WO2018021051A1 - Separator-covered reinforcing film - Google Patents
Separator-covered reinforcing film Download PDFInfo
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- WO2018021051A1 WO2018021051A1 PCT/JP2017/025599 JP2017025599W WO2018021051A1 WO 2018021051 A1 WO2018021051 A1 WO 2018021051A1 JP 2017025599 W JP2017025599 W JP 2017025599W WO 2018021051 A1 WO2018021051 A1 WO 2018021051A1
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- WIPO (PCT)
- Prior art keywords
- separator
- acid
- reinforcing film
- layer
- weight
- Prior art date
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to a reinforcing film with a separator.
- a reinforcing film with a separator may be bonded in advance to the exposed surface side of the optical member or the electronic member in some cases (Patent Literature). 1).
- An object of the present invention is a reinforcing film with a separator having a reinforcing film and a separator, which can suppress peeling electrification that may occur when the separator is peeled off, and is applied in advance to the exposed surface side of an optical member or an electronic member.
- An object of the present invention is to provide a reinforcing film with a separator that can reduce damage to the optical member and the electronic member even when the separator is peeled off from the combined reinforcing film with a separator.
- the reinforcing film with a separator of the present invention is A reinforcing film with a separator having a reinforcing film P and a separator Q,
- the reinforcing film P includes a base layer A1 and an adhesive layer A2,
- a conductive layer C1 and / or an antistatic layer C2 is disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2,
- the pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
- the conductive layer C1 has a surface resistance value of 1.0 ⁇ 10 10 ⁇ / ⁇ or less.
- the antistatic layer C2 has a surface resistance value of 1.0 ⁇ 10 10 ⁇ / ⁇ or less.
- the surface peeling voltage is 10.0 kV or less.
- the transmittance of the reinforcing film P is 70% or more.
- the initial adhesive strength of the layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is 1.0 N / 25 mm or more.
- the peeling force is 0.30 N / 25 mm or less.
- a reinforcing film with a separator having a reinforcing film and a separator can suppress peeling electrification that may occur when the separator is peeled off, and is attached in advance to an exposed surface side of an optical member or an electronic member. Even if a separator is peeled from the combined reinforcing film with a separator, a reinforcing film with a separator that can reduce damage to the optical member and the electronic member can be provided.
- weight which is conventionally commonly used as a unit of weight
- weight which is commonly used as an SI system unit indicating weight
- (meth) acryl means “acryl and / or methacryl”
- the expression “(meth) acrylate” means “acrylate and / or methacrylate”.
- “(meth) acrolein” means “acrolein and / or methacrole”. It means "rain”.
- the reinforcing film with a separator of the present invention is a reinforcing film with a separator having a reinforcing film P and a separator Q.
- the reinforcing film with a separator of the present invention may have any other appropriate layer as long as the effects of the present invention are not impaired.
- the reinforcing film P includes a base material layer A1 and an adhesive layer A2, and the conductive layer C1 and / or the antistatic layer C2 is provided between the base material layer A1 and the adhesive layer A2. Is arranged, and the pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
- the thickness of the reinforcing film with a separator of the present invention any appropriate thickness can be adopted depending on the purpose as long as the effects of the present invention are not impaired.
- the thickness is preferably 9 ⁇ m to 1300 ⁇ m, more preferably 20 ⁇ m to 1050 ⁇ m, still more preferably 35 ⁇ m to 900 ⁇ m, and particularly preferably 45 ⁇ m to 750 ⁇ m.
- the thickness of the reinforcing film P any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 5 ⁇ m to 800 ⁇ m, more preferably 10 ⁇ m to 650 ⁇ m, still more preferably 20 ⁇ m to 550 ⁇ m, and particularly preferably 25 ⁇ m to 450 ⁇ m.
- the reinforcing film P includes a base material layer A1 and an adhesive layer A2, and a conductive layer C1 and / or an antistatic layer C2 are disposed between the base material layer A1 and the adhesive layer A2.
- the reinforcing film P can include any appropriate other layer depending on the purpose within a range not impairing the effects of the present invention.
- one embodiment of the reinforcing film P includes a base layer A1, a conductive layer C1, and an adhesive layer A2.
- Another embodiment of the reinforcing film P is composed of a base layer A1, an antistatic layer C2, and an adhesive layer A2, as shown in FIG.
- the reinforcing film P may have the antistatic layer A3 on the side opposite to the adhesive layer A2 of the base material layer A1.
- the reinforcing film with a separator of the present invention does not have the antistatic layer A3, but the conductive layer C1 and / or the antistatic layer C2 are disposed between the base layer A1 and the adhesive layer A2. Therefore, the effect of the present invention can be fully expressed.
- Base material layer A1 As base material layer A1, the base material formed from arbitrary appropriate materials can be employ
- the resin constituting the resin sheet examples include acrylic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethyl methacrylate (PMMA), polycarbonate, and triacetyl cellulose (TAC).
- acrylic resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polybutylene terephthalate (PBT), and polymethyl methacrylate (PMMA), polycarbonate, and triacetyl cellulose (TAC).
- non-woven fabric examples include a non-woven fabric made of natural fibers having heat resistance such as a non-woven fabric containing Manila hemp; a synthetic resin non-woven fabric such as a polypropylene resin non-woven fabric, a polyethylene resin non-woven fabric and an ester resin non-woven fabric.
- the base material layer A1 may be only one layer or two or more layers.
- any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
- the base material layer A1 may contain an antistatic agent.
- base material layer A1 containing an antistatic agent the resin sheet in which the antistatic agent was kneaded can be used, for example.
- Such a resin sheet can be formed from the composition for forming base material layer A1 containing a resin and an antistatic agent.
- the base material layer A1 itself may act as an antistatic agent.
- the base material layer A1 itself can act as an antistatic agent.
- the base material layer A1 may be subjected to a surface treatment.
- the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric exposure, ionizing radiation treatment, and coating treatment with a primer.
- the organic coating material examples include materials described in Plastic Hard Coat Material II (CMC Publishing, (2004)).
- a urethane type polymer is mentioned, More preferably, polyacryl urethane, polyester urethane, or these precursors are mentioned. This is because coating and application to the base material layer A1 are simple, and various types can be selected industrially and obtained at low cost.
- urethane-based polymers include polymers composed of a reaction mixture of an isocyanate monomer and an alcoholic hydroxyl group-containing monomer (for example, a hydroxyl group-containing acrylic compound or a hydroxyl group-containing ester compound).
- the organic coating material may contain a chain extender such as polyamine, an anti-aging agent, an oxidation stabilizer and the like as optional additives.
- the base material layer A1 may contain any appropriate other additive depending on the purpose as long as the effects of the present invention are not impaired.
- ⁇ Adhesive layer A2> As thickness of adhesive layer A2, arbitrary appropriate thickness can be employ
- the thickness is preferably 1 ⁇ m to 300 ⁇ m, more preferably 2 ⁇ m to 250 ⁇ m, still more preferably 4 ⁇ m to 200 ⁇ m, and particularly preferably 5 ⁇ m to 150 ⁇ m.
- the pressure-sensitive adhesive layer A2 may be a single layer or two or more layers.
- Adhesive layer A2 is formed from the adhesive composition a2.
- the pressure-sensitive adhesive layer A2 can be formed by any appropriate method as long as the pressure-sensitive adhesive composition a2 can be formed into a layer.
- the pressure-sensitive adhesive layer A2 can be formed by applying the pressure-sensitive adhesive composition a2 on any appropriate base material and performing heating or irradiation with active energy rays (such as ultraviolet rays) as necessary. I can do it.
- the pressure-sensitive adhesive composition a2 preferably contains an acrylic polymer.
- an acrylic polymer is preferably a (meth) acrylic acid alkyl ester having an alkyl group having 4 to 12 carbon atoms (sometimes referred to as “(meth) acrylic acid C4-C12 alkyl ester”). It is an acrylic polymer obtained by polymerizing a monomer component containing 1 to 10 parts by weight as a component and a carboxyl group-containing monomer as a monomer component with respect to 100 parts by weight of the total amount of monomer components.
- the content of the acrylic polymer in the pressure-sensitive adhesive composition a2 is preferably 50% by weight or more, more preferably 50% to 99.99% by weight, more preferably 55% by weight, in terms of solid content. ⁇ 99% by weight, particularly preferably 60% by weight to 95% by weight, and most preferably 70% by weight to 90% by weight.
- the (meth) acrylic acid C4-C12 alkyl ester is a (meth) acrylic acid alkyl ester (acrylic acid alkyl ester, methacrylic acid alkyl ester) in which the alkyl group has 4 to 12 carbon atoms.
- Any suitable (meth) acrylic acid C4-C12 alkyl ester may be employed depending on the purpose.
- Examples of such (meth) acrylic acid C4-C12 alkyl esters include n-butyl (meth) acrylate, isobutyl (meth) acrylate, s-butyl (meth) acrylate, and t- (meth) acrylic acid.
- the (meth) acrylic acid C4-C12 alkyl ester as the main component of the monomer component may be one kind or two or more kinds.
- the content ratio of the (meth) acrylic acid C4-C12 alkyl ester in the total amount of the monomer components is preferably 50% to 99% by weight, more preferably 80% to 98% by weight, and still more preferably 90% by weight. % To 97% by weight. If the content ratio of the (meth) acrylic acid C4-C12 alkyl ester is within the above range, the effects of the present invention can be more manifested.
- the monomer component includes a carboxyl group-containing monomer.
- carboxyl group-containing monomers include (meth) acrylic acid (acrylic acid, methacrylic acid), itaconic acid, maleic acid, fumaric acid, crotonic acid, and the like.
- acid anhydrides of these carboxyl group-containing monomers for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride
- acrylic acid is preferable.
- the content of the carboxyl group-containing monomer in the total amount of the monomer components is preferably 1% by weight to 10% by weight, more preferably 3% by weight to 10% by weight, and further preferably 3% by weight to 5% by weight. is there. If the content ratio of the carboxyl group-containing monomer in the total amount of the monomer components is within the above range, the effect of the present invention can be more manifested.
- the monomer component used to obtain the acrylic polymer by polymerization is a monomer (copolymerizable monomer) that can be copolymerized with a (meth) acrylic acid C4-C12 alkyl ester or a carboxyl group-containing monomer, if necessary. May be included.
- the content of such a copolymerizable monomer is preferably less than 50% by weight with respect to the total amount of monomer components.
- the content ratio of such a copolymerizable monomer is such a content ratio that the glass transition temperature of the obtained acrylic polymer is more preferably ⁇ 20 ° C. or less in order to develop good adhesiveness.
- the content ratio is preferably -70 ° C to -35 ° C.
- Examples of the copolymerizable monomer include (meth) acrylic acid C1-C3 alkyl esters such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, and isopropyl (meth) acrylate; (Meth) acrylic acid tridecyl, (meth) acrylic acid tetradecyl, (meth) acrylic acid pentadecyl, (meth) acrylic acid hexadecyl, (meth) acrylic acid heptadecyl, (meth) acrylic acid octadecyl, (meth) acrylic acid nonadecyl, (meta ) (Meth) acrylic acid C13-C20 alkyl esters such as eicosyl acrylate; non-aromatic rings such as (meth) acrylic acid cycloalkyl esters (such as cyclohexyl (meth) acrylate) and isoborny
- copolymerizable monomers examples include hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, and pentaerythritol.
- copolymerizable monomers include nitrogen atom-containing monomers (for example, (meth) acrylates such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate).
- nitrogen atom-containing monomers for example, (meth) acrylates such as aminoethyl (meth) acrylate, N, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate).
- Aminoalkyl acrylate monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide; acrylonitrile, Cyanoacrylate monomers such as methacrylonitrile; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate).
- amide monomers such as (meth) acrylamide, N, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-hydroxy (meth) acrylamide
- Cyanoacrylate monomers such as methacrylonitrile
- isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate.
- nitrogen atom-containing monomer can cause yellowing of the pressure-sensitive adhesive under heating, it is preferable not to use it when it is not necessary to use it.
- the acrylic polymer can be prepared by any appropriate polymerization method as long as the effects of the present invention are not impaired.
- Examples of the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by ultraviolet irradiation, and the like, and a solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. .
- any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
- the amount used is preferably 0.01% by weight to 1% by weight with respect to the total amount of monomer components.
- any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
- the amount used is preferably 0.01% by weight to 15% by weight with respect to the total amount of monomer components.
- solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl Organic solvents such as cycloaliphatic hydrocarbons such as cyclohexane; ketones such as methyl ethyl ketone and methyl isobutyl ketone; One type of solvent may be sufficient and 2 or more types may be sufficient as it.
- the acrylic polymer has a weight average molecular weight of preferably 500,000 to 900,000, more preferably 550,000 to 850,000, and still more preferably 600,000 to 800,000. If the weight average molecular weight of the acrylic polymer is within the above range, the effects of the present invention can be more manifested.
- the weight average molecular weight of the acrylic polymer can be controlled by the type of the polymerization initiator and the chain transfer agent, the amount used, the temperature and time during the polymerization, the monomer concentration, the monomer dropping rate, and the like.
- the pressure-sensitive adhesive composition a2 may contain an oligomer component.
- the oligomer component is preferably an ethylenically unsaturated monomer having a glass transition temperature of 60 ° C. to 190 ° C. when a homopolymer is formed and having a cyclic structure (“Tg of 60 ° C. to 190 ° C.
- Tg glass transition temperature of 60 ° C. to 190 ° C.
- oligomer component examples include an oligomer component obtained by polymerizing an ethylenically unsaturated monomer having a glass transition temperature of 60 ° C. or higher when a homopolymer is formed and having a cyclic structure.
- the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. has a glass transition temperature (Tg) of 60 ° C. to 190 ° C. when forming a homopolymer
- Tg glass transition temperature
- Any ethylenically unsaturated monomer having a cyclic structure can employ any appropriate monomer component as long as the effects of the present invention are not impaired.
- the ring in such a ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be either an aromatic ring or a non-aromatic ring. preferable.
- aromatic ring examples include an aromatic hydrocarbon ring (for example, a benzene ring, a condensed carbocycle in naphthalene, etc.), various aromatic heterocycles, and the like.
- Non-aromatic rings include non-aromatic alicyclic rings (cycloalkane rings such as cyclopentane ring, cyclohexane ring, cycloheptane ring and cyclooctane ring; cycloalkene rings such as cyclohexene ring), non-aromatic Bridged ring (eg, bicyclic hydrocarbon ring in pinane, pinene, bornane, norbornane, norbornene, etc .; tricyclic hydrocarbon ring in adamantane, etc .; tetracyclic hydrocarbon ring; etc. Etc.).
- Examples of ring-containing ethylenically unsaturated monomers having a Tg of 60 ° C. to 190 ° C. include non-aromatics such as (meth) acrylic acid cycloalkyl esters such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate.
- Aromatic ring-containing (meth) acrylic acid esters such as (meth) acrylic acid phenyl; (meth) acrylic acid aryloxyalkyl esters such as (meth) acrylic acid phenoxyethyl; Ethylene having a cyclic structure in the molecule, such as aromatic ring-containing (meth) acrylic acid esters such as (meth) acrylic acid arylalkyl esters such as benzyl acrylate; styrene monomers such as styrene and ⁇ -methylstyrene; Glass transition temperature when homopolymers are formed 0 °C may appropriately selected and to be ⁇ 190 ° C..
- the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. preferably includes a (meth) acrylic acid ester having a non-aromatic ring such as cyclohexyl methacrylate and isobornyl (meth) acrylate. From the viewpoint of transparency, more preferred is cyclohexyl methacrylate.
- the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. may be only one type or two or more types.
- the content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is preferably 50% by weight or more, more preferably 80% by weight to 99% by weight, based on the total amount of the monomer components. More preferably, it is 90 to 97% by weight. If the content ratio of the ring-containing ethylenically unsaturated monomer having a Tg of 60 ° C. to 190 ° C. is within the above range, the effect of the present invention can be further exhibited.
- the oligomer component may contain a carboxyl group-containing monomer as a monomer component.
- a carboxyl group-containing monomer examples include (meth) acrylic acid, itaconic acid, maleic acid, fumaric acid, crotonic acid and the like, similarly to the carboxyl group-containing monomer that can constitute the acrylic polymer.
- acid anhydrides of these carboxyl group-containing monomers for example, acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride
- acrylic acid is preferable.
- the content ratio of the carboxyl group-containing monomer that can constitute the oligomer component is preferably 1 to 10 parts by weight, preferably 3 to 10 parts by weight, with respect to 100 parts by weight of the total amount of the monomer components.
- the amount is preferably 3 to 5 parts by weight. If the content ratio of the carboxyl group-containing monomer is within the above range, the effects of the present invention can be further exhibited.
- the monomer component that can constitute the oligomer component is a monomer that can be copolymerized with a ring-containing ethylenically unsaturated monomer or carboxyl group-containing monomer having a Tg of 60 to 190 ° C. Monomer).
- the content of such a copolymerizable monomer is preferably less than 50% by weight with respect to 100 parts by weight of the total amount of monomer components.
- the content ratio of such a copolymerizable monomer is such that the glass transition temperature of the oligomer component can be preferably 60 ° C. or higher, more preferably 65 ° C. to 180 ° C., in that good adhesiveness can be exhibited. It is preferable that it is such a content rate.
- the same copolymerizable monomer as described above that may be included in the monomer component used for obtaining the acrylic polymer by polymerization may be employed.
- 1 type may be sufficient as a copolymerizable monomer and 2 or more types may be sufficient as it.
- the oligomer component can be prepared by any appropriate polymerization method as long as the effects of the present invention are not impaired.
- the polymerization method of the acrylic polymer include a solution polymerization method, an emulsion polymerization method, a bulk polymerization method, a polymerization method by ultraviolet irradiation, and the like, and a solution polymerization method is preferable in terms of transparency, water resistance, cost, and the like. .
- any appropriate one can be adopted as long as the effects of the present invention are not impaired.
- the amount of the polymerization initiator used any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
- the amount used is preferably, for example, 0.1 to 15% by weight based on the total amount of monomer components.
- any appropriate amount can be adopted as long as the effects of the present invention are not impaired.
- the amount used is preferably 0.01% by weight to 15% by weight with respect to the total amount of monomer components.
- solvents include esters such as ethyl acetate and n-butyl acetate; aromatic hydrocarbons such as toluene and benzene; aliphatic hydrocarbons such as n-hexane and n-heptane; cyclohexane and methyl Organic solvents such as cycloaliphatic hydrocarbons such as cyclohexane; ketones such as methyl ethyl ketone and methyl isobutyl ketone; One type of solvent may be sufficient and 2 or more types may be sufficient as it.
- the oligomer component has a weight average molecular weight of preferably 3000 to 6000, more preferably 3300 to 5500, and further preferably 3500 to 5000. If the weight average molecular weight of the oligomer component is within the above range, the effect of the present invention can be more manifested.
- the weight average molecular weight of the oligomer component can be controlled by the type and amount of polymerization initiator and chain transfer agent, temperature and time during polymerization, monomer concentration, monomer dropping rate, and the like.
- the pressure-sensitive adhesive composition a2 preferably contains the acrylic polymer and the oligomer component.
- the pressure-sensitive adhesive composition a2 contains an acrylic polymer and an oligomer component, excellent transparency can be expressed, and it is difficult to lift and peel off at the adhesive interface. Can be expressed).
- the ratio of the acrylic polymer to the oligomer component is preferably 10 parts by weight with respect to 100 parts by weight of the acrylic polymer. 35 parts by weight, more preferably 15 parts by weight to 30 parts by weight.
- the effect of the present invention can be further exhibited if the ratio of the acrylic polymer and the oligomer component is within the above range.
- the pressure-sensitive adhesive composition a2 includes a crosslinking agent, a silane coupling agent, a solvent, an ultraviolet absorber, an antioxidant, a light stabilizer, an anti-aging agent, and a tackifier, as necessary.
- Known additives may be included. These additives may be only one kind or two or more kinds.
- any appropriate ionic liquid can be adopted as long as the effects of the present invention are not impaired.
- Examples of such an ionic liquid include ionic liquids described in JP-A-2016-108442.
- any appropriate ion conductive polymer can be adopted as long as the effects of the present invention are not impaired.
- examples of such an ion conductive polymer include an ion conductive polymer obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium base), such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine polymer. Conductive polymer; and the like. Only one type of ion conductive polymer may be used, or two or more types may be used.
- any appropriate ion conductive filler can be adopted as long as the effects of the present invention are not impaired.
- examples of such ion conductive filler include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, and iron. , Cobalt, copper iodide, ITO (indium oxide / tin oxide), ATO (antimony oxide / tin oxide), and the like. Only one type of ion conductive filler may be used, or two or more types may be used.
- any appropriate electrically conductive polymer can be adopted as long as the effects of the present invention are not impaired.
- Examples of such an electrically conductive polymer include (3,4-ethylenedioxythiophene) -poly (styrenesulfonic acid).
- the pressure-sensitive adhesive composition a2 contains a crosslinking agent among the above-mentioned additives.
- a crosslinking agent to crosslink the acrylic polymer or oligomer component, the cohesive force as an adhesive can be further increased.
- One type of crosslinking agent may be sufficient and 2 or more types may be sufficient as it.
- crosslinking agents isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents Agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, amine crosslinking agents and the like. Of these, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferable.
- the content of the isocyanate-based crosslinking agent can be set to any appropriate amount depending on the desired adhesive strength, and is preferably 0.01 to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. More preferred is 0.01 to 10 parts by weight, still more preferred is 0.03 to 5 parts by weight.
- the content of the epoxy crosslinking agent can be set to any appropriate amount depending on the desired adhesive strength, and is preferably 0.01 to 20 parts by weight with respect to 100 parts by weight of the acrylic polymer. More preferred is 0.01 to 10 parts by weight, still more preferred is 0.03 to 5 parts by weight.
- the pressure-sensitive adhesive composition a2 can be prepared, for example, by mixing an acrylic polymer, an oligomer component as necessary, and other additives such as a crosslinking agent as necessary.
- the pressure-sensitive adhesive composition a2 is applied on any appropriate base material (for example, a PET base material), and is heated and dried to form the pressure-sensitive adhesive layer A2.
- the pressure-sensitive adhesive composition a2 is applied on the base material layer A1, and heated and dried to form the pressure-sensitive adhesive layer A2.
- any appropriate coating method can be used.
- a coating using a conventional coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater.
- a conventional coater such as a gravure roll coater, a reverse roll coater, a kiss roll coater, a dip roll coater, a bar coater, a knife coater, a spray coater, a comma coater, or a direct coater. Law.
- the conductive layer C1 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
- the conductive layer C1 may be only one layer or two or more layers.
- the conductive layer C1 can be provided by being formed on any appropriate base material.
- a base material is preferably a base material layer A1.
- the conductive layer C1 may be formed by any appropriate thin film formation method such as a vacuum deposition method, a sputtering method, an ion plating method, a spray pyrolysis method, a chemical plating method, an electroplating method, or a combination thereof.
- a conductive film is formed over a suitable base material (preferably, base material layer A1).
- the vacuum deposition method and the sputtering method are preferable from the viewpoint of the formation rate of the conductive film, the formability of the large area film, and the productivity.
- a material for forming the conductive film for example, a metal-based material made of gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, alloys thereof, indium oxide, Metal oxide materials composed of tin oxide, titanium oxide, cadmium oxide, mixtures thereof, and the like; other metal compounds composed of copper iodide and the like are used.
- any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- Such thickness is, for example, preferably 30 to 600 mm when formed from a metal-based material, and preferably 80 to 5000 mm when formed from a metal oxide-based material.
- the surface resistance value of the conductive layer C1 is preferably 1.0 ⁇ 10 10 ⁇ / ⁇ or less, more preferably 1.0 ⁇ 10 9 ⁇ / ⁇ or less, and further preferably 1.0 ⁇ 10 8 ⁇ . / ⁇ or less, particularly preferably 1.0 ⁇ 10 7 ⁇ / ⁇ or less.
- the surface of the substrate is subjected to corona discharge treatment, ultraviolet irradiation treatment, Arbitrary appropriate pretreatments such as plasma treatment, sputter etching treatment, and undercoat treatment can be applied to improve the adhesion between the conductive film and the substrate (preferably, the substrate layer A1).
- the antistatic layer C2 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
- the antistatic layer C2 may be a single layer or two or more layers.
- the thickness of the antistatic layer C2 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.
- the surface resistance value of the antistatic layer C2 is preferably 1.0 ⁇ 10 10 ⁇ / ⁇ or less, more preferably 8.0 ⁇ 10 9 ⁇ / ⁇ or less, and further preferably 5.0 ⁇ 10 9. Omega / ⁇ or less, particularly preferably 1.0 ⁇ 10 9 ⁇ / ⁇ or less.
- any appropriate antistatic layer can be adopted as long as the effect of the present invention is not impaired as long as it can exhibit an antistatic effect.
- Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating solution containing a conductive polymer on any appropriate base material layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on the base material layer A1. After coating, the coating is dried as necessary and subjected to a curing treatment (heat treatment, ultraviolet treatment, etc.) as necessary.
- Specific coating methods include a roll coating method, a bar coating method, a gravure coating method, and the like.
- any appropriate conductive coating liquid can be adopted as long as the effects of the present invention are not impaired.
- a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since this solvent is substantially eliminated by volatilization or evaporation by heating or the like in the process of forming the antistatic layer C2, the antistatic layer C2 preferably contains a conductive polymer, a binder, and a crosslinking agent.
- the solvent examples include an organic solvent, water, or a mixed solvent thereof.
- the organic solvent include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic carbonization such as n-hexane and cyclohexane.
- Hydrogen aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; alkylene glycol monoalkyl ether (for example, ethylene glycol monomethyl ether, Ethylene glycol monoethyl ether), glycol ethers such as dialkylene glycol monoalkyl ether; and the like.
- the solvent is preferably water or a mixed solvent containing water as a main component (for example, a mixed solvent of water and ethanol).
- the content of the conductive polymer in the antistatic layer C2 is preferably 3% by weight to 80% by weight, and more preferably 5% by weight to 60% by weight.
- any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired.
- a conductive polymer include a conductive polymer obtained by doping a ⁇ -conjugated conductive polymer with a polyanion.
- the ⁇ -conjugated conductive polymer include chain conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene.
- polyanion examples include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacrylic carboxylic acid.
- Only one type of conductive polymer may be used, or two or more types may be used.
- the content ratio of the binder in the antistatic layer C2 is preferably 50% by weight to 95% by weight, and more preferably 60% by weight to 90% by weight.
- any appropriate binder can be adopted as long as the effects of the present invention are not impaired. Only one type of binder may be used, or two or more types of binders may be used.
- a binder is preferably a resin, and more preferably a polyester resin.
- the proportion of the polyester resin in the binder is preferably 90% by weight to 100% by weight, and more preferably 98% by weight to 100% by weight.
- the polyester resin contains polyester as a main component (preferably more than 50% by weight, more preferably 75% by weight or more, still more preferably 90% by weight or more, particularly preferably a component occupying substantially 100% by weight). It is preferable to include as.
- any appropriate polyester can be adopted as long as the effects of the present invention are not impaired.
- a polyvalent carboxylic acid having two or more carboxyl groups in one molecule for example, a dicarboxylic acid compound
- a derivative thereof for example, an anhydride, esterified product of a polyvalent carboxylic acid, 1 type selected from 1 type, or 2 or more types of compounds (polyhydric carboxylic acid component) selected from halide etc.
- polyhydric alcohol for example, diol
- it preferably has a structure in which two or more compounds (polyhydric alcohol components) are condensed.
- any appropriate polyvalent carboxylic acid can be adopted as long as the effects of the present invention are not impaired.
- examples of such a polyvalent carboxylic acid component include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, ( ⁇ ) -malic acid, meso-tartaric acid, Itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, Tetramethyladipic acid, methyleneadipic acid, muconic acid, galactaric acid, pimelic acid, suberic acid, perfluo
- the polyvalent carboxylic acid component is preferably an aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalenedicarboxylic acid and its acid anhydride; adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, Aliphatic dicarboxylic acids such as highmic acid and 1,4-cyclohexanedicarboxylic acid and acid anhydrides thereof; lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms); It is done.
- aromatic dicarboxylic acid such as terephthalic acid, isophthalic acid or naphthalenedicarboxylic acid and its acid anhydride
- adipic acid sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid
- Aliphatic dicarboxylic acids such as highmic acid and 1,4-cycl
- any appropriate polyhydric alcohol can be adopted as long as the effects of the present invention are not impaired.
- examples of such polyhydric alcohol components include ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propane Diols such as diol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A and bisphenol A; these diols Of alky
- the molecular weight of the polyester resin is preferably 5 ⁇ 10 3 to 1.5 ⁇ 10 5 , more preferably 1 as the weight average molecular weight (Mw) in terms of standard polystyrene measured by gel permeation chromatography (GPC). ⁇ 10 4 to 6 ⁇ 10 4 .
- the glass transition temperature (Tg) of the polyester resin is preferably 0 ° C. to 120 ° C., more preferably 10 ° C. to 80 ° C.
- polyester resin for example, a commercially available product name “Vylonal” manufactured by Toyobo Co., Ltd. can be used.
- the conductive coating liquid is a resin other than polyester resin (for example, acrylic resin, acrylic resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, At least one resin selected from a fluororesin and a polyolefin resin).
- a resin other than polyester resin for example, acrylic resin, acrylic resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, At least one resin selected from a fluororesin and a polyolefin resin).
- any appropriate crosslinking agent can be adopted as long as the effects of the present invention are not impaired.
- One type of crosslinking agent may be sufficient and 2 or more types may be sufficient as it.
- a crosslinking agent preferably an isocyanate crosslinking agent, an epoxy crosslinking agent, a melamine crosslinking agent, a peroxide crosslinking agent, a urea crosslinking agent, a metal alkoxide crosslinking agent, a metal chelate crosslinking agent.
- the content of the crosslinking agent in the antistatic layer C2 is preferably 1% by weight to 30% by weight, and more preferably 2% by weight to 20% by weight.
- the antistatic layer C2 may contain any appropriate other component as long as the effects of the present invention are not impaired.
- the thickness of the antistatic layer A3 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.
- the antistatic layer A3 may be a single layer or two or more layers.
- any appropriate antistatic layer can be adopted as long as the effect of the present invention is not impaired as long as the layer can exhibit an antistatic effect.
- the method described in the item ⁇ Antistatic layer C2> is preferably used.
- any appropriate conductive polymer can be adopted as long as the effects of the present invention are not impaired.
- Examples of such a conductive polymer include the conductive polymers described in the section ⁇ Antistatic layer C2>.
- the thickness of the separator Q any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
- the separator Q preferably includes a base material layer B1.
- base material layer B1 a base material formed of any appropriate material can be adopted depending on the purpose within a range not impairing the effects of the present invention. As such a material, what was illustrated by the item of ⁇ base material layer A1> is mentioned, for example.
- the base material layer B1 may be only one layer or two or more layers.
- the thickness of the base material layer B any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 4 ⁇ m to 500 ⁇ m, more preferably 10 ⁇ m to 400 ⁇ m, still more preferably 15 ⁇ m to 350 ⁇ m, and particularly preferably 20 ⁇ m to 300 ⁇ m.
- the base material layer B1 may contain an antistatic agent described later.
- base material layer B1 containing an antistatic agent the resin sheet in which the antistatic agent was kneaded can be used, for example.
- Such a resin sheet can be formed from a composition for forming the base layer B1 containing a resin and an antistatic agent.
- the base material layer B1 itself may act as an antistatic agent.
- the base material layer B1 itself can act as an antistatic agent.
- the base material layer B1 may be subjected to a surface treatment.
- the surface treatment include corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high piezoelectric exposure, ionizing radiation treatment, and coating treatment with a primer.
- Examples of the organic coating material include those exemplified in the item ⁇ Substrate Layer A1>.
- the base material layer B1 may contain any appropriate other additive depending on the purpose as long as the effects of the present invention are not impaired.
- the base material layer B1 may be subjected to a release treatment.
- a mold release process any appropriate mold release process can be adopted as long as the effects of the present invention are not impaired.
- the surface subjected to the mold release treatment is the pressure-sensitive adhesive layer A2 side.
- the separator Q may have a release layer B2.
- the release layer B2 is preferably on the pressure-sensitive adhesive layer A2 side.
- the release layer B2 is preferably provided to improve the peelability from the pressure-sensitive adhesive layer A2.
- Any appropriate forming material can be adopted as the forming material of the release layer B2 as long as the effects of the present invention are not impaired.
- Examples of such a forming material include a silicone release agent, a fluorine release agent, a long-chain alkyl release agent, and a fatty acid amide release agent. Of these, silicone release agents are preferred.
- the release layer B2 can be formed as a coating layer.
- the thickness of the release layer B2 any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention.
- the thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, still more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.
- the release layer B2 may be only one layer or two or more layers.
- silicone release layer examples include addition reaction type silicone resins.
- KS-774, KS-775, KS-778, KS-779H, KS-847H, KS-847T manufactured by Shin-Etsu Chemical
- Toray Dow -Corning SD7220, SD7226; etc. are mentioned.
- the coating amount (after drying) of the silicone release layer is preferably 0.01 g / m 2 to 2 g / m 2 , more preferably 0.01 g / m 2 to 1 g / m 2 , and still more preferably 0.01 g / m 2 to 0.5 g / m 2 .
- the release layer B2 is formed, for example, by applying the above-mentioned forming material on any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, die coating, etc. It can carry out by making it harden
- the separator Q may include any appropriate other layer depending on the purpose as long as the effects of the present invention are not impaired.
- the reinforcing film with a separator of the present invention can be obtained by laminating the reinforcing film P and the separator Q so that the conductive adhesive layer A2 and the separator Q are directly laminated.
- one embodiment of the reinforcing film with a separator of the present invention comprises a reinforcing film P composed of a base layer A1, a conductive layer C1, and an adhesive layer A2, and a base layer B1.
- the separator Q has a form in which the pressure-sensitive adhesive layer A2 and the separator Q are laminated so as to be directly laminated.
- FIG. 4 Another embodiment of the reinforcing film with a separator of the present invention is, as shown in FIG. 4, a reinforcing film P composed of a base material layer A1, an antistatic layer C2, and an adhesive layer A2, and a base material layer.
- the separator Q made of B1 is bonded to the adhesive layer A2 and the separator Q so as to be directly laminated.
- the reinforcing film with a separator of the present invention is the adhesive layer A2 when the separator Q is peeled from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min.
- the surface peeling band voltage is preferably 10.0 kV or less, more preferably 0.001 kV to 9 kV, still more preferably 0.002 kV to 8 kV, and particularly preferably 0.003 kV to 7 kV.
- the peeling voltage on the surface of the pressure-sensitive adhesive layer A2 is within the above range, the peeling charge that can be generated when the separator Q is peeled off can be further suppressed, and it is bonded in advance to the exposed surface side of an optical member or an electronic member. Even if the separator is peeled from the reinforcing film with a separator, damage to the optical member and the electronic member can be further reduced.
- the transmittance of the reinforcing film P is preferably 70% or more, more preferably 75% or more, still more preferably 80% or more, and particularly preferably 85. % Or more. If the transmittance of the reinforcing film P is within the above range, for example, it can be used without impairing the optical properties of the optical member when bonded to the optical member.
- the reinforcing film with a separator of the present invention is an adhesive for a glass plate after peeling the separator Q from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 150 degrees and a peeling speed of 10 m / min.
- the initial adhesive strength of the layer A2 at a temperature of 23 ° C., a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is preferably 1.0 N / 25 mm or more, more preferably 1.0 N / 25 mm to 50 N / 25 mm, more preferably 1.0 N / 25 mm to 45 N / 25 mm, and particularly preferably 1.0 N / 25 mm to 40 N / 25 mm. If the initial adhesive force of the adhesive layer A2 to the glass plate is within the above range, good adhesion can be obtained, and poor adhesion to the adherend can be reduced.
- the reinforcing film with a separator of the present invention preferably has a peeling force when the separator Q is peeled off from the reinforcing film P at a temperature of 23 ° C. and a humidity of 50% RH at a peeling angle of 180 degrees and a tensile speed of 300 mm / min. 0.30 N / 25 mm or less, more preferably 0.005 N / 25 mm to 0.30 N / 25 mm, still more preferably 0.0075 N / 25 mm to 0.30 N / 25 mm, and particularly preferably 0.01 N / It is 25 mm to 0.30 N / 25 mm.
- the peeling force when the reinforcing film with a separator is handled, it can be reduced that the separator is accidentally peeled off from the reinforcing film, and the adhesive of the reinforcing film is peeled off when the separator is peeled off. It can reduce cohesive failure or throwing failure of the agent layer.
- test and evaluation method in an Example etc. are as follows. Note that “parts” means “parts by weight” unless otherwise noted, and “%” means “% by weight” unless otherwise noted.
- the weight average molecular weight was measured by a gel permeation chromatograph (GPC) method. Specifically, using a trade name “HLC-8120GPC” (manufactured by Tosoh Corporation) as a GPC measuring apparatus, the measurement was performed under the following conditions, and the standard polystyrene equivalent was calculated.
- GPC gel permeation chromatograph
- peeling is performed using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peeling angle of 180 degrees and a pulling speed of 300 mm / min.
- TCM-1kNB universal tensile tester
- cyclohexyl methacrylate as a monomer component [glass transition temperature of homopolymer (polycyclohexyl methacrylate): 66 ° C.]: 95 parts by weight, acrylic acid: 5 parts by weight, ⁇ -methylstyrene dimer as a chain transfer agent: 10 parts by weight, 2,2′-azobisisobutyronitrile as a polymerization initiator: 10 parts by weight, and toluene as a polymerization solvent: 120 parts by weight are charged into a separable flask, and nitrogen gas is introduced. The mixture was stirred for 1 hour. After removing oxygen in the polymerization system in this way, the temperature was raised to 85 ° C.
- an acrylic oligomer solution having a solid content concentration of 50% by weight.
- the weight average molecular weight of the acrylic oligomer in the obtained acrylic oligomer solution was 4000.
- a silane coupling agent ⁇ -glycidoxypropyltrimethoxysilane, trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.
- KBM403 ⁇ -glycidoxypropyltrimethoxysilane
- KBM403 trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.
- a crosslinking agent epoxy crosslinking agent, trade name “TETRAD-C”, manufactured by Mitsubishi Gas Chemical Co., Ltd.
- the acrylic oligomer solution is added so as to be 0.075 parts by weight in terms of solid content with respect to parts by weight, and the acrylic oligomer solution is further converted into an acrylic oligomer in terms of solid content with respect to 100 parts by weight of acrylic polymer (solid content).
- the pressure-sensitive adhesive composition (1) was produced by adding the mixture so that the amount was 25 parts by weight, and mixing them.
- an aqueous solution for an antistatic layer was produced.
- the antistatic layer aqueous solution was applied to one surface of a 75 ⁇ m thick polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) so that the thickness after drying was 15 nm.
- PET polyethylene terephthalate
- the coated material was heated at 130 ° C. for 1 minute and dried to produce a base material (1) with an antistatic layer having an antistatic layer on one surface of the PET film.
- the surface resistance value of the antistatic layer was 4.3 ⁇ 10 8 ⁇ / ⁇ .
- PET film Polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) having a thickness of 75 ⁇ m, 97% by weight of indium oxide and tin oxide on one surface
- PET film polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) having a thickness of 75 ⁇ m, 97% by weight of indium oxide and tin oxide on one surface
- An indium tin oxide layer having a thickness of 25 nm was formed by a sputtering method in a sputtering apparatus provided with a fired body target containing 3% by weight. Subsequently, it heat-processed for 90 minutes at 150 degreeC, the indium tin oxide layer was converted from amorphous to crystalline, and the base material (1) with a conductive layer which has a conductive layer on one side of PET film was manufactured.
- the surface resistance value of the conductive layer was 1.0 ⁇ 10
- Example 1 The pressure-sensitive adhesive composition (1) obtained in Production Example 1 so that the thickness after drying on the surface of the base material with antistatic layer (1) obtained in Production Example 3 is 25 ⁇ m after drying. Is applied and dried at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is applied to the surface of the formed adhesive layer. Bonding and a reinforcing film (1) with a separator were obtained. The results are shown in Table 1.
- Example 2 The same procedure as in Example 1 was carried out except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1. A film (2) was obtained. The results are shown in Table 1.
- Example 3 The pressure-sensitive adhesive composition (1) obtained in Production Example 1 is applied to the surface on the conductive layer side of the substrate with conductive layer (1) obtained in Production Example 4 so that the thickness after drying is 25 ⁇ m. Then, drying is performed at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is bonded to the surface of the formed adhesive layer. A separator reinforcing film (3) was obtained. The results are shown in Table 1.
- Comparative Example 2 The same procedure as in Comparative Example 1 was conducted except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1, and for reinforcement with a separator. A film (C2) was obtained. The results are shown in Table 1.
- the reinforcing film with a separator of the present invention can be used as a reinforcing film to be bonded to the back side of a substrate of a semiconductor element.
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Abstract
Description
補強用フィルムPとセパレーターQを有するセパレーター付補強用フィルムであって、
該補強用フィルムPが基材層A1と粘着剤層A2を含み、
該基材層A1と該粘着剤層A2の間に導電層C1および/または帯電防止層C2が配置され、
該粘着剤層A2とセパレーターQが直接に積層されてなる。 The reinforcing film with a separator of the present invention is
A reinforcing film with a separator having a reinforcing film P and a separator Q,
The reinforcing film P includes a base layer A1 and an adhesive layer A2,
A conductive layer C1 and / or an antistatic layer C2 is disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2,
The pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
本発明のセパレーター付補強用フィルムは、補強用フィルムPとセパレーターQを有するセパレーター付補強用フィルムである。本発明のセパレーター付補強用フィルムは、補強用フィルムPとセパレーターQを有していれば、本発明の効果を損なわない範囲で、任意の適切な他の層を有していてもよい。 ≪≪Reinforcing film with separator≫≫
The reinforcing film with a separator of the present invention is a reinforcing film with a separator having a reinforcing film P and a separator Q. As long as the reinforcing film with a separator of the present invention has the reinforcing film P and the separator Q, the reinforcing film may have any other appropriate layer as long as the effects of the present invention are not impaired.
補強用フィルムPの厚みとしては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な厚みを採用し得る。このような厚みとしては、好ましくは5μm~800μmであり、より好ましくは10μm~650μmであり、さらに好ましくは20μm~550μmであり、特に好ましくは25μm~450μmである。 ≪Reinforcing film P≫
As the thickness of the reinforcing film P, any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention. The thickness is preferably 5 μm to 800 μm, more preferably 10 μm to 650 μm, still more preferably 20 μm to 550 μm, and particularly preferably 25 μm to 450 μm.
基材層A1としては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な材料から形成される基材を採用し得る。このような材料としては、例えば、樹脂シート、不織布、紙、金属箔、織布、ゴムシート、発泡シート、これらの積層体(特に、樹脂シートを含む積層体)などが挙げられる。 <Base material layer A1>
As base material layer A1, the base material formed from arbitrary appropriate materials can be employ | adopted according to the objective in the range which does not impair the effect of this invention. Examples of such materials include resin sheets, nonwoven fabrics, paper, metal foils, woven fabrics, rubber sheets, foam sheets, and laminates thereof (particularly laminates including resin sheets).
粘着剤層A2の厚みとしては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な厚みを採用し得る。このような厚みとしては、好ましくは1μm~300μmであり、より好ましくは2μm~250μmであり、さらに好ましくは4μm~200μmであり、特に好ましくは5μm~150μmである。 <Adhesive layer A2>
As thickness of adhesive layer A2, arbitrary appropriate thickness can be employ | adopted according to the objective in the range which does not impair the effect of this invention. The thickness is preferably 1 μm to 300 μm, more preferably 2 μm to 250 μm, still more preferably 4 μm to 200 μm, and particularly preferably 5 μm to 150 μm.
導電層C1は、基材層A1と粘着剤層A2の間に配置され得る。 <Conductive layer C1>
The conductive layer C1 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
帯電防止層C2は、基材層A1と粘着剤層A2の間に配置され得る。 <Antistatic layer C2>
The antistatic layer C2 can be disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2.
帯電防止層A3の厚みとしては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な厚みを採用し得る。このような厚みとしては、好ましくは1nm~1000nmであり、より好ましくは5nm~900nmであり、さらに好ましくは7.5nm~800nmであり、特に好ましくは10nm~700nmである。 <Antistatic layer A3>
As the thickness of the antistatic layer A3, any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention. The thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, still more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.
セパレーターQの厚みとしては、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な厚みを採用し得る。このような厚みとしては、好ましくは4μm~500μmであり、より好ましくは10μm~400μmであり、さらに好ましくは15μm~350μmであり、特に好ましくは20μm~300μmである。 ≪Separator Q≫
As the thickness of the separator Q, any appropriate thickness can be adopted depending on the purpose within a range not impairing the effects of the present invention. The thickness is preferably 4 μm to 500 μm, more preferably 10 μm to 400 μm, still more preferably 15 μm to 350 μm, and particularly preferably 20 μm to 300 μm.
セパレーターQは、好ましくは、基材層B1を含む。 <Base material layer B1>
The separator Q preferably includes a base material layer B1.
セパレーターQは、離型層B2を有していてもよい。この場合、離型層B2が、粘着剤層A2側となることが好ましい。 <Release layer B2>
The separator Q may have a release layer B2. In this case, the release layer B2 is preferably on the pressure-sensitive adhesive layer A2 side.
セパレーターQは、本発明の効果を損なわない範囲で、目的に応じて、任意の適切な他の層を含み得る。 <Other layers>
The separator Q may include any appropriate other layer depending on the purpose as long as the effects of the present invention are not impaired.
本発明のセパレーター付補強用フィルムは、補強用フィルムPとセパレーターQを、導粘着剤層A2とセパレーターQが直接に積層されてなるように張り合わせることにより得ることができる。 ≪Reinforcing film with separator≫
The reinforcing film with a separator of the present invention can be obtained by laminating the reinforcing film P and the separator Q so that the conductive adhesive layer A2 and the separator Q are directly laminated.
重量平均分子量は、ゲルパーミエーションクロマトグラフ(GPC)法により測定した。具体的には、GPC測定装置として、商品名「HLC-8120GPC」(東ソー株式会社製)を用いて、下記の条件にて測定し、標準ポリスチレン換算値により算出した。
(分子量測定条件)
・サンプル濃度:0.2重量%(テトラヒドロフラン溶液)
・サンプル注入量:10μL
・カラム:商品名「TSKguardcolumn SuperHZ-H(1本)+TSKgel SuperHZM-H(2本)」(東ソー株式会社製)
・リファレンスカラム:商品名「TSKgel SuperH-RC(1本)」(東ソー株式会社製)
・溶離液:テトラヒドロフラン(THF)
・流量:0.6mL/min
・検出器:示差屈折計(RI)
・カラム温度(測定温度):40℃ <Measurement of weight average molecular weight>
The weight average molecular weight was measured by a gel permeation chromatograph (GPC) method. Specifically, using a trade name “HLC-8120GPC” (manufactured by Tosoh Corporation) as a GPC measuring apparatus, the measurement was performed under the following conditions, and the standard polystyrene equivalent was calculated.
(Molecular weight measurement conditions)
Sample concentration: 0.2% by weight (tetrahydrofuran solution)
Sample injection volume: 10 μL
Column: Trade name “TSKguardcolumn SuperHZ-H (1) + TSKgel SuperHZM-H (2)” (manufactured by Tosoh Corporation)
Reference column: Trade name “TSKgel SuperH-RC (1)” (manufactured by Tosoh Corporation)
・ Eluent: Tetrahydrofuran (THF)
・ Flow rate: 0.6mL / min
・ Detector: Differential refractometer (RI)
Column temperature (measurement temperature): 40 ° C
温度23℃、湿度50%RHにおいて、抵抗率計(三菱化学アナリティック社製、ハイレスタUP MCP-HT450型)を用い、JIS-K-6911に準じて測定を行った。 <Measurement of surface resistance value>
The measurement was performed according to JIS-K-6911 using a resistivity meter (Hiresta UP MCP-HT450 type, manufactured by Mitsubishi Chemical Analytic Co., Ltd.) at a temperature of 23 ° C. and a humidity of 50% RH.
剥離ライナーを剥がした後の補強用フィルムの全光線透過率を、JIS-K-7361に準拠して、ヘイズメーター(村上色彩技術研究所製、商品名「HM-150」)を用いて測定した。 <Measurement of transmittance>
The total light transmittance of the reinforcing film after peeling off the release liner was measured using a haze meter (trade name “HM-150” manufactured by Murakami Color Research Laboratory) in accordance with JIS-K-7361. .
予め除電しておいたセパレーター付補強用フィルムを幅70mm、長さ130mmサイズにカットし、セパレーターを剥離して10秒後の粘着剤層表面の電位を、30mm離れた位置に固定した静電電位測定器(シシド静電気株式会社、STATIRON DZ4)にて測定した。測定は、温度23℃、湿度50%RHの環境下にて行った。なお、セパレーターの剥離は、セパレーターを自動巻き取り機に固定し、温度23℃、湿度50%RHにおいて、剥離角度150度、剥離速度10m/分となるようにして剥離した。 <Measurement of peeling voltage on pressure-sensitive adhesive layer surface>
An electrostatic potential in which a reinforcing film with a separator that has been previously neutralized is cut to a size of 70 mm in width and 130 mm in length, the separator is peeled off, and the potential on the surface of the
予め除電しておいたセパレーター付補強用フィルムを幅25mm、長さ150mmに切断し、評価用サンプルとした。温度23℃、湿度50%RHの雰囲気下で、評価用サンプルの粘着剤層表面をガラス板(松浪硝子工業株式会社製、商品名:マイクロスライドガラスS)に、2.0kgローラー1往復により貼り付けた。温度23℃、湿度50%RHの雰囲気下で30分間養生した後、万能引張試験機(ミネベア株式会社製、製品名:TCM-1kNB)を用い、剥離角度180度、引っ張り速度300mm/分で剥離し、粘着力を測定した。 <Measurement of initial adhesive strength of adhesive layer to glass plate>
A reinforcing film with a separator, which had been previously neutralized, was cut into a width of 25 mm and a length of 150 mm to obtain a sample for evaluation. In an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH, the adhesive layer surface of the sample for evaluation is attached to a glass plate (Matsunami Glass Industry Co., Ltd., trade name: Micro Slide Glass S) by one reciprocating 2.0 kg roller. I attached. After curing for 30 minutes in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH, peeling is performed using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peeling angle of 180 degrees and a pulling speed of 300 mm / min. The adhesive strength was measured.
予め除電しておいたセパレーター付補強用フィルムを幅25mm、長さ150mmに切断し、評価用サンプルとした。補強用の基材面がアクリル板に接するように補強用フィルムを固定し、温度23℃、湿度50%RHの雰囲気下で、万能引張試験機(ミネベア株式会社製、製品名:TCM-1kNB)を用い、剥離角度180度、引っ張り速度300mm/分でセパレーターを剥離し、セパレーター剥離力を測定した。 <Measurement of peel strength of separator>
A reinforcing film with a separator, which had been previously neutralized, was cut into a width of 25 mm and a length of 150 mm to obtain a sample for evaluation. Fixing the reinforcing film so that the surface of the reinforcing substrate is in contact with the acrylic plate, in an atmosphere of a temperature of 23 ° C. and a humidity of 50% RH, a universal tensile tester (product name: TCM-1kNB, manufactured by Minebea Co., Ltd.) The separator was peeled at a peeling angle of 180 degrees and a pulling speed of 300 mm / min, and the separator peeling force was measured.
モノマー成分としてのアクリル酸n-ブチル(BA):95重量部、アクリル酸(AA):5重量部、および、重合溶媒としての酢酸エチル:185.7重量部をセパラブルフラスコに投入し、窒素ガスを導入しながら1時間撹拌した。このようにして重合系内の酸素を除去した後、63℃に昇温して10時間反応させ、トルエンを加えて、固形分濃度25重量%のアクリル系ポリマー溶液を得た。得られたアクリル系ポリマー溶液中のアクリル系ポリマーの重量平均分子量は60万であった。
次に、モノマー成分としてのメタクリル酸シクロヘキシル[ホモポリマー(ポリメタクリル酸シクロヘキシル)のガラス転移温度:66℃]:95重量部、アクリル酸:5重量部、連鎖移動剤としてのα-メチルスチレンダイマー:10重量部、重合開始剤としての2,2’-アゾビスイソブチロニトリル:10重量部、および、重合溶媒としてのトルエン:120重量部を、セパラブルフラスコに投入し、窒素ガスを導入しながら、1時間攪拌した。このようにして、重合系内の酸素を除去した後、85℃に昇温し、5時間反応させて、固形分濃度50重量%のアクリル系オリゴマー溶液を得た。得られたアクリル系オリゴマー溶液中のアクリル系オリゴマーの重量平均分子量は4000であった。
次に、上記アクリル系ポリマー溶液に、シランカップリング剤(γ-グリシドキシプロピルトリメトキシシラン、商品名「KBM403」、信越化学工業株式会社製)をアクリル系ポリマー(固形分)100重量部に対して固形分換算で0.15重量部となるように添加し、架橋剤(エポキシ系架橋剤、商品名「TETRAD-C」、三菱ガス化学株式会社製)をアクリル系ポリマー(固形分)100重量部に対して固形分換算で0.075重量部となるように添加して、さらに、上記アクリル系オリゴマー溶液をアクリル系ポリマー(固形分)100重量部に対して固形分換算でアクリル系オリゴマーの量が25重量部となるように添加し、これを混合することによって粘着剤組成物(1)を製造した。 [Production Example 1]: Production of pressure-sensitive adhesive composition (1) n-butyl acrylate (BA) as a monomer component: 95 parts by weight, acrylic acid (AA): 5 parts by weight, and ethyl acetate as a polymerization solvent 185.7 parts by weight were put into a separable flask and stirred for 1 hour while introducing nitrogen gas. After removing oxygen in the polymerization system in this way, the temperature was raised to 63 ° C. and reacted for 10 hours, and toluene was added to obtain an acrylic polymer solution having a solid content concentration of 25% by weight. The weight average molecular weight of the acrylic polymer in the obtained acrylic polymer solution was 600,000.
Next, cyclohexyl methacrylate as a monomer component [glass transition temperature of homopolymer (polycyclohexyl methacrylate): 66 ° C.]: 95 parts by weight, acrylic acid: 5 parts by weight, α-methylstyrene dimer as a chain transfer agent: 10 parts by weight, 2,2′-azobisisobutyronitrile as a polymerization initiator: 10 parts by weight, and toluene as a polymerization solvent: 120 parts by weight are charged into a separable flask, and nitrogen gas is introduced. The mixture was stirred for 1 hour. After removing oxygen in the polymerization system in this way, the temperature was raised to 85 ° C. and reacted for 5 hours to obtain an acrylic oligomer solution having a solid content concentration of 50% by weight. The weight average molecular weight of the acrylic oligomer in the obtained acrylic oligomer solution was 4000.
Next, a silane coupling agent (γ-glycidoxypropyltrimethoxysilane, trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.) is added to 100 parts by weight of the acrylic polymer (solid content) in the acrylic polymer solution. In contrast, 0.15 parts by weight in terms of solid content was added, and a crosslinking agent (epoxy crosslinking agent, trade name “TETRAD-C”, manufactured by Mitsubishi Gas Chemical Co., Ltd.) was added to an acrylic polymer (solid content) 100. The acrylic oligomer solution is added so as to be 0.075 parts by weight in terms of solid content with respect to parts by weight, and the acrylic oligomer solution is further converted into an acrylic oligomer in terms of solid content with respect to 100 parts by weight of acrylic polymer (solid content). The pressure-sensitive adhesive composition (1) was produced by adding the mixture so that the amount was 25 parts by weight, and mixing them.
シランカップリング剤(γ-グリシドキシプロピルトリメトキシシラン、商品名「KBM403」、信越化学工業株式会社製)の添加量を、アクリル系ポリマー(固形分)100重量部に対して固形分換算で2重量部に変更した以外は、製造例1と同様に行い、粘着剤組成物(2)を製造した。 [Production Example 2]: Production of pressure-sensitive adhesive composition (2) The amount of silane coupling agent (γ-glycidoxypropyltrimethoxysilane, trade name “KBM403”, manufactured by Shin-Etsu Chemical Co., Ltd.) Except having changed into 2 weight part in conversion of solid content with respect to 100 weight part of polymers (solid content), it carried out similarly to manufacture example 1 and manufactured the adhesive composition (2).
バインダとしてポリエステル樹脂「バイロナールMD-1480」(25%水溶液、東洋紡社製)、導電性ポリマーとしてポリ(3,4-エチレンジオキシチオフェン)(PEDOT)0.5%およびポリスチレンスルホネート(重量平均分子量15万)(PSS)0.8%を含む水溶液(Bytron P、H.C.Stark社製)を、水/エタノール(1/1)の混合溶媒に、バインダを固形分量で100質量部と、導電性ポリマーを固形分量で50質量部と、メラミン系架橋剤とを加え、約20分間撹拌して十分に混合した。このようにして、帯電防止層用水溶液を製造した。
厚み75μmのポリエチレンテレフタレート(PET)フィルム(ポリエステルフィルム、S10、東レ社製)の一方の面に、上記帯電防止層用水溶液を、乾燥後の厚みが15nmとなるように塗布した。この塗布物を130℃で1分間加熱して乾燥させることにより、PETフィルムの一方の面に帯電防止層を有する帯電防止層付基材(1)を製造した。
帯電防止層の表面抵抗値は4.3×108Ω/□であった。 [Production Example 3]: Production of substrate with antistatic layer (1) Polyester resin “Vylonal MD-1480” (25% aqueous solution, manufactured by Toyobo Co., Ltd.) as a binder, and poly (3,4-ethylenedioxy) as a conductive polymer An aqueous solution (Bytron P, manufactured by HC Stark) containing 0.5% thiophene (PEDOT) and 0.8% polystyrene sulfonate (weight average molecular weight 150,000) (PSS) was added to water / ethanol (1/1 ), 100 parts by mass of the binder in a solid amount, 50 parts by mass of the conductive polymer in a solid content, and a melamine-based crosslinking agent were added to the mixed solvent, and the mixture was stirred and mixed for about 20 minutes. In this way, an aqueous solution for an antistatic layer was produced.
The antistatic layer aqueous solution was applied to one surface of a 75 μm thick polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) so that the thickness after drying was 15 nm. The coated material was heated at 130 ° C. for 1 minute and dried to produce a base material (1) with an antistatic layer having an antistatic layer on one surface of the PET film.
The surface resistance value of the antistatic layer was 4.3 × 10 8 Ω / □.
厚み75μmのポリエチレンテレフタレート(PET)フィルム(ポリエステルフィルム、S10、東レ社製)の一方の面に、酸化インジウムを97重量%、酸化スズを3重量%含む焼成体ターゲットを設置したスパッタ装置内にて、スパッタ法により、厚み25nmのインジウムスズ酸化物層を形成した。次いで、150℃で90分間加熱処理し、インジウムスズ酸化物層を非晶質から結晶質に転化させ、PETフィルムの一方の面に導電層を有する導電層付基材(1)を製造した。
導電層の表面抵抗値は1.0×103Ω/□であった。 [Production Example 4]: Production of substrate with conductive layer (1) Polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) having a thickness of 75 μm, 97% by weight of indium oxide and tin oxide on one surface An indium tin oxide layer having a thickness of 25 nm was formed by a sputtering method in a sputtering apparatus provided with a fired body target containing 3% by weight. Subsequently, it heat-processed for 90 minutes at 150 degreeC, the indium tin oxide layer was converted from amorphous to crystalline, and the base material (1) with a conductive layer which has a conductive layer on one side of PET film was manufactured.
The surface resistance value of the conductive layer was 1.0 × 10 3 Ω / □.
製造例3で得られた帯電防止層付基材(1)の帯電防止層側の表面に、乾燥後の厚みが25μmとなるように、製造例1で得られた粘着剤組成物(1)を塗布し、130℃で3分間乾燥を行い、形成された粘着剤層の表面にセパレーター(離形処理されたPET(ポリエチレンテレフタレート)フィルム、商品名「ダイアホイルMRF38」、三菱樹脂社製)を貼り合せ、セパレーター付補強用フィルム(1)を得た。
結果を表1に示した。 [Example 1]
The pressure-sensitive adhesive composition (1) obtained in Production Example 1 so that the thickness after drying on the surface of the base material with antistatic layer (1) obtained in Production Example 3 is 25 μm after drying. Is applied and dried at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is applied to the surface of the formed adhesive layer. Bonding and a reinforcing film (1) with a separator were obtained.
The results are shown in Table 1.
製造例1で得られた粘着剤組成物(1)に代えて、製造例2で得られた粘着剤組成物(2)を用いた以外は、実施例1と同様に行い、セパレーター付補強用フィルム(2)を得た。
結果を表1に示した。 [Example 2]
The same procedure as in Example 1 was carried out except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1. A film (2) was obtained.
The results are shown in Table 1.
製造例4で得られた導電層付基材(1)の導電層側の表面に、乾燥後の厚みが25μmとなるように、製造例1で得られた粘着剤組成物(1)を塗布し、130℃で3分間乾燥を行い、形成された粘着剤層の表面にセパレーター(離形処理されたPET(ポリエチレンテレフタレート)フィルム、商品名「ダイアホイルMRF38」、三菱樹脂社製)を貼り合せ、セパレーター付補強用フィルム(3)を得た。
結果を表1に示した。 Example 3
The pressure-sensitive adhesive composition (1) obtained in Production Example 1 is applied to the surface on the conductive layer side of the substrate with conductive layer (1) obtained in Production Example 4 so that the thickness after drying is 25 μm. Then, drying is performed at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is bonded to the surface of the formed adhesive layer. A separator reinforcing film (3) was obtained.
The results are shown in Table 1.
厚み75μmのポリエチレンテレフタレート(PET)フィルム(ポリエステルフィルム、S10、東レ社製)の一方の面に、乾燥後の厚みが25μmとなるように、製造例1で得られた粘着剤組成物(1)を塗布し、130℃で3分間乾燥を行い、形成された粘着剤層の表面にセパレーター(離形処理されたPET(ポリエチレンテレフタレート)フィルム、商品名「ダイアホイルMRF38」、三菱樹脂社製)を貼り合せ、セパレーター付補強用フィルム(C1)を得た。
結果を表1に示した。 [Comparative Example 1]
The pressure-sensitive adhesive composition (1) obtained in Production Example 1 so that the thickness after drying is 25 μm on one surface of a 75 μm-thick polyethylene terephthalate (PET) film (polyester film, S10, manufactured by Toray Industries, Inc.) Is applied and dried at 130 ° C. for 3 minutes, and a separator (molded PET (polyethylene terephthalate) film, trade name “Diafoil MRF38”, manufactured by Mitsubishi Plastics) is applied to the surface of the formed adhesive layer. Bonding and a reinforcing film with a separator (C1) were obtained.
The results are shown in Table 1.
製造例1で得られた粘着剤組成物(1)に代えて、製造例2で得られた粘着剤組成物(2)を用いた以外は、比較例1と同様に行い、セパレーター付補強用フィルム(C2)を得た。
結果を表1に示した。 [Comparative Example 2]
The same procedure as in Comparative Example 1 was conducted except that the pressure-sensitive adhesive composition (2) obtained in Production Example 2 was used in place of the pressure-sensitive adhesive composition (1) obtained in Production Example 1, and for reinforcement with a separator. A film (C2) was obtained.
The results are shown in Table 1.
100 補強用フィルムP
200 セパレーターQ
10 基材層A1
20 粘着剤層A2
30 導電層C1
40 帯電防止層C2
1000 Reinforcing film with
200 Separator Q
10 Base material layer A1
20 Adhesive layer A2
30 Conductive layer C1
40 Antistatic layer C2
Claims (7)
- 補強用フィルムPとセパレーターQを有するセパレーター付補強用フィルムであって、
該補強用フィルムPが基材層A1と粘着剤層A2を含み、
該基材層A1と該粘着剤層A2の間に導電層C1および/または帯電防止層C2が配置され、
該粘着剤層A2とセパレーターQが直接に積層されてなる、
セパレーター付補強用フィルム。 A reinforcing film with a separator having a reinforcing film P and a separator Q,
The reinforcing film P includes a base layer A1 and an adhesive layer A2,
A conductive layer C1 and / or an antistatic layer C2 is disposed between the base material layer A1 and the pressure-sensitive adhesive layer A2,
The pressure-sensitive adhesive layer A2 and the separator Q are directly laminated.
Reinforcing film with separator. - 前記導電層C1の表面抵抗値が1.0×1010Ω/□以下である、請求項1に記載のセパレーター付補強用フィルム。 The reinforcing film with a separator according to claim 1, wherein the conductive layer C <b> 1 has a surface resistance value of 1.0 × 10 10 Ω / □ or less.
- 前記帯電防止層C2の表面抵抗値が1.0×1010Ω/□以下である、請求項1に記載のセパレーター付補強用フィルム。 The reinforcing film with a separator according to claim 1, wherein the antistatic layer C <b> 2 has a surface resistance value of 1.0 × 10 10 Ω / □ or less.
- 温度23℃、湿度50%RHにおいて、剥離角度150度、剥離速度10m/分で、前記補強用フィルムPから前記セパレーターQを剥離したときの、前記粘着剤層A2の表面の剥離帯電圧が10.0kV以下である、請求項1から3までのいずれかに記載のセパレーター付補強用フィルム。 When the separator Q was peeled from the reinforcing film P at a peeling angle of 150 degrees and a peeling speed of 10 m / min at a temperature of 23 ° C. and a humidity of 50% RH, the peeling voltage on the surface of the pressure-sensitive adhesive layer A2 was 10 The reinforcing film with a separator according to any one of claims 1 to 3, which is 0.0 kV or less.
- 前記補強用フィルムPの透過率が70%以上である、請求項1から4までのいずれかに記載のセパレーター付補強用フィルム。 The reinforcing film with a separator according to any one of claims 1 to 4, wherein the transmittance of the reinforcing film P is 70% or more.
- 温度23℃、湿度50%RHにおいて、剥離角度150度、剥離速度10m/分で、前記補強用フィルムPから前記セパレーターQを剥離した後における、ガラス板に対する前記粘着剤層A2の、温度23℃、湿度50%RH、剥離角度180度、引張速度300mm/分での初期粘着力が1.0N/25mm以上である、請求項1から5までのいずれかに記載のセパレーター付補強用フィルム。 The temperature of the pressure-sensitive adhesive layer A2 on the glass plate after peeling the separator Q from the reinforcing film P at a peeling angle of 150 degrees and a peeling speed of 10 m / min at a temperature of 23 ° C. and a humidity of 50% RH is a temperature of 23 ° C. The reinforcing film with a separator according to any one of claims 1 to 5, wherein the initial adhesive strength at a humidity of 50% RH, a peeling angle of 180 degrees, and a tensile speed of 300 mm / min is 1.0 N / 25 mm or more.
- 温度23℃、湿度50%RHにおいて、剥離角度180度、引張速度300mm/分で、前記補強用フィルムPから前記セパレーターQを剥離したときの剥離力が0.30N/25mm以下である、請求項1から6までのいずれかに記載のセパレーター付補強用フィルム。
The peeling force when the separator Q is peeled from the reinforcing film P at a peeling angle of 180 degrees and a tensile speed of 300 mm / min at a temperature of 23 ° C. and a humidity of 50% RH is 0.30 N / 25 mm or less. The reinforcing film with a separator according to any one of 1 to 6.
Priority Applications (3)
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CN201780043477.XA CN109476960A (en) | 2016-07-28 | 2017-07-13 | Enhancing film with isolation film |
KR1020187028802A KR102345171B1 (en) | 2016-07-28 | 2017-07-13 | Reinforcement film with separator |
JP2018529770A JP6888010B2 (en) | 2016-07-28 | 2017-07-13 | Reinforcing film with separator |
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JP2016-148044 | 2016-07-28 | ||
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PCT/JP2017/025599 WO2018021051A1 (en) | 2016-07-28 | 2017-07-13 | Separator-covered reinforcing film |
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JP (1) | JP6888010B2 (en) |
KR (1) | KR102345171B1 (en) |
CN (1) | CN109476960A (en) |
TW (2) | TW201934322A (en) |
WO (1) | WO2018021051A1 (en) |
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KR102345171B1 (en) | 2021-12-30 |
TW201934322A (en) | 2019-09-01 |
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KR20180122663A (en) | 2018-11-13 |
CN109476960A (en) | 2019-03-15 |
TWI701145B (en) | 2020-08-11 |
TW201811552A (en) | 2018-04-01 |
JP6888010B2 (en) | 2021-06-16 |
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