 retracts relative to the secondary belt 222, and the secondary belt 222 protrudes in a direction away from the second end 132 relative to the first belt 13 and the second belt 15, and the protruding part forms Buffer area 221.
  • the auxiliary belt 222 is made of a material with a coefficient of friction less than 0.3, and the friction coefficient of the third belt 22 is greater than that of the auxiliary belt 222.
  • the water spray assembly 30 blows water on it, making it smooth.
  • the secondary belt 222 can make the silicon wafer 200 and the next silicon wafer 200 be separated smoothly.
  • the secondary belt 222 is provided with a fourth driving wheel 2221, a fourth driven wheel 2222 and a tensioning wheel 2223, the fourth driving wheel 2221 is connected to the transmission shaft 215, and the transmission shaft 215 drives the fourth driving wheel 2221 to rotate, and the fourth driving wheel 2221
  • the fourth driven wheel 2222 is driven to rotate, so as to realize the transmission of the auxiliary belt 222
  • the tensioning wheel 2223 is used for tensioning the auxiliary belt 222 .
  • Both sides of the auxiliary belt 222 are provided with a fixed plate 2224, and the fixed plate 2224 is provided with a fifth connector 2225 and a sixth connector 2226.
  • One end of the fifth connector 2225 is fixedly connected with the fixed plate 2224, and the other end is connected with the fourth slave.
  • the driving wheel 2222 is rotatably connected, one end of the sixth connecting member 2226 is fixedly connected to the fixed plate 2224 , and the other end is rotatably connected to the tensioning wheel 2223 , thereby supporting the fourth driven wheel 2222 and the tensioning wheel 2223 .
  • the third belt 22 is one, and the whole third belt 22 is made of a material with a coefficient of friction less than 0.3.
  • the end of the third belt 22 close to the water spray assembly 30 protrudes in a direction away from the second end 132 relative to the first belt 13 and the second belt 15, and the protruding part forms a buffer zone 221,
  • the smooth buffer area 221 can reduce the frictional force on the silicon wafer 200 and facilitate smooth slicing.
  • One end of the first bracket 11 and the second bracket 12 near the water spray assembly 30 is provided with a guide portion 40, the guide portion 40 can guide the silicon wafer 200 entering the buffer area 221, so as to prevent the silicon wafer 200 from breaking away from the first belt 13 and the second belt After 15, he lost his support and fell down.
  • the guide part 40 is two guide wheels, which can reduce friction on the silicon wafer 200 and protect the silicon wafer 200 from being crushed.
  • third belts 22 There are two third belts 22, and the two third belts 22 are arranged at intervals. At one end close to the water spray assembly 30 , two third belts 22 protrude toward the direction away from the second end 132 relative to the first belt 13 and the second belt 15 , and the protruding parts are buffer areas 221 .
  • the two third belts 22 are made of materials with a friction coefficient less than 0.3, that is, the two third belts 22 are smooth, thereby reducing the friction on the silicon wafer 200 and facilitating smooth slicing.
  • the water spray assembly 30 includes a first nozzle 31 and a second nozzle 32 , the first nozzle 31 is disposed closer to the third belt 22 relative to the second nozzle 32 , that is, the first nozzle 31 is closer to the bottom of the silicon wafer 200 .
  • the first nozzle 31 blows water to the bottom of the silicon wafer 200, so that the bottom of the silicon wafer 200 is stressed.
  • the silicon wafer 200 breaks away from the first belt 13 and the second belt 15, and the upper end of the silicon wafer 200 Can be poured away from the adjacent silicon wafer 200 direction, the second nozzle 32 blows water to the upper end of the silicon wafer 200, helps the silicon wafer 200 to separate from the adjacent silicon wafer 200, and can control the inclination angle of the silicon wafer 200, so that the silicon wafer 200
  • the slices 200 are poured into the inserting head in a fan shape.
  • the water blowing volume of the plurality of second nozzles 32 can be adjusted according to the actual situation, and cooperate with each other to control the inclination angle of the silicon wafer 200 .
  • the second nozzle 32 closest to the second end 132 in the first nozzle 31 and the second nozzle 32 blows water first at the same time, so that the silicon wafer 200 is separated from the latter silicon wafer 200, and then the remaining second nozzles are controlled.
  • the water blowing volume of the second nozzle 32 is different, not only can make the silicon wafer 200 separate more thoroughly, but also can cooperate with each other to control the inclination angle of the silicon wafer 200.
  • the length direction of the clamping assembly 10 and the third belt 22 refers to the advancing direction of the silicon wafer 200 on the third belt 22 .
  • the cooperation of the plurality of second nozzles 32 makes the silicon wafer 200 stand upright at a certain inclination angle.
  • the two water spray assemblies 30 are respectively connected to the first support 11 and the second support 12, the first nozzle 31 blows water on both sides of the silicon wafer 200, and the second The nozzles 32 also blow water on both sides of the silicon wafer 200, which not only ensures the water blowing volume and the uniformity of water blowing, but also prevents the first nozzle 31 and the second nozzle 32 from blocking the advance of the silicon wafer 200.
  • the silicon wafer conveying and dispersing device 100 is placed in the inserting water tank, the material frame with the silicon wafer 200 placed on the silicon wafer conveying and dispersing device 100, and the third belt 22 is stretched in from the bottom of the material frame, thereby The silicon wafer 200 is lifted up, and the clamping drive unit 19 is driven to clamp the silicon wafer 200 .
  • the silicon wafer 200 is conveyed to the buffer zone 221 by the first belt 13, the second belt 15 and the third belt 22, and the first nozzle 31 blows water to the bottom of the silicon wafer 200, so that the upper end of the silicon wafer 200 has a direction away from the second end 132.
  • the second nozzle 32 is used to blow water on the upper end of the silicon wafer 200, so that the current silicon wafer 200 is separated from the adjacent silicon wafer 200.

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Abstract

一种硅片输送分散装置(100)。该硅片输送分散装置(100)包括传送组件(20)，传送组件(20)能够对于硅片(200)进行传送；夹紧组件(10)，夹紧组件(10)设于传送组件(20)的两侧，夹紧组件(10)能够夹紧并传送硅片(200)；及喷水组件(30)，喷水组件(30)设于夹紧组件(10)上，传送组件(20)与夹紧组件(10)配合能够将硅片(200)传送至传送组件(20)靠近喷水组件(30)的一端，喷水组件(30)能够对硅片(200)吹水，以使硅片(200)与相邻的硅片(200)分离。

Description

硅片输送分散装置
相关申请
本申请要求2021年7月1日申请的，申请号为202110746252.9，发明名称为“脱胶插片机”以及2021年8月2日申请的，申请号为202110882181.5，发明名称为“硅片输送分散装置”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及硅片加工技术领域，特别是涉及硅片输送分散装置。
背景技术
硅片输送分散装置用于将硅片输送至指定区域，再进行分片。
相关的硅片输送分散装置将硅片放置于弹夹中，再放入传送组件上传送，由于弹夹不夹持硅片，沿传送组件的传送方向，前面的硅片会压着后面的硅片，导致硅片之间无间隙，在吹片时硅片之间难以分离，需要较大的吹力，而较大的吹力会导致硅片损伤，并且，前面硅片上的细小线切颗粒会导致后面的硅片隐裂或破碎。
发明内容
根据本申请的各种实施例，本申请提供了一种硅片输送分散装置，包括：
传送组件，所述传送组件能够对于硅片进行传送；
夹紧组件，所述夹紧组件设于所述传送组件的两侧，所述夹紧组件和所述传送组件之间形成能够容置所述硅片的容置区，所述夹紧组件能够夹紧并 传送所述硅片；
及，喷水组件，所述喷水组件设于所述夹紧组件上，所述传送组件与所述夹紧组件配合能够将所述硅片传送至所述传送组件靠近所述喷水组件的一端，所述喷水组件能够对所述硅片吹水，以使所述硅片与相邻的所述硅片分离。
在一实施例中，所述夹紧组件包括第一支架、第一皮带、第二支架及第二皮带，所述第一支架及所述第二支架分别设于所述传送组件的两侧，所述第一皮带套设于所述第一支架外，并能够在所述第一支架外传动，所述第二皮带套设于所述第二支架外并能够在所述第二支架外传动，所述第一皮带与所述第二皮带配合能够夹紧所述硅片。
在一实施例中，所述夹紧组件还包括夹紧驱动单元，所述夹紧驱动单元分别与所述第一支架及所述第二支架连接，所述夹紧驱动单元能够带动所述第一支架及所述第二支架运动，以改变所述容置区的容积。
在一实施例中，所述传送组件包括第三驱动单元、第三皮带及第三支架，所述第三皮带套设于所述第三支架外，所述第三驱动单元能够驱动所述第三皮带传送。
在一实施例中，所述第三皮带靠近所述喷水组件的一端设有缓存区，所述第一皮带、所述第二皮带及所述第三皮带能够将所述硅片自所述容置区传送至所述缓存区，且所述第一皮带及所述第二皮带在所述缓存区内解除对于所述硅片的夹持，所述喷水组件在所述缓存区对所述硅片吹水。
在一实施例中，所述第三皮带为一根，所述第三皮带的两侧设有副带，所述副带形成所述缓存区。
在一实施例中，所述第三皮带为一根，所述第三皮带靠近所述喷水组件 的一端形成所述缓存区，所述夹紧组件的一端设有导向部，所述导向部能够对进入所述缓存区的所述硅片导向。
在一实施例中，所述第三皮带为两根，两根所述第三皮带间隔设置，两根所述第三皮带靠近所述喷水组件的一端形成所述缓存区。
在一实施例中，所述喷水组件包括第一喷嘴及第二喷嘴，沿着硅片输送分散装置的高度方向，所述第一喷嘴、所述第二喷嘴分别与所述夹紧组件的距离不同，所述第一喷嘴相对所述第二喷嘴远离所述夹紧组件设置。
在一实施例中，所述第二喷嘴为多个，多个所述第二喷嘴沿着所述夹紧组件的长度方向并列设置。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更好地描述和说明这里公开的那些申请的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的申请、目前描述的实施例和/或示例以及目前理解的这些申请的最佳模式中的任何一者的范围的限制。
图1为根据一个或多个实施例的硅片输送分散装置的结构示意图。
图2为图1中A处的局部放大图。
图3为根据一个或多个实施例的硅片输送分散装置的结构示意图。
图4为图3中B处的局部放大图。
图5为根据一个或多个实施例的硅片输送分散装置的结构示意图。
图6为图5中C处的局部放大图。
图中各符号表示含义如下：
100、硅片输送分散装置；10、夹紧组件；101、容置区；11、第一支架；111、配合部；12、第二支架；13、第一皮带；131、第一端；132、第二端；14、第一驱动单元；141、第一电机；142、第一驱动轮；1421、第一连接件；143、第一从动轮；15、第二皮带；16、第二驱动单元；161、第二电机；162、第二驱动轮；1621、第二连接件；163、第二从动轮；17、第一支撑板；19、夹紧驱动单元；191、夹紧导轨；192、夹紧驱动件；20、传送组件；21、第三驱动单元；211、第三驱动轮；2111、第三连接件；212、第三从动轮；213、第三电机；214、第一轮；215、传动轴；22、第三皮带；221、缓存区；222、副带；2221、第四驱动轮；2222、第四从动轮；2223、张紧轮；2224、固定板；2225、第五连接件；2226、第六连接件；23、第三支架；231、第三支撑板；30、喷水组件；31、第一喷嘴；32、第二喷嘴；40、导向部；200、硅片。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
需要说明的是，当组件被称为“装设于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。当一个组件被认为是“固定于”另一个组件，它可以是直接固定在另一个组件上或者可能同时存在居中组件。
除非另有定义，本申请所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本申请。本申请所使用的术语“或/及”包括一个或多个相关的所列项目的任意的和所有的组合。
请参见图1、图3及图5，本申请提供的硅片输送分散装置100，用于传送并分离硅片200。
具体地，硅片输送分散装置100包括夹紧组件10、传送组件20及喷水组件30。夹紧组件10设于传送组件20的两侧，夹紧组件10与传送组件20之间形成容置区101，硅片200放置于容置区101内，传送组件20能够传动，夹紧组件10夹紧硅片200并能够随着传送组件20传送，以将硅片200一边夹紧，一边传送至靠近喷水组件30的一端。喷水组件30连接于夹紧组件10，用于对硅片200吹水，使得硅片200与相邻的硅片200之间能够分离。
如此设置，通过夹紧组件10夹紧硅片200，使得前面的硅片200不会对后面的硅片200施力，从而使得硅片200与硅片200之间保持间隙而不相互抵靠，减小后续的吹片的吹力，在吹水分片时容易将硅片200分开，并且保护硅片200免受大吹力的破坏，同时，能够保护硅片200不受前面硅片200的抵靠力的损坏，硅片200不会受到前面硅片200上的细小颗粒的磨损，使得硅片200保持完整性，防止硅片200产生隐裂或破碎。
夹紧组件10包括相互平行的第一支架11及第二支架12，第一支架11及第二支架12分别设于传送组件20的两侧。
夹紧组件10还包括第一皮带13、第一驱动单元14、第二皮带15及第二驱动单元16，第一驱动单元14连接于第一支架11，第二驱动单元16连接于第二支架12，第一皮带13及第二皮带15设于硅片200的两侧，第一驱动单 元14能够带动第一皮带13传动，第二驱动单元16能够带动第二皮带15传动。第一皮带13及第二皮带15不仅能够夹紧硅片200，还能够与传送组件20配合传送硅片200。
在本实施例中，第一驱动单元14包括第一电机141、第一驱动轮142及第一从动轮143，第一驱动轮142设于第一支架11远离喷水组件30的一端，第一从动轮143设于第一支架11远离第一驱动轮142的一端，第一皮带13设于第一支架11、第一驱动轮142及第一从动轮143的外侧，第一电机141的输出轴连接于第一驱动轮142，用于驱动第一驱动轮142旋转，第一驱动轮142通过第一皮带13带动第一从动轮143旋转。在其他实施例中，还可采用旋转气缸驱动第一驱动轮142旋转。
在本实施例中，第二驱动单元16包括第二电机161、第二驱动轮162及第二从动轮163，第二驱动轮162设于第二支架12远离喷水组件30的一端，第二从动轮163设于第二支架12远离第二驱动轮162的一端，第二皮带15设于第二支架12、第二驱动轮162及第二从动轮163的外侧，第二电机161的输出轴连接于第二驱动轮162，用于驱动第二驱动轮162旋转，第二驱动轮162通过第二皮带15带动第二从动轮163旋转。在其他实施例中，还可采用旋转气缸驱动第二驱动轮162旋转。
第一支架11的内侧设有第一支撑板17，第一支撑板17设于第一支架11与第一皮带13之间，以对第一皮带13进行支撑；第二支架12的内侧设有第二支撑板(图未示)，第二支撑板设于第二支架12与第二皮带15之间，从而使得第一皮带13及第二皮带15能够更好地夹紧硅片200。
第一皮带13设于第一支架11的一侧，第二皮带15设于第二支架12的一侧。第一驱动轮142及第一从动轮143远离第一支架11的一端均设有第一 连接件1421，设于第一驱动轮142上的第一连接件1421的一端与第一支架11固定连接，另一端与第一驱动轮142转动连接，用于支撑第一驱动轮142，设于第一从动轮143上的第一连接件1421的一端与第一支架11固定连接，另一端与第一从动轮143转动连接，用于支撑第一从动轮143。第二驱动轮162及第二从动轮163远离第二支架12的一端均设有第二连接件1621，设于第二驱动轮162上的第二连接件1621的一端与第二支架12固定连接，另一端与第二驱动轮162转动连接，用于支撑第二驱动轮162，设于第二从动轮163上的第二连接件1621的一端与第二支架12固定连接，另一端与第二从动轮163转动连接，用于支撑第二从动轮163。
夹紧组件10还包括夹紧驱动单元19，夹紧驱动单元19分别连接于第一支架11及第二支架12，使得第一支架11与第二支架12能够相向或相背运动，以改变容置区101的容积，从而在接收硅片200前，松开第一支架11及第二支架12，使得第一皮带13及第二皮带15松开，硅片200进入后，再夹紧硅片200。
夹紧驱动单元19包括夹紧导轨191及夹紧驱动件192，夹紧导轨191分别连接于第一支架11及第二支架12，夹紧驱动件192分别连接于第一支架11及第二支架12，第一支架11及第二支架12上分别设有一配合部111，每一配合部111分别沿着夹紧导轨191运动，夹紧驱动件192驱动第一支架11及第二支架12运动沿着第一支架11及第二支架12的宽度方向运动。需要说明的是，本申请的第一支架11及第二支架12的宽度方向指的第一支架11的中心与第二支架12的中心的连接线的方向。
在本实施例中，夹紧驱动单元19为两个，其中一个夹紧驱动单元19连接于第一支架11，另一个连接于第二支架12；夹紧导轨191为四个，其中两 个夹紧导轨191分别靠近第一支架11的两端设置，第一支架11上配合部111也为两个，使得第一支架11的运动更加平顺，另外两个夹紧导轨191分别靠近第二支架12的两端设置，第二支架12上的配合部111也为两个，使得第二支架12的运动更加平顺。夹紧驱动件192为两个气缸，其中一个气缸的伸缩轴连接于第一支架11，另一个气缸的伸缩轴连接于第二支架12，以分别带动第一支架11及第二支架12运动。在其他实施例中，夹紧导轨191的个数可为2个、3个、5个及以上，夹紧驱动件192的个数也可为3个、4个及以上，夹紧驱动件192还可为电机。
传送组件20包括第三驱动单元21、第三皮带22及第三支架23，第三皮带22套设于第三支架23外，第三驱动单元21能够驱动第三皮带22传送，硅片200放置于第三皮带22上。
第三驱动单元21包括第三驱动轮211及第三从动轮212，第三驱动轮211及第三从动轮212分别设于第三支架23的两端，第三皮带22套设于第三驱动轮211及第三从动轮212外，第三驱动轮211通过第三皮带22带动第三从动轮212旋转。
在本实施例中，第三驱动单元21还包括第三电机213、第一轮214及传动轴215，第三电机213的输出轴上设有旋转轮，旋转轮通过皮带带动第一轮214旋转，第一轮214通过传动轴215与第三驱动轮211连接，从而带动第三驱动轮211旋转。在其他实施例中，还可用旋转气缸代替第三电机213，第三电机213还可直接带动第一轮214旋转。
第三驱动轮211及第三从动轮212的两侧均设有第三连接件2111，设于第三驱动轮211上的第三连接件2111的一端与第三支架23固定连接，另一端与第三驱动轮211转动连接，用于支撑第三驱动轮211，设于第三从动轮212 上的第三连接件2111的一端与第三支架23固定连接，另一端与第三从动轮212转动连接，用于支撑第三从动轮212。
第三支架23朝向第一支架11及第二支架12的一侧设有第三支撑板231，第三支撑板231设于第三支架23与第三皮带22之间，以对第三皮带22进行支撑。
第三皮带22靠近喷水组件30的一端设有缓存区221，第一皮带13及第二皮带15将硅片200传送至缓存区221，在缓存区221内，第一皮带13及第二皮带15解除对于硅片200的夹持。也就是说，第一皮带13具有相对设置的第一端131，第二皮带15具有相对设置的第二端132，第二端132相对于第一端131远离喷水组件30，缓存区221相对第一皮带13及第二皮带15朝向远离第二端132的方向凸出。喷水组件30在缓存区221对硅片200吹水，此时，硅片200脱离第一皮带13及第二皮带15的夹紧作用，通过喷水组件30吹水，使得硅片200呈扇形倾倒至插片机头(图未示)。
如此设置，使得硅片200在进入缓存区221后脱离第一皮带13及第二皮带15，使得硅片200能够朝向远离后面的硅片200倾倒，从而顺利地分片。
在传送组件20将硅片200从料框中顶起时，硅片200竖直地放置于第三皮带22上，经第三皮带22、第一皮带13及第二皮带15同步传送，将硅片竖直地传送至缓存区221；或者，硅片200倾斜地放置于第三皮带22上，并经第三皮带22、第一皮带13及第二皮带15同步传送，将硅片200倾斜地传送至缓存区221；或者硅片200先竖直地放置于第三皮带22上，经第三皮带22、第一皮带13及第二皮带15同步传送，当靠近缓存区221时，将硅片200倾斜地送入缓存区221。硅片200倾斜的方法为，通过先驱动第三驱动单元21，再驱动第一驱动单元14及第二驱动单元16，使得第三皮带22先于第一皮带 13及第二皮带15运行，或者，利用第一驱动单元14及第二驱动单元16驱动第一皮带13及第二皮带15反向运动一段距离，或者，当将硅片200竖直地传送至靠近缓存区221时，减慢第一皮带13及第二皮带15的速度，或停止第一皮带13及第二皮带15的传送，从而使得硅片200朝向第二端132呈一定角度倾斜排布。
实施例一
请参见图1及图2，第三皮带22为一根，第三皮带22靠近喷水组件30的一端的两侧设有一个或多个副带222，副带222形成缓存区221。
如此设置，便于顺利分片。
在靠近喷水组件30的一端，第三皮带22相对副带222缩进，且副带222相对于第一皮带13及第二皮带15朝向远离第二端132的方向凸出，凸出部分形成缓存区221。
副带222采用摩擦系数为小于0.3的材料制作，第三皮带22的摩擦系数大于副带222的摩擦系数，硅片200在传送至副带222上时，喷水组件30对其吹水，光滑的副带222能够使得硅片200与后一片硅片200顺利地分离。
副带222内设有第四驱动轮2221、第四从动轮2222及张紧轮2223，第四驱动轮2221连接于传动轴215，传动轴215带动第四驱动轮2221旋转，第四驱动轮2221带动第四从动轮2222旋转，从而实现副带222的传送，张紧轮2223用于张紧副带222。
副带222的两侧设有固定板2224，固定板2224上设有第五连接件2225及第六连接件2226，第五连接件2225的一端与固定板2224固定连接，另一端与第四从动轮2222转动连接，第六连接件2226的一端与固定板2224固定连接，另一端与张紧轮2223转动连接，从而支撑第四从动轮2222及张紧轮 2223。
实施例二
请参见图3及图4，本实施例与实施例一的结构基本相同，相同之处不再赘述，不同之处在于：
第三皮带22为一根，一整根第三皮带22均为摩擦系数小于0.3的材料制作。
在靠近喷水组件30的一端，第三皮带22靠近喷水组件30的一端相对于第一皮带13及第二皮带15朝向远离第二端132的方向凸出，凸出部分形成缓存区221，光滑的缓存区221能够减少对于硅片200的摩擦力，便于顺利分片。
第一支架11及第二支架12靠近喷水组件30的一端设有导向部40，导向部40能够导向进入缓存区221的硅片200，以防止硅片200脱离第一皮带13及第二皮带15后失去支撑力而倾倒。
可选地，导向部40为两个导向轮，导向轮能够减少对于硅片200的摩擦力，保护硅片200不被夹碎。
实施例三
请参见图5及图6，本实施例与实施例二的结构基本相同，相同之处不再赘述，不同之处在于：
第三皮带22为两根，两个第三皮带22间隔设置。在靠近喷水组件30的一端，两根第三皮带22相对第一皮带13及第二皮带15朝向远离第二端132的方向凸出，凸出部分为缓存区221。
两根第三皮带22均为摩擦系数小于0.3的材料制作，即，两根第三皮带22均为光滑的，从而减少对于硅片200的摩擦力，便于顺利分片。
喷水组件30包括第一喷嘴31及第二喷嘴32，第一喷嘴31相对第二喷嘴32靠近第三皮带22设置，即，第一喷嘴31靠近硅片200的底部。在吹水时，第一喷嘴31对硅片200的底部进行吹水，使得硅片200的底部受力，此时，硅片200脱离第一皮带13及第二皮带15，硅片200的上端能够朝向远离相邻的硅片200方向倾倒，第二喷嘴32对硅片200的上端吹水，帮助硅片200与相邻的硅片200分离，且能够控制硅片200的倾斜角度，使得硅片200呈扇形倾倒至插片机头。
第二喷嘴32为多个，多个第二喷嘴32沿着第三皮带22的长度方向并列设置。多个第二喷嘴32的吹水量够根据实际情况作出调整，相互配合以控制硅片200的倾斜角度。在吹水时，第一喷嘴31和第二喷嘴32中最靠近第二端132的第二喷嘴32同时先吹水，使得硅片200与后一片硅片200分离，再控制其余的第二喷嘴32吹水，第二喷嘴32的吹水量不同，不仅能够使得硅片200分离更加彻底，且能够相互配合控制硅片200的倾斜角度。需要说明的是，夹紧组件10及第三皮带22的长度方向指的是硅片200在第三皮带22上的前进方向。
如此设置，多个第二喷嘴32的相互配合，使得硅片200保持一定倾斜角度的直立。
在本实施例中，喷水组件30为两个，两个喷水组件30分别连接于第一支架11及第二支架12，第一喷嘴31在硅片200的两侧进行吹水，第二喷嘴32也在硅片200的两侧进行吹水，不仅能够保证吹水量，保证吹水的均匀性，还能够防止第一喷嘴31及第二喷嘴32阻挡硅片200的前进。
在工作过程中，硅片输送分散装置100放置于插片水槽内，将放有硅片200的料框放置于硅片输送分散装置100上，第三皮带22从料框底部伸入， 从而将硅片200顶起，驱动夹紧驱动单元19，将硅片200夹紧。硅片200被第一皮带13、第二皮带15及第三皮带22传送至缓存区221，第一喷嘴31对硅片200的底部吹水，使得硅片200的上端具有朝向远离第二端132的方向倾倒势，再利用第二喷嘴32对硅片200的上端吹水，使得当前硅片200与相邻的硅片200分离。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本申请的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本申请构思的前提下，还可以做出若干变形和改进，这些都属于本申请的保护范围。因此，本申请专利的保护范围应以所附权利要求为准。

Claims (10)

  1. 一种硅片输送分散装置，其特征在于，包括：
    传送组件，所述传送组件能够对于硅片进行传送；
    夹紧组件，所述夹紧组件设于所述传送组件的两侧，所述夹紧组件和所述传送组件之间形成能够容置所述硅片的容置区，所述夹紧组件能够夹紧并传送所述硅片；
    及，喷水组件，所述喷水组件设于所述夹紧组件上，所述传送组件与所述夹紧组件配合能够将所述硅片传送至所述传送组件靠近所述喷水组件的一端，所述喷水组件能够对所述硅片吹水，以使所述硅片与相邻的所述硅片分离。
  2. 根据权利要求1所述的硅片输送分散装置，其中，所述夹紧组件包括第一支架、第一皮带、第二支架及第二皮带，所述第一支架及所述第二支架分别设于所述传送组件的两侧，所述第一皮带套设于所述第一支架外，并能够在所述第一支架外传动，所述第二皮带套设于所述第二支架外并能够在所述第二支架外传动，所述第一皮带与所述第二皮带配合能够夹紧所述硅片。
  3. 根据权利要求2所述的硅片输送分散装置，其中，所述夹紧组件还包括夹紧驱动单元，所述夹紧驱动单元分别与所述第一支架及所述第二支架连接，所述夹紧驱动单元能够带动所述第一支架及所述第二支架运动，以改变所述容置区的容积。
  4. 根据权利要求2所述的硅片输送分散装置，其中，所述传送组件包括第三驱动单元、第三皮带及第三支架，所述第三皮带套设于所述第三支架外，所述第三驱动单元能够驱动所述第三皮带传送。
  5. 根据权利要求4所述的硅片输送分散装置，其中，所述第三皮带靠近所述喷水组件的一端设有缓存区，所述第一皮带、所述第二皮带及所述第三皮带 能够将所述硅片自所述容置区传送至所述缓存区，且所述第一皮带及所述第二皮带在所述缓存区内解除对于所述硅片的夹持，所述喷水组件在所述缓存区对所述硅片吹水。
  6. 根据权利要求5所述的硅片输送分散装置，其中，所述第三皮带为一根，所述第三皮带的两侧设有副带，所述副带形成所述缓存区。
  7. 根据权利要求5所述的硅片输送分散装置，其中，所述第三皮带为一根，所述第三皮带靠近所述喷水组件的一端形成所述缓存区，所述夹紧组件的一端设有导向部，所述导向部能够对进入所述缓存区的所述硅片导向。
  8. 根据权利要求5所述的硅片输送分散装置，其中，所述第三皮带为两根，两根所述第三皮带间隔设置，两根所述第三皮带在靠近所述喷水组件的一端形成所述缓存区。
  9. 根据权利要求1所述的硅片输送分散装置，其中，所述喷水组件包括第一喷嘴及第二喷嘴，沿着硅片输送分散装置的高度方向，所述第一喷嘴、所述第二喷嘴分别与所述夹紧组件的距离不同，所述第一喷嘴相对所述第二喷嘴远离所述夹紧组件设置。
  10. 根据权利要求9所述的硅片输送分散装置，其中，所述第二喷嘴为多个，多个所述第二喷嘴沿着所述夹紧组件的长度方向并列设置。
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