WO2016152856A1 - 繊維強化プラスチック成形用材料、その製造方法及び成形物 - Google Patents
繊維強化プラスチック成形用材料、その製造方法及び成形物 Download PDFInfo
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/007—Processes for applying liquids or other fluent materials using an electrostatic field
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
- B29C43/32—Component parts, details or accessories; Auxiliary operations
- B29C43/52—Heating or cooling
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
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- C08J3/00—Processes of treating or compounding macromolecular substances
- C08J3/12—Powdering or granulating
- C08J3/122—Pulverisation by spraying
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/246—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2361/00—Characterised by the use of condensation polymers of aldehydes or ketones; Derivatives of such polymers
- C08J2361/04—Condensation polymers of aldehydes or ketones with phenols only
- C08J2361/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
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- C08J2371/00—Characterised by the use of polyethers obtained by reactions forming an ether link in the main chain; Derivatives of such polymers
- C08J2371/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08J2371/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08J2371/12—Polyphenylene oxides
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- C08J2373/00—Characterised by the use of macromolecular compounds obtained by reactions forming a linkage containing oxygen or oxygen and carbon in the main chain, not provided for in groups C08J2359/00 - C08J2371/00; Derivatives of such polymers
- C08J2373/02—Polyanhydrides
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- C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- the present invention relates to a fiber reinforced plastic molding material, a manufacturing method thereof, and a molded product.
- Fiber reinforced plastic (FRP) material which is a composite material of glass fiber and carbon fiber and plastic, is lightweight, high strength and highly rigid, and has been used for sports and leisure such as tennis rackets, bicycles and fishing rods. It is a material used from.
- FRP Fiber reinforced plastic
- the use of fiber reinforced plastic materials has been expanding, and from consumer equipment such as housings for electronic devices such as notebook PCs and tablets, arms for industrial robots, and reinforcing materials for building structures. It has been expanded to industrial equipment.
- the FRP material is produced by impregnating a reinforced fiber base material with a liquid matrix resin and curing, but as a liquid resin impregnated into the reinforced fiber base material, a thermosetting resin such as an epoxy resin is mainly used. It is used because of the easy impregnation of the resin into the fiber substrate. However, when a thermosetting resin is used as the matrix resin, it is generally necessary to use a curing agent in combination. Therefore, the storage load of such a mixture is large, but the productivity is low due to the long curing time. However, there is no recyclability like metal materials, and there is a strong demand for improvement.
- thermosetting resin As an FRP molding material, a prepreg in which a thermosetting resin is dissolved in a solvent together with a curing agent, impregnated into a reinforcing fiber base, and kept in a semi-cured (B stage) state is widely used. There was a problem described above.
- Patent Document 1 a solid epoxy resin having a softening point (Ts) of 50 ° C. or higher and a melt viscosity at 150 ° C. of 500 mPa ⁇ s or less by a cone plate viscometer and other bisphenol type solid epoxy resins Then, a tetracarboxylic dianhydride and a curing accelerator are melt-kneaded to obtain an epoxy resin composition, which is then pulverized to form a powder, and this powder is applied to a reinforcing fiber base and heated. It has been proposed to melt into a prepreg for FRP molding.
- Ts softening point
- this method requires the use of two different solid epoxy resins in combination as an epoxy resin as a matrix resin, and also uses a curing agent, so a curing accelerator is used as seen in the examples.
- a curing accelerator is used as seen in the examples.
- the curing time is as long as 1 hour and the glass transition point (Tg) of the cured matrix resin is 150 ° C. or less, the heat resistance is insufficient.
- Tg glass transition point
- the molding is not as easy as a thermoplastic resin, and is not suitable for molding a housing having a complicated shape such as an electronic device.
- Patent Document 2 proposes a prepreg of a fiber reinforced plastic material impregnated by a technique such as bringing a polyamide resin having a reduced low molecular weight terminal amino group or carboxyl group into contact with a reinforced substrate in a powder state. Yes.
- the polyamide resin used has a low molecular weight, the mechanical properties of FRP are slightly low, and the molding temperature is as high as 290 ° C. Therefore, it takes time to raise and lower the temperature, and the FRP molded product has high productivity. Not suitable for manufacturing.
- Patent Document 3 discloses a novel phenoxy resin having high moldability and high heat resistance, and can impregnate a reinforcing fiber base material by a hot melt method or a solvent method to produce a prepreg for FRP molding.
- this method requires a special condensed ring structure-containing phenoxy resin, and since this phenoxy resin has a glass transition temperature (Tg) of about 150 ° C. at the maximum, it is a member to be used in harsh environments such as automobiles.
- Tg glass transition temperature
- it is insufficient for application to a vehicle, and even when it is applied to a vehicle body, it cannot withstand the temperature at the time of baking coating, so that a separate primer treatment or the like is required and an extra manufacturing process step is required.
- the hot melt method is generally difficult when the molecular weight of the resin to be impregnated is large. Since this phenoxy resin has a molecular weight of about 30,000 to 70,000, it is considered that the hot melt method is difficult to apply, and the solvent method uses a large amount of solvent to improve the impregnation property.
- the obtained prepreg has a drawback that the residual solvent has a strong tackiness and is difficult to work with. Furthermore, no prepreg examples or comparative examples using phenoxy resin are disclosed.
- FRP molding materials are required to be capable of melting at a relatively low temperature and capable of greatly shortening molding time (high moldability and high productivity). It is necessary to shape a complex shape such as a body, and the obtained FRP molded product is required to have excellent characteristics (high toughness, high heat resistance, long life).
- Patent Document 4 discloses a phenoxy resin composition capable of causing a crosslinking reaction and improving heat resistance by adding a crosslinking agent to phenoxy resin, which is a thermoplastic resin, and applying heat to the optical component. It is stated that it can be used for the molding process. However, this material also requires a heat treatment at the time of molding for the crosslinking reaction for improving Tg. Therefore, a heat treatment of 30 to 60 minutes is separately required, and it is inherent in the kneading of the material before the molding. Since the reaction with the crosslinking agent that progresses easily causes gelation, there is a problem of how to impregnate the reinforcing fiber substrate.
- JP 2006-232915 A Special table 2012-503893 JP 2010-126694 A WO2014-157132
- An object of the present invention is to provide an FRP molding material having high molding processability and excellent manufacturing stability, which is excellent in storage stability and can be significantly shortened in molding process time by a hot press.
- the present inventor has used a phenoxy resin, which is a thermoplastic resin having good moldability, as an essential component of the matrix resin, and the matrix resin fine powder is used as a powder by an electrostatic field.
- a phenoxy resin which is a thermoplastic resin having good moldability
- the matrix resin fine powder is used as a powder by an electrostatic field.
- the matrix resin contains a phenoxy resin having a room temperature solid having a melt viscosity of 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C. in an amount of 50 wt.
- the particle size (d50) is 10 to 150 ⁇ m
- the matrix resin fine powder is adhered to the reinforcing fiber substrate by a powder coating method
- the matrix resin ratio is 20 to 50 wt%.
- the present invention relates to a fiber reinforced plastic molding material.
- the phenoxy resin desirably has any one or more of the following characteristics. 1)
- the mass average molecular weight Mw is 20,000 to 100,000. 2)
- the hydroxyl group equivalent is 50 to 750 g / eq, 3)
- Glass transition temperature Tg is 65 to 160 ° C. 4)
- the average particle size (d50) is 10 to 150 ⁇ m.
- the reinforcing fiber substrate examples include one or two or more fibers selected from the group consisting of carbon fiber, boron fiber, silicon carbide fiber, glass fiber and aramid fiber, or those containing the same.
- the matrix resin contains a phenoxy resin, an epoxy resin, and a crosslinking agent as essential components, and 9 to 85 parts by weight of the epoxy resin is blended with 100 parts by weight of the phenoxy resin.
- Both of the resins relate to the above fiber-reinforced plastic molding material, which is a room temperature solid matrix resin having a melt viscosity of 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C.
- the crosslinking agent (C) there is an acid anhydride, and the acid anhydride group is in the range of 0.5 to 1.3 mol with respect to 1 mol of the secondary hydroxyl group of the phenoxy resin (A). It is desirable to be blended as follows.
- the average particle size (d50) of the powders of phenoxy resin (A) and epoxy resin (B) is 10 to 150 ⁇ m, respectively, and is 1 to 2 times the average particle size (d50) of the powder of crosslinking agent (C). It is desirable.
- Another aspect of the present invention is a method for producing a material for a fiber-reinforced plastic molded body, comprising a room temperature solid phenoxy resin having a melt viscosity of 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C.
- a matrix resin containing 50 wt or more of all resin components is prepared, and after the matrix resin is pulverized to an average particle size (d50) of 10 to 150 ⁇ m, this fine powder is adhered to a reinforcing fiber substrate by a powder coating method.
- the present invention relates to a method for producing a fiber-reinforced plastic molding material, wherein the resin ratio is 20 to 50 wt%.
- Another embodiment of the present invention includes a phenoxy resin, an epoxy resin, and a crosslinking agent as essential components as a raw material matrix resin, 9 to 85 parts by weight of an epoxy resin with respect to 100 parts by weight of the phenoxy resin, and 160 ° C. to 220 ° C.
- a matrix resin that is solid at room temperature and has a melt viscosity of 3,000 Pa ⁇ s or less in any one of the temperature ranges is pulverized to an average particle size (d50) of 10 to 150 ⁇ m, and the resulting matrix resin is obtained.
- the fine powder is attached to a reinforced fiber base material by a powder coating method, and the ratio of the matrix resin is in the range of 20 to 50 wt%.
- a powder coating method using an electrostatic field is suitable.
- Another aspect of the present invention is a phenoxy resin powder for producing the above fiber-reinforced plastic molding material, which has a melt viscosity of 3000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C., and The present invention relates to a phenoxy resin powder having an average particle diameter (d50) of 10 to 150 ⁇ m.
- Another aspect of the present invention relates to a fiber-reinforced plastic molded product obtained by heating or pressing the above-mentioned fiber-reinforced plastic molding material to form or cure.
- the matrix resin in the fiber reinforced plastic molding may be a cross-linked cured resin, and the glass transition temperature thereof may be 160 ° C. or higher. Further, the matrix resin in the fiber reinforced plastic molding can be a thermoplastic resin.
- a matrix resin As a matrix resin, a normal temperature solid phenoxy resin having a melt viscosity at 250 ° C. of 1000 Pa ⁇ s or less is an essential component, and a phenoxy resin fine powder having an average particle size (D50) of 10 to 150 ⁇ m is applied to a reinforced fiber substrate by powder coating.
- An intermediate substrate for molding a fiber-reinforced plastic characterized in that it adheres so that the ratio (RC) is 20 to 50%.
- the above phenoxy resin has a mass average molecular weight (Mw) of 20,000 to 100,000, a hydroxyl group equivalent (g / eq) of 50 to 750, or a glass transition temperature (Tg) of 70 ° C. to 160 ° C. or less. It is good that it is.
- a normal temperature solid phenoxy resin having a melt viscosity at 250 ° C. of 1000 Pa ⁇ s or less is prepared, the phenoxy resin is pulverized to an average particle size (D50) of 10 to 150 ⁇ m, and the resulting fine powder of the phenoxy resin Is attached to a reinforced fiber base material by powder coating, and the resin ratio (RC) is 20 to 50%.
- D50 average particle size
- RC resin ratio
- the phenoxy resin (A), the epoxy resin (B) and the crosslinking agent (C) are essential components, and 9 to 85 parts by weight of the epoxy resin (B) is blended with 100 parts by weight of the phenoxy resin (A) at 160 ° C. It contains a matrix resin composition at room temperature solid having a melt viscosity of 2000 Pa ⁇ s or less, and the fine powder of the matrix resin composition is adhered to the reinforcing fiber substrate by powder coating, and the ratio of the matrix resin composition ( An intermediate substrate for molding a fiber-reinforced plastic, characterized in that RC) is in the range of 20 to 50%.
- the above-mentioned intermediate substrate for fiber-reinforced plastic molding preferably has a glass transition temperature (Tg) of the crosslinked cured product of the crosslinked or cured matrix resin composition of 160 ° C. or higher.
- the glass transition temperature (Tg) of the phenoxy resin (A) is preferably 65 ° C. to 100 ° C.
- the crosslinking agent (C) is an acid anhydride
- the secondary hydroxyl group 1 of the phenoxy resin (A) is 1
- the amount of acid anhydride groups is blended in the range of 0.3 to 1.3 moles with respect to the mole
- the average particle diameter of the phenoxy resin (A) and epoxy resin (B) powders (D50) is preferably 10 to 150 ⁇ m, and preferably 1 to 1.5 times the average particle size of the powder of the crosslinking agent (C)
- the adhesion of the matrix resin composition powder to the reinforcing fiber substrate is electrostatic It is preferably made by powder coating using a reinforcing fiber base material of carbon fibers, boron fibers, silicon carbide fibers, to be selected from the group consisting of glass fibers and aramid fibers preferred.
- a method for producing the above intermediate substrate for fiber-reinforced plastic molding wherein the phenoxy resin (A), the epoxy resin (B), and the cross-linking agent (C) are pulverized and blended, and the melt viscosity at 160 ° C.
- a fine powder of a matrix resin composition at room temperature that is 2000 Pa ⁇ s or less was adhered to a reinforcing fiber substrate by powder coating, so that the ratio (RC) of the matrix resin composition was in the range of 20 to 50%.
- a method for producing an intermediate substrate for molding a fiber-reinforced plastic characterized by the above.
- a fiber reinforced plastic molded product obtained by molding the above-mentioned intermediate substrate for molding a fiber reinforced plastic by heating and pressing.
- Such a fiber-reinforced plastic molded product is characterized in that the cross-linked cured product of the matrix resin composition has a glass transition temperature (Tg) of 160 ° C. or higher.
- the fiber-reinforced plastic molding material of the present invention can be easily handled in the same manner as a prepreg using a conventional thermosetting resin while using a thermoplastic phenoxy resin as a matrix resin, and at a room temperature compared to a prepreg. It is possible to advantageously obtain a fiber-reinforced plastic molded article having excellent storage stability and having no tackiness.
- the fiber-reinforced plastic molding material of the present invention contains a phenoxy resin that is solid at room temperature as an essential component as a matrix resin. Since the intermediate substrate for FRP molding of the present invention uses a phenoxy resin, which is a thermoplastic resin, as a matrix resin, it can be easily pressure-molded by a hot press and can greatly improve productivity. .
- the matrix resin may be a phenoxy resin alone, or may be a mixture of an epoxy resin and a crosslinking agent in addition to the phenoxy resin. However, it is not desirable to add a solvent.
- the matrix resin is pulverized and adhered to the reinforcing fiber substrate by a powder coating method, preferably a powder coating method using an electrostatic field (electrostatic coating method). Since normal temperature solid phenoxy resin as a matrix resin is finely pulverized and adhered to the reinforced fiber base material by electrostatic coating method, even if the melt viscosity is relatively high, the matrix resin fine powder is generated by the heat during molding. Since the matrix resin melts and reaches the inside of the fiber base material, a molded product having good physical properties can be obtained.
- a powder coating method preferably a powder coating method using an electrostatic field (electrostatic coating method). Since normal temperature solid phenoxy resin as a matrix resin is finely pulverized and adhered to the reinforced fiber base material by electrostatic coating method, even if the melt viscosity is relatively high, the matrix resin fine powder is generated by the heat during molding. Since the matrix resin melts and reaches the inside of the fiber base material, a molded product having good physical properties can
- the phenoxy resin used as an essential component of the matrix resin is solid at room temperature and exhibits a melt viscosity of 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C.
- the melt viscosity is preferably 30 to 2,900 Pa ⁇ s, more preferably 100 to 2,800 Pa ⁇ s.
- a phenoxy resin that is solid at room temperature is uniformly attached to a reinforcing fiber substrate by electrostatic powder coating. If the melt viscosity exceeds 3,000 Pa ⁇ s in any temperature range of 160 to 220 ° C., the fluidity of the phenoxy resin during the molding process deteriorates. However, the mechanical properties of the molded product are deteriorated.
- the viscosity of the matrix resin is made of a thermoplastic resin such as a phenoxy resin
- the viscosity decreases as the temperature increases.
- an epoxy resin or a crosslinking agent is included, a crosslinking or curing reaction occurs and the viscosity increases during the temperature increase.
- the viscosity of the matrix resin at 160 to 220 ° C. is also the minimum viscosity when the temperature is raised under the conditions shown in the examples.
- the temperature range of 160 to 220 ° C. is the temperature at which the molding press is performed. If the melt viscosity of the matrix resin of the molding material is 3,000 Pa ⁇ s or less in any of these temperature ranges, a good machine An FRP molded product having physical properties can be obtained. That is, as long as the melt viscosity of the matrix resin is 3,000 Pa ⁇ s or less in any one of these temperature ranges, the melt viscosity may exceed 3,000 Pa ⁇ s in a part of this temperature range.
- the melt viscosity continues to decrease as the temperature rises, so the melt temperature at 220 ° C. is the lowest melt viscosity.
- the FRP molded body obtained by heat-press molding the FRP molding material containing the phenoxy resin of the present invention as an essential component is used as a material for application in various applications, and even when disposal is required, it is crosslinked. If it is not cured, it is possible to separate and recycle the reinforcing fibers and the matrix resin with heat or a solvent without discarding them.
- a phenoxy resin is a thermoplastic resin obtained from a condensation reaction of a dihydric phenol compound and an epihalohydrin, or a polyaddition reaction of a dihydric phenol compound and a bifunctional epoxy resin. Can be obtained at The average molecular weight is usually 10,000 to 200,000 as a mass average molecular weight (Mw), preferably 20,000 to 100,000, more preferably 30,000 to 80,000. When Mw is too low, the strength of the molded article is inferior, and when it is too high, the workability and workability tend to be inferior. Mw is a value measured by gel permeation chromatography (GPC) and converted using a standard polystyrene calibration curve.
- GPC gel permeation chromatography
- the hydroxyl equivalent (g / eq) of the phenoxy resin is usually 50 to 1000, preferably 50 to 750, particularly preferably 50 to 500. If the hydroxyl equivalent is too low, the water absorption increases due to the increase of hydroxyl groups, and there is a concern that the mechanical properties are lowered. When the hydroxyl group equivalent is too high, the hydroxyl group is small, so that the wettability with the carbon fiber constituting the reinforcing fiber substrate is lowered, and even if a crosslinking agent is used, the mechanical properties are not improved because the crosslinking density is low.
- the hydroxyl equivalent referred to herein means a secondary hydroxyl equivalent.
- the glass transition temperature (Tg) of the phenoxy resin is suitably from 65 ° C to 160 ° C, but preferably from 70 ° C to 150 ° C. If the glass transition temperature is lower than 65 ° C., the moldability is improved, but there is a problem in the storage stability of the powder and the tackiness of the preform. When the temperature is higher than 160 ° C., the melt viscosity becomes high, and the moldability and the filling property into the fiber are inferior. As a result, higher temperature press molding is required.
- the glass transition temperature of the phenoxy resin is a numerical value obtained from the second scan peak value measured in the range of 20 to 280 ° C. under a temperature rising condition of 10 ° C./min using a differential scanning calorimeter.
- the phenoxy resin is not particularly limited as long as it satisfies the above physical properties, but is not limited to bisphenol A type phenoxy resin (for example, phenototo YP-50, YP-50S, YP-55U manufactured by Nippon Steel & Sumitomo Chemical), bisphenol F type Phenoxy resin (for example, phenototox FX-316 manufactured by Nippon Steel & Sumikin Chemical), copolymerized phenoxy resin of bisphenol A and bisphenol F (for example, YP-70 manufactured by Nippon Steel & Sumikin Chemical), other special phenoxy resins (for example, Nippon Steel & Sumikin) Chemical phenotote YPB-43C, FX293, etc.) can be used, and these can be used alone or in admixture of two or more.
- bisphenol A type phenoxy resin for example, phenototo YP-50, YP-50S, YP-55U manufactured by Nippon
- the epoxy resin (B) can be blended in the matrix resin together with the phenoxy resin (A).
- the epoxy resin By blending the epoxy resin, it is possible to improve the impregnation property to the reinforcing fiber base by reducing the melt viscosity of the matrix resin and to improve the heat resistance through the improvement of the crosslinking density of the cured matrix resin.
- the improvement in heat resistance can greatly exceed the Tg of the phenoxy resin, and can be expanded to applications that require higher heat resistance, such as automobile materials.
- the epoxy resin (B) can be applied to the present invention as long as it is a solid epoxy resin.
- a bifunctional or higher epoxy resin is preferable, and a bisphenol A type epoxy resin (for example, EPOTOTO YD manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.).
- the epoxy resin (B) is also preferably a solid at room temperature, a melting point of 75 ° C. to 145 ° C., and a viscosity at 160 ° C. of 1.0 Pa ⁇ s.
- the following crystalline epoxy resin is preferable.
- a crystalline epoxy resin has a low melt viscosity, is easy to handle, and can reduce the melt viscosity of a matrix resin containing a phenoxy resin as an essential component. When it exceeds 1.0 Pa ⁇ s, the filling property of the matrix resin into the reinforcing fiber base is inferior, and the homogeneity of the obtained fiber-reinforced plastic molding (FRP molding) is inferior.
- a crosslinking agent (C) can be blended together with the phenoxy resin (A) for the purpose of improving the Tg of the matrix resin.
- the crosslinking agent (C) can be blended even when the epoxy resin (B) is blended or not.
- the cross-linking agent one having two or more functional groups that react with the OH group of the phenoxy resin can be used, but an acid anhydride is preferable. It is understood that the acid anhydride has two of the above functional groups because it generates two carboxy groups upon hydrolysis.
- the crosslinking agent can be used as long as it has two or more functional groups reactive with the secondary hydroxyl group of the phenoxy resin, but the acid anhydride can form an ester bond with the secondary hydroxyl group of the phenoxy resin. Three-dimensional cross-linking of phenoxy resin. Therefore, since the crosslinking can be released by a hydrolysis reaction, the FRP molded product is given recyclability.
- the curing agent is an acid anhydride type
- hydrolysis of the matrix resin is carried out because the ester bond between the phenoxy resin (A) and the crosslinking agent (C) is used.
- the FRP molded product can be separated into reinforcing fibers and a matrix resin and recycled without being discarded.
- the acid anhydride as the cross-linking agent is not particularly limited as long as it is solid at room temperature and has no sublimation property. Trimellitic anhydride, pyromellitic anhydride, methylcyclohexene dicarboxylic acid anhydride, benzophenone tetra Carboxylic anhydride, tetrahydrophthalic anhydride, etc. are mentioned, These can be used individually or in mixture of 2 or more types.
- An acid anhydride having an aromatic ring having two or more acid anhydrides that react with the secondary hydroxyl group of the phenoxy resin is preferable from the viewpoint of imparting heat resistance and reactivity of the molded product, and in particular, 2 such as pyromellitic acid anhydride.
- trimellitic anhydride has a higher crosslinking density and heat resistance than a hydroxyl group.
- the acid anhydride group reacts with the secondary hydroxyl group, but the COOH group is weakly reactive. Therefore, in order to cause sufficient crosslinking only with the phenoxy resin and the acid anhydride, it has two acid anhydride groups.
- An acid anhydride compound is used. Since the crosslinking agent forms a three-dimensional crosslinked structure by an esterification reaction between the acid anhydride group of the acid anhydride and the secondary hydroxyl group in the phenoxy resin, the Tg of the matrix resin is improved.
- the reaction of the phenoxy resin (A), the epoxy resin (B), and the crosslinking agent (C) causes the secondary hydroxyl group in the phenoxy resin (A) to react with the acid of the crosslinking agent (C). It is crosslinked and cured by an esterification reaction with an anhydride group, and further by a reaction between a carboxyl group generated by the esterification reaction and an epoxy group of the epoxy resin (B).
- a crosslinked phenoxy resin can be obtained by the reaction of the phenoxy resin (A) and the crosslinking agent (C), but the carboxy group produced by reacting with the hydroxyl group of the acid anhydride group phenoxy resin in the presence of the epoxy resin (B).
- the cross-linking reaction is accelerated and the cross-linking density is improved, and the melt viscosity of the matrix resin is reduced to improve the impregnation property to the reinforcing fiber base.
- the epoxy resin (B) coexists, but the main component is the phenoxy resin (A) which is a thermoplastic resin, and an acid anhydride of the secondary hydroxyl group and the crosslinking agent (C).
- the esterification reaction with the group is considered to have priority.
- the FRP molding material of the present invention unlike a normal prepreg mainly composed of an epoxy resin that is a thermosetting resin, has good moldability and long-term room temperature in a state where humidity control is not performed. Even after storage, the moldability and physical properties of the FRP molded product are maintained, and the storage stability is excellent.
- the matrix resin contains more than 50 wt% of the phenoxy resin as a resin component. Preferably it contains 55 wt% or more.
- the resin component includes a thermosetting resin such as a thermoplastic resin or an epoxy resin, but does not include a non-resin component such as a crosslinking agent.
- the matrix resin contains a crosslinking agent and does not contain a reinforcing fiber substrate.
- the matrix resin has a blending amount of the phenoxy resin (A) and the epoxy resin (B) of 9 to 10 parts by weight of the epoxy resin (B) with respect to 100 parts by weight of the phenoxy resin (A). It mix
- the compounding amount of the epoxy resin (B) is preferably 9 to 83 parts by weight, more preferably 10 to 80 parts by weight. If the amount of the epoxy resin (B) exceeds 85 parts by weight, it takes time to cure the epoxy resin, so that it is difficult to obtain the strength necessary for demolding in a short time, and the recyclability of FRP is lowered.
- the blending amount of the epoxy resin (B) is less than 5 parts by weight, the effect of improving the crosslinking density due to the blending of the epoxy resin cannot be obtained, and the cured product of the matrix resin hardly exhibits Tg of 160 ° C. or more. Since the fluidity of the matrix resin is deteriorated, it is difficult to impregnate the reinforcing fiber substrate.
- the matrix resin contains an epoxy resin and a crosslinking agent together with a phenoxy resin, it is solid at room temperature, and its melt viscosity is 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C. is required.
- the melt viscosity is preferably 2,900 Pa ⁇ s or less, and more preferably 2,800 Pa ⁇ s or less.
- the melt viscosity exceeds 3,000 Pa ⁇ s, the matrix fiber is not sufficiently impregnated into the reinforcing fiber base during molding by hot pressing, resulting in defects such as internal voids, and variations in the physical properties of the matrix resin of the molded product. As a result, the mechanical properties of the FRP compact are reduced.
- the melt viscosity decreases rapidly as the temperature rises, and then the melt viscosity rapidly increases due to the start of the cross-linking reaction. Therefore, usually, in the temperature range of 160 to 220 ° C. that is the molding temperature, the minimum melt viscosity before the start of the crosslinking reaction may be 3,000 Pa ⁇ s or less. As described above, if the melt viscosity of the matrix resin is 3,000 Pa ⁇ s or less in any of the temperature range of 160 to 220 ° C. Obtainable.
- the melt viscosity of the phenoxy resin alone is 3,000 Pa ⁇ s or less in any temperature range of 160 to 220 ° C. Even so, the cross-linking reaction starts early depending on the blending of the cross-linking agent, and the melt viscosity as the matrix resin may exceed 3,000 Pa ⁇ s in any of the above temperature ranges. Therefore, when the matrix resin is a phenoxy resin cross-linked system, it is necessary that the melt viscosity of the matrix resin, not the melt viscosity of the phenoxy resin, is 3,000 Pa ⁇ s or less in any of the above temperature ranges.
- the temperature at which the melt viscosity is 3,000 Pa ⁇ s or less varies depending on the type of phenoxy resin, but the melt viscosity is 3,000 Pa ⁇ s or less at least in the temperature range of 160 to 220 ° C. which is the molding temperature. If so, FRP molding is possible.
- the molding temperature can be increased even at a higher temperature, for example, 250 ° C., but particularly in the case of a phenoxy resin cross-linked matrix resin, it tends to exceed 3,000 Pa ⁇ s due to the cross-linking reaction.
- the compounding amount of the crosslinking agent (C) is usually in the range of 0.5 to 1.3 mol of acid anhydride groups with respect to 1 mol of the secondary hydroxyl group of the phenoxy resin (A), preferably 0.7
- the amount is in the range of -1.3 mol, more preferably in the range of 1.1-1.3 mol. If the amount of the acid anhydride group is too small, the crosslinking density is low, resulting in poor mechanical properties and heat resistance. If the amount is too large, the unreacted acid anhydride or carboxyl group adversely affects the curing characteristics and the crosslinking density. For this reason, it is preferable to adjust the compounding quantity of an epoxy resin (B) according to the compounding quantity of a crosslinking agent (C).
- the amount of the epoxy resin (B) blended with the epoxy resin (B) for the purpose of reacting the carboxyl group produced by the reaction between the secondary hydroxyl group of the phenoxy resin and the acid anhydride group of the crosslinking agent is preferably in the range of 0.5 to 1.2. More preferably, the equivalent ratio of the crosslinking agent to the epoxy resin is 0.7 to 1.0 mol.
- cross-linking agent (C) is blended with a resin composition containing a phenoxy resin and an epoxy resin, a cross-linked phenoxy resin molded product can be obtained.
- an accelerator (D) as a catalyst to ensure that the cross-linking reaction is performed. May be further added.
- the accelerator is not particularly limited as long as it is solid at room temperature and has no sublimation property.
- a tertiary amine such as triethylenediamine, 2-methylimidazole, 2-phenylimidazole, 2-phenyl
- examples include imidazoles such as -4-methylimidazole, organic phosphines such as triphenylphosphine, and tetraphenylboron salts such as tetraphenylphosphonium tetraphenylborate.
- These accelerators may be used alone or in combination of two or more. Since the FRP molding material of the present invention is obtained by adhering a fine matrix resin powder to a fiber base material using powder coating by an electrostatic field, the catalyst activation temperature is 130 ° C. or higher as a promoter. It is preferable to use a solid imidazole-based latent catalyst.
- the blending amount of (D) is 0.1 to 5 with respect to 100 parts by weight of the total amount of the phenoxy resin (A), the epoxy resin (B) and the crosslinking agent (C). Weight part.
- the blending amount of (D) is 0.1 to 5 with respect to 100 parts by weight of the total amount of the phenoxy resin (A), the epoxy resin (B) and the crosslinking agent (C). Weight part.
- it adjusts suitably so that it may become in the range which does not impair the adhesion to the fiber base material of a matrix resin material powder, and the characteristic of a molding.
- the FRP molding material of the present invention desirably contains a flame retardant and a flame retardant aid.
- the flame retardant is not particularly limited as long as it is solid at room temperature and has no sublimation property.
- inorganic flame retardants such as calcium hydroxide, organic and inorganic phosphorus flame retardants such as ammonium phosphates and phosphate ester compounds.
- nitrogen-containing flame retardants such as flame retardants and triazine compounds
- bromine-containing flame retardants such as brominated phenoxy resins.
- brominated phenoxy resins and phosphorus-containing phenoxy resins can be preferably used because they can be used as flame retardant / matrix resins.
- the amount of the flame retardant (and flame retardant aid) is appropriately selected depending on the type of flame retardant and the desired degree of flame retardancy, but is generally 0.01 to 50 parts by weight with respect to 100 parts by weight of the matrix resin. In this range, it is preferable to blend in such an extent that the adhesion of the matrix resin and the physical properties of the FRP molded product are not impaired.
- thermoplastic resin powders other than phenoxy resin for example, within a range that does not impair the good adhesion of the matrix resin powder to the fiber substrate and the physical properties of the molded FRP molding
- powders such as polyvinylidene chloride resin, natural rubber, and synthetic rubber, and various other additives such as various inorganic fillers, extender pigments, colorants, antioxidants, and ultraviolet inhibitors can be blended.
- the FRP molding material of the present invention can be obtained by making the matrix resin containing the above phenoxy resin as an essential component into a predetermined fine powder and adhering the matrix resin fine powder to the reinforcing fiber substrate.
- the pulverizing mixer such as a low-temperature drying pulverizer (centridry mill), but the invention is not limited thereto.
- the components may be pulverized and mixed, or may be pulverized after the components are mixed in advance.
- the pulverization conditions may be set so that each fine powder has an average particle diameter described later.
- the fine powder thus obtained has an average particle size of 10 to 150 ⁇ m, preferably 40 to 100 ⁇ m, more preferably 40 to 80 ⁇ m.
- the average particle diameter exceeds 150 ⁇ m, the energy when the matrix resin collides with the fiber increases in powder coating in an electrostatic field, and the adhesion rate to the reinforcing fiber substrate decreases. Further, when the particle size is 10 ⁇ m or less, particles are scattered by the accompanying air flow and the adhesion efficiency is lowered, and the resin fine powder floating in the atmosphere may cause deterioration of the working environment.
- the average particle size of the phenoxy resin (A) fine powder and the epoxy resin (B) fine powder is the crosslinking agent. (C) It is preferably 1 to 1.5 times the average particle size of the fine powder.
- the cross-linking agent adheres to the inside of the reinforcing fiber base, and the cross-linking agent becomes phenoxy resin particles and epoxy. By uniformly existing around the resin particles, the crosslinking reaction can be surely advanced.
- the fine powder of the matrix resin containing phenoxy resin as an essential component is attached to the reinforcing fiber substrate by a powder coating method, whereby the FRP molding material of the present invention is obtained.
- a powder coating method There are two types of powder coating methods: fluid coating using a fluidized bed and electrostatic coating using an electrostatic field.
- electrostatic coating using an electrostatic field due to the uniformity of adhesion to the reinforcing fiber substrate.
- a fluid coating method using a fluidized bed can also be used.
- the amount of the matrix resin adhered to the reinforcing fiber base (resin ratio: RC) is applied to be 20 to 50%, preferably 25 to 45%, more preferably 25 to 40%. is there. If RC exceeds 50%, mechanical properties such as tensile and bending elastic modulus of FRP will decrease, and if it is less than 10%, the amount of resin adhering will be extremely small, so that impregnation of matrix resin inside the substrate will not be possible. There is a concern that the thermal and mechanical properties will be low.
- the fine powder of matrix resin coated with powder is fixed to the reinforcing fiber base by heating and melting, but may be heat-sealed after coating the powder, or may be applied to the pre-heated reinforcing fiber base.
- the matrix resin fine powder may be fused simultaneously with application to the fiber base material.
- the matrix resin on the surface of the reinforcing fiber base is melted, thereby improving the adhesion to the base and preventing the coated resin powder from falling off.
- the matrix resin is concentrated on the surface of the reinforcing fiber base material, and does not reach the inside of the reinforcing fiber base material as in the molded body after heat and pressure molding.
- the heating time for fusing the matrix resin after powder coating is not particularly limited, but usually 1 to 2 minutes is suitable.
- the melting temperature is 150 to 240 ° C., preferably 160 to 220 ° C., more preferably 180 to 200 ° C. If the melting temperature exceeds the upper limit, the curing reaction may proceed. If the melting temperature is lower than the lower limit, thermal fusion will be insufficient, and the matrix resin fine powder may fall off or fall off during handling of FRP molding materials. There is a concern that will occur.
- this process is a heat treatment performed to fix the powder-coated matrix resin to the fiber base material. If this heat treatment is not performed, the matrix resin is powdered off during molding. For this reason, the phenoxy resin or the epoxy resin is fixed to the fiber base material by heat fusion without causing the cross-linking agent and the resin to react by performing a heat treatment in a much shorter time than the press molding.
- the reinforcing fiber base It is preferable to use carbon fibers having high strength and good thermal conductivity for the reinforcing fiber base.
- pitch-based carbon fibers are more preferable because they are not only high in strength but also high in thermal conductivity, and thus can rapidly diffuse the generated heat.
- the form of the reinforcing fiber base is not particularly limited. For example, a unidirectional material, a cloth such as a plain weave or a twill weave, a three-dimensional cloth, a chopped strand mat, a tow composed of thousands or more filaments, or a nonwoven fabric. Can be used.
- These reinforcing fiber bases can be used alone or in combination of two or more.
- a reinforcing fiber base that has been subjected to fiber opening treatment during powder coating. Since the fiber opening treatment facilitates the impregnation of the matrix resin into the reinforcing fiber base during powder coating and subsequent molding processing, higher physical properties of the molded article can be expected.
- An FRP molded product can be easily produced by heating or pressurizing the FRP molding material of the present invention alone or in layers.
- a metal foil such as aluminum or stainless steel can be laminated between the layers and the outermost layer.
- the FRP molding material of the present invention can simultaneously perform shaping and cross-linking and curing of the matrix resin by pressure molding by hot pressing. As long as the FRP molding material is molded by heating and pressing, various molding methods such as autoclave molding and hot press molding using a mold are appropriately used according to the size and shape of the target FRP molding. Can be selected and implemented.
- the molding temperature is, for example, 160 to 250 ° C, preferably 180 ° C to 240 ° C, more preferably 180 ° C to 230 ° C.
- the molding temperature is, for example, 150 to 240 ° C., preferably 160 ° C. to 220 ° C., more preferably 180 ° C. to 200 ° C.
- the molding temperature exceeds the upper limit temperature, excessive heat is applied more than necessary, so the molding time (tact time) becomes longer and the productivity becomes worse.
- the molding time can usually be 30 to 60 minutes.
- the epoxy resin or the fine powder of the crosslinking agent is used together with the fine powder of the phenoxy resin as the matrix resin, the crosslinking agent using the secondary hydroxyl group of the phenoxy resin (A) as the main component even for a short time of about 10 minutes.
- the reaction with (C) the strength capable of demolding can be obtained.
- post-curing at 200 to 250 ° C. for about 30 to 60 minutes is preferable.
- the demolding temperature of the manufactured FRP molded product is set in consideration of the type of matrix resin and productivity.
- the temperature is 100 to 120 ° C.
- post-curing is performed separately at various temperatures in the oven at 100 to 200 ° C to ensure cross-linking. This is preferable because it can be advanced.
- the heat resistance is greatly increased as compared with that before molding due to a crosslinking reaction utilizing the secondary hydroxyl group of the phenoxy resin, and a molded product having a Tg of 160 ° C. or more can be obtained.
- the softening point of the cured product of the matrix resin is approximately within ⁇ 25 ° C. from Tg, for example, in the hot press molding using a mold, the demolding temperature of the molded product from the mold is the Tg of the cured product of the matrix resin. To ⁇ 30 ° C. or less, preferably from Tg of the cured product to ⁇ 35 ° C.
- a softening point shows the temperature of the inflexion point where the storage elastic modulus (E ') measured by DMA of a matrix resin hardened
- Particle size (d50) The average particle size of fine powders such as matrix resin is measured with a laser diffraction / scattering particle size distribution measuring device (Microtrack MT3300EX, manufactured by Nikkiso Co., Ltd.) when the cumulative volume reaches 50% on a volume basis. did.
- Glass transition temperature (Tg) of molded product A test piece having a thickness of 2 mm, a width of 10 mm, and a length of 10 mm was prepared from a laminate produced by stacking 10 FRP molding materials and hot-pressing using a diamond cutter, and a dynamic viscoelasticity measuring device (Perkin Using DMA 7e) manufactured by Elmer, measurement was performed at a temperature rising condition of 5 ° C./min and in the range of 25 to 250 ° C., and the maximum peak of tan ⁇ obtained was taken as the glass transition point.
- Tg Glass transition temperature
- Tack property The surface of the FRP molding material was touched with a finger, and the one without tack property was regarded as acceptable, and indicated as ⁇ in the table.
- Resin ratio (RC:%) (W2-W1) / W2 ⁇ 100 W1: Reinforcing fiber cloth weight before resin adhesion W2: Weight of FRP molding material after resin adhesion
- Example 1 A plain-woven reinforced fiber obtained by pulverizing and classifying phenoxy resin (A-1), and having a powder having an average particle diameter d50 of 100 ⁇ m, made of carbon fiber (STANDARD Modulus type HTS40 3K, manufactured by Toho Tenax Co., Ltd.).
- the substrate is powder-coated in an electrostatic field under the conditions of an electric charge of 70 kV and a spraying air pressure of 0.32 MPa, and then heated and melted in an oven at 200 ° C. for 2 minutes to thermally fuse the resin, and the FRP molding material is obtained. Obtained.
- Various physical properties of the obtained FRP molding material were measured.
- Examples 2 and 3 The phenoxy resin (A-1) or (A-2) was pulverized and classified, respectively, to prepare a powder having a d50 of 50 to 80 ⁇ m, and an FRP molding material was obtained in the same manner as described above. Laminate plates were produced and mechanical properties were evaluated. These results are shown in Table 1.
- Comparative Example 1 The phenoxy resin (A-1) was dissolved in methyl ethyl ketone and applied to a PET film with a release agent, and then the solvent was evaporated in an oven to release the film. Next, this phenoxy resin (A-1) film was alternately laminated with a plain fiber reinforced fiber base material made of carbon fiber (STANDARD Modulus type HTS40 3K, manufactured by Toho Tenax Co., Ltd.), and 10 layers were laminated. Then, the laminate was made by pressing at 5 MPa for 5 minutes with a press machine heated to 200 ° C., and mechanical properties were performed. These results are shown in Table 1. In addition, RC adjusted the thickness of the phenoxy resin film so that it might become the same as Example 1. FIG.
- Phenoxy resins (A-1) and (A-3) were pulverized and classified, respectively, to prepare powders having an average particle size d50 of 80 to 100 ⁇ m. After these were dry blended in the proportions (parts by mass) shown in Table 2, FRP molding materials were obtained in the same manner as in Examples 1 to 3, and a laminate was produced at a press temperature of 220 ° C. to include a flame retardancy test. Various evaluations were performed. The results are shown in Table 2.
- the FRP molding material prepared by adhering the matrix resin containing the phenoxy resin of the present invention as an essential component to the carbon fiber as the reinforcing fiber substrate by the powder coating method is good. It can be seen that it can be molded even with complex shapes. Further, the FRP molded using such FRP molding material has sufficient mechanical properties for use as a casing for portable electronic devices.
- Example 6 The average particle diameter D50 is 100 ⁇ m by pulverizing and classifying (A-1) as the phenoxy resin (A), (B-1) as the epoxy resin (B), and (C-1) as the crosslinking agent (C).
- the powdered product is dry blended in the proportions (parts by weight) shown in Table 2 and statically spread on a plain-woven reinforced fiber substrate made of carbon fibers (STANDARD Modulus type HTS40 3K, manufactured by Toho Tenax Co., Ltd.). In an electric field, powder coating was performed under conditions of an electric charge of 70 kV and a spraying air pressure of 0.32 MPa. Thereafter, the resin was heat-fused by heating at 180 ° C. for 2 minutes in an oven to obtain an FRP molding material.
- the resin ratio (RC) of the obtained FRP molding material was 27%.
- the FRP molding material obtained above was evaluated for tackiness, and then 10 sheets were stacked on a Teflon sheet and pressed at 5 MPa for 10 minutes with a press machine heated to 200 ° C. to obtain an FRP laminate. Thereafter, after-curing was performed in an oven for 2 hours, and mechanical properties were evaluated. These results are shown in Table 3.
- Examples 7 to 13 FRP was performed in the same manner as in Example 6 except that the phenoxy resins (A-1) and (A-2) were pulverized and classified so that the average particle diameter D50 was 80 ⁇ m. Molding materials and FRP laminates were prepared and evaluated. These results are shown in Table 3.
- Comparative Example 3 Coating of the matrix resin to the reinforcing fiber base is not a powder coating method (electrostatic coating method), but a solution (solid content concentration of 10) in which matrix resin powder having the same composition as in Example 6 is dissolved in methyl ethyl ketone (MEK). %), And FRP laminates were prepared in the same manner except that the FRP molding material was prepared by drying for 1 minute in a 160 ° C. drying oven, and various evaluations were performed. The results are shown in Table 4.
- Examples 14 to 16 As the phenoxy resin (A), the phenoxy resin (A-1) powder pulverized and classified so that the average particle diameter d50 is 80 ⁇ m, the epoxy resin (B) as (B-1), and the crosslinking agent (C) as (C The powder obtained by pulverizing and classifying -1) was dry blended with the formulation (parts by weight) shown in Table 4, and FRP molding materials and FRP laminates were produced and evaluated in the same manner as in Example 6. These results are also shown in Table 4.
- Examples 17 and 18 Phenoxy resin (A-1) and (A-3) powder pulverized and classified so that the average particle diameter D50 is 80 ⁇ m is used as the phenoxy resin (A), and (B-1) is used as the epoxy resin (B).
- the powder obtained by pulverizing and classifying (C-1) as the cross-linking agent (C) was dry blended in the formulation (parts by weight) and molar ratio shown in Table 5, and FRP molding material and FRP lamination were conducted in the same manner as in Example 6. A plate was prepared and subjected to various evaluations including a flame retardancy test. These results are shown in Table 5.
- the fiber-reinforced plastic molding material of the present invention is a fiber-reinforced plastic (FRP) material, from the housing of electronic devices such as notebook PCs and tablets, to arms for industrial robots, reinforcing materials for building structures, and sport leisure. It can be used in a wide range of fields.
- FRP fiber-reinforced plastic
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Abstract
Description
1)質量平均分子量Mwが20,000~100,000であること、
2)水酸基当量が50~750g/eqであること、
3)ガラス転移温度Tgが65~160℃であること、
4)平均粒子径(d50)10~150μmであること。
上記繊維強化プラスチック成形物中のマトリックス樹脂が、架橋硬化樹脂であり、そのガラス転移温度が160℃以上であることができる。また、繊維強化プラスチック成形物中のマトリックス樹脂が熱可塑性樹脂であることができる。
マトリックス樹脂として250℃における溶融粘度が1000Pa・s以下である常温固形のフェノキシ樹脂を必須成分とし、平均粒子径(D50)10~150μmのフェノキシ樹脂微粉末を粉体塗装によって強化繊維基材に樹脂割合(RC)が20~50%となるように付着したことを特徴とする繊維強化プラスチック成形用中間基材。
上記のフェノキシ樹脂は、質量平均分子量(Mw)が20,000~100,000、水酸基当量(g/eq)が50~750であること、又はガラス転移温度(Tg)が70℃~160℃以下であることがよい。
上記の繊維強化プラスチック成形用中間基材を加熱かつ加圧により成形させてなることを特徴とする繊維強化プラスチック成形物。
本発明の繊維強化プラスチック成形用材料は、マトリックス樹脂として常温で固形のフェノキシ樹脂を必須成分とする。本発明のFRP成形用中間基材は、熱可塑性樹脂であるフェノキシ樹脂をマトリックス樹脂に使用しているため、加熱プレスによる加圧成形が容易であり、生産性を大きく向上させることが可能となる。
マトリックス樹脂は、フェノキシ樹脂単独であってもよく、フェノキシ樹脂の他にエポキシ樹脂及び架橋剤等を配合したものであってもよい。しかし、溶剤を配合することは望まれない。マトリックス樹脂は、微粉末化されて、粉体塗装法、好ましくは静電場を利用した粉体塗装法(静電塗装法)により強化繊維基材に付着されている。マトリックス樹脂としての常温固形フェノキシ樹脂等を微粉砕し、静電塗装法により強化繊維基材に付着しているために、溶融粘度が比較的高くてもマトリックス樹脂の微粉末が成形時の熱により溶融し、繊維基材の内部までマトリックス樹脂が行き渡るので、良好な物性の成形物が得られる。
なお、架橋剤としてはフェノキシ樹脂の2級水酸基と反応性の官能基を2以上有するものであれば使用できるが、酸無水物は、フェノキシ樹脂の2級水酸基とエステル結合を形成することによって、フェノキシ樹脂を三次元架橋させる。そのため、加水分解反応により架橋を解くことができるので、FRP成形物にリサイクル性を与える。すなわち、架橋硬化した場合であっても、硬化剤が酸無水物系であれば、マトリックス樹脂の硬化にフェノキシ樹脂(A)と架橋剤(C)のエステル結合を利用しているため、加水分解反応を利用することによりFRP成型物を強化繊維とマトリックス樹脂へと分別し、廃棄することなくリサイクルすることも可能である。
架橋剤は酸無水物の酸無水物基とフェノキシ樹脂中の2級水酸基とのエステル化反応によって3次元化架橋構造を形成するため、マトリックス樹脂のTgが向上する。
フェノキシ樹脂の種類によって、溶融粘度が3,000Pa・s以下となる温度が多少変動するが、少なくとも成形温度である160~220℃の温度域のいずれかにおいて、溶融粘度が3,000Pa・s以下であれば、FRP成形可能である。なお、成形温度はより高温、例えば250℃でも成形できるが、特にフェノキシ樹脂架橋系のマトリックス樹脂においては、架橋反応によって3,000Pa・sを超える事態となり易い。
このため、架橋剤(C)の配合量に応じて、エポキシ樹脂(B)の配合量を調整することが好ましい。具体的には、エポキシ樹脂(B)により、フェノキシ樹脂の2級水酸基と架橋剤の酸無水物基との反応による生じるカルボキシル基を反応させることを目的に、エポキシ樹脂(B)の配合量を架橋剤(C)との当量比で0.5~1.2の範囲内となるようにするとよい。更に好ましくは、架橋剤とエポキシ樹脂の当量比が、0.7~1.0モルである。
なかでも臭素化フェノキシ樹脂やリン含有フェノキシ樹脂は、難燃剤兼マトリックス樹脂として使用することが可能なことから好ましく使用することができる。
難燃剤(および難燃助剤)の配合量については、難燃剤の種類や所望の難燃性の程度によって適宜選択されるが、マトリックス樹脂100重量部に対して概ね0.01~50重量部の範囲内で、マトリックス樹脂の付着性やFRP成形物の物性を損なわない程度で配合することが好ましい。
なお、本工程は、粉体塗装したマトリックス樹脂を繊維基材に固定させるために行う熱処理であり、この熱処理を行わないと、成形時にマトリックス樹脂が粉落ちする。このため、プレス成形時よりもはるかに短時間での熱処理を行うことによって、架橋剤と樹脂を反応させずにフェノキシ樹脂やエポキシ樹脂を繊維基材に熱融着により固定する。
また、粉体塗装に際して開繊処理された強化繊維基材を使用することが好ましい。開繊処理により、粉体塗装およびその後の成形加工時において、マトリックス樹脂の強化繊維基材の内部への含浸がより行われやすくなるため、より高い成形物物性を期待することができる。
FRP成形用材料を使用した成形は、加熱加圧成形である限り、目的とするFRP成形物の大きさや形状に合わせて、オートクレーブ成型や金型を使用した熱プレス成型等の各種成形法を適宜選択して実施することができる。マトリックス樹脂としてフェノキシ樹脂微粉末を単独で使用する場合、成形温度は、例えば160~250℃、好ましくは180℃~240℃、より好ましくは180℃~230℃である。マトリックス樹脂としてフェノキシ樹脂微粉末と共にエポキシ樹脂や架橋剤の微粉末を併用する場合、成形温度は、例えば150~240℃、好ましくは160℃~220℃、より好ましくは180℃~200℃である。成形温度が上限温度を超えると、必要以上の過剰な熱を加えるため、成形時間(タクトタイム)が長くなり生産性が悪くなり、下限温度を下回るとマトリックス樹脂の溶融粘度が高いため、強化繊維基材へのマトリックス樹脂の含浸性が悪くなる。成形時間については、通常30~60分で行うことができる。マトリックス樹脂としてフェノキシ樹脂微粉末と共にエポキシ樹脂や架橋剤の微粉末を併用する場合、10分程度の短時間であっても、主成分としてのフェノキシ樹脂(A)の2級水酸基を利用した架橋剤(C)との反応によって、脱型を行える強度を得ることができる。ただし、エポキシ樹脂(B)の硬化反応を完結させるためには、例えば200~250℃で30~60分程度、ポストキュアすることが好ましい。
なお、軟化点とは、マトリックス樹脂硬化物のDMAによって測定される貯蔵弾性率(E’)が減衰する変曲点の温度のことを示す。
マトリックス樹脂などの微粉末等の平均粒子径は、レーザー回折・散乱式粒子径分布測定装置(マイクロトラックMT3300EX、日機装社製)により、体積基準で累積体積が50%となるときの粒子径を測定した。
FRP成形用材料を10枚重ねて熱プレスすることにより作製した積層板から、ダイヤモンドカッターを用いて厚さ2mm、幅10mm、長さ10mmの試験片を作製し、動的粘弾性測定装置(Perkin Elmer社製 DMA 7e)を用いて、5℃/分の昇温条件、25~250℃の範囲で測定し、得られるtanδの極大ピークをガラス転移点とした。
レオメータ(Anton Paar社製)を用いて、サンプルサイズ4.3cm3をパラレルプレートに挟み、20℃/minで昇温しながら、周波数:1Hz、負荷ひずみ:5%の条件にて、180℃における溶融粘度を測定した。
FRP成形用材料の表面を指で触ってタック性のないものを合格とし、表中に○として表記した。
マトリックス樹脂付着前の強化繊維クロスの重量(W1)と、樹脂付着後のFRP成形用材料の重量(W2)から下記の式を用いて算出した。
樹脂割合(RC:%)=(W2-W1)/W2×100
W1:樹脂付着前の強化繊維クロス重量
W2:樹脂付着後のFRP成形用材料の重量
JIS K 7074:1988 炭素繊維強化プラスチックの曲げ試験方法に基づいて、得られたFRP積層板の機械物性を測定した。
特段の温湿度管理を行っていない室内に3か月間保管したFRP成形用材料を、テフロン(登録商標)シート上に10枚重ねて、200℃に加熱したプレス機で5MPa、5分間プレスして積層板を作製し、熱物性や機械物性の評価を行った。三か月前に作製した積層板との比較を行い、物性の誤差が±10%の範囲内であれば合格とし、表中に○と表記した。
FRP成形用材料を、テフロンシート上に10枚重ねて、200℃に加熱したプレス機で5MPa、5分間プレスして積層板を作製したのち、ダイヤモンドカッターを用いて10mm角の細片を数枚切り出した。切り出した細片は#1000以上の耐水研磨紙で切断面を研磨した後、光学顕微鏡により観察を行いボイドの有無を確認した。
良好を○、1~2個の空隙ありを△、空隙が多数を×とした。
米国UL規格のUL94に規定されている垂直燃焼性試験に準拠して、長さ125mm×幅13mm×厚み1mmの試験片を評価し、V-0相当の難燃性があった場合を◎、V-1またはV-2相当の難燃性があった場合を○、難燃性が無かった場合を×として表に示した。
(A-1)フェノトートYP-50S(新日鉄住金化学株式会社製ビスフェノールA型、Mw=60,000、水酸基当量=284)、Tg=84℃、200℃における溶融粘度=400Pa・s
(A-2)フェノトートYP-70(新日鉄住金化学株式会社製ビスフェノールA/ビスフェノールFの共重合型フェノキシ樹脂、Mw=55,000、水酸基等量=270)、Tg=70℃、200℃における溶融粘度=140Pa・s
(A-3)フェノトートYPB-43C(新日鉄住金化学株式会社製臭素化フェノキシ樹脂、Mw=60,000、水酸基等量=600)、Tg=149℃、220℃における溶融粘度=2,000Pa・s
(B-1):YSLV-80XY(新日鉄住金化学株式会社製テトラメチルビスフェノールF型、エポキシ当量=192、融点=72℃)
(C-1):無水ピロメリット酸(酸無水物当量=109、融点=283-286℃)
フェノキシ樹脂(A-1)を粉砕、分級し、平均粒径d50が100μmである粉体を、炭素繊維(東邦テナックス社製、STANDARD Modulus type HTS40 3K)からなる開繊処理された平織の強化繊維基材に、静電場において、電荷70kV、吹き付け空気圧0.32MPaの条件で粉体塗装を行い、その後、オーブンで200℃、2分間加熱溶融して樹脂を熱融着させ、FRP成形用材料を得た。得られたFRP成形用材料について、各種の物性を測定した。
その後、得られたFRP成形用材料をテフロンシート上に10枚重ねて、200℃に加熱したプレス機で5MPa、5分間プレスして積層板を作製し、機械物性の評価を行った。これらの結果を表1に示す。
フェノキシ樹脂(A-1)、又は(A-2)をそれぞれ粉砕、分級し、d50が50~80μmとなる粉体を作製し、上記と同様にしてFRP成形用材料を得て、同様にして積層板を作製し、機械物性の評価を行った。これらの結果を表1に示す。
フェノキシ樹脂(A-1)をメチルエチルケトンに溶解し、離型剤付きのPETフィルムに塗工した後、オーブン中で溶剤を揮発させて剥離し、フィルム化した。次いで、このフェノキシ樹脂(A-1)フィルムを、炭素繊維(東邦テナックス社製、STANDARD Modulus type HTS40 3K)からなる開繊処理された平織の強化繊維基材と、交互に積層し、10枚重ねて、200℃に加熱したプレス機で5MPa、5分間プレスして積層板を作成し、機械物性を行った。これらの結果を表1に示す。なお、RCは実施例1と同じになるようにフェノキシ樹脂フィルムの厚みを調整した。
マトリックス樹脂粉末として6-ナイロン樹脂粉末(NYLOTEX200、Tg=200℃、220℃における溶融粘度=220Pa・s)を使用し、プレス温度を230℃としたこと以外は、実施例1~3と同様にしてFRP成形用材料を得、積層板を作製して各種評価を行った。結果を表1に示す。
フェノキシ樹脂(A-1)、(A-3)をそれぞれ粉砕、分級し、平均粒径d50が80~100μmとなる粉体を作製した。これらを表2に示す割合(質量部)でドライブレンドしたのち、実施例1~3と同様にしてFRP成形用材料を得、プレス温度220℃として積層板を作製して難燃性試験を含む各種評価を行った。結果を表2に示す。
フェノキシ樹脂(A)として(A-1)、エポキシ樹脂(B)として(B-1)、架橋剤(C)として(C-1)をそれぞれ粉砕、分級して平均粒子径D50が100μmである粉体にしたものを、表2に示す割合(重量部)でドライブレンドし、炭素繊維(東邦テナックス社製、STANDARD Modulus type HTS40 3K)からなる開繊処理された平織の強化繊維基材に静電場において、電荷70kV、吹き付け空気圧0.32MPaの条件で粉体塗装を行った。その後、オーブンで180℃、2分間加熱溶融して樹脂を熱融着させ、FRP成形用材料を得た。得られたFRP成形用材料の樹脂割合(RC)は27%であった。
上記で得られたFRP成形用材料はタック性の評価を行ったのち、テフロンシート上に10枚重ねて、200℃に加熱したプレス機で5MPaで10分間プレスしFRP積層板を得た。その後、オーブンで2時間アフターキュアを行い、機械物性の評価を行った。
これらの結果を表3に示す。
フェノキシ樹脂(A)として、平均粒子径D50を80μmとなるように粉砕・分級したフェノキシ樹脂(A-1)、(A-2)粉末をそれぞれ使用した以外は、実施例6と同様にしてFRP成形用材料およびFRP積層板を作製し、評価を行った。これらの結果を表3に示す。
強化繊維基材へのマトリックス樹脂の塗工を、粉体塗装法(静電塗装法)ではなく、実施例6と同配合のマトリックス樹脂粉末をメチルエチルケトン(MEK)に溶解した溶液(固形分濃度10%)を用いたソルベント法にて行い、160℃の乾燥炉で1min乾燥することによりFRP成形用材料を作製した以外は、すべて同様にしてFRP積層板を作製し、各種評価を行った。結果を表4に示す。
フェノキシ樹脂(A)として、平均粒子径d50が80μmとなるよう粉砕・分級したフェノキシ樹脂(A-1)粉末に、エポキシ樹脂(B)として(B-1)、架橋剤(C)として(C-1)をそれぞれ粉砕・分級した粉末を表4に示す配合(重量部)でドライブレンドし、実施例6と同様にしてFRP成形用材料およびFRP積層板を作製し、評価を行った。これらの結果も表4に示す。
フェノキシ樹脂(A)として、平均粒子径D50が80μmとなるように粉砕・分級したフェノキシ樹脂(A-1)および(A-3)粉末を用い、エポキシ樹脂(B)として(B-1)、架橋剤(C)として(C-1)をそれぞれ粉砕・分級した粉末を表5に示す配合(重量部)及びモル比でドライブレンドし、実施例6と同様にしてFRP成形用材料およびFRP積層板を作製し、難燃性試験を含めた各種評価を行った。これらの結果を表5に示す。
Claims (14)
- マトリックス樹脂中に、160~220℃の温度域のいずれかにおいて溶融粘度が3,000Pa・s以下である常温固形のフェノキシ樹脂を全樹脂成分の50wt%以上含み、該マトリックス樹脂が平均粒子径(d50)10~150μmであること、該マトリックス樹脂の微粉末が粉体塗装法によって強化繊維基材に付着されていること、マトリックス樹脂割合が20~50wt%であることを特徴とする繊維強化プラスチック成形用材料。
- フェノキシ樹脂の質量平均分子量が20,000~100,000である請求項1に記載の繊維強化プラスチック成形用材料。
- フェノキシ樹脂の水酸基当量が50~750g/eqである請求項1に記載の繊維強化プラスチック成形用材料。
- フェノキシ樹脂のガラス転移温度が65~160℃である請求項1に記載の繊維強化プラスチック成形用材料。
- 強化繊維基材が炭素繊維、ボロン繊維、シリコンカーバイト繊維、ガラス繊維及びアラミド繊維よりなる群の中から選ばれる1種または2種以上の繊維を含むものである請求項1に記載の繊維強化プラスチック成形用材料。
- マトリックス樹脂中にフェノキシ樹脂、エポキシ樹脂及び架橋剤を必須成分として含み、フェノキシ樹脂100重量部に対してエポキシ樹脂が9~85重量部配合され、上記マトリックス樹脂及びフェノキシ樹脂の両者が、160~220℃の温度域のいずれかにおいて溶融粘度が3,000Pa・s以下である常温固形のマトリックス樹脂である請求項1に記載の繊維強化プラスチック成形用材料。
- 架橋剤(C)が酸無水物であり、フェノキシ樹脂(A)の2級水酸基1モルに対して、酸無水物基が0.5~1.3モルの範囲となるように配合された請求項6に記載の繊維強化プラスチック成形用材料。
- フェノキシ樹脂(A)とエポキシ樹脂(B)の粉末の平均粒子径(d50)がそれぞれ10~150μmであり、かつ架橋剤(C)の粉末の平均粒子径(d50)の1~2倍である請求項6に記載の繊維強化プラスチック成形用材料。
- 繊維強化プラスチック成形体用材料の製造方法であって、160~220℃の温度域のいずれかにおいて溶融粘度が3,000Pa・s以下である常温固形のフェノキシ樹脂を全樹脂成分の50wt以上含むマトリックス樹脂を用意し、このマトリックス樹脂を平均粒子径(d50)10~150μmに粉砕した後、得られたマトリックス樹脂の微粉末を、粉体塗装法によって強化繊維基材に付着させ、マトリックス樹脂割合を20~50wt%にすることを特徴とする繊維強化プラスチック成形用材料の製造方法。
- 原料マトリックス樹脂としてフェノキシ樹脂、エポキシ樹脂及び架橋剤を必須成分として含み、フェノキシ樹脂100重量部に対してエポキシ樹脂を9~85重量部含み、160℃~220℃の温度範囲の温度域のいずれかにおいて溶融粘度が3,000Pa・s以下である常温固形のマトリックス樹脂を用意し、これを平均粒子径(d50)10~150μmに粉砕した後、得られたマトリックス樹脂の微粉末を、粉体塗装法によって強化繊維基材に付着させ、マトリックス樹脂割合を20~50wt%の範囲にすることを特徴とする繊維強化プラスチック成形用材料の製造方法。
- 粉体塗装法が静電場を利用した粉体塗装法である請求項10に記載の繊維強化プラスチック成形体用材料の製造方法。
- 請求項1に記載の繊維強化プラスチック成形用材料を製造するためのフェノキシ樹脂粉末であって、160~220℃の温度域のいずれかにおいて溶融粘度が3000Pa・s以下であり、かつ平均粒子径(d50)が10~150μmであることを特徴とするフェノキシ樹脂粉末。
- 請求項1~8のいずれかに記載の繊維強化プラスチック成形用材料を加熱、加圧して成形又は硬化させてなることを特徴とする繊維強化プラスチック成形物。
- 繊維強化プラスチック成形物中のマトリックス樹脂が、硬化樹脂であり、そのガラス転移温度が160℃以上である請求項13に記載の繊維強化プラスチック成形物。
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EP3275923A4 (en) | 2018-10-24 |
JPWO2016152856A1 (ja) | 2017-12-14 |
CN107428970B (zh) | 2021-09-10 |
TW201706476A (zh) | 2017-02-16 |
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CN112851987A (zh) | 2021-05-28 |
US10590250B2 (en) | 2020-03-17 |
JP2019048460A (ja) | 2019-03-28 |
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