EA201592260A1 - Полупроводниковые пленки из соединения iii-v или ii-vi на графитовых подложках - Google Patents

Полупроводниковые пленки из соединения iii-v или ii-vi на графитовых подложках

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Publication number
EA201592260A1
EA201592260A1 EA201592260A EA201592260A EA201592260A1 EA 201592260 A1 EA201592260 A1 EA 201592260A1 EA 201592260 A EA201592260 A EA 201592260A EA 201592260 A EA201592260 A EA 201592260A EA 201592260 A1 EA201592260 A1 EA 201592260A1
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EA
Eurasian Patent Office
Prior art keywords
semiconductor films
graphite substrates
connections iii
iii
connections
Prior art date
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EA201592260A
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English (en)
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EA031009B1 (ru
Inventor
Бьерн-Ове Фимланд
Дхирадж Л. Даса
Хельге Веман
Original Assignee
НОРВИДЖЕН ЮНИВЕРСИТИ ОФ САЙЕНС ЭНД ТЕКНОЛОДЖИ (ЭнТиЭнЮ)
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Publication of EA201592260A1 publication Critical patent/EA201592260A1/ru
Publication of EA031009B1 publication Critical patent/EA031009B1/ru

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    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/10Heating of the reaction chamber or the substrate
    • C30B25/105Heating of the reaction chamber or the substrate by irradiation or electric discharge
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    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/183Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
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Abstract

Композиция, включающая пленку на графитовой подложке, причем указанная пленка выращена эпитаксиально на указанной подложке, где указанная пленка содержит по меньшей мере одно соединение группы III-V или по меньшей мере одно соединение группы II-VI.
EA201592260A 2013-06-21 2014-06-23 Полупроводниковые пленки из соединения iii-v или ii-vi на графитовых подложках EA031009B1 (ru)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB1311101.8A GB201311101D0 (en) 2013-06-21 2013-06-21 Semiconducting Films
PCT/EP2014/063195 WO2014202796A1 (en) 2013-06-21 2014-06-23 Iii-v or ii-vi compound semiconductor films on graphitic substrates

Publications (2)

Publication Number Publication Date
EA201592260A1 true EA201592260A1 (ru) 2016-06-30
EA031009B1 EA031009B1 (ru) 2018-10-31

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EA201592260A EA031009B1 (ru) 2013-06-21 2014-06-23 Полупроводниковые пленки из соединения iii-v или ii-vi на графитовых подложках

Country Status (13)

Country Link
US (2) US10472734B2 (ru)
EP (1) EP3011587B1 (ru)
JP (1) JP6463743B2 (ru)
KR (1) KR102356432B1 (ru)
CN (2) CN111509039A (ru)
AU (1) AU2014283130B2 (ru)
BR (1) BR112015031712A2 (ru)
CA (1) CA2916152C (ru)
EA (1) EA031009B1 (ru)
GB (1) GB201311101D0 (ru)
HK (1) HK1223735A1 (ru)
SG (1) SG11201510517VA (ru)
WO (1) WO2014202796A1 (ru)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201021112D0 (en) 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
GB201311101D0 (en) * 2013-06-21 2013-08-07 Norwegian Univ Sci & Tech Ntnu Semiconducting Films
ES2821019T3 (es) 2015-07-13 2021-04-23 Crayonano As Nanocables o nanopirámides cultivados sobre un sustrato grafítico
US11594657B2 (en) 2015-07-13 2023-02-28 Crayonano As Nanowires/nanopyramids shaped light emitting diodes and photodetectors
KR102698244B1 (ko) 2015-07-31 2024-08-22 크래요나노 에이에스 그라파이트 기판 상에 나노와이어 또는 나노피라미드를 성장시키는 방법
US10249780B1 (en) * 2016-02-03 2019-04-02 Stc.Unm High quality AlSb for radiation detection
GB201701829D0 (en) 2017-02-03 2017-03-22 Norwegian Univ Of Science And Tech (Ntnu) Device
GB201705755D0 (en) 2017-04-10 2017-05-24 Norwegian Univ Of Science And Tech (Ntnu) Nanostructure
CN109003888A (zh) * 2018-07-20 2018-12-14 华南理工大学 硅/石墨烯复合衬底上外延生长GaN纳米柱及制备方法
CN108735866A (zh) * 2018-07-20 2018-11-02 华南理工大学 生长在Si/石墨烯复合衬底上InN纳米柱外延片及其制备方法
JP2021057366A (ja) * 2019-09-26 2021-04-08 旭化成エレクトロニクス株式会社 赤外線センサ
GB2610346A (en) * 2020-09-29 2023-03-01 Boe Technology Group Co Ltd Display panel, display apparatus, method of fabricating display panel, and counter substrate
CN114836827A (zh) * 2022-04-29 2022-08-02 中国科学院半导体研究所 量子点的制备方法

Family Cites Families (117)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4213801A (en) 1979-03-26 1980-07-22 Bell Telephone Laboratories, Incorporated Ohmic contact of N-GaAs to electrical conductive substrates by controlled growth of N-GaAs polycrystalline layers
KR20040000418A (ko) 2001-03-30 2004-01-03 더 리전트 오브 더 유니버시티 오브 캘리포니아 나노구조체 및 나노와이어의 제조 방법 및 그로부터제조되는 디바이스
JP3823784B2 (ja) 2001-09-06 2006-09-20 富士ゼロックス株式会社 ナノワイヤーおよびその製造方法、並びにそれを用いたナノネットワーク、ナノネットワークの製造方法、炭素構造体、電子デバイス
JP3679097B2 (ja) 2002-05-31 2005-08-03 株式会社光波 発光素子
US7594982B1 (en) 2002-06-22 2009-09-29 Nanosolar, Inc. Nanostructured transparent conducting electrode
US7335908B2 (en) 2002-07-08 2008-02-26 Qunano Ab Nanostructures and methods for manufacturing the same
US7608147B2 (en) 2003-04-04 2009-10-27 Qunano Ab Precisely positioned nanowhiskers and nanowhisker arrays and method for preparing them
US7354850B2 (en) 2004-02-06 2008-04-08 Qunano Ab Directionally controlled growth of nanowhiskers
US7528002B2 (en) 2004-06-25 2009-05-05 Qunano Ab Formation of nanowhiskers on a substrate of dissimilar material
GB2418532A (en) 2004-09-28 2006-03-29 Arima Optoelectronic Textured light emitting diode structure with enhanced fill factor
EP2432058B8 (en) 2004-12-09 2013-09-11 Nanosys, Inc. Nanowire-based membrane electrode assemblies for fuel cells
US7939218B2 (en) 2004-12-09 2011-05-10 Nanosys, Inc. Nanowire structures comprising carbon
EP1727216B1 (en) 2005-05-24 2019-04-24 LG Electronics, Inc. Rod type light emitting diode and method for fabricating the same
EP1952467B9 (en) 2005-11-21 2012-03-14 Nanosys, Inc. Nanowire structures comprising carbon
US7570355B2 (en) 2006-01-27 2009-08-04 Hewlett-Packard Development Company, L.P. Nanowire heterostructures and methods of forming the same
US7643136B2 (en) 2006-02-02 2010-01-05 Optilia Instrument Ab Device for inspection of narrow spaces and objects in narrow spaces
CA2643439C (en) 2006-03-10 2015-09-08 Stc.Unm Pulsed growth of gan nanowires and applications in group iii nitride semiconductor substrate materials and devices
FR2904146B1 (fr) 2006-07-20 2008-10-17 Commissariat Energie Atomique Procede de fabrication d'une nanostructure a base de nanofils interconnectes,nanostructure et utilisation comme convertisseur thermoelectrique
JP4106397B2 (ja) 2006-09-14 2008-06-25 株式会社島津製作所 光または放射線検出器の製造方法
US7442575B2 (en) 2006-09-29 2008-10-28 Texas Christian University Method of manufacturing semiconductor nanowires
US8426224B2 (en) 2006-12-18 2013-04-23 The Regents Of The University Of California Nanowire array-based light emitting diodes and lasers
US20080191317A1 (en) 2007-02-13 2008-08-14 International Business Machines Corporation Self-aligned epitaxial growth of semiconductor nanowires
CN101687631A (zh) 2007-03-28 2010-03-31 昆南诺股份有限公司 纳米线电路结构
KR100904588B1 (ko) 2007-07-05 2009-06-25 삼성전자주식회사 코어/쉘 형태의 나노와이어를 제조하는 방법, 그에 의해제조된 나노와이어 및 이를 포함하는 나노와이어 소자
US7714317B2 (en) 2007-08-30 2010-05-11 Brookhaven Science Associates, Llc Assembly of ordered carbon shells on semiconducting nanomaterials
WO2009054804A1 (en) 2007-10-26 2009-04-30 Qunano Ab Nanowire growth on dissimilar material
US8273983B2 (en) 2007-12-21 2012-09-25 Hewlett-Packard Development Company, L.P. Photonic device and method of making same using nanowires
US8435676B2 (en) 2008-01-09 2013-05-07 Nanotek Instruments, Inc. Mixed nano-filament electrode materials for lithium ion batteries
US7871653B2 (en) 2008-01-30 2011-01-18 Ocean Duke Corporation Double-stack shrimp tray
US8129763B2 (en) 2008-02-07 2012-03-06 International Business Machines Corporation Metal-oxide-semiconductor device including a multiple-layer energy filter
JP5386747B2 (ja) * 2008-02-21 2014-01-15 公益財団法人神奈川科学技術アカデミー 半導体基板、半導体素子、発光素子及び電子素子
KR101445877B1 (ko) 2008-03-24 2014-09-29 삼성전자주식회사 산화아연 나노와이어의 제조방법
TW200952184A (en) 2008-06-03 2009-12-16 Univ Nat Taiwan Structure of mixed type heterojunction thin film solar cells and its manufacturing method
JP5836122B2 (ja) 2008-07-07 2015-12-24 グロ アーベーGlo Ab ナノ構造のled
US8735797B2 (en) 2009-12-08 2014-05-27 Zena Technologies, Inc. Nanowire photo-detector grown on a back-side illuminated image sensor
WO2010056064A2 (ko) 2008-11-13 2010-05-20 주식회사 엘지화학 리튬 이차전지용 비수 전해액 및 이를 구비한 리튬 이차전지
KR101071906B1 (ko) 2008-11-14 2011-10-11 한국과학기술원 단결정 게르마늄코발트 나노와이어, 게르마늄코발트 나노와이어 구조체, 및 이들의 제조방법
CN101504961B (zh) 2008-12-16 2010-08-11 华中科技大学 面发射多色发光二极管及其制造方法
US8389387B2 (en) 2009-01-06 2013-03-05 Brookhaven Science Associates, Llc Segmented nanowires displaying locally controllable properties
KR101650310B1 (ko) 2009-01-16 2016-08-24 삼성전자주식회사 도광부재 및 이를 구비하는 제전유닛, 화상형성장치, 화상독취장치
WO2010087853A1 (en) 2009-01-30 2010-08-05 Hewlett-Packard Development Company Photovoltaic structure and solar cell and method of fabrication employing hidden electrode
FR2941688B1 (fr) 2009-01-30 2011-04-01 Commissariat Energie Atomique Procede de formation de nano-fils
KR100995394B1 (ko) 2009-02-18 2010-11-19 한국과학기술원 박막 태양전지의 박막 형성장치
WO2010096035A1 (en) 2009-02-23 2010-08-26 Nanosys, Inc. Nanostructured catalyst supports
JP2012528020A (ja) 2009-05-26 2012-11-12 ナノシス・インク. ナノワイヤおよび他のデバイスの電場沈着のための方法およびシステム
US9162896B2 (en) 2009-05-31 2015-10-20 College Of William And Mary Method for making polymer composites containing graphene sheets
JP5299105B2 (ja) 2009-06-16 2013-09-25 ソニー株式会社 二酸化バナジウムナノワイヤとその製造方法、及び二酸化バナジウムナノワイヤを用いたナノワイヤデバイス
CN101931507B (zh) 2009-06-18 2012-09-05 华为技术有限公司 码本生成方法、数据传输方法及装置
US8409366B2 (en) * 2009-06-23 2013-04-02 Oki Data Corporation Separation method of nitride semiconductor layer, semiconductor device, manufacturing method thereof, semiconductor wafer, and manufacturing method thereof
US8337003B2 (en) * 2009-07-16 2012-12-25 Eastman Kodak Company Catcher including drag reducing drop contact surface
WO2011016616A2 (ko) 2009-08-03 2011-02-10 인제대학교 산학협력단 신규한 구조의 탄소계 나노복합체 및 이의 제조방법
US8507797B2 (en) 2009-08-07 2013-08-13 Guardian Industries Corp. Large area deposition and doping of graphene, and products including the same
CN102576653B (zh) * 2009-08-20 2015-04-29 财团法人生产技术研究奖励会 半导体基板、半导体层的制造方法、半导体基板的制造方法、半导体元件、发光元件、显示面板、电子元件、太阳能电池元件及电子设备
JP2011057474A (ja) * 2009-09-07 2011-03-24 Univ Of Tokyo 半導体基板、半導体基板の製造方法、半導体成長用基板、半導体成長用基板の製造方法、半導体素子、発光素子、表示パネル、電子素子、太陽電池素子及び電子機器
WO2011048808A1 (ja) * 2009-10-20 2011-04-28 パナソニック株式会社 発光ダイオード素子およびその製造方法
WO2011048809A1 (ja) 2009-10-21 2011-04-28 パナソニック株式会社 太陽電池およびその製造方法
KR20110057989A (ko) 2009-11-25 2011-06-01 삼성전자주식회사 그래핀과 나노구조체의 복합 구조체 및 그 제조방법
CN101710567A (zh) 2009-11-27 2010-05-19 晶能光电(江西)有限公司 具有复合碳基衬底的氮化镓基半导体器件及其制造方法
US9306099B2 (en) * 2009-12-01 2016-04-05 Samsung Electronics Co., Ltd. Material including graphene and an inorganic material and method of manufacturing the material
KR101736972B1 (ko) * 2009-12-01 2017-05-19 삼성전자주식회사 그라펜 및 무기물의 적층 구조체 및 이를 구비한 전기소자
CN102301042B (zh) 2009-12-04 2014-10-01 松下电器产业株式会社 基板及其制造方法
KR101234180B1 (ko) 2009-12-30 2013-02-18 그래핀스퀘어 주식회사 그래핀 필름의 롤투롤 도핑 방법 및 도핑된 그래핀 필름
US8212236B2 (en) 2010-01-19 2012-07-03 Eastman Kodak Company II-VI core-shell semiconductor nanowires
WO2011090863A1 (en) 2010-01-19 2011-07-28 Eastman Kodak Company Ii-vi core-shell semiconductor nanowires
US8377729B2 (en) 2010-01-19 2013-02-19 Eastman Kodak Company Forming II-VI core-shell semiconductor nanowires
US20110240099A1 (en) 2010-03-30 2011-10-06 Ellinger Carolyn R Photovoltaic nanowire device
TWI440074B (zh) * 2010-04-02 2014-06-01 Univ Nat Chiao Tung 一種在三族氮化物磊晶過程中降低缺陷產生的方法
WO2011125277A1 (ja) 2010-04-07 2011-10-13 株式会社島津製作所 放射線検出器およびそれを製造する方法
MX2012013521A (es) 2010-05-24 2013-04-08 Siluria Technologies Inc Catalizadores de nanoalambre, su preparacion y uso de los mismos.
KR101781552B1 (ko) 2010-06-21 2017-09-27 삼성전자주식회사 보론 및 질소로 치환된 그라핀 및 제조방법과, 이를 구비한 트랜지스터
US9947829B2 (en) 2010-06-24 2018-04-17 Glo Ab Substrate with buffer layer for oriented nanowire growth
AU2011289620C1 (en) 2010-08-07 2014-08-21 Tpk Holding Co., Ltd. Device components with surface-embedded additives and related manufacturing methods
CN102376817A (zh) 2010-08-11 2012-03-14 王浩 一种半导体光电器件的制备方法
US9190590B2 (en) 2010-09-01 2015-11-17 Sharp Kabushiki Kaisha Light emitting element and production method for same, production method for light-emitting device, illumination device, backlight, display device, and diode
WO2012029381A1 (ja) 2010-09-01 2012-03-08 シャープ株式会社 発光素子およびその製造方法、発光装置の製造方法、照明装置、バックライト、表示装置、並びにダイオード
KR101636915B1 (ko) 2010-09-03 2016-07-07 삼성전자주식회사 그래핀 또는 탄소나노튜브를 이용한 반도체 화합물 구조체 및 그 제조방법과, 반도체 화합물 구조체를 포함하는 반도체 소자
KR101691906B1 (ko) 2010-09-14 2017-01-02 삼성전자주식회사 Ⅲ족 질화물 나노로드 발광 소자 제조방법
US8901536B2 (en) 2010-09-21 2014-12-02 The United States Of America, As Represented By The Secretary Of The Navy Transistor having graphene base
KR101802374B1 (ko) 2010-10-05 2017-11-29 삼성전자주식회사 도핑된 그래핀 함유 투명전극, 그의 제조방법, 및 이를 구비하는 표시소자와 태양전지
US8321961B2 (en) 2010-10-07 2012-11-27 International Business Machines Corporation Production scale fabrication method for high resolution AFM tips
KR101217209B1 (ko) 2010-10-07 2012-12-31 서울대학교산학협력단 발광소자 및 그 제조방법
KR101142545B1 (ko) 2010-10-25 2012-05-08 서울대학교산학협력단 태양전지 및 그 제조 방법
AU2010363814B2 (en) 2010-11-12 2016-05-19 Gentium S.R.L. Defibrotide for use in prophylaxis and/or treatment of Graft versus Host Disease (GVHD).
US20120141799A1 (en) * 2010-12-03 2012-06-07 Francis Kub Film on Graphene on a Substrate and Method and Devices Therefor
GB201021112D0 (en) * 2010-12-13 2011-01-26 Ntnu Technology Transfer As Nanowires
KR20120065792A (ko) 2010-12-13 2012-06-21 삼성전자주식회사 나노 센서 및 그의 제조 방법
KR101268033B1 (ko) * 2010-12-21 2013-05-28 한국세라믹기술원 실리콘카바이드 코팅방법
KR20120083084A (ko) 2011-01-17 2012-07-25 삼성엘이디 주식회사 나노 로드 발광 소자 및 그 제조 방법
KR101227600B1 (ko) 2011-02-11 2013-01-29 서울대학교산학협력단 그래핀-나노와이어 하이브리드 구조체에 기반한 광센서 및 이의 제조방법
US8591990B2 (en) 2011-03-25 2013-11-26 GM Global Technology Operations LLC Microfiber supported metal silicide nanowires
CN102201503A (zh) * 2011-03-30 2011-09-28 苏州纳维科技有限公司 一种iii族氮化物衬底的生长方法、衬底以及led
US9713650B2 (en) 2011-05-06 2017-07-25 The Research Foundation For The State University Of New York Magnetic graphene-like nanoparticles or graphitic nano- or microparticles and method of production and uses thereof
KR20140040169A (ko) 2011-05-27 2014-04-02 유니버시티 오브 노스 텍사스 그라핀 자기터널접합 스핀 필터 및 그 제조방법
JP2012250868A (ja) * 2011-06-01 2012-12-20 Sumitomo Electric Ind Ltd Iii族窒化物層の成長方法およびiii族窒化物基板
WO2012167282A1 (en) 2011-06-02 2012-12-06 Brown University High-efficiency silicon-compatible photodetectors based on ge quantumdots and ge/si hetero-nanowires
KR101305705B1 (ko) 2011-07-12 2013-09-09 엘지이노텍 주식회사 터치 패널 및 전극 제조 방법
US20130020623A1 (en) 2011-07-18 2013-01-24 Taiwan Semiconductor Manufacturing Company, Ltd. Structure and method for single gate non-volatile memory device
CN102254969B (zh) 2011-08-17 2012-11-14 中国科学院苏州纳米技术与纳米仿生研究所 基于纳米柱阵列的光电器件及其制作方法
KR101217216B1 (ko) * 2011-08-31 2012-12-31 서울대학교산학협력단 전자 소자 및 그 제조 방법
WO2013052541A2 (en) 2011-10-04 2013-04-11 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Quantum dots, rods, wires, sheets, and ribbons, and uses thereof
US8440350B1 (en) 2011-11-10 2013-05-14 GM Global Technology Operations LLC Lithium-ion battery electrodes with shape-memory-alloy current collecting substrates
CN104039451B (zh) 2011-11-29 2018-11-30 希路瑞亚技术公司 纳米线催化剂及其应用和制备方法
GB201200355D0 (en) * 2012-01-10 2012-02-22 Norwegian Univ Sci & Tech Ntnu Nanowires
US9299560B2 (en) * 2012-01-13 2016-03-29 Applied Materials, Inc. Methods for depositing group III-V layers on substrates
CN104205294B (zh) 2012-02-14 2017-05-10 六边钻公司 基于氮化镓纳米线的电子器件
TW201344749A (zh) 2012-04-23 2013-11-01 Nanocrystal Asia Inc 以塡膠燒結方式製造選擇性成長遮罩之方法
US20130311363A1 (en) 2012-05-15 2013-11-21 Jonathan E. Ramaci Dynamically re-programmable transaction card
GB201211038D0 (en) 2012-06-21 2012-08-01 Norwegian Univ Sci & Tech Ntnu Solar cells
FR2997558B1 (fr) 2012-10-26 2015-12-18 Aledia Dispositif opto-electrique et son procede de fabrication
EP2922891A1 (en) 2012-11-26 2015-09-30 Massachusetts Institute of Technology Nanowire-modified graphene and methods of making and using same
JP5876408B2 (ja) 2012-12-14 2016-03-02 日本電信電話株式会社 ナノワイヤの作製方法
CN103050498B (zh) 2012-12-28 2015-08-26 中山大学 一种微纳米线阵列结构紫外雪崩光电探测器及其制备方法
US10957816B2 (en) * 2013-02-05 2021-03-23 International Business Machines Corporation Thin film wafer transfer and structure for electronic devices
GB201311101D0 (en) 2013-06-21 2013-08-07 Norwegian Univ Sci & Tech Ntnu Semiconducting Films
GB2517186A (en) 2013-08-14 2015-02-18 Norwegian University Of Science And Technology Radial P-N junction nanowire solar cells
KR101517551B1 (ko) 2013-11-14 2015-05-06 포항공과대학교 산학협력단 발광소자의 제조방법 및 그에 의해 제조된 발광소자
US9577176B1 (en) 2015-06-18 2017-02-21 Raytheon Bbn Technologies Corp. Josephson junction readout for graphene-based single photon detector

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