WO2015163082A1 - 電子部品を埋設した樹脂構造体およびその製造方法 - Google Patents
電子部品を埋設した樹脂構造体およびその製造方法 Download PDFInfo
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- WO2015163082A1 WO2015163082A1 PCT/JP2015/059346 JP2015059346W WO2015163082A1 WO 2015163082 A1 WO2015163082 A1 WO 2015163082A1 JP 2015059346 W JP2015059346 W JP 2015059346W WO 2015163082 A1 WO2015163082 A1 WO 2015163082A1
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- Prior art keywords
- exposed
- resin
- molded body
- electrode
- electronic component
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15158—Shape the die mounting substrate being other than a cuboid
- H01L2924/15159—Side view
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/14—Related to the order of processing steps
- H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
- H05K2203/1469—Circuit made after mounting or encapsulation of the components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
Definitions
- the present invention relates to a resin structure in which electronic parts are embedded and a method for manufacturing the same.
- the electronic device is configured by assembling various electronic components on a printed circuit board.
- various electronic components include passive components such as resistors and capacitors, active components such as LSI (Large Scale Integrated Circuit) and IC (Integrated Circuit), power supply devices such as batteries, Display devices such as LEDs (Light Emitting Diodes), sensors, switches, and the like.
- the above printed circuit board is generally made by laminating a copper foil on a sheet of epoxy resin board (Garaepo) reinforced with glass fiber or a board made of polyimide (flexible board).
- a wiring circuit is formed by etching.
- An electronic device is assembled by mounting other electronic components on the wiring circuit using solder, conductive adhesive, metal wire, or the like.
- a printed circuit board that forms a circuit by etching copper foil is expensive in terms of material costs and processing costs, and also for mounting electronic components using solder, conductive adhesive, metal wires, etc. There is a problem that the cost becomes high because the cost and processing cost increase. Further, there is a problem that the waste liquid discharged by the etching process has a large load on the environment.
- Patent Document 1 discloses an electronic circuit package in which electronic parts, circuit elements, and the like are embedded in a molding resin so that the electrode surfaces are exposed.
- the electronic circuit package first, electronic parts, circuit elements and the like are temporarily fixed with a thermosetting resin, and the electronic parts, circuit elements and the like are embedded in the molding resin by injection molding. Thereafter, the temporarily fixing resin is dissolved and removed to expose the electrode surface.
- An electronic circuit package is manufactured by forming a conductor layer on the exposed electrode surface and forming a wiring pattern by exposure and etching.
- Patent Document 2 discloses a method of using a resin in which an electronic component is embedded as an exterior component.
- an electronic component is embedded in the inner surface of a resin with an electrode exposed, and a circuit is formed by a technique such as printing a silver paste. Therefore, the exterior component plays the role of a substrate, and a substrate for forming a circuit is not necessary, and the product can be thinned.
- Patent Document 3 discloses an electronic component mounting apparatus in which an electronic component is embedded in a resin molded product.
- the electronic component is embedded in the resin molded product with the electrode of the electronic component exposed. Therefore, by electrically connecting the exposed electrodes, a member (substrate) for fixing the electronic component in a positioned state becomes unnecessary, and an operation for assembling the electronic component to the housing becomes unnecessary.
- Japanese Patent Publication “JP 7-66570 A (published on March 10, 1995)” Japanese Patent Publication “Japanese Patent Laid-Open No. 2004-111502 (published on April 8, 2004)” Japanese Patent Publication “Japanese Patent Laid-Open No. 2010-272756 (Released on Dec. 2, 2010)”
- the surface on which a circuit for connecting each electronic component or the like can be formed is limited to one surface where the electrodes are exposed.
- the present invention has been made in view of the above problems, and its purpose is a resin structure in which an electronic component is embedded in a resin molded body, and in the resin structure in which the electrode of the electronic component is exposed from the resin,
- the purpose is to increase the degree of freedom in circuit design for mounting electronic components.
- the resin molded body has a plurality of exposed surfaces from which electrodes of the electronic components are exposed.
- the resin molded body has a recess, and the bottom surface of the recess is at least one of the plurality of exposed surfaces.
- the resin structure includes a plurality of exposed surfaces from which the electrodes are exposed. Therefore, a circuit can be formed on a plurality of surfaces, and the degree of freedom in circuit design for mounting electronic components is increased. Therefore, the number of components that can be mounted is increased, and the problem that the circuit length connecting each electronic component is limited when the number of surfaces forming the circuit is one is solved.
- the present invention can increase the degree of freedom in circuit design for mounting electronic components in a resin structure in which electronic components are embedded in a resin molded body.
- FIG. 1 is a schematic configuration diagram illustrating an example of a resin structure according to the present embodiment.
- FIG. 1A is a schematic configuration diagram of a resin structure 1 according to this embodiment as viewed from above
- FIG. 1B is a view taken along the line AA ′ in FIG.
- FIG. 1C is a cross-sectional view
- FIG. 1C is a schematic configuration diagram of the resin structure 1 according to this embodiment as viewed from below.
- the resin structure 1 includes an electronic component 2, a conductive member 4, a resin molded body 5, and a wiring 6.
- the plurality of electronic components 2 (2a to 2h) are passive components such as resistors and capacitors, active components such as LSI and IC, power supply devices such as batteries, display devices such as LEDs, sensors and switches.
- reference numeral 2 is assigned when not distinguishing each of the plurality of electronic components, and any of reference numerals 2a to 2h is assigned when distinction is made.
- Each electronic component 2 includes electrodes 3 (3a-1 to 3h-2).
- the electronic component 2a includes electrodes 3a-1 and 3a-2
- the electronic component 2b includes electrodes 3b-1 and 3b-2
- the electronic component 2c includes electrodes 3c-1 and 3c-2.
- 2d includes electrodes 3d-1 and 3d-2
- the electronic component 2e includes electrodes 3e-1 and 3e-2
- the electronic component 2f includes electrodes 3f-1 and 3f-2
- the electronic component 2g includes The electrodes 3g-1 and 3g-2 are provided
- the electronic component 2h is provided with electrodes 3h-1 and 3h-2.
- the conductive member 4 (4a, 4b) is a member made of a conductive metal (for example, copper) and functions as a terminal block for facilitating connection between the electronic components 2.
- the reference numeral 4 is assigned when the conductive members are not distinguished from each other, and any of the reference numerals 4a and 4b is attached when the conductive members are distinguished.
- the resin molded body 5 is substantially plate-shaped, and the electronic component 2 and the conductive member 4 are embedded therein. However, the resin molded body 5 has a plurality of exposed surfaces that expose the electrodes 3 and the conductive members 4 of the electronic component 2.
- the exposed surface refers to a surface where one or more electrodes are exposed.
- the entire upper surface 11 (hereinafter referred to as the resin molded body upper surface) 11 of the flat resin molded body 5 is one of the exposed surfaces.
- the resin molded body 5 has a recess 7 formed on the lower surface (hereinafter referred to as the resin molded body lower surface) 12. The recess 7 is formed to such a depth that the electrode 3 or the conductive member 4 is exposed. For this reason, the flat bottom surface (hereinafter referred to as the recess bottom surface) 13 of the recess 7 becomes an exposed surface that exposes the electrode 3 and the conductive member 4.
- the resin molded body 5 has a part of the electrodes 3 of the electronic component 2 (in FIG. 1, the electrode 3a-2, the electrode 3c-2, the electrode 3d-1, and the electrode 3f-2) are arranged on the upper surface of the resin molded body.
- the electronic component 2 is supported so as to be a two-sided exposed electrode that is exposed at both the bottom surface 11 and the recess bottom surface 13.
- the resin molded body 5 supports the conductive member 4 so that the conductive member 4 is exposed on both the resin molded body upper surface 11 and the recess bottom surface 13.
- the wiring 6 is a member for connecting a circuit between the electrodes 3, between the electrodes 3 and the conductive member 4, or between the conductive members 4, and is made of a conductive material.
- the wiring 6 is formed in each of a plurality of exposed surfaces that expose the electrodes 3 and / or the conductive members 4 of the electronic component 2, and the exposed surfaces 3 are exposed between the exposed electrodes 3 and the electrodes 3.
- the conductive member 4 or the conductive member 4 is connected.
- the resin structure 1 has a plurality of exposed surfaces that expose the electrodes 3 and / or the conductive members 4. Therefore, it is possible to increase the degree of freedom in circuit design as compared with the case where wiring is performed only within one exposed surface.
- the electrode 3f-2 and the electrode 3d-1 are connected to each other.
- the wiring 6 to be connected cannot be provided on the upper surface 11 of the resin molded body. This is because the wiring 6 connecting the electrode 3f-2 and the electrode 3d-1 intersects the existing wiring 6 between the conductive member 4a and the electrode 3h-2.
- the resin structure 1 has the recess bottom surface 13 where the electrode 3f-2 and the electrode 3d-2 are exposed separately from the resin molded body top surface 11.
- a wiring 6 for connecting 3f-2 and the electrode 3d-1 can be provided to form a circuit.
- the double-sided exposed electrode (in FIG. 1, the electrode 3a-2, the electrode 3c-2, the electrode 3d-1, and the electrode 3f-2) (multiple-sided exposed electrode) is a resin molded body top surface 11 in the resin structure 1. And the recess bottom surface 13 are exposed. Therefore, the two-sided exposed electrode can be used as a part of the wiring 6 that connects the circuit formed on the resin molded body upper surface 11 and the circuit formed on the recess bottom surface 13.
- the electrode 3f-2 is a two-sided exposed electrode exposed to two exposed surfaces of the resin molded body upper surface 11 and the recessed portion bottom surface 13.
- the electrode 3f-2 has a wiring 6 between the electrode 3h-1 on the upper surface 11 of the resin molded body and a wiring between the electrode 3d-1 and the conductive member 4a on the bottom surface 13 of the recess.
- the wiring 6 between the electrode 3h-1 and the electrode 3f-2 formed on the resin molded body upper surface 11, and the electrode 3d-1, the conductive member 4a and the electrode 3f formed on the recess bottom surface 13 are formed.
- -6 can be made conductive without passing through the electronic component 2f.
- the electrode 3f-2 can be used as a part of the wiring 6.
- the conductive member 4 is also exposed on both the resin molded body top surface 11 and the recess bottom surface 13, the circuit formed on the resin molded body top surface 11 and the circuit formed on the recess bottom surface 13 are connected.
- the conductive member 4 can also be used as a part of the wiring 6.
- the conductive member 4a has the wiring 6 between the electrode 3h-2 and the electrode 3g-1 on the upper surface 11 of the resin molded body, and the electrode 3d-1 and the electrode 3f-2 on the bottom surface 13 of the recess. And a wiring 6 between them. That is, if the conductive member 4 exposed to both exposed surfaces is embedded in the resin structure 1, the wiring 6 is formed between the conductive member 4 and the electrode 3 on each exposed surface.
- the circuit formed on the resin molded body upper surface 11 and the circuit formed on the recess bottom surface 13 can be connected. For this reason, when there is only one surface on which a circuit can be formed, it is possible to form a circuit even in an electronic component arrangement where it was difficult to form a circuit, and it is possible to increase the degree of freedom in circuit design. Become.
- the electroconductive member 4 is exposed with respect to both the resin molding top surface 11 and the recessed part bottom face 13, it is not restricted to this. If the conductive member 4 is exposed to at least one of the resin molded body upper surface 11 and the recess bottom surface 13, the electronic component 2 can be used as a terminal block for circuit connection.
- a circuit can be formed on both the upper surface 11 of the resin molded body and the bottom surface 13 of the recess, and an electronic component arrangement in which it has been difficult to form wiring conventionally. It is also possible to form wiring. Thereby, the freedom degree of arrangement
- the electronic component 2 and the conductive member 4 are attached and fixed so that the electrode 3 contacts the sheet 20 ((a) of FIG. 2).
- the material of the sheet 20 is preferably a material that transmits ultraviolet rays and has flexibility.
- PET polyethylene terephthalate
- PEN polyethylene naphthalate
- PPS polyphenylene sulfide
- an adhesive is applied to the surface 20 of the sheet 20, and the electronic component 2 is fixed to the surface 22 of the sheet 20 in a state where the positional relationship of the electronic component 2 is determined.
- the adhesive those having a short curing time are preferable.
- an ultraviolet curable adhesive can be used.
- the ultraviolet curable adhesive is cured when irradiated with ultraviolet rays, and bonds the sheet 20 and the electronic component 2 together. Therefore, when the ultraviolet ray is irradiated from the surface 22 to which the adhesive is applied, the electronic component 2 itself becomes a barrier that prevents the adhesive from being irradiated with the ultraviolet ray, and curing (adhesion) becomes insufficient. there is a possibility.
- the adhesive is sufficiently cured, and the electronic component 2 can be reliably secured in a short time. Can be fixed to the sheet.
- GL-3005H manufactured by Gurelab is used as an ultraviolet curable adhesive, and the adhesive is applied to a 50 ⁇ m PET sheet at a thickness of 2 to 3 ⁇ m. After that, the position of the electronic component 2 is determined, and the adhesive is cured by fixing the electronic component 2 by irradiating 3000 mJ / cm 2 of ultraviolet rays from the surface 21 where the adhesive of the sheet is not applied. .
- the sheet 20 to which the electronic component 2 is fixed is placed inside the molding die 23 (second step), and the electronic component 2 is embedded in the resin molded body 5.
- the substantially plate-shaped resin molded body 5 is molded (third step).
- the mold 23 includes a first mold 23a and a second mold 23b.
- the sheet 20 created in the first step is placed inside a space surrounded by the first mold 23a and the second mold 23b.
- the first mold 23a has a substantially flat inner surface
- the second mold 23b has a convex portion 25 on the inner surface.
- the sheet 20 is disposed so that the surface 21 is in close contact with the inner surface of the first mold 23a.
- the sheet 20 is arranged such that at least a part of the electronic component 2 is in contact with the convex portion 25 of the second molding die 23b, and a portion other than the contact is separated from the second molding die 23b.
- the resin molding 5 is shape
- the convex portion 25 has a flat top surface and is formed at a position that is exposed from the bottom surface 13 of the concave portion and contacts the electrode 3 and / or the conductive member 4 of the electronic component 2.
- a portion (contact portion 26) where the convex portion 25 and the electronic component 2 are in contact with each other is exposed from the resin molded body 5. That is, the convex portion 25 corresponds to the concave portion 7 of the resin molded body 5, and the upper surface of the convex portion 25 corresponds to the concave bottom surface 13 that is the exposed surface of the resin molded body 5.
- the contact portion 26 of the electronic component 2 that contacts the convex portion 25 of the second mold 23 b is a part including the electrode 3 of the electronic component 2. This is because the contact portion 26 is a part including the electrode 3 of the electronic component 2, so that the electrode 3 is exposed from the bottom surface 13 of the recess of the resin molded body 5. This is because the portion is not exposed from the resin molded body 5. Thereby, fixation in the resin molding 5 of the electronic component 2 can be ensured.
- a resin such as an ABS resin is used as the resin molded body 5 and injection molding can be performed at a molding die temperature of 80 ° C., an injection resin temperature of 180 ° C., and an injection pressure of 20 kgf / cm 2 .
- the resin molded body 5 is taken out from the mold 23 and the sheet 20 is peeled off ((c) in FIG. 2).
- the electrode 3 is exposed from the resin molded body upper surface 11 corresponding to the surface 22 of the sheet 20, and the resin molded body upper surface (first exposed surface) 11 becomes an exposed surface.
- an adhesive having a property of softening at the molding temperature in the third step may be used, and a sheet 20 having flexibility suitable for peeling may be used.
- the sheet 20 can be easily peeled off.
- the resin molded body 5 has a recess 7 formed at a position corresponding to the protrusion 25 of the molding die 23, and a recess bottom surface (second exposed surface) 13 from which the electrode 3 and / or the conductive member 4 is exposed. It is formed as an exposed surface.
- the wiring 6 As a method of forming the wiring 6, it is preferable to form the wiring 6 by a method of printing by using a conductive material (for example, silver ink) and spraying a conductive material such as inkjet printing.
- a conductive material for example, silver ink
- a conductive material such as inkjet printing.
- Each of the exposed surfaces (resin molded body upper surface 11 and recess bottom surface 13) formed in the fourth step is a flat surface. Therefore, by injecting the conductive material, the wiring 6 with high connection reliability can be easily formed, and the electronic component 2 can be electrically connected.
- the position of the electronic component 2 is shifted due to the extrusion pressure of the resin when the resin molded body 5 is molded.
- the present embodiment by using the above-described method as a method for forming the wiring, even when the electronic component 2 is displaced from a predetermined position and is embedded and molded in the resin molded body 5, an image is printed when the wiring 6 is printed.
- the position of the electrode 3 can be detected using a method such as processing, and the wiring 6 can be printed according to the deviation. Therefore, a sufficient ground area between the electrode 3 and the wiring 6 can be ensured, and a highly reliable circuit can be formed.
- the conductive member 4 is embedded in the resin molded body 5.
- the conductive member 4 may not be embedded in the resin structure 1.
- the conductive member 4 can be omitted.
- FIG. 3 shows a schematic diagram of the resin structure 30 according to the present embodiment
- FIG. 3A is a schematic configuration diagram of the resin structure 30 according to the present embodiment as viewed from above
- 3B is a cross-sectional view taken along the line AA ′ in FIG. 3A
- FIG. 3C is a view of the resin structure 30 according to the present embodiment from below.
- a passive element such as a resistor or a capacitor, an active element such as an IC or LSI, a thermistor 2k as a temperature sensor, a battery 2m, or the like is provided as an electronic component 2 in the resin molded body 5. Buried. The electrodes 3 exposed from the resin structure 30 are connected to each other by wiring 6.
- the electrode 3 includes electrodes 3k-1 and 3k-2 of the thermistor 2k and electrodes 3m-1 and 3m-2 of the battery 2m.
- the resin structure 30 in the present embodiment also has the recess 7 on the lower surface 32 of the resin molded body, similarly to the resin structure 1 described in the first embodiment. Further, the recess bottom surface 13 and the resin molded body upper surface 31 are exposed surfaces of the electrodes 3 of the electronic component 2.
- the electrodes 3k-1 and 3k-2 of the thermistor 2k are two-sided exposed electrodes that are exposed on both the upper surface 31 and the bottom surface 13 of the recess. Therefore, it is possible to form a circuit on both surfaces of the resin molded body upper surface 31 and the recess bottom surface 13.
- one electrode 3k-1 of the thermistor 2k is connected to the electronic component 2i by the wiring 6 on the upper surface 31 of the resin molded body.
- the other electrode 3k-2 of the thermistor 2k is connected to the electronic component 2j by the wiring 6 at the bottom surface 13 of the recess.
- both the electrode 3j-1 of the electronic component 2j and the electrode 3k-2 of the thermistor 2k are exposed to the exposed surface formed on the bottom surface 13 of the recess. Even between the electrodes 3 where it is difficult to form 6, the wiring 6 can be formed on the bottom surface 13 of the recess, which is another exposed surface.
- the electrode 3k-1 of the thermistor 2k when the thickness of the electrode 3k-1 of the thermistor 2k is different from the thickness of the electronic component 2j, the electrode 3k-1 of the thermistor 2k with respect to both the upper surface 31 and the bottom surface 13 of the recess. In order to expose the electrode 3j-1 of the electronic component 2j, an inclined surface 40 is provided on the bottom surface 13 of the recess. As a result, even when the electrode 3k-1 of the thermistor 2k and the electronic component 2j are different in thickness, the wiring 6 can be printed and a circuit can be formed, which increases the degree of freedom in circuit design. it can.
- the inclined surface 40 is only inclined with respect to the lower surface 32 of the resin molded body, and is not perpendicular to the lower surface 32 of the resin molded body. Therefore, even with a method of printing by injecting a conductive material such as inkjet printing, wiring with high connection reliability can be formed on the inclined surface 40.
- the electrodes 3m-1 and 3m-2 of the battery 2m embedded in the resin structure 30 are also similar to the electrodes 3k-1 and 3k-2 of the thermistor 2k described above, Are embedded in the resin structure 30 as two-surface exposed electrodes exposed on both exposed surfaces. Therefore, the wiring 6 can be formed on both exposed surfaces, and the circuit formed on each of the resin molded body upper surface 31 and the recess bottom surface 13 is used as a part of the wiring 6 to conduct the circuit. The degree of freedom can also be increased.
- the sealing body 50 is assembled on the upper surface side of the resin structure 30 described above, and sealing is performed by a method such as adhesive, ultrasonic welding, or pouring resin in a mold to manufacture an electronic thermometer.
- a method such as adhesive, ultrasonic welding, or pouring resin in a mold to manufacture an electronic thermometer.
- the exposed electronic component 2, electrode 3, wiring 6, and the like are shielded from the external environment, and the inside of the resin structure 30 can be protected from moisture, moisture, and the like.
- the bottom surface 13 of the recess may be sealed in the same way, but the electrodes 3m-1 and 3m-2 of the battery 2m described above are left exposed from the resin structure 30 and used as an electrode for charging or the like. It may be used.
- the wiring 6 is not formed on the bottom surface 13 of the recess, which is an exposed surface from which the electrodes 3m-1 and 3m-2 are exposed.
- the resin structure 30 as an exterior part of an electronic device such as a thermometer, a fixing member for fixing an electronic part such as a board is not necessary, and the exterior accompanying the arrangement of the fixing member such as a board is eliminated. There are no restrictions on parts. Therefore, by using the resin structure as an exterior part of an electronic device, the influence on the appearance due to the arrangement of the electronic part can be reduced.
- the resin molded body includes a plurality of electrodes from which the electrodes of the electronic components are exposed.
- a concave portion is formed in the resin molded body, and the bottom surface of the concave portion is at least one of the plurality of exposed surfaces.
- the resin structure includes a plurality of exposed surfaces from which the electrodes are exposed. Therefore, a circuit can be formed on a plurality of surfaces, and the degree of freedom in circuit design for mounting electronic components is increased. Therefore, the number of components that can be mounted is increased, and the problem that the circuit length connecting each electronic component is limited when the number of surfaces forming the circuit is one is solved.
- the resin structure according to the present invention may have a wiring connecting the electrodes exposed from the exposed surface in the exposed surface.
- the wiring is formed in the same plane. That is, for example, wiring (three-dimensional wiring) extending over two surfaces orthogonal to each other is not formed. Therefore, when the resin molded body is subjected to deformation force such as expansion, contraction, bending, etc., the three-dimensional wiring (generally, a 90-degree bent portion) is easily disconnected by the deformation force. If wiring is performed in the same plane as in a resin structure, it is possible to form a highly reliable circuit in which wiring is hard to break.
- At least one of the electrodes is a multi-surface exposed electrode exposed to at least two different exposed surfaces, and at least two exposed surfaces from which the multi-surface exposed electrode is exposed. Each of these may have wiring connected to the multiple-surface exposed electrode.
- At least one of the plurality of exposed surfaces from which the plurality of exposed electrodes are exposed may be a bottom surface of the concave portion.
- a circuit can be formed on the bottom surface of the concave portion, and the multiple-surface exposed electrode is connected to the concave bottom surface and other exposed surfaces.
- a circuit can be formed as a part of the wiring connecting the two.
- the resin molded body is substantially plate-shaped, and one surface is a flat surface, the entire flat surface is the exposed surface, and the concave surface is formed on the other surface. May be formed.
- a conductive member embedded in the resin molded body and exposed from at least one of the plurality of exposed surfaces, and an exposed surface where the conductive member is exposed The wiring of connecting the electrode of the electronic component exposed on the exposed surface and the conductive member may be provided.
- the conductive member if it is exposed from the exposed surface, it can be used as a terminal block for connecting the electrodes.
- Each may have wiring connected to the conductive member.
- the conductive member if the conductive member is exposed from at least two exposed surfaces, the conductive member can be regarded as part of the wiring connecting the two exposed surfaces to form a circuit. , The degree of freedom of circuit arrangement increases.
- the resin structure may include a sealing body that seals the exposed surface.
- the exposed electronic components, electrodes, wiring, and the like are shielded from the external environment, and the inside of the resin structure can be protected from moisture, moisture, and the like.
- the method for manufacturing a resin structure according to the present invention is a method for manufacturing a resin structure in which a plurality of electronic components are embedded in a resin molded body, and the sheet is attached to the electronic component so that the sheet contacts the electrode.
- a second step by arranging the sheet on the mold so that the convex portion comes into contact with the electrode, in the fourth step, a second
- the 1st exposed surface surface from which the sheet
- the 2nd exposed surface surface where the convex part of the shaping
- the conductive material is sprayed and printed on each of the first exposed surface and the second exposed surface to form wiring between the exposed electrodes. You may have 5 processes.
- a circuit can be formed using a simple method of printing by ejecting a conductive material such as an ink jet within the same surface of each of the first exposed surface and the second exposed surface.
- material cost and processing cost can be held down cheaply.
- the printing position can be easily adjusted by the method of printing by spraying the conductive material. Therefore, even if the embedded position of the electronic component is shifted from a predetermined position, wiring corresponding to the shift can be formed.
- the method for producing a resin structure according to the present invention may include a sixth step of sealing the electrode exposed from the resin molded body.
- the present invention can be used for an electronic device using a resin structure as an exterior part.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
(樹脂構造体の構成概略)
図1は、本実施形態に係る樹脂構造体の一例を示す構成概略図である。図1の(a)は、本実施形態に係る樹脂構造体1を上方から見た構成概略図であり、図1の(b)は、図1の(a)におけるA-A’線矢視断面図であり、図1の(c)は、本実施形態に係る樹脂構造体1を下方から見た構成概略図である。
次に、本実施形態に係る樹脂構造体1の製造方法を、図2の(a)~(d)を参照して説明する。
次に、本実施形態に係る樹脂構造体1の変形例について説明する。
次に、本発明に係る樹脂構造体を電子体温計に適用した場合の実施形態を示す。なお、説明の便宜上、上述した実施形態と同様の機能を有する部材については前記実施形態と同じ符号を付し、その説明を省略する。
以上のように、本発明に係る樹脂成形体と、前記樹脂成形体内に埋設された複数の電子部品とを備える樹脂構造体において、前記樹脂成形体は、前記電子部品の電極が露出する複数の露出面を有し、前記樹脂成形体には、凹部が形成されており、前記凹部の底面が前記複数の露出面の少なくとも1つである。
2 電子部品
3 電極
4 導電性部材
5 樹脂成形体
6 配線
7 凹部
13 凹部底面
20 シート
23 成形型
25 凸部
50 封止体
Claims (12)
- 樹脂成形体と、前記樹脂成形体内に埋設された複数の電子部品とを備える樹脂構造体において、
前記樹脂成形体は、前記電子部品の電極が露出する複数の露出面を有し、
前記樹脂成形体には、凹部が形成されており、
前記凹部の底面が前記複数の露出面の少なくとも1つであることを特徴とする樹脂構造体。 - 前記露出面内において、当該露出面から露出している前記電極間を接続する配線を有することを特徴とする請求項1に記載の樹脂構造体。
- 前記電極のうち少なくとも1つは、少なくとも異なる2つの露出面に対して露出する複数面露出電極であり、
前記複数面露出電極が露出する少なくとも2つの露出面の各々において、前記複数面露出電極と接続される配線を有することを特徴とする請求項1または2に記載の樹脂構造体。 - 前記複数面露出電極が露出している複数の露出面のうち少なくとも1つは、前記凹部の底面であることを特徴とする請求項3に記載の樹脂構造体。
- 前記電子部品は、前記凹部の底面において、一部のみが露出していることを特徴とする請求項1から4のいずれか1項に記載の樹脂構造体。
- 前記樹脂成形体は、
略板状であって、
一方の面が平面であり、前記平面のすべてが前記露出面であって、
他方の面に前記凹部が形成されていることを特徴とする請求項1から5のいずれか1項に記載の樹脂構造体。 - 前記樹脂成形体内に埋設され、前記複数の露出面の少なくとも1つから露出している導電性部材と、
前記導電性部材が露出している露出面において、当該露出面に露出している電子部品の電極と前記導電性部材とを接続する配線とを有していることを特徴とする請求項1から6のいずれか1項に記載の樹脂構造体。 - 前記樹脂成形体内に埋設され、前記複数の露出面の少なくとも2つから露出している導電性部材と、
前記導電性部材が露出している露出面の各々において、前記導電性部材と接続される配線とを有していることを特徴とする請求項1から6のいずれか1項に記載の樹脂構造体。 - 前記露出面を封止する封止体を有することを特徴とする請求項1から8のいずれか1項に記載の樹脂構造体。
- 樹脂成形体内に複数の電子部品が埋設された樹脂構造体の製造方法において、
シートが電極に当接するように、電子部品にシートを貼り付ける第1工程と、
前記電極のうち少なくとも1つが前記シートにおける前記電子部品が貼り付けられた面と成形型の内面との間に空間ができるように、前記シートを成形型に配置する第2工程と、
前記空間に樹脂を充填させることで、前記電子部品が埋設された樹脂成形体を成形する第3工程と、
前記電子部品が埋設された樹脂成形体を前記成形型から取り出し、前記シートを前記樹脂成形体から剥離することで、前記シートに当接していた電極が露出する第1露出面を樹脂成形体に形成する第4工程とを有し、
前記成形型は、内面に凸部を有し、
前記第2工程において、前記凸部が前記電極に当接するように前記シートを前記成形型に配置することにより、前記第4工程において、前記凸部に当接していた電極が露出する第2露出面を形成することを特徴とする樹脂構造体の製造方法。 - 前記第1露出面および第2露出面の各々において、導電材を噴射して印刷することで、露出した前記電極間の配線を形成する第5工程を有することを特徴とする請求項10に記載の樹脂構造体の製造方法。
- 前記樹脂成形体から露出した前記電極を封止する第6工程を有することを特徴とする請求項11に記載の樹脂構造体の製造方法。
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EP3136432B1 (en) | 2021-02-17 |
TW201606954A (zh) | 2016-02-16 |
US9922932B2 (en) | 2018-03-20 |
CN106104777B (zh) | 2018-09-28 |
EP3136432A4 (en) | 2018-01-03 |
JP2015207703A (ja) | 2015-11-19 |
KR20160124865A (ko) | 2016-10-28 |
CN106104777A (zh) | 2016-11-09 |
TWI630686B (zh) | 2018-07-21 |
US20170103950A1 (en) | 2017-04-13 |
JP6354285B2 (ja) | 2018-07-11 |
EP3136432A1 (en) | 2017-03-01 |
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