WO2018021051A1 - Film de renforcement recouvert d'un séparateur - Google Patents

Film de renforcement recouvert d'un séparateur Download PDF

Info

Publication number
WO2018021051A1
WO2018021051A1 PCT/JP2017/025599 JP2017025599W WO2018021051A1 WO 2018021051 A1 WO2018021051 A1 WO 2018021051A1 JP 2017025599 W JP2017025599 W JP 2017025599W WO 2018021051 A1 WO2018021051 A1 WO 2018021051A1
Authority
WO
WIPO (PCT)
Prior art keywords
separator
acid
reinforcing film
layer
weight
Prior art date
Application number
PCT/JP2017/025599
Other languages
English (en)
Japanese (ja)
Inventor
浩司 設樂
創矢 徐
翔悟 佐々木
Original Assignee
日東電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日東電工株式会社 filed Critical 日東電工株式会社
Priority to CN201780043477.XA priority Critical patent/CN109476960A/zh
Priority to KR1020187028802A priority patent/KR102345171B1/ko
Priority to JP2018529770A priority patent/JP6888010B2/ja
Publication of WO2018021051A1 publication Critical patent/WO2018021051A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to a reinforcing film with a separator.
  • a reinforcing film with a separator may be bonded in advance to the exposed surface side of the optical member or the electronic member in some cases (Patent Literature). 1).
  • An object of the present invention is a reinforcing film with a separator having a reinforcing film and a separator, which can suppress peeling electrification that may occur when the separator is peeled off, and is applied in advance to the exposed surface side of an optical member or an electronic member.
  • An object of the present invention is to provide a reinforcing film with a separator that can reduce damage to the optical member and the electronic member even when the separator is peeled off from the combined reinforcing film with a separator.
  • the reinforcing film with a separator of the present invention is A reinforcing film with a separator having a reinforcing film P and a separator Q,
  • the reinforcing film P includes a base layer A1 and an adhesive layer A2,
  • a conductive layer C1 and / or an antistatic layer C2 is disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2,
  • the pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
  • the conductive layer C1 has a surface resistance value of 1.0 ⁇ 10 10 ⁇ / ⁇ or less.
  • the antistatic layer C2 has a surface resistance value of 1.0 ⁇ 10 10 ⁇ / ⁇ or less.
  • the surface peeling voltage is 10.0 kV or less.
  • the transmittance of the reinforcing film P is 70% or more.
  • the initial adhesive strength of the layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is 1.0 N / 25 mm or more.
  • the peeling force is 0.30 N / 25 mm or less.
  • a reinforcing film with a separator having a reinforcing film and a separator can suppress peeling electrification that may occur when the separator is peeled off, and is attached in advance to an exposed surface side of an optical member or an electronic member. Even if a separator is peeled from the combined reinforcing film with a separator, a reinforcing film with a separator that can reduce damage to the optical member and the electronic member can be provided.
  • weight which is conventionally commonly used as a unit of weight
  • weight which is commonly used as an SI system unit indicating weight
  • (meth) acryl means “acryl and / or methacryl”
  • the expression “(meth) acrylate” means “acrylate and / or methacrylate”.
  • “(meth) acrolein” means “acrolein and / or methacrole”. It means "rain”.
  • the reinforcing film with a separator of the present invention is a reinforcing film with a separator having a reinforcing film P and a separator Q.
  • the reinforcing film with a separator of the present invention may have any other appropriate layer as long as the effects of the present invention are not impaired.
  • the reinforcing film P includes a base material layer A1 and an adhesive layer A2, and the conductive layer C1 and / or the antistatic layer C2 is provided between the base material layer A1 and the adhesive layer A2. Is arranged, and the pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
  • the thickness of the reinforcing film with a separator of the present invention any appropriate thickness can be adopted depending on the purpose as long as the effects of the present invention are not impaired.
  • the thickness is preferably 9 ⁇ m to 1300 ⁇ m, more preferably 20 ⁇ m to 1050 ⁇ m, still more preferably 35 ⁇ m to 900 ⁇ m, and particularly preferably 45 ⁇ m to 750 ⁇ m.
  • the thickness of the reinforcing film P any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 5 ⁇ m to 800 ⁇ m, more preferably 10 ⁇ m to 650 ⁇ m, still more preferably 20 ⁇ m to 550 ⁇ m, and particularly preferably 25 ⁇ m to 450 ⁇ m.
  • the reinforcing film P includes a base material layer A1 and an adhesive layer A2, and a conductive layer C1 and / or an antistatic layer C2 are disposed between the base material layer A1 and the adhesive layer A2.
  • the reinforcing film P can include any appropriate other layer depending on the purpose within a range not impairing the effects of the present invention.
  • one embodiment of the reinforcing film P includes a base layer A1, a conductive layer C1, and an adhesive layer A2.
  • Another embodiment of the reinforcing film P is composed of a base layer A1, an antistatic layer C2, and an adhesive layer A2, as shown in FIG.
  • the reinforcing film P may have the antistatic layer A3 on the side opposite to the adhesive layer A2 of the base material layer A1.
  • the reinforcing film with a separator of the present invention does not have the antistatic layer A3, but the conductive layer C1 and / or the antistatic layer C2 are disposed between the base layer A1 and the adhesive layer A2. Therefore, the effect of the present invention can be fully expressed.
  • Base material layer A1 As base material layer A1, the base material formed from arbitrary appropriate materials can be employ
  • the resin constituting the resin sheet examples include acrylic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethyl methacrylate (PMMA), polycarbonate, and triacetyl cellulose (TAC).
  • acrylic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethyl methacrylate (PMMA), polycarbonate, and triacetyl cellulose (TAC).
  • non-woven fabric examples include a non-woven fabric made of natural fibers having heat resistance such as a non-woven fabric containing Manila hemp; a synthetic resin non-woven fabric such as a polypropylene resin non-woven fabric, a polyethylene resin non-woven fabric and an ester resin non-woven fabric.
  • the base material layer A1 may be only one layer or two or more layers.
  • any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
  • the base material layer A1 may contain an antistatic agent.
  • base material layer A1 containing an antistatic agent the resin sheet in which the antistatic agent was kneaded can be used, for example.
  • Such a resin sheet can be formed from the composition for forming base material layer A1 containing a resin and an antistatic agent.
  • the base material layer A1 itself may act as an antistatic agent.
  • the base material layer A1 itself can act as an antistatic agent.
  • the base material layer A1 may be subjected to a surface treatment.
  • the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric exposure, ionizing radiation treatment, and coating treatment with a primer.
  • the organic coating material examples include materials described in Plastic Hard Coat Material II (CMC Publishing, (2004)).
  • a urethane type polymer is mentioned, More preferably, polyacryl urethane, polyester urethane, or these precursors are mentioned. This is because coating and application to the base material layer A1 are simple, and various types can be selected industrially and obtained at low cost.
  • urethane-based polymers include polymers composed of a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound).
  • the organic coating material may contain a chain extender such as polyamine, an anti-aging agent, an oxidation stabilizer and the like as optional additives.
  • the base material layer A1 may contain any appropriate other additive depending on the purpose as long as the effects of the present invention are not impaired.
  • ⁇ Adhesive layer A2> As thickness of adhesive layer A2, arbitrary appropriate thickness can be employ
  • the thickness is preferably 1 ⁇ m to 300 ⁇ m, more preferably 2 ⁇ m to 250 ⁇ m, still more preferably 4 ⁇ m to 200 ⁇ m, and particularly preferably 5 ⁇ m to 150 ⁇ m.
  • the pressure-sensitive adhesive layer A2 may be a single layer or two or more layers.
  • Adhesive layer A2 is formed from the adhesive composition a2.
  • the pressure-sensitive adhesive layer A2 can be formed by any appropriate method as long as the pressure-sensitive adhesive composition a2 can be formed into a layer.
  • the pressure-sensitive adhesive layer A2 can be formed by applying the pressure-sensitive adhesive composition a2 on any appropriate base material and performing heating or irradiation with active energy rays (such as ultraviolet rays) as necessary. I can do it.
  • the pressure-sensitive adhesive composition a2 preferably contains an acrylic polymer.
  • an acrylic polymer is preferably a (meth) acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms (sometimes referred to as “(meth) acrylic acid C4-C12 alkyl ester”). It is an acrylic polymer obtained by polymerizing a monomer component containing 1 to 10 parts by weight as a component and a carboxyl group-containing monomer as a monomer component with respect to 100 parts by weight of the total amount of monomer components.
  • the content of the acrylic polymer in the pressure-sensitive adhesive composition a2 is preferably 50% by weight or more, more preferably 50% to 99.99% by weight, more preferably 55% by weight, in terms of solid content. ⁇ 99% by weight, particularly preferably 60% by weight to 95% by weight, and most preferably 70% by weight to 90% by weight.
  • the (meth) acrylic acid C4-C12 alkyl ester is a (meth) acrylic acid alkyl ester (acrylic acid alkyl ester, methacrylic acid alkyl ester) in which the alkyl group has 4 to 12 carbon atoms.
  • Any suitable (meth) acrylic acid C4-C12 alkyl ester may be employed depending on the purpose.
  • Examples of such (meth) acrylic acid C4-C12 alkyl esters include n-butyl (meth) acrylate, isobutyl (meth) acrylate, s-butyl (meth) acrylate, and t- (meth) acrylic acid.
  • the (meth) acrylic acid C4-C12 alkyl ester as the main component of the monomer component may be one kind or two or more kinds.
  • the content ratio of the (meth) acrylic acid C4-C12 alkyl ester in the total amount of the monomer components is preferably 50% to 99% by weight, more preferably 80% to 98% by weight, and still more preferably 90% by weight. % To 97% by weight. If the content ratio of the (meth) acrylic acid C4-C12 alkyl ester is within the above range, the effects of the present invention can be more manifested.
  • the monomer component includes a carboxyl group-containing monomer.
  • carboxyl group-containing monomers include (meth) acrylic acid (acrylic acid, methacrylic acid), itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like.
  • acid anhydrides of these carboxyl group-containing monomers for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride
  • acrylic acid is preferable.
  • the content of the carboxyl group-containing monomer in the total amount of the monomer components is preferably 1% by weight to 10% by weight, more preferably 3% by weight to 10% by weight, and further preferably 3% by weight to 5% by weight. is there. If the content ratio of the carboxyl group-containing monomer in the total amount of the monomer components is within the above range, the effect of the present invention can be more manifested.
  • the monomer component used to obtain the acrylic polymer by polymerization is a monomer (copolymerizable monomer) that can be copolymerized with a (meth) acrylic acid C4-C12 alkyl ester or a carboxyl group-containing monomer, if necessary. May be included.
  • the content of such a copolymerizable monomer is preferably less than 50% by weight with respect to the total amount of monomer components.
  • the content ratio of such a copolymerizable monomer is such a content ratio that the glass transition temperature of the obtained acrylic polymer is more preferably ⁇ 20 ° C. or less in order to develop good adhesiveness.
  • the content ratio is preferably -70 ° C to -35 ° C.
  • Examples of the copolymerizable monomer include (meth) acrylic acid C1-C3 alkyl esters such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and isopropyl (meth) acrylate; (Meth) acrylic acid tridecyl, (meth) acrylic acid tetradecyl, (meth) acrylic acid pentadecyl, (meth) acrylic acid hexadecyl, (meth) acrylic acid heptadecyl, (meth) acrylic acid octadecyl, (meth) acrylic acid nonadecyl, (meta ) (Meth) acrylic acid C13-C20 alkyl esters such as eicosyl acrylate; non-aromatic rings such as (meth) acrylic acid cycloalkyl esters (such as cyclohexyl (meth) acrylate) and isoborny
  • copolymerizable monomers examples include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol.
  • copolymerizable monomers include nitrogen atom-containing monomers (for example, (meth) acrylates such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate).
  • nitrogen atom-containing monomers for example, (meth) acrylates such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate).
  • Aminoalkyl acrylate monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide; acrylonitrile, Cyanoacrylate monomers such as methacrylonitrile; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate).
  • amide monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide
  • Cyanoacrylate monomers such as methacrylonitrile
  • isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate.
  • nitrogen atom-containing monomer can cause yellowing of the pressure-sensitive adhesive under heating, it is preferable not to use it when it is not necessary to use it.
  • the acrylic polymer can be prepared by any appropriate polymerization method as long as the effects of the present invention are not impaired.
  • Examples of the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by ultraviolet irradiation, and the like, and a solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. .
  • any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
  • the amount used is preferably 0.01% by weight to 1% by weight with respect to the total amount of monomer components.
  • any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
  • the amount used is preferably 0.01% by weight to 15% by weight with respect to the total amount of monomer components.
  • solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl Organic solvents such as cycloaliphatic hydrocarbons such as cyclohexane; ketones such as methyl ethyl ketone and methyl isobutyl ketone; One type of solvent may be sufficient and 2 or more types may be sufficient as it.
  • the acrylic polymer has a weight average molecular weight of preferably 500,000 to 900,000, more preferably 550,000 to 850,000, and still more preferably 600,000 to 800,000. If the weight average molecular weight of the acrylic polymer is within the above range, the effects of the present invention can be more manifested.
  • the weight average molecular weight of the acrylic polymer can be controlled by the type of the polymerization initiator and the chain transfer agent, the amount used, the temperature and time during the polymerization, the monomer concentration, the monomer dropping rate, and the like.
  • the pressure-sensitive adhesive composition a2 may contain an oligomer component.
  • the oligomer component is preferably an ethylenically unsaturated monomer having a glass transition temperature of 60 ° C. to 190 ° C. when a homopolymer is formed and having a cyclic structure (“Tg of 60 ° C. to 190 ° C.
  • Tg glass transition temperature of 60 ° C. to 190 ° C.
  • oligomer component examples include an oligomer component obtained by polymerizing an ethylenically unsaturated monomer having a glass transition temperature of 60 ° C. or higher when a homopolymer is formed and having a cyclic structure.
  • the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. has a glass transition temperature (Tg) of 60 ° C. to 190 ° C. when forming a homopolymer
  • Tg glass transition temperature
  • Any ethylenically unsaturated monomer having a cyclic structure can employ any appropriate monomer component as long as the effects of the present invention are not impaired.
  • the ring in such a ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be either an aromatic ring or a non-aromatic ring. preferable.
  • aromatic ring examples include an aromatic hydrocarbon ring (for example, a benzene ring, a condensed carbocycle in naphthalene, etc.), various aromatic heterocycles, and the like.
  • Non-aromatic rings include non-aromatic alicyclic rings (cycloalkane rings such as cyclopentane ring, cyclohexane ring, cycloheptane ring and cyclooctane ring; cycloalkene rings such as cyclohexene ring), non-aromatic Bridged ring (eg, bicyclic hydrocarbon ring in pinane, pinene, bornane, norbornane, norbornene, etc .; tricyclic hydrocarbon ring in adamantane, etc .; tetracyclic hydrocarbon ring; etc. Etc.).
  • Examples of ring-containing ethylenically unsaturated monomers having a Tg of 60 ° C. to 190 ° C. include non-aromatics such as (meth) acrylic acid cycloalkyl esters such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate.
  • Aromatic ring-containing (meth) acrylic acid esters such as (meth) acrylic acid phenyl; (meth) acrylic acid aryloxyalkyl esters such as (meth) acrylic acid phenoxyethyl; Ethylene having a cyclic structure in the molecule, such as aromatic ring-containing (meth) acrylic acid esters such as (meth) acrylic acid arylalkyl esters such as benzyl acrylate; styrene monomers such as styrene and ⁇ -methylstyrene; Glass transition temperature when homopolymers are formed 0 °C may appropriately selected and to be ⁇ 190 ° C..
  • the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. preferably includes a (meth) acrylic acid ester having a non-aromatic ring such as cyclohexyl methacrylate and isobornyl (meth) acrylate. From the viewpoint of transparency, more preferred is cyclohexyl methacrylate.
  • the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be only one type or two or more types.
  • the content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is preferably 50% by weight or more, more preferably 80% by weight to 99% by weight, based on the total amount of the monomer components. More preferably, it is 90 to 97% by weight. If the content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is within the above range, the effect of the present invention can be further exhibited.
  • the oligomer component may contain a carboxyl group-containing monomer as a monomer component.
  • a carboxyl group-containing monomer examples include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid and the like, similarly to the carboxyl group-containing monomer that can constitute the acrylic polymer.
  • acid anhydrides of these carboxyl group-containing monomers for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride
  • acrylic acid is preferable.
  • the content ratio of the carboxyl group-containing monomer that can constitute the oligomer component is preferably 1 to 10 parts by weight, preferably 3 to 10 parts by weight, with respect to 100 parts by weight of the total amount of the monomer components.
  • the amount is preferably 3 to 5 parts by weight. If the content ratio of the carboxyl group-containing monomer is within the above range, the effects of the present invention can be further exhibited.
  • the monomer component that can constitute the oligomer component is a monomer that can be copolymerized with a ring-containing ethylenically unsaturated monomer or carboxyl group-containing monomer having a Tg of 60 to 190 ° C. Monomer).
  • the content of such a copolymerizable monomer is preferably less than 50% by weight with respect to 100 parts by weight of the total amount of monomer components.
  • the content ratio of such a copolymerizable monomer is such that the glass transition temperature of the oligomer component can be preferably 60 ° C. or higher, more preferably 65 ° C. to 180 ° C., in that good adhesiveness can be exhibited. It is preferable that it is such a content rate.
  • the same copolymerizable monomer as described above that may be included in the monomer component used for obtaining the acrylic polymer by polymerization may be employed.
  • 1 type may be sufficient as a copolymerizable monomer and 2 or more types may be sufficient as it.
  • the oligomer component can be prepared by any appropriate polymerization method as long as the effects of the present invention are not impaired.
  • the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by ultraviolet irradiation, and the like, and a solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. .
  • any appropriate one can be adopted as long as the effects of the present invention are not impaired.
  • the amount of the polymerization initiator used any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
  • the amount used is preferably, for example, 0.1 to 15% by weight based on the total amount of monomer components.
  • any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
  • the amount used is preferably 0.01% by weight to 15% by weight with respect to the total amount of monomer components.
  • solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl Organic solvents such as cycloaliphatic hydrocarbons such as cyclohexane; ketones such as methyl ethyl ketone and methyl isobutyl ketone; One type of solvent may be sufficient and 2 or more types may be sufficient as it.
  • the oligomer component has a weight average molecular weight of preferably 3000 to 6000, more preferably 3300 to 5500, and further preferably 3500 to 5000. If the weight average molecular weight of the oligomer component is within the above range, the effect of the present invention can be more manifested.
  • the weight average molecular weight of the oligomer component can be controlled by the type and amount of polymerization initiator and chain transfer agent, temperature and time during polymerization, monomer concentration, monomer dropping rate, and the like.
  • the pressure-sensitive adhesive composition a2 preferably contains the acrylic polymer and the oligomer component.
  • the pressure-sensitive adhesive composition a2 contains an acrylic polymer and an oligomer component, excellent transparency can be expressed, and it is difficult to lift and peel off at the adhesive interface. Can be expressed).
  • the ratio of the acrylic polymer to the oligomer component is preferably 10 parts by weight with respect to 100 parts by weight of the acrylic polymer. 35 parts by weight, more preferably 15 parts by weight to 30 parts by weight.
  • the effect of the present invention can be further exhibited if the ratio of the acrylic polymer and the oligomer component is within the above range.
  • the pressure-sensitive adhesive composition a2 includes a crosslinking agent, a silane coupling agent, a solvent, an ultraviolet absorber, an antioxidant, a light stabilizer, an anti-aging agent, and a tackifier, as necessary.
  • Known additives may be included. These additives may be only one kind or two or more kinds.
  • any appropriate ionic liquid can be adopted as long as the effects of the present invention are not impaired.
  • Examples of such an ionic liquid include ionic liquids described in JP-A-2016-108442.
  • any appropriate ion conductive polymer can be adopted as long as the effects of the present invention are not impaired.
  • examples of such an ion conductive polymer include an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium base), such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymer. Conductive polymer; and the like. Only one type of ion conductive polymer may be used, or two or more types may be used.
  • any appropriate ion conductive filler can be adopted as long as the effects of the present invention are not impaired.
  • examples of such ion conductive filler include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , Cobalt, copper iodide, ITO (indium oxide / tin oxide), ATO (antimony oxide / tin oxide), and the like. Only one type of ion conductive filler may be used, or two or more types may be used.
  • any appropriate electrically conductive polymer can be adopted as long as the effects of the present invention are not impaired.
  • Examples of such an electrically conductive polymer include (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid).
  • the pressure-sensitive adhesive composition a2 contains a crosslinking agent among the above-mentioned additives.
  • a crosslinking agent to crosslink the acrylic polymer or oligomer component, the cohesive force as an adhesive can be further increased.
  • One type of crosslinking agent may be sufficient and 2 or more types may be sufficient as it.
  • crosslinking agents isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents Agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents and the like. Of these, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable.
  • the content of the isocyanate-based crosslinking agent can be set to any appropriate amount depending on the desired adhesive strength, and is preferably 0.01 to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. More preferred is 0.01 to 10 parts by weight, still more preferred is 0.03 to 5 parts by weight.
  • the content of the epoxy crosslinking agent can be set to any appropriate amount depending on the desired adhesive strength, and is preferably 0.01 to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. More preferred is 0.01 to 10 parts by weight, still more preferred is 0.03 to 5 parts by weight.
  • the pressure-sensitive adhesive composition a2 can be prepared, for example, by mixing an acrylic polymer, an oligomer component as necessary, and other additives such as a crosslinking agent as necessary.
  • the pressure-sensitive adhesive composition a2 is applied on any appropriate base material (for example, a PET base material), and is heated and dried to form the pressure-sensitive adhesive layer A2.
  • the pressure-sensitive adhesive composition a2 is applied on the base material layer A1, and heated and dried to form the pressure-sensitive adhesive layer A2.
  • any appropriate coating method can be used.
  • a coating using a conventional coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater.
  • a conventional coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater. Law.
  • the conductive layer C1 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
  • the conductive layer C1 may be only one layer or two or more layers.
  • the conductive layer C1 can be provided by being formed on any appropriate base material.
  • a base material is preferably a base material layer A1.
  • the conductive layer C1 may be formed by any appropriate thin film formation method such as a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof.
  • a conductive film is formed over a suitable base material (preferably, base material layer A1).
  • the vacuum deposition method and the sputtering method are preferable from the viewpoint of the formation rate of the conductive film, the formability of the large area film, and the productivity.
  • a material for forming the conductive film for example, a metal-based material made of gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys thereof, indium oxide, Metal oxide materials composed of tin oxide, titanium oxide, cadmium oxide, mixtures thereof, and the like; other metal compounds composed of copper iodide and the like are used.
  • any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • Such thickness is, for example, preferably 30 to 600 mm when formed from a metal-based material, and preferably 80 to 5000 mm when formed from a metal oxide-based material.
  • the surface resistance value of the conductive layer C1 is preferably 1.0 ⁇ 10 10 ⁇ / ⁇ or less, more preferably 1.0 ⁇ 10 9 ⁇ / ⁇ or less, and further preferably 1.0 ⁇ 10 8 ⁇ . / ⁇ or less, particularly preferably 1.0 ⁇ 10 7 ⁇ / ⁇ or less.
  • the surface of the substrate is subjected to corona discharge treatment, ultraviolet irradiation treatment, Arbitrary appropriate pretreatments such as plasma treatment, sputter etching treatment, and undercoat treatment can be applied to improve the adhesion between the conductive film and the substrate (preferably, the substrate layer A1).
  • the antistatic layer C2 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
  • the antistatic layer C2 may be a single layer or two or more layers.
  • the thickness of the antistatic layer C2 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.
  • the surface resistance value of the antistatic layer C2 is preferably 1.0 ⁇ 10 10 ⁇ / ⁇ or less, more preferably 8.0 ⁇ 10 9 ⁇ / ⁇ or less, and further preferably 5.0 ⁇ 10 9. Omega / ⁇ or less, particularly preferably 1.0 ⁇ 10 9 ⁇ / ⁇ or less.
  • any appropriate antistatic layer can be adopted as long as the effect of the present invention is not impaired as long as it can exhibit an antistatic effect.
  • Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating solution containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the base material layer A1. After coating, the coating is dried as necessary and subjected to a curing treatment (heat treatment, ultraviolet treatment, etc.) as necessary.
  • Specific coating methods include a roll coating method, a bar coating method, a gravure coating method, and the like.
  • any appropriate conductive coating liquid can be adopted as long as the effects of the present invention are not impaired.
  • a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since this solvent is substantially eliminated by volatilization or evaporation by heating or the like in the process of forming the antistatic layer C2, the antistatic layer C2 preferably contains a conductive polymer, a binder, and a crosslinking agent.
  • the solvent examples include an organic solvent, water, or a mixed solvent thereof.
  • the organic solvent include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic carbonization such as n-hexane and cyclohexane.
  • Hydrogen aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; alkylene glycol monoalkyl ether (for example, ethylene glycol monomethyl ether, Ethylene glycol monoethyl ether), glycol ethers such as dialkylene glycol monoalkyl ether; and the like.
  • the solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).
  • the content of the conductive polymer in the antistatic layer C2 is preferably 3% by weight to 80% by weight, and more preferably 5% by weight to 60% by weight.
  • any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired.
  • a conductive polymer include a conductive polymer obtained by doping a ⁇ -conjugated conductive polymer with a polyanion.
  • the ⁇ -conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene.
  • polyanion examples include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacrylic carboxylic acid.
  • Only one type of conductive polymer may be used, or two or more types may be used.
  • the content ratio of the binder in the antistatic layer C2 is preferably 50% by weight to 95% by weight, and more preferably 60% by weight to 90% by weight.
  • any appropriate binder can be adopted as long as the effects of the present invention are not impaired. Only one type of binder may be used, or two or more types of binders may be used.
  • a binder is preferably a resin, and more preferably a polyester resin.
  • the proportion of the polyester resin in the binder is preferably 90% by weight to 100% by weight, and more preferably 98% by weight to 100% by weight.
  • the polyester resin contains polyester as a main component (preferably more than 50% by weight, more preferably 75% by weight or more, still more preferably 90% by weight or more, particularly preferably a component occupying substantially 100% by weight). It is preferable to include as.
  • any appropriate polyester can be adopted as long as the effects of the present invention are not impaired.
  • a polyvalent carboxylic acid having two or more carboxyl groups in one molecule for example, a dicarboxylic acid compound
  • a derivative thereof for example, an anhydride, esterified product of a polyvalent carboxylic acid, 1 type selected from 1 type, or 2 or more types of compounds (polyhydric carboxylic acid component) selected from halide etc.
  • polyhydric alcohol for example, diol
  • it preferably has a structure in which two or more compounds (polyhydric alcohol components) are condensed.
  • any appropriate polyvalent carboxylic acid can be adopted as long as the effects of the present invention are not impaired.
  • examples of such a polyvalent carboxylic acid component include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, ( ⁇ ) -malic acid, meso-tartaric acid, Itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, Tetramethyladipic acid, methyleneadipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluo
  • the polyvalent carboxylic acid component is preferably an aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalenedicarboxylic acid and its acid anhydride; adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, Aliphatic dicarboxylic acids such as highmic acid and 1,4-cyclohexanedicarboxylic acid and acid anhydrides thereof; lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms); It is done.
  • aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalenedicarboxylic acid and its acid anhydride
  • adipic acid sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid
  • Aliphatic dicarboxylic acids such as highmic acid and 1,4-cycl
  • any appropriate polyhydric alcohol can be adopted as long as the effects of the present invention are not impaired.
  • examples of such polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propane Diols such as diol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A and bisphenol A; these diols Of alky
  • the molecular weight of the polyester resin is preferably 5 ⁇ 10 3 to 1.5 ⁇ 10 5 , more preferably 1 as the weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC). ⁇ 10 4 to 6 ⁇ 10 4 .
  • the glass transition temperature (Tg) of the polyester resin is preferably 0 ° C. to 120 ° C., more preferably 10 ° C. to 80 ° C.
  • polyester resin for example, a commercially available product name “Vylonal” manufactured by Toyobo Co., Ltd. can be used.
  • the conductive coating liquid is a resin other than polyester resin (for example, acrylic resin, acrylic resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, At least one resin selected from a fluororesin and a polyolefin resin).
  • a resin other than polyester resin for example, acrylic resin, acrylic resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, At least one resin selected from a fluororesin and a polyolefin resin).
  • any appropriate crosslinking agent can be adopted as long as the effects of the present invention are not impaired.
  • One type of crosslinking agent may be sufficient and 2 or more types may be sufficient as it.
  • a crosslinking agent preferably an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent.
  • the content of the crosslinking agent in the antistatic layer C2 is preferably 1% by weight to 30% by weight, and more preferably 2% by weight to 20% by weight.
  • the antistatic layer C2 may contain any appropriate other component as long as the effects of the present invention are not impaired.
  • the thickness of the antistatic layer A3 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.
  • the antistatic layer A3 may be a single layer or two or more layers.
  • any appropriate antistatic layer can be adopted as long as the effect of the present invention is not impaired as long as the layer can exhibit an antistatic effect.
  • the method described in the item ⁇ Antistatic layer C2> is preferably used.
  • any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired.
  • Examples of such a conductive polymer include the conductive polymers described in the section ⁇ Antistatic layer C2>.
  • the thickness of the separator Q any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
  • the separator Q preferably includes a base material layer B1.
  • base material layer B1 a base material formed of any appropriate material can be adopted depending on the purpose within a range not impairing the effects of the present invention. As such a material, what was illustrated by the item of ⁇ base material layer A1> is mentioned, for example.
  • the base material layer B1 may be only one layer or two or more layers.
  • the thickness of the base material layer B any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
  • the base material layer B1 may contain an antistatic agent described later.
  • base material layer B1 containing an antistatic agent the resin sheet in which the antistatic agent was kneaded can be used, for example.
  • Such a resin sheet can be formed from a composition for forming the base layer B1 containing a resin and an antistatic agent.
  • the base material layer B1 itself may act as an antistatic agent.
  • the base material layer B1 itself can act as an antistatic agent.
  • the base material layer B1 may be subjected to a surface treatment.
  • the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric exposure, ionizing radiation treatment, and coating treatment with a primer.
  • Examples of the organic coating material include those exemplified in the item ⁇ Substrate Layer A1>.
  • the base material layer B1 may contain any appropriate other additive depending on the purpose as long as the effects of the present invention are not impaired.
  • the base material layer B1 may be subjected to a release treatment.
  • a mold release process any appropriate mold release process can be adopted as long as the effects of the present invention are not impaired.
  • the surface subjected to the mold release treatment is the pressure-sensitive adhesive layer A2 side.
  • the separator Q may have a release layer B2.
  • the release layer B2 is preferably on the pressure-sensitive adhesive layer A2 side.
  • the release layer B2 is preferably provided to improve the peelability from the pressure-sensitive adhesive layer A2.
  • Any appropriate forming material can be adopted as the forming material of the release layer B2 as long as the effects of the present invention are not impaired.
  • Examples of such a forming material include a silicone release agent, a fluorine release agent, a long-chain alkyl release agent, and a fatty acid amide release agent. Of these, silicone release agents are preferred.
  • the release layer B2 can be formed as a coating layer.
  • the thickness of the release layer B2 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
  • the thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, still more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.
  • the release layer B2 may be only one layer or two or more layers.
  • silicone release layer examples include addition reaction type silicone resins.
  • KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical
  • Toray Dow -Corning SD7220, SD7226; etc. are mentioned.
  • the coating amount (after drying) of the silicone release layer is preferably 0.01 g / m 2 to 2 g / m 2 , more preferably 0.01 g / m 2 to 1 g / m 2 , and still more preferably 0.01 g / m 2 to 0.5 g / m 2 .
  • the release layer B2 is formed, for example, by applying the above-mentioned forming material on any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc. It can carry out by making it harden
  • the separator Q may include any appropriate other layer depending on the purpose as long as the effects of the present invention are not impaired.
  • the reinforcing film with a separator of the present invention can be obtained by laminating the reinforcing film P and the separator Q so that the conductive adhesive layer A2 and the separator Q are directly laminated.
  • one embodiment of the reinforcing film with a separator of the present invention comprises a reinforcing film P composed of a base layer A1, a conductive layer C1, and an adhesive layer A2, and a base layer B1.
  • the separator Q has a form in which the pressure-sensitive adhesive layer A2 and the separator Q are laminated so as to be directly laminated.
  • FIG. 4 Another embodiment of the reinforcing film with a separator of the present invention is, as shown in FIG. 4, a reinforcing film P composed of a base material layer A1, an antistatic layer C2, and an adhesive layer A2, and a base material layer.
  • the separator Q made of B1 is bonded to the adhesive layer A2 and the separator Q so as to be directly laminated.
  • the reinforcing film with a separator of the present invention is the adhesive layer A2 when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min.
  • the surface peeling band voltage is preferably 10.0 kV or less, more preferably 0.001 kV to 9 kV, still more preferably 0.002 kV to 8 kV, and particularly preferably 0.003 kV to 7 kV.
  • the peeling voltage on the surface of the pressure-sensitive adhesive layer A2 is within the above range, the peeling charge that can be generated when the separator Q is peeled off can be further suppressed, and it is bonded in advance to the exposed surface side of an optical member or an electronic member. Even if the separator is peeled from the reinforcing film with a separator, damage to the optical member and the electronic member can be further reduced.
  • the transmittance of the reinforcing film P is preferably 70% or more, more preferably 75% or more, still more preferably 80% or more, and particularly preferably 85. % Or more. If the transmittance of the reinforcing film P is within the above range, for example, it can be used without impairing the optical properties of the optical member when bonded to the optical member.
  • the reinforcing film with a separator of the present invention is an adhesive for a glass plate after peeling the separator Q from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min.
  • the initial adhesive strength of the layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is preferably 1.0 N / 25 mm or more, more preferably 1.0 N / 25 mm to 50 N / 25 mm, more preferably 1.0 N / 25 mm to 45 N / 25 mm, and particularly preferably 1.0 N / 25 mm to 40 N / 25 mm. If the initial adhesive force of the adhesive layer A2 to the glass plate is within the above range, good adhesion can be obtained, and poor adhesion to the adherend can be reduced.
  • the reinforcing film with a separator of the present invention preferably has a peeling force when the separator Q is peeled off from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 180 degrees and a tensile speed of 300 mm / min. 0.30 N / 25 mm or less, more preferably 0.005 N / 25 mm to 0.30 N / 25 mm, still more preferably 0.0075 N / 25 mm to 0.30 N / 25 mm, and particularly preferably 0.01 N / It is 25 mm to 0.30 N / 25 mm.
  • the peeling force when the reinforcing film with a separator is handled, it can be reduced that the separator is accidentally peeled off from the reinforcing film, and the adhesive of the reinforcing film is peeled off when the separator is peeled off. It can reduce cohesive failure or throwing failure of the agent layer.
  • test and evaluation method in an Example etc. are as follows. Note that “parts” means “parts by weight” unless otherwise noted, and “%” means “% by weight” unless otherwise noted.
  • the weight average molecular weight was measured by a gel permeation chromatograph (GPC) method. Specifically, using a trade name “HLC-8120GPC” (manufactured by Tosoh Corporation) as a GPC measuring apparatus, the measurement was performed under the following conditions, and the standard polystyrene equivalent was calculated.
  • GPC gel permeation chromatograph
  • peeling is performed using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peeling angle of 180 degrees and a pulling speed of 300 mm / min.
  • TCM-1kNB universal tensile tester
  • cyclohexyl methacrylate as a monomer component [glass transition temperature of homopolymer (polycyclohexyl methacrylate): 66 ° C.]: 95 parts by weight, acrylic acid: 5 parts by weight, ⁇ -methylstyrene dimer as a chain transfer agent: 10 parts by weight, 2,2′-azobisisobutyronitrile as a polymerization initiator: 10 parts by weight, and toluene as a polymerization solvent: 120 parts by weight are charged into a separable flask, and nitrogen gas is introduced. The mixture was stirred for 1 hour. After removing oxygen in the polymerization system in this way, the temperature was raised to 85 ° C.
  • an acrylic oligomer solution having a solid content concentration of 50% by weight.
  • the weight average molecular weight of the acrylic oligomer in the obtained acrylic oligomer solution was 4000.
  • a silane coupling agent ⁇ -glycidoxypropyltrimethoxysilane, trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.
  • KBM403 ⁇ -glycidoxypropyltrimethoxysilane
  • KBM403 trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.
  • a crosslinking agent epoxy crosslinking agent, trade name “TETRAD-C”, manufactured by Mitsubishi Gas Chemical Co., Ltd.
  • the acrylic oligomer solution is added so as to be 0.075 parts by weight in terms of solid content with respect to parts by weight, and the acrylic oligomer solution is further converted into an acrylic oligomer in terms of solid content with respect to 100 parts by weight of acrylic polymer (solid content).
  • the pressure-sensitive adhesive composition (1) was produced by adding the mixture so that the amount was 25 parts by weight, and mixing them.
  • an aqueous solution for an antistatic layer was produced.
  • the antistatic layer aqueous solution was applied to one surface of a 75 ⁇ m thick polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) so that the thickness after drying was 15 nm.
  • PET polyethylene terephthalate
  • the coated material was heated at 130 ° C. for 1 minute and dried to produce a base material (1) with an antistatic layer having an antistatic layer on one surface of the PET film.
  • the surface resistance value of the antistatic layer was 4.3 ⁇ 10 8 ⁇ / ⁇ .
  • PET film Polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) having a thickness of 75 ⁇ m, 97% by weight of indium oxide and tin oxide on one surface
  • PET film polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) having a thickness of 75 ⁇ m, 97% by weight of indium oxide and tin oxide on one surface
  • An indium tin oxide layer having a thickness of 25 nm was formed by a sputtering method in a sputtering apparatus provided with a fired body target containing 3% by weight. Subsequently, it heat-processed for 90 minutes at 150 degreeC, the indium tin oxide layer was converted from amorphous to crystalline, and the base material (1) with a conductive layer which has a conductive layer on one side of PET film was manufactured.
  • the surface resistance value of the conductive layer was 1.0 ⁇ 10
  • Example 1 The pressure-sensitive adhesive composition (1) obtained in Production Example 1 so that the thickness after drying on the surface of the base material with antistatic layer (1) obtained in Production Example 3 is 25 ⁇ m after drying. Is applied and dried at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is applied to the surface of the formed adhesive layer. Bonding and a reinforcing film (1) with a separator were obtained. The results are shown in Table 1.
  • Example 2 The same procedure as in Example 1 was carried out except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1. A film (2) was obtained. The results are shown in Table 1.
  • Example 3 The pressure-sensitive adhesive composition (1) obtained in Production Example 1 is applied to the surface on the conductive layer side of the substrate with conductive layer (1) obtained in Production Example 4 so that the thickness after drying is 25 ⁇ m. Then, drying is performed at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is bonded to the surface of the formed adhesive layer. A separator reinforcing film (3) was obtained. The results are shown in Table 1.
  • Comparative Example 2 The same procedure as in Comparative Example 1 was conducted except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1, and for reinforcement with a separator. A film (C2) was obtained. The results are shown in Table 1.
  • the reinforcing film with a separator of the present invention can be used as a reinforcing film to be bonded to the back side of a substrate of a semiconductor element.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un film de renforcement recouvert d'un séparateur qui comprend un film de renforcement et un séparateur. Le film de renforcement recouvert d'un séparateur est efficace pour inhiber l'électrification par décollement qui peut se produire lors du décollement du séparateur. Même lorsque le séparateur est décollé du film de renforcement recouvert d'un séparateur appliqué à l'avance sur une surface exposée, par exemple, d'un élément optique ou d'un élément électronique, le décollement endommage moins l'élément optique ou l'élément électronique. Le film de renforcement recouvert d'un séparateur de la présente invention comprend un film de renforcement (P) et un séparateur (Q), le film de renforcement (P) comprenant une couche de base (A1) et une couche d'adhésif sensible à la pression (A2) et comportant une couche électro-conductrice (C1) et/ou une couche antistatique (C2) interposée entre la couche de base (A1) et la couche d'adhésif sensible à la pression (A2), la couche d'adhésif sensible à la pression (A2) et le séparateur (Q) ayant été directement superposés l'un sur l'autre.
PCT/JP2017/025599 2016-07-28 2017-07-13 Film de renforcement recouvert d'un séparateur WO2018021051A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201780043477.XA CN109476960A (zh) 2016-07-28 2017-07-13 带隔离膜的增强用薄膜
KR1020187028802A KR102345171B1 (ko) 2016-07-28 2017-07-13 세퍼레이터를 구비한 보강용 필름
JP2018529770A JP6888010B2 (ja) 2016-07-28 2017-07-13 セパレーター付補強用フィルム

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-148044 2016-07-28
JP2016148044 2016-07-28

Publications (1)

Publication Number Publication Date
WO2018021051A1 true WO2018021051A1 (fr) 2018-02-01

Family

ID=61016064

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/025599 WO2018021051A1 (fr) 2016-07-28 2017-07-13 Film de renforcement recouvert d'un séparateur

Country Status (5)

Country Link
JP (1) JP6888010B2 (fr)
KR (1) KR102345171B1 (fr)
CN (1) CN109476960A (fr)
TW (2) TW201934322A (fr)
WO (1) WO2018021051A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022138676A1 (fr) * 2020-12-24 2022-06-30 昭和電工マテリアルズ株式会社 Film détachable et procédé de fabrication de dispositif à composant électronique
CN114729241A (zh) * 2019-11-26 2022-07-08 日东电工株式会社 增强用薄膜
CN114729242A (zh) * 2019-11-26 2022-07-08 日东电工株式会社 增强用薄膜

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007046003A (ja) * 2005-08-12 2007-02-22 Three M Innovative Properties Co 被着体の貼付方法
JP2013216749A (ja) * 2012-04-06 2013-10-24 Shin Etsu Polymer Co Ltd 導電性粘着シート、その製造方法およびプリント配線板
JP2013249334A (ja) * 2012-05-30 2013-12-12 Shin Etsu Polymer Co Ltd 導電性粘着シート、その製造方法およびプリント配線板

Family Cites Families (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5076150A (fr) * 1973-11-09 1975-06-21
JPH06316024A (ja) * 1993-05-07 1994-11-15 Nissha Printing Co Ltd 帯電防止転写箔
JP3499957B2 (ja) * 1995-03-10 2004-02-23 リンテック株式会社 帯電防止粘着シート
JPH0940851A (ja) * 1995-07-31 1997-02-10 Fuji Photo Film Co Ltd 紫外線カットフイルム
JP4409646B2 (ja) * 1999-01-18 2010-02-03 日東電工株式会社 表面保護フィルム
JP4531883B2 (ja) * 1999-03-25 2010-08-25 リンテック株式会社 帯電防止性粘着シート
JP4414016B2 (ja) * 1999-05-24 2010-02-10 日東電工株式会社 表面保護フィルム
JP4841058B2 (ja) * 2000-04-28 2011-12-21 リンテック株式会社 粘着シートおよび貼着体
JP3570546B2 (ja) * 2000-05-29 2004-09-29 東洋紡績株式会社 高分子フィルム及びこれを用いた表面保護フィルム
JP2002069395A (ja) * 2000-08-28 2002-03-08 Fujimori Kogyo Co Ltd 半導体製造用粘着テープ
JP2002194302A (ja) * 2000-12-27 2002-07-10 Nitto Denko Corp 粘着剤式鑑識用シート
JP2003003132A (ja) * 2001-06-19 2003-01-08 Lintec Corp 粘着シートおよび貼着体
JP2003013014A (ja) * 2001-06-27 2003-01-15 Lintec Corp 粘着シートおよび貼着体
KR100624525B1 (ko) * 2003-10-15 2006-09-18 서광석 대전방지 점착 또는 접착 테이프 및 그 제조 방법
JP4229817B2 (ja) * 2003-11-27 2009-02-25 電気化学工業株式会社 電子部材固定用シート
JP4837257B2 (ja) * 2004-02-26 2011-12-14 日東電工株式会社 帯電防止性粘着型光学フィルムおよび画像表示装置
JP4865192B2 (ja) * 2004-03-16 2012-02-01 古河電気工業株式会社 半導体固定用粘着テープ
JP2005290287A (ja) * 2004-04-02 2005-10-20 Nitto Denko Corp 帯電防止コート剤および帯電防止フィルム
JP4526021B2 (ja) * 2004-10-21 2010-08-18 日東電工株式会社 帯電防止性粘着型光学フィルム及び画像表示装置
US7641946B2 (en) * 2005-08-08 2010-01-05 Nitto Denko Corporation Adhesive film and image display device
JP5000171B2 (ja) * 2006-03-29 2012-08-15 日東電工株式会社 粘着フィルムおよび画像表示装置
JP2007087438A (ja) * 2005-09-20 2007-04-05 Nitto Denko Corp ハードディスクドライブ用粘着ラベルおよび該ハードディスクドライブ用粘着ラベルが用いられたハードディスクドライブ
JP2008280520A (ja) * 2007-04-11 2008-11-20 Furukawa Electric Co Ltd:The 半導体固定用粘着テープ
US20110014443A1 (en) * 2008-03-10 2011-01-20 The Furukawa Electric Co., Ltd Adhesive tape for electronic component fabrication
JP5415833B2 (ja) * 2009-05-29 2014-02-12 古河電気工業株式会社 半導体固定用粘着テープ、およびその製造方法
TWI381303B (zh) * 2010-02-09 2013-01-01 Oji Paper Co 導電性積層體及使用其之觸控面板
JP5607401B2 (ja) * 2010-03-30 2014-10-15 古河電気工業株式会社 帯電防止型半導体加工用粘着テープ
JP5534896B2 (ja) * 2010-03-30 2014-07-02 古河電気工業株式会社 帯電防止性半導体加工用粘着テープ
KR101232518B1 (ko) * 2010-12-28 2013-02-12 율촌화학 주식회사 정전기 방지 성능이 우수한 이형필름 및 그 제조방법
JP5885286B2 (ja) * 2011-03-29 2016-03-15 日東電工株式会社 粘着シートおよびその利用
KR101209552B1 (ko) * 2011-10-07 2012-12-06 도레이첨단소재 주식회사 몰드 언더필 공정의 마스킹 테이프용 점착제 조성물 및 그를 이용한 마스킹 테이프
JP2013107998A (ja) * 2011-11-22 2013-06-06 Nitto Denko Corp 表面保護フィルム
JP2013237788A (ja) * 2012-05-16 2013-11-28 Nitto Denko Corp 表面保護フィルム
JP5942321B2 (ja) * 2012-09-21 2016-06-29 東レ先端素材株式会社Ｔｏｒａｙ Ａｄｖａｎｃｅｄ Ｍａｔｅｒｉａｌｓ Ｋｏｒｅａ， Ｉｎｃ． モールドアンダーフィル工程のマスキングテープ用粘着剤組成物及びそれを利用したマスキングテープ
JP6181958B2 (ja) * 2013-03-28 2017-08-16 日東電工株式会社 帯電防止性粘着シート、及び、光学フィルム
JP6229926B2 (ja) 2013-06-03 2017-11-15 大日本印刷株式会社 粘着剤組成物およびそれを用いた粘着シート
JP6376741B2 (ja) * 2013-10-11 2018-08-22 アキレス株式会社 熱剥離性粘着フィルム
CN204097390U (zh) * 2014-03-31 2015-01-14 苏州汉纳材料科技有限公司 基于碳纳米管的透明防静电压敏胶结构及防静电保护膜
JP6433143B2 (ja) * 2014-04-16 2018-12-05 日東電工株式会社 粘着シート、及び、光学部材
CN203845983U (zh) * 2014-05-23 2014-09-24 苏州斯迪克新材料科技股份有限公司 一种阻燃抗静电保护胶带
JP6224547B2 (ja) * 2014-08-26 2017-11-01 藤森工業株式会社 表面保護フィルム、及びそれが貼合された光学部品
KR102388869B1 (ko) * 2014-08-28 2022-04-20 린텍 가부시키가이샤 도전성 점착 시트
CN106794684B (zh) * 2014-10-20 2020-09-01 琳得科株式会社 表面保护片用基材及表面保护片
JP6566630B2 (ja) * 2014-11-27 2019-08-28 日東電工株式会社 表面保護フィルム、表面保護フィルムの製造方法、及び、光学部材
JP6890920B2 (ja) * 2014-12-08 2021-06-18 日東電工株式会社 粘着剤層付き透明導電性フィルム
JP6464452B2 (ja) * 2015-03-02 2019-02-06 フジコピアン株式会社 静電容量式センサー感知状態維持用の導電性粘着シートおよび前記導電性粘着シートを用いた静電容量式センサーの感知状態を維持する方法
JP6560570B2 (ja) * 2015-09-10 2019-08-14 マクセルホールディングス株式会社 透明導電性粘着シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007046003A (ja) * 2005-08-12 2007-02-22 Three M Innovative Properties Co 被着体の貼付方法
JP2013216749A (ja) * 2012-04-06 2013-10-24 Shin Etsu Polymer Co Ltd 導電性粘着シート、その製造方法およびプリント配線板
JP2013249334A (ja) * 2012-05-30 2013-12-12 Shin Etsu Polymer Co Ltd 導電性粘着シート、その製造方法およびプリント配線板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114729241A (zh) * 2019-11-26 2022-07-08 日东电工株式会社 增强用薄膜
CN114729242A (zh) * 2019-11-26 2022-07-08 日东电工株式会社 增强用薄膜
WO2022138676A1 (fr) * 2020-12-24 2022-06-30 昭和電工マテリアルズ株式会社 Film détachable et procédé de fabrication de dispositif à composant électronique

Also Published As

Publication number Publication date
KR102345171B1 (ko) 2021-12-30
TW201934322A (zh) 2019-09-01
JPWO2018021051A1 (ja) 2019-01-31
KR20180122663A (ko) 2018-11-13
CN109476960A (zh) 2019-03-15
TWI701145B (zh) 2020-08-11
TW201811552A (zh) 2018-04-01
JP6888010B2 (ja) 2021-06-16

Similar Documents

Publication Publication Date Title
KR102649511B1 (ko) 플렉시블 화상 표시 장치용 점착제층, 플렉시블 화상 표시 장치용 적층체, 및 플렉시블 화상 표시 장치
TWI620665B (zh) Laminated body
JP5199917B2 (ja) 粘着シートとその製造方法および粘着型機能性フィルム
TW202300333A (zh) 撓性影像顯示裝置用積層體及撓性影像顯示裝置
TW202244227A (zh) 可撓性圖像顯示裝置用黏著劑層、可撓性圖像顯示裝置用積層體及可撓性圖像顯示裝置
WO2018021051A1 (fr) Film de renforcement recouvert d'un séparateur
TWI686454B (zh) 黏著片、雙面黏著片及光學構件
TW201800536A (zh) 黏著劑、光學用黏著片、偏光板黏著片及液晶單元構件
KR101962019B1 (ko) 세퍼레이터를 갖는 보강 필름
TW201539020A (zh) 保護膜、保護膜的使用方法以及具有保護膜的透明導電性基板
JP2015072903A (ja) 積層体
JP2016535409A (ja) 導電性フィルム及びその製造方法
TW202204446A (zh) 附面塗層之膜、補強膜及圖像顯示裝置
TW201443469A (zh) 降低虹斑發生積層體、降低虹斑發生片材、及降低虹斑發生方法
JP2021079551A (ja) 積層フィルムおよびその使用方法
TW202141089A (zh) 多層化黏著劑層、附分離件之多層化黏著劑層及其製造方法、黏著型光學薄膜、附分離件之黏著型光學薄膜及其製造方法、以及影像顯示裝置
KR20160045219A (ko) 대전방지 이형필름

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2018529770

Country of ref document: JP

ENP Entry into the national phase

Ref document number: 20187028802

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 17834059

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 17834059

Country of ref document: EP

Kind code of ref document: A1