WO2023274077A1 - 硅片周转机构 - Google Patents

硅片周转机构 Download PDF

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Publication number
WO2023274077A1
WO2023274077A1 PCT/CN2022/101208 CN2022101208W WO2023274077A1 WO 2023274077 A1 WO2023274077 A1 WO 2023274077A1 CN 2022101208 W CN2022101208 W CN 2022101208W WO 2023274077 A1 WO2023274077 A1 WO 2023274077A1
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WO
WIPO (PCT)
Prior art keywords
clamping
assembly
silicon wafer
material frame
turnover mechanism
Prior art date
Application number
PCT/CN2022/101208
Other languages
English (en)
French (fr)
Inventor
李宏
张江水
景健
王俊
张广犬
黄游
刘哲
方勇健
胡普查
朱肖营
Original Assignee
杭州中为光电技术有限公司
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Publication date
Application filed by 杭州中为光电技术有限公司 filed Critical 杭州中为光电技术有限公司
Priority to US17/899,641 priority Critical patent/US20230005775A1/en
Publication of WO2023274077A1 publication Critical patent/WO2023274077A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • This application relates to the field of photovoltaic technology, in particular to a silicon wafer turnover mechanism.
  • the silicon rods are first cut into silicon wafers by using a wire cutter, and the silicon wafers are pasted on the crystal support through a resin plate.
  • the degumming machine for degumming to separate the silicon wafer from the crystal tray, and then the separated silicon wafers are transported to the inserter for splitting and inserting.
  • the degumming is usually carried out by carrying the crystal tray to the degumming machine, and the separated silicon wafers fall into the degumming tank after degumming, and the silicon wafers are prone to dumping and damage;
  • the wafers are taken out and put into the magazine for transportation, and the separated silicon wafers are transported through the magazines.
  • the silicon wafers are prone to tilt in the magazine, and the multiple silicon wafers are tilted and squeezed against each other, resulting in silicon chips being broken or hidden. Cracks seriously damage the quality of silicon wafers.
  • a silicon wafer turnover mechanism which is used to turn over a crystal support unit, and the crystal support unit includes a crystal support and a silicon wafer to be separated from the crystal support;
  • the silicon wafer turnover Agencies include:
  • the material frame has a material trough; the material trough can accommodate the crystal support unit;
  • the supporting assembly includes at least one set of first clamping assemblies, each set of first clamping assemblies includes two first clamping pieces, the two first clamping pieces are arranged on the material frame, and the two first clamping pieces An adjustable clamping space is formed between the first clamping parts; the crystal holder is located in the clamping space to clamp or release two of the crystal holders;
  • the second clamping assembly is arranged in the material trough; and along the height direction of the material frame, the second clamping assembly is relatively located below the support assembly;
  • the second clamping assembly includes: a second clamping assembly One rotating shaft, the first rotating shaft is provided with two, and the two first rotating shafts are arranged oppositely; the two first rotating shafts are rotatably connected with the material frame; two second clamping parts, the second clamping
  • the clamping piece is a flexible piece, and there are two clamping pieces, and the two second clamping pieces are arranged opposite to each other; wherein, the two second clamping pieces are correspondingly arranged on the two first clamping pieces. on a rotating shaft; each of the second clamping parts can rotate with the corresponding first rotating shaft, so that the two opposite second clamping parts move toward each other and clamp the and the silicon wafer to be separated.
  • the material frame includes a split upper layer material frame and a lower layer material frame; the support assembly is arranged on the upper layer material frame, and the second clamping assembly is arranged on the lower layer material frame superior.
  • the second clamping assembly further includes a mounting shaft, the mounting shaft is mounted on the first rotating shaft along the axial direction of the first rotating shaft, and the second clamping member covers It is arranged on the installation shaft, and the second clamping member can rotate relative to the installation shaft; when the first rotation shaft rotates, the first rotation shaft drives the installation shaft and the second clamp The tight parts are close to each other.
  • the silicon wafer turnover mechanism further includes a first driving assembly and two sets of connecting rod assemblies, one end of the connecting rod assembly is connected to the first driving assembly, and the other end is connected to the The first rotating shaft on the side is connected, and the first driving assembly moves to drive two groups of the connecting rod assemblies to move, so as to simultaneously drive the two first rotating shafts in each group of the clamping assemblies to rotate in opposite directions or Turn back.
  • the connecting rod assembly includes: a first connecting rod, one end of which is hinged to the first rotating shaft; each of the first rotating shafts is correspondingly equipped with one of the first connecting rods; a second connecting rod Rod, the other end of the first link is rotatably connected to the second link; and, a third link, one end of which is rotatably connected to the second link, and the other end of the third link Connect with the first drive assembly.
  • the first driving assembly includes a chute and a slider; the chute extends along the height direction of the material frame; the slider is installed in the chute, and can Sliding relative to the chute; the third connecting rod is connected with the slider; the slider moves along the height direction of the material frame to drive the second clamping assembly to clamp or release the silicon wafer .
  • the first drive assembly further includes a first limit assembly, and the first limit assembly includes two first limit blocks, and the two first limit blocks are respectively located on the Both sides of the chute; the slider moves until the slider abuts against the first limit block, and the first limit block limits the displacement of the slider along the height direction of the material frame.
  • the support assembly further includes two support shafts, the two ends of the support shafts are respectively connected to the two ends of the material frame, and the two support shafts are located opposite to the material trough.
  • the two sides of the first clamping member are rotatably mounted on the corresponding support shafts.
  • the support assembly further includes a second limit assembly, each set of the second limit assemblies includes a lower limit block and an upper limit block, each of the first clamping pieces corresponds to a set The second limit assembly; wherein, along the height direction of the material frame, the lower limit block is located below the corresponding first clamping piece; the first clamping piece rotates to the lower limit When the position block abuts, the lower limit block restricts the rotation of the first clamping part; the upper limit block is arranged above the corresponding first clamping part, and the upper limit block and the support shaft connection; when the first clamping member rotates to abut against the upper limit block, the upper limit block restricts the rotation of the first clamping member.
  • the support assembly further includes a second drive assembly, the second drive assembly includes two slide rails and a drive unit; the two slide rails are respectively arranged at both ends of the material frame, The two first clamping members in each group of the first clamping assemblies are mounted on the same slide rail; the drive unit is used to drive the two first clamping members along the Rails slide.
  • Figure 1 is a schematic diagram of a silicon wafer turnover mechanism according to one or more embodiments.
  • Figure 2 is a schematic diagram of a wafer turnover mechanism according to one or more embodiments.
  • FIG. 3 is a partial enlarged view of A in FIG. 2 .
  • FIG. 4 is a partial enlarged view of B in FIG. 2 .
  • Fig. 5 is a schematic diagram of an installation state of a crystal tray in an upper material frame according to one or more embodiments.
  • Fig. 6 is a cross-sectional view of the upper material frame in Fig. 5 .
  • Figure 7 is a schematic diagram of a wafer turnover mechanism according to one or more embodiments.
  • FIG. 8 is a schematic diagram of a silicon wafer conveying and dispersing mechanism in the related art.
  • Wafer turnover mechanism 10. Material frame; 11. Upper layer material frame; 12. Lower layer material frame; 13. Material trough; 14. Discharge port; 15. Supporting rod; 16. First channel; 17. 20, support assembly; 21, first clamp assembly; 211, first clamp; 22, support shaft; 23, second limit assembly; 231, upper limit block; 232, lower limit block ; 24, elastic reset piece; 25, the third limit assembly; 251, outer limit block; 252, inner limit block; 26, second drive assembly; 261, slide rail; 262, drive unit; 30, second Clamping assembly; 31, first rotating shaft; 32, second clamping member; 33, installation shaft; 40, first driving assembly; 41, chute; 42, slider; 43, elastic member; 44, first limiting 441, the first limit block; 50, the connecting rod assembly; 51, the first connecting rod; 52, the second connecting rod; 53, the third connecting rod; Silicon wafer; 400, silicon wafer conveying and dispersing mechanism; 401, transmission support assembly; 4011, second support; 4012, second belt; 402, transmission clamping assembly; 4021, transmission clamping member; 40
  • a component when a component is said to be “mounted on” another component, it may be directly mounted on another component or there may be an intervening component.
  • a component When a component is said to be “set on” another component, it may be set directly on the other component or there may be an intervening component at the same time.
  • a component When a component is said to be “fixed” to another component, it may be directly fixed to the other component or there may be an intervening component at the same time.
  • the crystal tray unit is usually placed in the traditional material frame, and the traditional material frame is transported to the degumming machine for degumming.
  • the crystal tray unit includes the crystal tray and the silicon tray to be separated from the crystal tray.
  • the silicon wafers separated from the crystal holder are manually taken out from the degumming machine and put into the clips, and the clips are transported to the inserting machine for slicing; however, the silicon wafers are usually ultra-thin sheets and The high mechanical brittleness makes the silicon wafer extremely fragile; the traditional material frame has no clamping effect on the crystal holder and the silicon wafer, so when the silicon wafer is separated from the crystal holder during the degumming process, the silicon wafer is easy to dump and the silicon wafer is broken.
  • the separated silicon wafers need to be transported into the clips in the related process, and the clips are put into the inserting machine for slice insertion, but the clips also have no clamping effect. As a result, the silicon wafers topple over and crush each other during handling.
  • the present application provides a silicon wafer turnover mechanism 100 specially used for the turnover crystal tray unit 500; referring to Fig. 1-Fig. Two clamping components 30 .
  • the support assembly 20 includes at least one set of first clamping assemblies 21, and each set of first clamping assemblies 21 includes two first clamping assemblies.
  • Fastener 211 The two first clamping parts 211 are arranged on the material frame 10, and an adjustable clamping space is formed between the two first clamping parts, the crystal support is located in the clamping space, and the two first clamping parts 211 can move toward or away from each other to clamp or release the crystal holder 200;
  • the second clamping assembly 30 is arranged in the material tank 13, and along the height direction of the material frame 10, the second clamping assembly 30 is opposite to the support assembly 20 below.
  • the second clamping assembly 30 includes a first rotating shaft 31 and a second clamping member 32 .
  • There are two first rotating shafts 31 the two first rotating shafts 31 are arranged opposite to each other, and are arranged at intervals in the material trough 13 , and the two first rotating shafts 31 are rotatably connected with the material frame 10 .
  • the second clamping member 32 is a flexible member, and the two second clamping members 32 are respectively arranged on the two first rotating shafts 31 correspondingly; each second clamping member 32 can rotate with the corresponding first rotating shaft 31 , so that the second clamping members 32 on the two first rotating shafts 31 move toward each other, and clamp the silicon wafer 300 on the crystal holder 200 to be separated.
  • a silicon wafer turnover mechanism 100 provided in the present application is provided with a supporting assembly 20 and a second clamping assembly 30.
  • the crystal tray 200 When carrying the crystal tray 200 and the silicon wafer 300 for degumming, the crystal tray 200 is first placed in the trough 13, And the crystal holder 200 is supported and clamped by the support assembly 20, so as to prevent the crystal holder 200 from sliding and shifting. Further, when the first clamping assembly 21 clamps the crystal holder 200 , the second clamping assembly 30 also correspondingly clamps the unseparated silicon wafer 300 on the crystal holder 200 .
  • the silicon wafer 300 separated from the crystal tray 200 is always clamped by the second clamping assembly 30 , so as to prevent the silicon wafer 300 from falling down, thereby preventing the silicon wafer 300 from being squeezed and broken.
  • the material frame 10 in the degumming machine is directly transported, and the clip is omitted.
  • the silicon wafer 300 is located in the material frame 10 and is always clamped, which effectively prevents the The silicon wafer 300 is broken.
  • a discharge port 14 on the material frame 10 there is a discharge port 14 on the material frame 10, and the discharge port 14 is adapted to the inserting machine, and the silicon wafer 300 can be transported from the material frame 10 through the discharge port 14 to the inserting machine.
  • the silicon wafers in the material frame 10 can be directly transported to the chip insertion machine by the silicon wafer turnover mechanism 100, so as to reduce the turnover times of the silicon wafers 300.
  • a silicon wafer conveying and dispersing mechanism 400 is provided between the degumming machine (not shown in the figures) and the inserting machine, and the silicon wafer conveying and dispersing mechanism 400 transfers the silicon wafer turnover mechanism 100
  • the silicon wafer 300 inside is transported to the inserting machine, and the structures of the silicon wafer turnover mechanism 100 and the silicon wafer transporting and dispersing mechanism 400 are compatible with each other.
  • Both sides of the material frame 10 are respectively provided with first through grooves 16, and the first through grooves 16 communicate with the material trough 13; and the two first through grooves 16 on both sides of the material frame are oppositely arranged.
  • a second channel 17 is opened at the bottom of the material frame 10 , and the second channel 17 communicates with the material channel 13 ;
  • the crystal support unit 500 before degumming is accommodated in the silicon wafer turnover mechanism 100, and the silicon wafer turnover mechanism 100 together with the crystal support unit 500 is transported to Degumming is completed in the degumming machine, and the degummed and separated silicon wafers 300 are directly transferred to the silicon wafer transport and dispersion mechanism 400 through the silicon wafer turnover mechanism 100.
  • the mechanism 400 can directly transport the silicon wafers 300 in the material frame 10 to the inserting machine from the outlet 14 , omitting the turnover steps of the silicon wafers, thereby reducing the fragmentation rate of the silicon wafers.
  • the silicon wafer conveying and dispersing mechanism 400 includes a conveying supporting assembly 401 and a conveying clamping assembly 402 arranged in a cyclic rolling manner.
  • the conveying clamping assembly 402 includes two conveying clamping parts 4021, two conveying clamps
  • the fastening element 4021 is oppositely disposed on two sides of the transmission support assembly 401 .
  • An accommodating area 403 capable of accommodating the silicon wafer turnover mechanism 100 is formed between the transfer support assembly 401 and the transfer clamp assembly 402; first through grooves 16 are respectively opened on both sides of the material frame 10, and the two sides of the material frame 10 Two first through grooves 16 are arranged oppositely; the first through groove 16 communicates with the material groove 13; When conveying, the silicon wafer turnover mechanism 100 is placed in the accommodation area 403, and the two conveying clamps 4021 respectively extend into the two first through grooves 16 and move toward each other to clamp the silicon wafers in the trough 13. piece.
  • the transfer support assembly 401 extends into the second through groove 17 correspondingly, and supports the silicon wafer 300 in the material frame 10; silicon wafer 300, so that the silicon wafer 300 is detached from the magazine 10 and transported to the wafer insertion machine.
  • the width of the first through groove 16 is greater than or equal to the width of the corresponding conveying clamping member 4021 .
  • the transmission clamp assembly 402 further includes two first brackets 4022, and the two first brackets 4022 are arranged on both sides of the transmission support assembly 401, The first belt is sheathed on the first bracket 4022 and can roll on the first bracket 4022 in a circular manner.
  • the specific structure of the transmission clamping assembly 402 is not limited to the above description or the illustration in the figure.
  • the transmission support assembly 401 includes a second bracket 4011 and a second belt 4012; the second belt 4012 is sleeved on the second bracket 4011 and can Loop scrolling.
  • a plurality of supporting rods 15 are arranged at the bottom of the trough 13, and the silicon wafer 300 in the trough 13 is supported by the supporting rods 15, and the plurality of supporting rods 15 are arranged at intervals to form a second
  • the groove widths of the through groove 17 and the second through groove 17 are adapted to the silicon wafer conveying and dispersing mechanism 400 .
  • the manner of forming the second through groove 17 is not limited to the above description or the drawing.
  • the supporting rod 15 is covered with a flexible material, so as to prevent the supporting rod 15 from scratching the edge of the silicon wafer 300 .
  • the bottom of the material frame 10 is set as a hollow structure, in other words, the bottom of the material trough 13 is a hollow structure to adapt to the degumming process.
  • the frame 10 is soaked in clear water and degumming solution, and the hollow structure is arranged to facilitate the infiltration or oozing of the clear water and/or degumming solution into the material frame 10 .
  • the material frame 10 is a one-piece structure.
  • the material frame 10 is a split structure, and the material frame 10 includes an upper layer material frame 11 and a lower layer material frame 12 arranged separately, wherein the support assembly 20 is arranged on the upper layer material frame 11, The second clamping assembly 30 is disposed on the lower material frame 12 .
  • the upper material frame 11 and the crystal tray 200 can be directly taken out, and the lower material frame 12 and the silicon wafers 300 in the lower material frame 12 can be directly transported to the next step of the insertion process, thereby reducing the need for transportation to the insertion process.
  • the weight of the material frame 10 in the sheet process In practical applications, the overall weight of the material frame 10 is relatively large, and through the separate arrangement, only the lower material frame 12 needs to be transported, which is convenient for handling and transportation.
  • the number of sets of the first clamping assembly 21 can be multiple sets.
  • the number of sets of the first clamping assembly 21 is two groups. 21 respectively clamping the two ends of the crystal holder 200 to prevent the crystal holder 200 from shifting during the handling process, causing damage to the silicon wafer 300 due to collision.
  • more than two sets of first clamping assemblies 21 may also be provided.
  • the support assembly 20 also includes two support shafts 22, the two ends of the support shaft 22 are respectively connected to the two ends of the material frame 10, and the two support shafts 22 are respectively located on opposite sides of the material trough 13,
  • the two first clamping members 211 in each set of first clamping assemblies 21 are rotatably mounted on the corresponding supporting shafts 22 .
  • the crystal holder 200 located between the two first clamping components 211 is clamped by driving the two first clamping components 211 to rotate in opposite directions.
  • the optional first clamping member 211 is a plate-shaped structure adapted to the slot 201 , the two first clamping pieces 211 rotate in opposite directions, so that one end of the first clamping piece 211 extends into the slot 201, and when the crystal holder 200 continues to move down to enter the material trough 13, the first clamping piece One end of 211 continues to extend into the slot 201 until the first clamping member 211 rotates to a preset angle, so that the first clamping member 211 fully extends into the slot 201 .
  • the slot 201 cooperates with the first clamping member 211 to achieve clamping and support on the crystal holder 200 , preventing the crystal holder 200 from sliding relative to the material frame 10 and preventing the crystal holder 200 from continuing to move down and crushing the silicon wafer 300 .
  • the specific structure of the first clamping member 211 is not limited to the above, and can be adjusted according to the structure of the crystal holder 200 .
  • the support assembly 20 also includes a second limit assembly 23, each set of second limit assemblies 23 includes a lower limit block 232, an upper limit block 231, and each first clamping member 211 corresponds to a set of The second limiting component 23.
  • the lower limit block 232 is located below the corresponding first clamping member 211 .
  • the upper limit block 231 is arranged above the corresponding first clamping piece 211, and the upper limit block 231 is connected with the support shaft 22; A clamping part 211 continues to rotate.
  • the support assembly 20 also includes an elastic return member 24, one end of the elastic return member 24 is connected to the support shaft 22, and the other end is connected to the first clamping member 211; the elastic return member 24 always pulls the first clamping member 211 , so that the first clamping part 211 rotates opposite to the other first clamping part 211 on the opposite side.
  • the elastic return member 24 pulls the first clamping assembly 21 to be in a released state.
  • the elastic reset member 24 always pulls the first clamping member 211 against the upper limit block 231, and at this time the first clamping assembly 21 is in the released state; when the crystal holder 200 is placed, the first clamping member 211 is in the corresponding position At the slots of the slots 201 on both sides, the crystal holder 200 slowly moves down to load the feeding frame 10 , and the corresponding first clamping piece 211 is pressed down by the groove wall, so that the first clamping piece 211 overcomes the pressure of the elastic reset piece 24 Elastic force, and rotate with the first clamping member 211 on the opposite side until the first clamping member 211 abuts against the lower limit block 232 to complete the clamping of the crystal holder 200; when the crystal holder 200 is taken out from the material frame 10 Afterwards, the pressure exerted by the crystal holder 200 on the first clamping member 211 disappears, so that the first clamping member 211 returns to the initial unclamped state by the elastic restoring force of the elastic reset member 24, realizing the first clamping assembly
  • the automatic clamping and automatic reset of the first clamping assembly 21 can be realized through the elastic force of the elastic reset member 24 and the gravity during the pressing down process of the crystal holder 200, without the need to set up power equipment such as a driving motor, which simplifies the installation of the silicon wafer turnover mechanism 100. Structure, and save power source, thereby reducing structure cost and equipment energy consumption.
  • the elastic return member 24 adopts a torsion spring, of course, in other embodiments, the elastic return member 24 may also be of other elastic structures.
  • the structure for realizing the clamping and resetting of the first clamping assembly 21 is not limited to the above, for example, in another embodiment provided by the present application, referring to Fig. 6 and Fig. 7, the support assembly 20 It also includes a second drive assembly 26, the second drive assembly 26 includes two slide rails 261 and a drive unit 262; the two slide rails 261 are respectively arranged at the two ends of the material frame 10, and the two slide rails 261 in each group of first clamping assemblies 21
  • the first clamping parts 211 are installed on the same slide rail 261 ; the driving unit 262 is used to drive the two first clamping parts 211 to slide along the slide rail 261 .
  • the driving unit 262 drives the two first clamping parts 211 to slide towards each other, thereby clamping the crystal holder 200 between the two first clamping parts 211; when the driving unit 262 drives the two first clamping parts 211 to face Slide, thereby releasing the crystal holder 200.
  • the driving unit 262 is a driving device such as a motor, which is not limited here.
  • the driving unit 262 may be a driving motor, a cylinder, etc., or other driving structures.
  • the support assembly 20 also includes a third limit assembly 25, and each set of third limit assemblies 25 includes two inner limit blocks 252 and two outer limit blocks 251; each slide rail 261 is equipped with a corresponding A set of third limiting components 25; wherein, two outer limiting blocks 251 are located at both ends of the slide rail 261, two inner limiting blocks 252 are located between the two outer limiting blocks 251, and the first clamping The member 211 is located between the adjacent outer limiting block 251 and the inner limiting block 252 .
  • the farthest distance between the two first clamping parts 211 is limited by the outer limit block 251 to prevent the first clamping part 211 from breaking away from the slide rail 261; and the two first clamping parts 211 are limited by the inner limit block 252 The shortest distance between them prevents the two first clamping members 211 from over-clamping the crystal holder 200 .
  • the second clamping assembly 30 further includes a mounting shaft, which is installed on the first rotating shaft 31 along the axial direction of the first rotating shaft 31 , and the second The second clamping member 32 is sleeved on the installation shaft, and the second clamping member 32 can rotate relative to the installation shaft; when the first rotating shaft 31 is driven to rotate, the first rotating shaft 31 drives the support shaft 22 and the second clamping member 32 to face each other Move closer or move away from each other.
  • the two second clamping members 32 clamp the silicon wafer 300 not separated from the crystal tray 200, and then the wafer turnover mechanism 100 transports the crystal tray unit 500 in the material frame 10 to the Degumming is carried out in the degumming mechanism.
  • the silicon wafer 300 is separated from the crystal tray 200 . Since the second clamping part 32 can rotate relative to the installation shaft, after the silicon chip 300 is separated from the crystal holder 200, it is driven by the self-weight of the silicon chip 300 and the friction between the silicon chip 300 and the second clamping part 32.
  • the second clamping member 32 rotates relative to the installation shaft, so that the silicon wafer 300 slowly moves down to abut against the bottom of the trough 13 .
  • the second clamping member 32 always clamps the silicon wafer 300, thereby preventing the silicon wafer 300 from falling while realizing the falling of the silicon wafer 300, effectively preventing the silicon wafers 300 from colliding with each other and being damaged .
  • the second clamping member 32 adopts a sponge roller, and the sponge roller has a certain softness to prevent scratching the silicon wafer 300; and the sponge roller has good corrosion resistance, so that the silicon wafer turnover mechanism 100 It can be soaked together with the crystal tray unit 500 in the degumming tank.
  • the silicon wafer turnover mechanism 100 also includes a first driving assembly 40 and two sets of connecting rod assemblies 50, one end of the connecting rod assembly 50 is connected to the first driving assembly 40, and the other end is connected to the same side of the trough 13.
  • the first rotating shafts 31 are connected, the first driving assembly 40 moves, and drives the two sets of connecting rod assemblies 50 to move, so as to simultaneously drive the two first rotating shafts 31 in each clamping assembly to rotate in opposite directions or in opposite directions.
  • the connecting rod assembly 50 includes a first connecting rod 51 , a second connecting rod 52 and a third connecting rod 53 : wherein, one end of the first connecting rod 51 is connected to the first rotating shaft 31 is hinged; each first rotating shaft 31 is correspondingly equipped with a first connecting rod 51; the other end of the first connecting rod 51 is rotationally connected with the second connecting rod 52; at the same time, one end of the third connecting rod 53 is connected with the second connecting rod 52 The connection is rotationally connected, and the other end of the third connecting rod 53 is connected with the first driving assembly 40 .
  • the first driving assembly 40 drives the third connecting rod 53 to rotate, and the corresponding third connecting rod 53 drives the second connecting rod 52 to move, and then the second connecting rod 52 drives the first connecting rod 51 to move, and the corresponding second connecting rod 52 drives The rotation of the first rotating shaft 31 realizes that the two oppositely arranged first rotating shafts 31 rotate toward each other or oppositely to realize the clamping or releasing of the silicon wafer.
  • the specific structure of the link assembly 50 is not limited to the above description.
  • the number of sets of the second clamping assembly 30 is not limited to one set, and multiple sets can also be set, for example, two sets of second clamping assemblies 30 are set, and the two first rotating shafts 31 on the same side are respectively connected to the corresponding
  • the first connecting rod 51 is hinged, and the two first connecting rods 51 are connected to the same second connecting rod 52, so that the connecting rod assembly 50 can simultaneously drive the two first rotating shafts 31 to rotate simultaneously, realizing multiple sets of second clamping assemblies 30 are clamped at the same time, which simplifies the structure of the connecting rod assembly 50.
  • multiple sets of second clamping assemblies 30 can also be driven separately, which is not limited here.
  • the second connecting rod 52 is a curved rod, so that when the second connecting rod 52 rotates, it can avoid the ends of the first connecting rod 51 and the first rotating shaft 31, preventing the first connecting rod 51 and the first rotating shaft from The rotating shaft 31 blocks the rotation of the second connecting rod 52 .
  • the first drive assembly 40 includes a chute 41 and a slider 42; the chute 41 extends along the height direction of the material frame 10; the slider 42 is installed in the chute 41, And can slide relative to the chute 41; the third connecting rod 53 is connected with the slider 42; the slider 42 moves along the height direction of the material frame 10 to drive the second clamping assembly 30 to clamp or release the silicon wafer.
  • the slider 42 moves toward the bottom of the material frame 10 along the height direction of the material frame 10, and the two second clamping members 32 in the second clamping assembly 30 are aligned with each other. back movement, the second clamping member 32 is in the released state; when the slider 42 moves back to the bottom of the material frame 10 along the height direction of the material frame 10, the two second clamping members 32 in the second clamping assembly 30 move toward each other , the second clamping member 32 is in a clamping state.
  • the relationship between the state of the second clamping assembly 30 and the moving direction of the slider 42 is not limited to the above, for example, the slider 42 moves toward the bottom of the material frame 10, and the second clamping assembly 30 is in the clamping position. tight state.
  • the first driving assembly further includes an elastic member 43 , one end of the elastic member 43 is connected to the slider 42 , and the other end is connected to the bottom of the material frame 10 . Press down the slider 42 to make the slider 42 move toward the bottom of the material frame 10, and then make the second clamping assembly 30 in the released state.
  • the elastic member 43 The elastic deformation resets to drive the slider 42 to move away from the bottom of the material frame 10 , so that the slider 42 drives the second clamping assembly 30 to automatically lock the silicon wafer.
  • the second clamping assembly 30 By setting the elastic member 43, when no external force is applied to the slider 42, the second clamping assembly 30 is always in the clamping state, ensuring that the second clamping assembly 30 is always in the process of degumming and carrying the silicon wafer turnover mechanism 100.
  • the silicon wafer is clamped to prevent the silicon wafer from toppling over; at the same time, the energy consumption of the silicon wafer turnover mechanism 100 is reduced.
  • the first driving assembly 40 further includes a first limiting assembly 44 , and the first limiting assembly 44 includes two first limiting blocks 441 , and the two first limiting blocks 441 are respectively located on both sides of the chute 41
  • the slider 42 moves until the slider 42 abuts against the first limit block 441 , and the first limit block 441 limits the displacement of the slider 42 along the height direction of the material frame 10 .
  • the second clamping component 30 is prevented from over-clamping the silicon wafer, and the damage rate of the silicon wafer is reduced.
  • the first clamping assembly 21 and the second clamping assembly 30 are in a released state.
  • each set of first clamping components 21 The two opposite first clamping pieces 211 move towards each other and close to clamp the crystal holder 200, and when the first clamping piece 211 abuts against the lower limit block 232 or the inner limit block 252, the clamping of the crystal support 200 is completed.
  • the two opposite second clamping members 32 in each group of second clamping assemblies 30 move toward each other and approach the unseparated silicon wafers on the crystal holder 200 until the second clamping members 32 and the first stop block 441 abuts to complete the clamping of the silicon wafer 300 .
  • the crystal carrier unit 500 in the material frame 10 of the silicon wafer turnover mechanism 100 is transported to the degumming machine. After the degumming is completed, the crystal tray 200 is separated from the silicon wafer 300.
  • the crystal tray 200 or the crystal tray 200 together with the upper material frame 11 can be taken out, and the remaining degummed silicon wafers 300 together with the lower material frame 12 are transported to the silicon wafer for transportation
  • the conveying support assembly 401 extends into the second through groove 17, supports the silicon wafer 300, and separates the bottom of the silicon wafer 300 from the bottom of the material tank 13;
  • the two conveying clamping parts 4021 on both sides extend into the first through groove 16 and approach the silicon wafers in the clamping trough 13.
  • the first driving assembly 40 in the silicon wafer turnover mechanism 100 drives the second clamping
  • the clamp 32 releases the silicon wafer 300
  • the silicon wafer turnover mechanism 100 loses the clamping and supporting effect on the silicon wafer 300; then, the silicon wafer conveying and dispersing mechanism 400 is activated, and the conveying support assembly 401 and the conveying clamping assembly 402 rotate circularly to drive
  • the silicon wafer 300 located in the trough 13 is transported from the discharge port 14 to the inserting machine for inserting and dividing into slices, and the conveying process of the silicon wafer 300 is completed.
  • the silicon wafer turnover mechanism 100 provided by this application can effectively realize the clamping of the silicon wafer and prevent the silicon wafer from falling over, and the silicon wafer turnover mechanism 100 can be used in conjunction with the degumming machine and the inserting machine, Therefore, in the silicon wafer processing process, the silicon wafer is always carried, clamped and transferred by the material frame 10, omitting the magazine clip, and does not need to turn over the silicon wafer multiple times, which significantly reduces the damage rate of the silicon wafer.

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Abstract

一种硅片周转机构(100)。该硅片周转机构(100)包括：料框(10)，具有料槽(13)；支撑组件(20)，包括至少一组第一夹紧组件(21)，每组第一夹紧组件(21)用以夹持或释放晶托(200)；第二夹紧组件(30)包括两根相对设置的第一转轴(31)以及两个第二夹紧件(32)，两根第一转轴(31)与料框(10)转动连接；两个第二夹紧件(32)分别对应的设于两根第一转轴(31)上；每件第二夹紧件(32)能够随着对应的第一转轴(31)转动，以使两个第二夹紧件(32)相向运动夹持待分离的硅片(300)。

Description

硅片周转机构
相关申请
本申请要求2021年7月1日申请的，申请号为202110746252.9，发明名称为“脱胶插片机”以及2021年8月2日申请的，申请号为202110882165.6，发明名称为“硅片周转机构”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及光伏技术领域，特别是涉及一种硅片周转机构。
背景技术
在硅片的生产流程中，首先利用线切机将硅棒切割成硅片，硅片此时是通过树脂板粘贴在晶托上的，为实现线切后的硅片的自动脱胶，需要将晶托以及晶托上的硅片搬运至脱胶机中进行脱胶，以使硅片与晶托分离，后续将分离后的硅片搬运至插片机内进行分片以及插片。
而相关技术中，通常通过搬运晶托至脱胶机内进行脱胶，脱胶后分离的硅片落入脱胶槽内，硅片易发生倾倒而产生损坏；接着，通过人工将脱胶机内的脱落的硅片取出并放入弹夹内进行搬运，而通过弹夹搬运分离后的硅片，硅片在弹夹内易发生倾斜，多片硅片之间相互倾斜挤压，导致硅片碎裂或隐裂，严重损坏硅片的质量。
发明内容
根据本申请的各种实施例，提供的一种硅片周转机构，用于周转晶托单元，所述晶托单元包括晶托及与所述晶托待分离的硅片；所述硅片周转机构包括：
料框，具有料槽；所述料槽可容置晶托单元；
支撑组件，包括至少一组第一夹紧组件，每组所述第一夹紧组件包括两个第一夹紧件，两个所述第一夹紧件设置在料框上，且两个所述第一夹持件之间构成一个可调节的夹持空间；所述晶托位于所述夹持空间内，以夹持或释放所述晶托两个；
第二夹紧组件，设于所述料槽内；且沿所述料框的高度方向，所述第二夹紧组件相对位于所述支撑组件的下方；所述第二夹紧组件包括：第一转轴，所述第一转轴设置有两根，且两根第一转轴相对设置；两根所述第一转轴与所述料框转动连接；两个第二夹紧件，所述第二夹紧件为柔性件，所述夹紧件设置有两个，且两个第二夹紧件之间相对设置；其中，两个所述第二夹紧件分别对应的设于两根所述第一转轴上；每件所述第二夹紧件能够随着对应的所述第一转轴转动，以使两个相对设置的所述第二夹紧件相向运动，并夹持位于所述晶托上 且待分离的所述硅片。
在其中一个实施例中，所述料框包括分体式的上层料框和下层料框；所述支撑组件设置于所述上层料框上，所述第二夹紧组件设置于所述下层料框上。
在其中一个实施例中，所述第二夹紧组件还包括安装轴，沿所述第一转轴的轴向，所述安装轴安装于所述第一转轴上，所述第二夹紧件套设在所述安装轴上，且所述第二夹紧件能够相对于所述安装轴转动；当所述第一转轴转动时，所述第一转轴带动所述安装轴以及所述第二夹紧件相向靠近。
在其中一个实施例中，所述硅片周转机构还包括第一驱动组件和两组连杆组件，所述连杆组件一端与所述第一驱动组件连接，另一端与位于所述料槽同侧的所述第一转轴连接，所述第一驱动组件移动，带动两组所述连杆组件移动，以同时驱动每组所述夹紧组件中的两根所述第一转轴相向转动或相背转动。
在其中一个实施例中，所述连杆组件包括：第一连杆，其一端与所述第一转轴铰接；每根所述第一转轴对应配备一根所述第一连杆；第二连杆，所述第一连杆的另一端与所述第二连杆转动连接；以及，第三连杆，其一端与所述第二连杆连接转动连接，所述第三连杆的另一端与所述第一驱动组件连接。
在其中一个实施例中，所述第一驱动组件包括滑槽、滑块；所述滑槽沿着所述料框的高度方向延伸设置；所述滑块安装于所述滑槽内，且能够相对于所述滑槽滑动；所述第三连杆与所述滑块连接；所述滑块沿所述料框的高度方向移动，以带动所述第二夹紧组件夹紧或释放硅片。
在其中一个实施例中，所述第一驱动组件还包括第一限位组件，所述第一限位组件包括两块第一限位块，两块所述第一限位块分别位于所述滑槽的两侧；所述滑块运动至所述滑块与所述第一限位块抵靠，所述第一限位块限制所述滑块沿所述料框高度方向上的位移。
在其中一个实施例中，所述支撑组件还包括两根支撑轴，所述支撑轴的两端分别与所述料框的两端连接，且两根所述支撑轴分别位于所述料槽相对的两侧，所述第一夹紧件转动的安装于对应的所述支撑轴上。
在其中一个实施例中，所述支撑组件还包括第二限位组件，每组所述第二限位组件包括下限位块、上限位块，每块所述第一夹紧件对应匹配一组所述第二限位组件；其中，沿所述料框的高度方向，所述下限位块位于对应的所述第一夹紧件的下方；所述第一夹紧件转动至与所述下限位块抵靠时，所述下限位块限制所述第一夹紧件转动；所述上限位块设置在对应的所述第一夹紧件上方，且所述上限位块与所述支撑轴连接；所述第一夹紧件转动至与所述上限位块抵靠时，所述上限位块限制所述第一夹紧件转动。
在其中一个实施例中，所述支撑组件还包括第二驱动组件，所述第二驱动组件包括两道滑轨和驱动单元；两道所述滑轨分别设置于所述料框的两端，每组所述第一夹紧组件中的两个所述第一夹紧件安装于同一道所述滑轨上；所述驱动单元用于驱动两个所述第一夹紧件沿着所述滑轨滑动。
本申请的一个或多个实施例的细节在下面的附图和描述中提出。本申请的其它特征、目的和优点将从说明书、附图以及权利要求书变得明显。
附图说明
为了更好地描述和说明这里公开的那些申请的实施例和/或示例，可以参考一幅或多幅附图。用于描述附图的附加细节或示例不应当被认为是对所公开的申请、目前描述的实施例和/或示例以及目前理解的这些申请的最佳模式中的任何一者的范围的限制。
图1为根据一个或多个实施例的硅片周转机构的示意图。
图2为根据一个或多个实施例的硅片周转机构的示意图。
图3为图2中的A处局部放大图。
图4为图2中的B处局部放大图。
图5为根据一个或多个实施例的上层料框中晶托安装状态的示意图。
图6为图5中上层料框的横截面图。
图7为根据一个或多个实施例的硅片周转机构的示意图。
图8为相关技术中一种硅片输送分散机构的示意图。
图示标号如下：
100、硅片周转机构；10、料框；11、上层料框；12、下层料框；13、料槽；14、出料口；15、承托杆；16、第一通槽；17、第二通槽；20、支撑组件；21、第一夹紧组件；211、第一夹紧件；22、支撑轴；23、第二限位组件；231、上限位块；232、下限位块；24、弹性复位件；25、第三限位组件；251、外限位块；252、内限位块；26、第二驱动组件；261、滑轨；262、驱动单元；30、第二夹紧组件；31、第一转轴；32、第二夹紧件；33、安装轴；40、第一驱动组件；41、滑槽；42、滑块；43、弹性件；44、第一限位组件；441、第一限位块；50、连杆组件；51、第一连杆；52、第二连杆；53、第三连杆；200、晶托；201、卡槽；300、硅片；400、硅片输送分散机构；401、传送承托组件；4011、第二支架；4012、第二皮带；402、传送夹紧组件；4021、传送夹紧件；4022、第一支架；403、容置区；500、晶托单元。
具体实施方式
下面将结合本申请实施方式中的附图，对本申请实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本申请一部分实施方式，而不是全部的实施方式。基于本申请中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本申请保护的范围。
需要说明的是，当组件被称为“装设于”另一个组件，它可以直接装设在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。当一个组件被认为是“固定于”另一个组件，它可以是直接固定在另一个组件上或者可能同时存在居中组件。
除非另有定义，本申请所使用的所有的技术和科学术语与属于本申请的技术领域的技术人员通常理解的含义相同。在本申请的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本申请。本申请所使用的术语“或/及”包括一个或多个相关的所列项目的任意的和所有的组合。
在相关的硅片生产加工工艺中，通常通过将晶托单元放置入传统料框内，将传统料框搬运至脱胶机中进行脱胶，其中晶托单元包括晶托及与晶托待分离的硅片；完成脱胶后，通过人工从脱胶机内将与晶托分离的硅片取出并放入弹夹内，通过运送弹夹至插片机内进行分片；然而硅片通常为超薄片且机械脆性高，导致硅片极其易碎；传统料框对晶托以及硅片均无夹紧作用，导致在脱胶过程中硅片与晶托分离时，硅片易倾倒，导致硅片碎裂。为适配后续的插片流程，相关工艺中需要将分离后的硅片搬运至弹夹内，将弹夹放入插片机内进行分片插片，但弹夹也同样无夹紧作用，导致在搬运过程中硅片倾倒并相互挤压碎裂。
为此，本申请提供一种专门用于周转晶托单元500的硅片周转机构100；参阅图1-图7，在本申请中，硅片周转机构100包括料框10、支撑组件20以及第二夹紧组件30。
其中，料框10内具有料槽13，料槽13可容置晶托单元500，支撑组件20包括至少一组第一夹紧组件21，每组第一夹紧组件21包括两个第一夹紧件211。两个第一夹紧件211设在料框10上，且两个第一夹紧件之间构成一个可调节的夹持空间，晶托位于该夹持空间内，两个第一夹紧件211能够相向或者相背运动，以夹持或释放晶托200；第二夹紧组件30设于料槽13内，且沿料框10的高度方向，第二夹紧组件30相对位于支撑组件20的下方。
具体的，第二夹紧组件30包括第一转轴31和第二夹紧件32。第一转轴31设置有两根，两根第一转轴31相对设置，且间隔地设于料槽13内，两根第一转轴31与料框10转动连接。第二夹紧件32为柔性件，且两个第二夹紧件32分别对应的设于两根第一转轴31上；每个第二夹紧件32能够随着对应的第一转轴31转动，以使两根第一转轴31上的第二夹紧件32相向运动，并夹持位于晶托200上且待分离的硅片300。
本申请提供的一种硅片周转机构100，通过设置支撑组件20以及第二夹紧组件30，在搬运晶托200和硅片300进行脱胶时，首先将晶托200置于料槽13内，并通过支撑组件20支撑以及夹紧晶托200，如此，防止晶托200滑动移位。进一步的，第一夹紧组件21夹紧晶托200时，第二夹紧组件30也对应的夹紧晶托200上未分离的硅片300。在进行脱胶后，从晶托200上分离的硅片300始终被第二夹紧组件30夹紧，从而避免硅片300倾倒，进而避免硅片300相互挤压碎裂。并且，在后续的工艺流程中，直接搬运脱胶机内的料框10，省略弹夹，在进行后续搬运过程中，硅片300位于料框10内且始终被夹紧，有效防止了搬运过程中硅片300碎裂。
请继续参阅图1和图2和图7，料框10上开设有出料口14，出料口14与插片机适配，硅片300能够从料框10内经出料口14输送至插片机中，从而在完成脱胶后，可直接通过搬运硅片周转机构100将料框10内的硅片搬运至插片机处，减少硅片300的周转次数。
在其中一个实施例中，参阅图1-图8，脱胶机(图中未示出)和插片机之间设有硅片输送分散机构400，硅片输送分散机构400将硅片周转机构100内的硅片300输送至插片机，且硅片周转机构100与硅片输送分散机构400的结构相互适配。料框10两侧分别开设有第一通槽16，第一通槽16与料槽13连通；且位于料框两侧的两个第一通槽16相对设置。并且，料框10底部开设有第二通槽17，第二通槽17与料槽13连通；第一通槽16和第二通槽17分别与硅片输送分散机构400适配。如此，由于硅片周转机构100与硅片输送分散机构400的结构相互适配，无需将料框内的硅片取出，在完成脱胶后，可直接将位于脱胶机内的料框10以及料框10内的脱胶分离的硅片300转移至硅片输送分散机构400上，减少硅片的周转次数，从而降低硅片300的碎片率。
通过硅片周转机构100与硅片输送分散机构400以及插片机的配合，未脱胶前的晶托单元500收容在硅片周转机构100中，将硅片周转机构100连同晶托单元500搬运至脱胶机内完成脱胶，脱胶分离后的硅片300直接通过硅片周转机构100转运至硅片输送分散机构400上，此时硅片输送分散机构400与硅片周转机构100配合，硅片输送分散机构400能够直接将料框10内的硅片300由出料口14输送至插片机，省略硅片周转步骤，从而降低了硅片的碎片率。
其中，参阅图1-图8，硅片输送分散机构400包括循环滚动设置的传送承托组件401和传送夹紧组件402，传送夹紧组件402包括两个传送夹紧件4021，两个传送夹紧件4021相对设置于传送承托组件401的两侧。传送承托组件401和传送夹紧组件402之间形成能够容置硅片周转机构100的容置区403；料框10两侧分别开设有第一通槽16，且料框10两侧的两个第一通槽16相对设置；第一通槽16与料槽13连通；料框10底部开设有第二通槽17，第 二通槽17与料槽13连通。在输送时，硅片周转机构100放置于容置区403内，两个传送夹紧件4021分别对应的伸入两个第一通槽16内并相向移动，以夹持料槽13内的硅片。传送承托组件401对应的伸进第二通槽17，并承托料框10内的硅片300；传送承托组件401配合两个传送夹紧件4021夹持并承托料框10内的硅片300，以使硅片300脱离料框10并输送至插片机中。
可选的，第一通槽16的槽宽大于或等于与对应的传送夹紧件4021的宽度。
进一步地，参阅图8，其中传送夹紧件4021设为第一皮带，传送夹紧组件402还包括两个第一支架4022，两个第一支架4022设置在传送承托组件401的两侧，第一皮带套设在第一支架4022上，且能够在第一支架4022上循环滚动。当然，在其他实施例中，传送夹紧组件402的具体结构不局限于以上所述或图中所示。
请继续参阅图8，在其中一个实施例中，传送承托组件401包括第二支架4011和第二皮带4012；第二皮带4012套设在第二支架4011上，且能够在第二支架4011上循环滚动。
可选的，参阅图1，料槽13底部设置多根承托杆15，通过承托杆15来承托料槽13内的硅片300，多根承托杆15之间间隔设置形成第二通槽17，第二通槽17的槽宽与硅片输送分散机构400适配。当然，在其他实施例中，第二通槽17形成的方式不局限于以上所述或图中所示。
进一步可选的，承托杆15上包覆有柔性材料，避免承托杆15刮伤硅片300边缘。在其中一个实施例中，参阅图1和图2，料框10底部设置为镂空结构，换言之，料槽13的槽底为镂空结构，以适应脱胶工艺，脱胶工艺中需将晶托200以及料框10浸泡在清水以及脱胶液中，设置为镂空结构有利于清水和/或脱胶液渗入或渗出料框10。
请参阅图1，在其中一个实施例中，料框10为一体式的结构。
当然在其他实施例中，例如图2中，料框10为分体式结构，料框10包括分体设置的上层料框11和下层料框12，其中支撑组件20设置于上层料框11上，第二夹紧组件30设置于下层料框12上。如此设置，完成脱胶后，上层料框11以及晶托200可直接取出，下层料框12以及下层料框12内的硅片300可直接输送至下一步的插片工序中，从而减轻输送至插片工序中的料框10的重量。在实际的应用中，料框10整体的重量较大，通过分体设置，只需输送下层料框12，如此便于搬运以及输送。
在本申请中，第一夹紧组件21设置的组数可以为多组，例如参阅图1和图2，第一夹紧组件21设置的组数为两组，通过两组第一夹紧组件21分别夹紧晶托200的两端，防止在搬运过程中晶托200移位，导致硅片300碰撞受损。当然在其他实施例中，也可以设置两组以上的第一夹紧组件21。
参阅图1-图4，支撑组件20还包括两根支撑轴22，支撑轴22的两端分别与料框10的两端连接，且两根支撑轴22分别位于料槽13相对的两侧，每组第一夹紧组件21中两个第一夹紧件211转动的安装于对应侧的支撑轴22上。通过驱动两个第一夹紧件211相向转动，从而夹紧位于两个第一夹紧件211之间的晶托200。
在本申请的一个实施例中，参阅图1、图2以及图5，晶托200的两侧具有卡槽201，可选的第一夹紧件211为与卡槽201适配的板状结构，两个第一夹紧件211相向转动，使得第一夹紧件211的一端伸入卡槽201内，在晶托200继续下移至进入料槽13内的过程中，第一夹紧件211的一端继续伸入卡槽201内，直至第一夹紧件211转动至预设的角度，使第一夹紧件211完全伸入卡槽201内。通过卡槽201与第一夹紧件211配合，实现在晶托200的夹紧以及承托，避免晶托200相对于料框10滑动以及防止晶托200继续下移导致压碎硅片300。在其他实施例中，第一夹紧件211的具体结构不局限于以上所述，依据晶托200的结构可进行适用性的调整。
参阅图1-图5，支撑组件20还包括第二限位组件23，每组第二限位组件23包括下限位块232、上限位块231，每块第一夹紧件211对应匹配一组第二限位组件23。其中，沿料框10的高度方向，下限位块232位于对应的第一夹紧件211的下方。第一夹紧件211转动至与下限位块232抵靠时，下限位块232能够阻挡以及限制第一夹紧件211继续向料框10底部转动，如此，下限位块232以及第一夹紧件211对晶托200起到支撑作用，防止晶托200下移。上限位块231设置在对应的第一夹紧件211上方，且上限位块231与支撑轴22连接；第一夹紧件211转动至与上限位块231抵靠时，上限位块231限制第一夹紧件211继续转动。
请继续参阅图3，支撑组件20还包括弹性复位件24，弹性复位件24一端与支撑轴22连接，一端与第一夹紧件211连接；弹性复位件24始终牵拉第一夹紧件211，以使第一夹紧件211与相对侧的另一第一夹紧件211相背转动。料槽13内未放置晶托200时，弹性复位件24牵拉第一夹紧组件21处于释放状态。换言之，弹性复位件24始终牵拉第一夹紧件211与上限位块231抵靠，此时第一夹紧组件21位于释放状态；当放置晶托200时，第一夹紧件211位于对应两侧卡槽201的槽口处，晶托200缓缓下移装载进料框10，对应的第一夹紧件211被槽壁下压，从而第一夹紧件211克服弹性复位件24的弹力，并与相对一侧的第一夹紧件211相向转动，直至第一夹紧件211与下限位块232抵靠，完成晶托200的夹紧；当从料框10内取出晶托200后，晶托200对第一夹紧件211施加的压力消失，从而第一夹紧件211受弹性复位件24的弹性回复力而回复至初始未夹紧的状态，实现第一夹紧组件21的自动复位，以便于进行下一轮的晶托200夹紧以及承载。如此设置，通过弹性复位件24的弹力以及晶托200下压过程中重力，实现第一夹紧组件21的自动夹紧以及自动复位，无需设置驱动电 机等动力设备，简化硅片周转机构100的结构，并节省动力源，从而降低结构成本以及设备能耗。
其中，弹性复位件24采用扭簧，当然在其他实施例中，弹性复位件24也可以为其他的弹性结构。
当然，在其他实施例中，实现第一夹紧组件21夹紧以及复位的结构不局限于以上所述，例如在本申请提供的另一个实施例中，参阅图6和图7，支撑组件20还包括第二驱动组件26，第二驱动组件26包括两道滑轨261和驱动单元262；两道滑轨261分别设置于料框10的两端，每组第一夹紧组件21中的两个第一夹紧件211安装于同一道滑轨261上；驱动单元262用于驱动两个第一夹紧件211沿着滑轨261滑动。当驱动单元262驱动两个第一夹紧件211相向滑动，从而夹紧位于两个第一夹紧件211之间的晶托200；当驱动单元262驱动两个第一夹紧件211相背滑动，从而释放晶托200。其中，驱动单元262为电机等驱动设备，此处不做限制。
可选的，驱动单元262可以是驱动电机、气缸等，也可以是其他驱动结构。
请继续参阅图6，支撑组件20还包括第三限位组件25，每组第三限位组件25包括两块内限位块252和两块外限位块251；每道滑轨261对应配备一组第三限位组件25；其中，两块外限位块251分别位于滑轨261的两端，两块内限位块252位于两块外限位块251之间，且第一夹紧件211位于相邻的外限位块251和内限位块252之间。通过外限位块251限制两个第一夹紧件211之间的最远距离，防止第一夹紧件211脱离滑轨261；且通过内限位块252限制两个第一夹紧件211之间的最近距离，防止两个第一夹紧件211过度夹紧晶托200。
在本申请的一个实施例中，参阅图1、图2以及图4，第二夹紧组件30还包括安装轴，沿第一转轴31的轴向，安装轴安装于第一转轴31上，第二夹紧件32套设在安装轴上，且第二夹紧件32能够相对于安装轴转动；驱动第一转轴31转动时，第一转轴31带动支撑轴22以及第二夹紧件32相向靠近或相背远离。晶托200装载完成时，此时两个第二夹紧件32夹紧未与晶托200分离的硅片300，接着将硅片周转机构100将料框10内的晶托单元500搬运传送至脱胶机构中进行脱胶。完成脱胶后，硅片300与晶托200分离。由于第二夹紧件32能够相对于安装轴转动，硅片300脱离晶托200后，受硅片300的自重和硅片300与第二夹紧件32之间摩擦力的作用，实现了驱动第二夹紧件32相对于安装轴转动，以使得硅片300缓慢下移至与料槽13的槽底抵靠。在硅片300下落过程中，第二夹紧件32始终夹紧硅片300，从而在实现硅片300下落的同时，还能防止硅片300倾倒，有效防止硅片300之间相互碰撞而损坏。
具体的，在其中一个实施例中，第二夹紧件32采用海绵辊，海绵辊具备一定柔软度，防 止划伤硅片300；且海绵辊具有良好的耐腐蚀性能，从而硅片周转机构100可连同晶托单元500共同浸泡于脱胶槽内。
参阅图2和图4，硅片周转机构100还包括第一驱动组件40和两组连杆组件50，连杆组件50一端与第一驱动组件40连接，另一端与位于料槽13同侧的第一转轴31连接，第一驱动组件40移动，带动两组连杆组件50移动，以同时驱动每组夹紧组件中的两根第一转轴31相向转动或相背转动。
请继续参阅图4，在本申请的一个实施例中，连杆组件50包括第一连杆51、第二连杆52以及第三连杆53：其中，第一连杆51一端与第一转轴31铰接；每根第一转轴31对应配备一根第一连杆51；第一连杆51的另一端与第二连杆52转动连接；同时第三连杆53的一端与第二连杆52连接转动连接，第三连杆53的另一端与第一驱动组件40连接。第一驱动组件40驱动第三连杆53转动，对应的第三连杆53带动第二连杆52运动，接着第二连杆52驱动第一连杆51运动，第二连杆52对应的驱动第一转轴31转动，从而实现两根相对设置的第一转轴31相向转动或相背转动，实现硅片的夹紧或释放。在其他实施例中，连杆组件50的具体结构不局限于以上所述。
可选的，第二夹紧组件30设置的组数不局限于一组，也可以设置多组，例如设置两组第二夹紧组件30，位于同侧的两根第一转轴31分别与对应的第一连杆51铰接，两根第一连杆51与同一根第二连杆52连接，从而连杆组件50能够同时带动两根第一转轴31同时转动，实现多组第二夹紧组件30同时夹紧，简化连杆组件50的结构。当然在其他实施例中，多组第二夹紧组件30也可以分别驱动，此处不做限制。
请继续参阅图4，第二连杆52为曲杆，从而在第二连杆52转动时，能够避让第一连杆51以及第一转轴31的端部，防止第一连杆51以及第一转轴31阻碍第二连杆52转动。
进一步，参阅图4，在本实施例中，第一驱动组件40包括滑槽41、滑块42；滑槽41沿着料框10的高度方向延伸设置；滑块42安装于滑槽41内，且能够相对于滑槽41滑动；第三连杆53与滑块42连接；滑块42沿料框10的高度方向移动，以带动第二夹紧组件30夹紧或释放硅片。
具体的，在本实施例中，参阅图1-图4，滑块42沿料框10的高度方向朝向料框10底部移动，第二夹紧组件30中的两个第二夹紧件32相背运动，第二夹紧件32处于释放状态；当滑块42沿料框10的高度方向背向料框10底部移动，第二夹紧组件30中的两个第二夹紧件32相向运动，第二夹紧件32处于夹紧状态。当然在其他实施例中，第二夹紧组件30的状态与滑块42的运动方向的关系不局限于以上所述，例如滑块42朝向料框10底部移动，第二夹紧组件30处于夹紧状态。
可选的，请继续参阅图4，第一驱动组件还包括弹性件43，弹性件43一端与滑块42连接，另一端与料框10底部连接。下压滑块42，使滑块42朝向料框10底部运动，进而使第二夹紧组件30处于释放状态，待装载晶托200时，撤销对滑块42施加的外力，此时弹性件43弹性形变复位，以驱动滑块42背离料框10底部移动，从而滑块42带动第二夹紧组件30自动锁紧硅片。通过设置弹性件43，使得在未对滑块42施加外力时，第二夹紧组件30始终处于夹紧状态，确保在脱胶以及搬运硅片周转机构100的过程中，第二夹紧组件30始终夹紧硅片，防止硅片倾倒；同时降低硅片周转机构100的能耗。
参阅图4，第一驱动组件40还包括第一限位组件44，第一限位组件44包括两块第一限位块441，两块第一限位块441分别位于滑槽41的两侧；滑块42运动至滑块42与第一限位块441抵靠，第一限位块441限制滑块42沿料框10高度方向上的位移。通过设置第一限位组件44，防止第二夹紧组件30对硅片过度夹紧，降低硅片的损坏率。
综上所述，参阅图1-图8，简述硅片周转机构100应用的步骤：
首先，未装载晶托单元500时，第一夹紧组件21以及第二夹紧组件30处于释放状态。接着，将晶托200沿料框10的高度方向缓慢下移，以使得第一夹紧件211逐步伸入晶托200侧边的卡槽201内，此时，每组第一夹紧组件21中的两个相对的第一夹紧件211相向移动并靠近夹紧晶托200，待第一夹紧件211与下限位块232或内限位块252抵靠时，完成晶托200的夹紧；同时每组第二夹紧组件30中的两个相对的第二夹紧件32相向移动并靠近晶托200上未分离的硅片，直至第二夹紧件32与第一限位块441抵靠，完成硅片300的夹紧。将硅片周转机构100中料框10内的晶托单元500输送至脱胶机内。完成脱胶后，晶托200与硅片300分离，此时可将晶托200或将晶托200连同上层料框11取出，余下脱胶后的硅片300连同下层料框12共同搬运至硅片输送分散机构400的容置区403内，此时传送承托组件401伸进第二通槽17内，将硅片300撑起，使硅片300底部与料槽13底部脱离；同时位于料槽13两侧的两个传送夹紧件4021伸进第一通槽16内，并相向靠近夹紧料槽13内的硅片，此时硅片周转机构100中的第一驱动组件40驱动第二夹紧件32释放硅片300，硅片周转机构100对硅片300失去夹持作用以及支撑作用；接着，硅片输送分散机构400启动，传送承托组件401以及传送夹紧组件402循环滚动，带动位于料槽13内的硅片300从出料口14输送至插片机处进行插片分片，完成硅片300的输送过程。在硅片加工的流程中，采用本申请提供的硅片周转机构100，有效实现硅片的夹紧，防止硅片倾倒，并且该硅片周转机构100能够与脱胶机以及插片机配合使用，从而在硅片加工流程中，硅片始终通过料框10承载、夹紧以及转运，省略弹夹，且无需多次周转硅片，明显降低了硅片破损率。
此外，需要说明的是，使用“第一”、“第二”等词语来限定零部件，仅仅是为了便于对 相应零部件进行区别，如没有另行声明，上述词语并没有特殊含义，因此不能理解为对本申请保护范围的限制。
以上实施方式的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施方式中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
本技术领域的普通技术人员应当认识到，以上的实施方式仅是用来说明本申请，而并非用作为对本申请的限定，只要在本申请的实质精神范围内，对以上实施方式所作的适当改变和变化都落在本申请要求保护的范围内。

Claims (10)

  1. 一种硅片周转机构，用于周转晶托单元，所述晶托单元包括晶托及与所述晶托待分离的硅片；其特征在于，所述硅片周转机构包括：
    料框，具有料槽，所述料槽可容置晶托单元；
    支撑组件，包括至少一组第一夹紧组件，每组所述第一夹紧组件包括两个第一夹紧件，两个所述第一夹紧件设置在料框上，且两个所述第一夹紧件之间构成一个可调节的夹持空间；所述晶托位于所述夹持空间内，以夹持或释放所述晶托两个；
    第二夹紧组件，设于所述料槽内；且沿所述料框的高度方向，所述第二夹紧组件相对位于所述支撑组件的下方；所述第二夹紧组件包括：
    第一转轴，所述第一转轴设置有两根，且两根所述第一转轴相对设置；两根所述第一转轴与所述料框转动连接；两个
    第二夹紧件，所述第二夹紧件为柔性件，所述夹紧件设置有两个，且两个第二夹紧件之间相对设置；
    其中，两个所述第二夹紧件分别对应的设于两根所述第一转轴上；每件所述第二夹紧件能够随着对应的所述第一转轴转动，以使两个相对设置的所述第二夹紧件相向运动，并夹持位于所述晶托上且待分离的所述硅片。
  2. 根据权利要求1所述的硅片周转机构，其中，所述料框包括分体式的上层料框和下层料框；所述支撑组件设置于所述上层料框上，所述第二夹紧组件设置于所述下层料框上。
  3. 根据权利要求1所述的硅片周转机构，其中，所述第二夹紧组件还包括安装轴，沿所述第一转轴的轴向，所述安装轴安装于所述第一转轴上，所述第二夹紧件套设在所述安装轴上，且所述第二夹紧件能够相对于所述安装轴转动；当所述第一转轴转动时，所述第一转轴带动所述安装轴以及所述第二夹紧件相向靠近。
  4. 根据权利要求1所述的硅片周转机构，其中，所述硅片周转机构还包括第一驱动组件和两组连杆组件，所述连杆组件一端与所述第一驱动组件连接，另一端与位于所述料槽同侧的所述第一转轴连接，所述第一驱动组件移动，带动两组所述连杆组件移动，以同时驱动每组夹紧组件中的两根所述第一转轴相向转动或相背转动。
  5. 根据权利要求4所述的硅片周转机构，其中，所述连杆组件包括：
    第一连杆，其一端与所述第一转轴铰接；每根所述第一转轴对应配备一根所述第一连杆；
    第二连杆，所述第一连杆的另一端与所述第二连杆转动连接；以及
    第三连杆，其一端与所述第二连杆连接转动连接，所述第三连杆的另一端与所述第一 驱动组件连接。
  6. 根据权利要求5所述的硅片周转机构，其中，所述第一驱动组件包括滑槽、滑块；所述滑槽沿着所述料框的高度方向延伸设置；所述滑块安装于所述滑槽内，且能够相对于所述滑槽滑动；所述第三连杆与所述滑块连接；
    所述滑块沿所述料框的高度方向移动，以带动所述第二夹紧组件夹紧或释放硅片。
  7. 根据权利要求6所述的硅片周转机构，其中，所述第一驱动组件还包括第一限位组件，所述第一限位组件包括两块第一限位块，两块所述第一限位块分别位于所述滑槽的两侧；所述滑块运动至所述滑块与所述第一限位块抵靠，所述第一限位块限制所述滑块沿所述料框高度方向上的位移。
  8. 根据权利要求1所述的硅片周转机构，其中，所述支撑组件还包括两根支撑轴，所述支撑轴的两端分别与所述料框的两端连接，且两根所述支撑轴分别位于所述料槽相对的两侧，所述第一夹紧件转动的安装于对应的所述支撑轴上。
  9. 根据权利要求8所述的硅片周转机构，其中，所述支撑组件还包括第二限位组件，每组所述第二限位组件包括下限位块、上限位块，每块所述第一夹紧件对应匹配一组所述第二限位组件；
    其中，沿所述料框的高度方向，所述下限位块位于对应的所述第一夹紧件的下方；所述第一夹紧件转动至与所述下限位块抵靠时，所述下限位块限制所述第一夹紧件转动；
    所述上限位块设置在对应的所述第一夹紧件上方，且所述上限位块与所述支撑轴连接；所述第一夹紧件转动至与所述上限位块抵靠时，所述上限位块限制所述第一夹紧件转动。
  10. 根据权利要求1所述的硅片周转机构，其中，所述支撑组件还包括第二驱动组件，所述第二驱动组件包括两道滑轨和驱动单元；两道所述滑轨分别设置于所述料框的两端，每组所述第一夹紧组件中的两个所述第一夹紧件安装于同一道所述滑轨上；所述驱动单元用于驱动两个所述第一夹紧件沿着所述滑轨滑动。
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