WO2017033833A9 - 感光性樹脂組成物、ポリイミドの製造方法および半導体装置 - Google Patents

感光性樹脂組成物、ポリイミドの製造方法および半導体装置 Download PDF

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WO2017033833A9
WO2017033833A9 PCT/JP2016/074143 JP2016074143W WO2017033833A9 WO 2017033833 A9 WO2017033833 A9 WO 2017033833A9 JP 2016074143 W JP2016074143 W JP 2016074143W WO 2017033833 A9 WO2017033833 A9 WO 2017033833A9
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Prior art keywords
resin composition
photosensitive resin
polyimide
layer
semiconductor device
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PCT/JP2016/074143
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English (en)
French (fr)
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WO2017033833A1 (ja
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友裕 頼末
義人 井戸
泰平 井上
治美 松田
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旭化成株式会社
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Application filed by 旭化成株式会社 filed Critical 旭化成株式会社
Priority to KR1020207002013A priority Critical patent/KR102229738B1/ko
Priority to US15/741,603 priority patent/US10719016B2/en
Priority to CN201680031940.4A priority patent/CN107615166B/zh
Priority to KR1020207002014A priority patent/KR102090451B1/ko
Priority to KR1020177031899A priority patent/KR20170133486A/ko
Priority to JP2017536387A priority patent/JP6297757B2/ja
Publication of WO2017033833A1 publication Critical patent/WO2017033833A1/ja
Publication of WO2017033833A9 publication Critical patent/WO2017033833A9/ja
Priority to US16/893,925 priority patent/US20200301273A1/en
Priority to US17/744,873 priority patent/US11809079B2/en

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    • G—PHYSICS
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    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0387—Polyamides or polyimides
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    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
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    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
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    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
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    • G03F7/20—Exposure; Apparatus therefor
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  • Physics & Mathematics (AREA)
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  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

高温保存試験後、Ｃｕ層の、ポリイミド層に接する界面でボイドが発生しにくく、密着性が高いポリイミド層が得られる感光性樹脂組成物、該感光性樹脂組成物を用いたポリイミドを提供することができる。及び、高温保存試験後、Ｃｕ層がポリイミド層に接する界面でボイドが発生しにくく、高温保存試験後のショートや断線が生じにくい半導体装置を提供する。　感光性ポリイミド前駆体である（Ａ）成分と、一般式（Ｂ１）で表される構造を含む（Ｂ）成分とを含有することを特徴とする感光性樹脂組成物。（式（Ｂ１）中、Ｚはイオウ又は酸素原子であり、そしてＲ１～Ｒ４は、それぞれ独立に、水素原子または１価の有機基を表す。）
PCT/JP2016/074143 2015-08-21 2016-08-18 感光性樹脂組成物、ポリイミドの製造方法および半導体装置 WO2017033833A1 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
KR1020207002013A KR102229738B1 (ko) 2015-08-21 2016-08-18 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
US15/741,603 US10719016B2 (en) 2015-08-21 2016-08-18 Photosensitive resin composition, polyimide production method, and semiconductor device
CN201680031940.4A CN107615166B (zh) 2015-08-21 2016-08-18 感光性树脂组合物、聚酰亚胺的制造方法及半导体装置
KR1020207002014A KR102090451B1 (ko) 2015-08-21 2016-08-18 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
KR1020177031899A KR20170133486A (ko) 2015-08-21 2016-08-18 감광성 수지 조성물, 폴리이미드의 제조 방법 및 반도체 장치
JP2017536387A JP6297757B2 (ja) 2015-08-21 2016-08-18 感光性樹脂組成物、ポリイミドの製造方法および半導体装置
US16/893,925 US20200301273A1 (en) 2015-08-21 2020-06-05 Photosensitive resin composition, polyimide production method, and semiconductor device
US17/744,873 US11809079B2 (en) 2015-08-21 2022-05-16 Photosensitive resin composition, polyimide production method, and semiconductor device

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JP2015163555 2015-08-21
JP2015-163555 2015-08-21
JP2016-083042 2016-04-18
JP2016083042 2016-04-18

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US16/893,925 Division US20200301273A1 (en) 2015-08-21 2020-06-05 Photosensitive resin composition, polyimide production method, and semiconductor device

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WO2017033833A1 (ja) * 2015-08-21 2017-03-02 旭化成株式会社 感光性樹脂組成物、ポリイミドの製造方法および半導体装置
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