JP2001524171A - 成形法のための予備成形物およびそのための樹脂 - Google Patents
成形法のための予備成形物およびそのための樹脂Info
- Publication number
- JP2001524171A JP2001524171A JP54782598A JP54782598A JP2001524171A JP 2001524171 A JP2001524171 A JP 2001524171A JP 54782598 A JP54782598 A JP 54782598A JP 54782598 A JP54782598 A JP 54782598A JP 2001524171 A JP2001524171 A JP 2001524171A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- binder
- weight
- coated
- fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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- 239000011347 resin Substances 0.000 title claims abstract description 160
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- 239000000835 fiber Substances 0.000 claims abstract description 48
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 34
- 229920001971 elastomer Polymers 0.000 claims abstract description 26
- 239000000806 elastomer Substances 0.000 claims abstract description 25
- 239000012783 reinforcing fiber Substances 0.000 claims abstract description 16
- 229920003247 engineering thermoplastic Polymers 0.000 claims abstract description 14
- 229920000642 polymer Polymers 0.000 claims abstract description 14
- -1 polysiloxane Polymers 0.000 claims abstract description 12
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 6
- 229920001973 fluoroelastomer Polymers 0.000 claims abstract description 5
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 5
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 5
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- 239000000843 powder Substances 0.000 claims description 24
- 239000011159 matrix material Substances 0.000 claims description 19
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- 239000000203 mixture Substances 0.000 claims description 17
- 239000004416 thermosoftening plastic Substances 0.000 claims description 17
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 16
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- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical group C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims description 5
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- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 9
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- 125000003118 aryl group Chemical group 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
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- 238000010438 heat treatment Methods 0.000 description 5
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
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- 238000005507 spraying Methods 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 150000004984 aromatic diamines Chemical class 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000004643 cyanate ester Substances 0.000 description 3
- 239000003925 fat Substances 0.000 description 3
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- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
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- 238000010189 synthetic method Methods 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
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- 239000004831 Hot glue Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
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- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000011162 core material Substances 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
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- 239000000178 monomer Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 229920000412 polyarylene Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
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- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- PTBCCLLVPOLXES-UHFFFAOYSA-N 2-[9-(2-hydroxyphenyl)fluoren-9-yl]phenol Chemical compound OC1=CC=CC=C1C1(C=2C(=CC=CC=2)O)C2=CC=CC=C2C2=CC=CC=C21 PTBCCLLVPOLXES-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical class NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- CKOFBUUFHALZGK-UHFFFAOYSA-N 3-[(3-aminophenyl)methyl]aniline Chemical compound NC1=CC=CC(CC=2C=C(N)C=CC=2)=C1 CKOFBUUFHALZGK-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- QGMGHALXLXKCBD-UHFFFAOYSA-N 4-amino-n-(2-aminophenyl)benzamide Chemical compound C1=CC(N)=CC=C1C(=O)NC1=CC=CC=C1N QGMGHALXLXKCBD-UHFFFAOYSA-N 0.000 description 1
- GLBHAWAMATUOBB-UHFFFAOYSA-N 6,6-dimethylheptane-1,1-diamine Chemical compound CC(C)(C)CCCCC(N)N GLBHAWAMATUOBB-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
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- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
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- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 238000005727 Friedel-Crafts reaction Methods 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- SNIOPGDIGTZGOP-UHFFFAOYSA-N Nitroglycerin Chemical compound [O-][N+](=O)OCC(O[N+]([O-])=O)CO[N+]([O-])=O SNIOPGDIGTZGOP-UHFFFAOYSA-N 0.000 description 1
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical compound ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 241000620457 Telestes souffia Species 0.000 description 1
- 229920004738 ULTEM® Polymers 0.000 description 1
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- 125000002252 acyl group Chemical group 0.000 description 1
- 125000004423 acyloxy group Chemical group 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000005529 alkyleneoxy group Chemical group 0.000 description 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- GREFHIDGEPDFSX-UHFFFAOYSA-N benzene-1,3-diol;phenol Chemical class OC1=CC=CC=C1.OC1=CC=CC=C1.OC1=CC=CC(O)=C1 GREFHIDGEPDFSX-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009954 braiding Methods 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- YACLQRRMGMJLJV-UHFFFAOYSA-N chloroprene Chemical compound ClC(=C)C=C YACLQRRMGMJLJV-UHFFFAOYSA-N 0.000 description 1
- HPNSNYBUADCFDR-UHFFFAOYSA-N chromafenozide Chemical compound CC1=CC(C)=CC(C(=O)N(NC(=O)C=2C(=C3CCCOC3=CC=2)C)C(C)(C)C)=C1 HPNSNYBUADCFDR-UHFFFAOYSA-N 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 150000001913 cyanates Chemical class 0.000 description 1
- ATDGTVJJHBUTRL-UHFFFAOYSA-N cyanogen bromide Chemical compound BrC#N ATDGTVJJHBUTRL-UHFFFAOYSA-N 0.000 description 1
- QPJDMGCKMHUXFD-UHFFFAOYSA-N cyanogen chloride Chemical compound ClC#N QPJDMGCKMHUXFD-UHFFFAOYSA-N 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 238000006704 dehydrohalogenation reaction Methods 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
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- JMLPVHXESHXUSV-UHFFFAOYSA-N dodecane-1,1-diamine Chemical compound CCCCCCCCCCCC(N)N JMLPVHXESHXUSV-UHFFFAOYSA-N 0.000 description 1
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- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N glycolonitrile Natural products N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
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- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- SYECJBOWSGTPLU-UHFFFAOYSA-N hexane-1,1-diamine Chemical compound CCCCCC(N)N SYECJBOWSGTPLU-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- GPIUUMROPXDNRH-UMRXKNAASA-N molport-035-395-376 Chemical compound O=C1NC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 GPIUUMROPXDNRH-UMRXKNAASA-N 0.000 description 1
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- NTNWKDHZTDQSST-UHFFFAOYSA-N naphthalene-1,2-diamine Chemical compound C1=CC=CC2=C(N)C(N)=CC=C21 NTNWKDHZTDQSST-UHFFFAOYSA-N 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 229940073020 nitrol Drugs 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 238000011002 quantification Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012260 resinous material Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 125000000020 sulfo group Chemical group O=S(=O)([*])O[H] 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
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- 239000004634 thermosetting polymer Substances 0.000 description 1
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- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- BIKXLKXABVUSMH-UHFFFAOYSA-N trizinc;diborate Chemical compound [Zn+2].[Zn+2].[Zn+2].[O-]B([O-])[O-].[O-]B([O-])[O-] BIKXLKXABVUSMH-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/105—Coating or impregnating independently of the moulding or shaping step of reinforcement of definite length with a matrix in solid form, e.g. powder, fibre or sheet form
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B11/00—Making preforms
- B29B11/14—Making preforms characterised by structure or composition
- B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/04—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts comprising reinforcements only, e.g. self-reinforcing plastics
- B29C70/28—Shaping operations therefor
- B29C70/40—Shaping or impregnating by compression not applied
- B29C70/42—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles
- B29C70/46—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs
- B29C70/48—Shaping or impregnating by compression not applied for producing articles of definite length, i.e. discrete articles using matched moulds, e.g. for deforming sheet moulding compounds [SMC] or prepregs and impregnating the reinforcements in the closed mould, e.g. resin transfer moulding [RTM], e.g. by vacuum
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Reinforced Plastic Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Moulding By Coating Moulds (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Mold Materials And Core Materials (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.80〜99重量%の強化繊維および1〜20重量%の予備成形物結合剤樹脂を含ん で成る結合剤を被覆した繊維であって、該結合剤樹脂は、粒子状または強化繊維 の表面上の離散領域であり、該結合剤樹脂は; 40〜90重量%の熱硬化性樹脂の結合剤樹脂、および 高分子量エンジニアリングサーモプラスチックおよび/またはビニル付加ポリ マー、フルオロエラストマーおよびポリシロキサンエラストマーから選択される エラストマーの10〜60重量%の結合剤樹脂を含んで成り、 エンジニアリングサーモプラスチック/エラストマーは、熱硬化性樹脂中に溶 解され、結合剤樹脂は周囲温度で非粘着性であり、50〜150℃の範囲の軟化点を 有し、そして50〜200℃の範囲の温度で熱硬化性である、上記の結合剤を被覆し た繊維。 2.上記結合剤樹脂が、約75重量%の熱硬化性樹脂/エラストマーおよび約25重 量%のエンジニアリングサーモプラスチックを含んで成る、請求の範囲第1項に 記載の結合剤を被覆した繊維。 3.熱硬化性樹脂が、ビスマレイミド樹脂、シアネート樹脂およびエポキシ樹脂 から選択される、請求の範囲第1項または第2項に記載の結合剤を被覆した繊維 。 4.熱硬化性樹脂がビスマレイミド樹脂である、請求の範囲第3項に記載の結合 剤を被覆した繊維。 5.エンジニアリングサーモプラスチックが少なくとも150℃のTgを有し、そ してポリイミド、ポリエーテルイミド、ポリエーテルスルホン、ポリスルホン、 ポリエーテルケトン、ポリエーテルエーテルケトン、ポ リアミド、ポリアミドイミドおよびフェノキシ樹脂から選択される、前記請求の 範囲のいずれかに記載の結合剤を被覆した繊維。 6.エンジニアリングサーモプラスチックがポリエーテルイミド、ポリエーテル スルホンまたはフェノキシ樹脂である、請求の範囲第5項に記載の結合剤を被覆 した繊維。 7.エラストマーが4〜8個の炭素原子を有する共役ジエンから誘導されたホモ 重合性または共重合性ジエンゴムである、前記請求の範囲のいずれかに記載の結 合剤を被覆した繊維。 8.エラストマーが、ブタジエン−アクリロニトリルポリマーまたはカルボン酸 −官能性ブタジエンアクリロニトリルポリマーである、請求の範囲第7項に記載 の結合剤を被覆した繊維。 9.結合剤樹脂が、熱伝導性粒子、導電性粒子、難燃剤、着色剤、触媒、硬化剤 およびカップリング剤から選択される1種以上の添加剤を最高20重量%含んで成 る、前記請求の範囲のいずれかに記載の結合剤を被覆した繊維。 10.強化繊維が、ガラス繊維、炭素繊維、アラミド繊維、セラミック繊維およ びそれらの混合物から選択される、前記請求の範囲のいずれかに記載の結合剤を 被覆した繊維。 11.強化繊維が織物状である、請求の範囲第11項に記載の結合剤を被覆した 繊維。 12.90〜97重量%の強化繊維、および織物の片面または織物の両面に被覆され た3〜10重量%の結合剤樹脂を含んで成る、請求の範囲第11項に記載の結合剤 を被覆した繊維。 13.結合剤樹脂が1500μm以下の粒子サイズを有する粒子状態である、 前記請求の範囲のいずれかに記載の結合剤を被覆した繊維。 14.結合剤樹脂が、100〜500μmの範囲の平均粒子サイズを有する粒子状態で ある、請求の範囲第13項に記載の結合剤を被覆した繊維。 15.周囲温度で非粘着性固体であり、50〜150℃の範囲に軟化点を有し、そし て50〜200℃の範囲の温度で硬化可能であり、そして: 40〜90重量%の熱硬化性樹脂および 10〜60重量%の高分子量エンジニアリングサーモプラスチックおよび/または ゴム状ビニル付加ポリマーであるエラストマーを含んで成るが、ただしエンジニ アリングサーモプラスチックがポリエーテルスルホンである時、これは20〜60重 量%の量で存在する、を含んでなる結合剤樹脂。 16.40〜90重量%の熱硬化性樹脂、 10〜60重量%の高分子量エンジニアリングサーモプラスチックおよび/または ビニル付加ポリマー、フルオロエラストマーおよびポリシロキサンエラストマー から選択されるエラストマー、 熱伝導性粒子、導電性粒子、難燃剤、着色剤、触媒、硬化剤およびカップリン グ剤から選択される最高20重量%の1種以上の添加剤、 から成る請求の範囲第15項に記載の結合剤樹脂。 17.成分が請求の範囲第2項ないし第8項のいずれか1項により定められる請 求の範囲第15項または第16項に記載の結合剤樹脂。 18.1500μm以下の粒子サイズを有する非凝集性のさらさらした粉末状である 、請求の範囲第15項ないし第17項のいずれかに1項に記載の結合剤樹脂。 19.100〜500μmの範囲の平均粒子サイズを有する請求の範囲第18項 に記載の結合剤樹脂。 20.安定化された予備成形物の調製法であって: 請求の範囲第1項ないし第18項をいずれか1項に記載の結合剤を被覆した繊 維の複数層を提供し、 層を型面上に形成し、層を50〜150℃の範囲の温度で加熱して結合剤樹脂を融 解し、そして層を一緒に融合し、そして層を冷却して硬質にして予備成形物を形 成する、 工程を含んで成る上記予備成形物の調製法。 21.複合体の作成法であって、 請求の範囲第20項に記載の方法により製造された予備成形物を提供し、 熱硬化性マトリックス樹脂を予備成形物に適用し、そして樹脂を50〜200℃の 範囲の温度で硬化することにより複合体を形成する、 工程を含んで成る上記複合体の作成法。 22.予備成形物が型の中に置かれる、請求の範囲第21項に記載の方法。 23.マトリックス樹脂が予備成形物を含む型の中に導入される、請求の範囲第 22項に記載の方法。 24.マトリックス樹脂が、結合剤樹脂の熱硬化性樹脂と同じ種類である、請求 の範囲第23項に記載の複合体の作成法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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GB9709166.4 | 1997-05-06 | ||
GBGB9709166.4A GB9709166D0 (en) | 1997-05-06 | 1997-05-06 | Preforms for moulding process and resins therefor |
PCT/GB1998/001268 WO1998050211A1 (en) | 1997-05-06 | 1998-04-30 | Preforms for moulding process and resins therefor |
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JP2001524171A true JP2001524171A (ja) | 2001-11-27 |
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JP54782598A Pending JP2001524171A (ja) | 1997-05-06 | 1998-04-30 | 成形法のための予備成形物およびそのための樹脂 |
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EP (1) | EP0981427B1 (ja) |
JP (1) | JP2001524171A (ja) |
KR (1) | KR100581657B1 (ja) |
CN (1) | CN1261303A (ja) |
AT (1) | ATE368558T1 (ja) |
AU (1) | AU731556B2 (ja) |
BR (1) | BR9809225A (ja) |
CA (1) | CA2289083C (ja) |
DE (1) | DE69838168T2 (ja) |
ES (1) | ES2288308T3 (ja) |
GB (1) | GB9709166D0 (ja) |
MY (1) | MY131576A (ja) |
NO (1) | NO995442L (ja) |
TW (1) | TW530107B (ja) |
WO (1) | WO1998050211A1 (ja) |
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- 1998-04-30 KR KR1019997010206A patent/KR100581657B1/ko not_active IP Right Cessation
- 1998-04-30 EP EP98919356A patent/EP0981427B1/en not_active Expired - Lifetime
- 1998-04-30 BR BR9809225-1A patent/BR9809225A/pt not_active IP Right Cessation
- 1998-04-30 ES ES98919356T patent/ES2288308T3/es not_active Expired - Lifetime
- 1998-04-30 CN CN98806418.9A patent/CN1261303A/zh active Pending
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- 1998-04-30 JP JP54782598A patent/JP2001524171A/ja active Pending
- 1998-04-30 AT AT98919356T patent/ATE368558T1/de active
- 1998-04-30 CA CA002289083A patent/CA2289083C/en not_active Expired - Lifetime
- 1998-05-02 TW TW087106804A patent/TW530107B/zh not_active IP Right Cessation
- 1998-05-06 MY MYPI98002029A patent/MY131576A/en unknown
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JP2005294829A (ja) * | 2004-03-31 | 2005-10-20 | Endicott Interconnect Technologies Inc | 回路基板に用いる電気的絶縁層を形成するための電気的絶縁構造体 |
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---|---|
AU7223198A (en) | 1998-11-27 |
AU731556B2 (en) | 2001-04-05 |
CA2289083A1 (en) | 1998-11-12 |
DE69838168T2 (de) | 2008-04-10 |
KR20010012255A (ko) | 2001-02-15 |
NO995442L (no) | 2000-01-05 |
ES2288308T3 (es) | 2008-01-01 |
TW530107B (en) | 2003-05-01 |
ATE368558T1 (de) | 2007-08-15 |
CN1261303A (zh) | 2000-07-26 |
CA2289083C (en) | 2008-02-12 |
DE69838168D1 (de) | 2007-09-13 |
GB9709166D0 (en) | 1997-06-25 |
BR9809225A (pt) | 2000-07-04 |
EP0981427B1 (en) | 2007-08-01 |
NO995442D0 (no) | 1999-11-05 |
MY131576A (en) | 2007-08-30 |
EP0981427A1 (en) | 2000-03-01 |
WO1998050211A1 (en) | 1998-11-12 |
KR100581657B1 (ko) | 2006-05-23 |
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