WO2013024873A1 - 接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体 - Google Patents
接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体 Download PDFInfo
- Publication number
- WO2013024873A1 WO2013024873A1 PCT/JP2012/070757 JP2012070757W WO2013024873A1 WO 2013024873 A1 WO2013024873 A1 WO 2013024873A1 JP 2012070757 W JP2012070757 W JP 2012070757W WO 2013024873 A1 WO2013024873 A1 WO 2013024873A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive
- reel
- tape
- adhesive tape
- winding
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/04—Kinds or types
- B65H75/08—Kinds or types of circular or polygonal cross-section
- B65H75/14—Kinds or types of circular or polygonal cross-section with two end flanges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H75/00—Storing webs, tapes, or filamentary material, e.g. on reels
- B65H75/02—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
- B65H75/34—Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks specially adapted or mounted for storing and repeatedly paying-out and re-storing lengths of material provided for particular purposes, e.g. anchored hoses, power cables
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/30—Handled filamentary material
- B65H2701/37—Tapes
- B65H2701/377—Adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to an adhesive reel, and more particularly, to an adhesive reel in which an adhesive tape having a tape-like base material and an adhesive layer provided on one surface thereof is wound around a winding core.
- An anisotropic conductive film (ACF: Anisotropic Conductive Film) is used as a connection material for electrically connecting circuit members having a large number of electrodes to manufacture a circuit connection body.
- Anisotropic conductive film keeps the conductive state between opposing electrodes when connecting a semiconductor element such as an IC or LSI or a member such as a package to a substrate such as a printed wiring board, LCD glass substrate or flexible printed circuit board. It is a connection material that performs electrical connection and mechanical fixation so as to maintain insulation between electrodes.
- connection materials such as non-conductive films (NCF) are known.
- the connecting material includes an adhesive component containing a thermosetting resin and the like, and conductive particles blended as necessary in the case of an anisotropic conductive film, and a substrate such as a polyethylene terephthalate film (PET film). Formed on top as a film.
- the raw film of the obtained film is cut into a tape shape so as to have a width suitable for the application, and this is wound around a core to produce an adhesive reel (see Patent Document 1).
- Blocking is a phenomenon in which the adhesive layer is transferred to the back surface of the substrate when the wound adhesive tape is pulled out and used. Since the adhesive layer provided on one surface of the substrate is in an uncured state, it has a certain degree of fluidity. If the adhesive reel is left for a long time, the adhesive may ooze out from the end face of the adhesive tape, and this may stick to the side plate of the reel. When the adhesive tape is pulled out from the reel in this state, there is a problem that a part of the adhesive layer is transferred to the back surface of the base material, or a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out. There is a case.
- Patent Documents 2 and 3 describe a technique for suppressing blocking from the viewpoint of the shape of the adhesive tape, and an adhesive having a width narrower than the width of the base material on the inner side in the width direction of the base material on the end surface on the tape side.
- An adhesive tape provided with a layer is disclosed.
- Patent Document 4 describes a technique for suppressing blocking from the viewpoint of the composition of the adhesive, and discloses an adhesive tape having a temporary fixing force with respect to a substrate within a predetermined range.
- Patent Document 5 describes a technique for suppressing blocking from the viewpoint of use conditions, and discloses a sticking device having means for controlling the temperature of a reel.
- Patent Document 6 describes a technique for suppressing blocking from the viewpoint of the structure of a reel part around which an adhesive tape is wound, and discloses an adhesive reel in which a rib structure provided on a side plate has conductivity.
- Patent Document 7 describes a technique for suppressing blocking from the viewpoint of the configuration of a base material, and discloses a wound body using a material having a superior difference in surface tension between the front and back surfaces as a base material.
- Patent Document 8 describes a technique for suppressing blocking from the viewpoint of compatibility between an end mark and an adhesive.
- JP 2003-34468 A International Publication No. 08/053824 International Publication No. 07/015372 Japanese Patent Application Laid-Open No. 2003-064322 JP 2006-218867 A JP 2009-004354 A Japanese Patent Laid-Open No. 11-293206 JP 2001-284005 A
- the present invention provides an adhesive reel capable of suppressing a problem that the adhesive layer is peeled off from the base material and only the base material is pulled out when pulling out the wound adhesive tape at a sufficiently high level.
- blocking indicates “a problem that when the wound adhesive tape is pulled out, the adhesive layer is peeled off from the base material and only the base material is pulled out”.
- An adhesive reel according to the present invention is wound around a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and a tape-like base material and one surface thereof.
- An adhesive tape having an adhesive layer provided, and the adhesive tape is a region extending in a direction from the start end portion to the end end portion of the adhesive tape, and a use portion where the adhesive layer is used; And a winding part where the adhesive layer is not used over a predetermined length from the terminal part of the adhesive tape, and an end mark provided in a region between the use part and the dumping part.
- the “roll-off portion” means a region on the end portion side of the adhesive tape that is wound around the core but discarded without being used.
- the length of the adhesive tape that can be wound around the core has been limited, but by adopting the above configuration, the adhesive tape is longer than the conventional product (for example, 200 m or more) is possible.
- the adhesive layer preferably has a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less.
- the low-viscosity adhesive include a thermal radical curable adhesive and a low-temperature curable adhesive.
- a low-temperature curable adhesive is required to have high fluidity at a low temperature (for example, 130 to 150 ° C.).
- a thermal radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less can be mentioned.
- the thermal radical curable adhesive contains a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator, blocking with a conventional adhesive reel is possible. It is likely to occur with high probability.
- the content of the radical polymerizable substance in the thermal radical curable adhesive is 20 to 80 masses with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. Even if it is a part, blocking can fully be suppressed.
- the adhesive layer may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
- the content of the epoxy resin in the epoxy adhesive is the total amount of the thermoplastic resin and the thermosetting material. Even if it is 20 to 80 parts by mass with respect to 100 parts by mass, blocking can be sufficiently suppressed.
- the inorganic filler content of the adhesive layer may be 20% by volume or less based on the volume of the adhesive layer.
- the inorganic filler content of the adhesive layer may be 50% by mass or less based on the mass of the adhesive layer. According to the present invention, blocking can be sufficiently suppressed even when an inorganic filler is not blended in the adhesive layer or even when the blending amount is 50% by mass or less.
- silica is used as the inorganic filler
- the content is preferably 35% by mass or less based on the mass of the adhesive layer.
- alumina is used as the inorganic filler, the content is preferably 50% by mass or less based on the mass of the adhesive layer.
- blocking can be sufficiently suppressed even when the width of the adhesive tape is 0.5 to 3.0 mm.
- a narrow tape has a relatively large influence of the bleeding of the adhesive on the end face of the tape as compared with a thick tape, and is likely to be blocked.
- the adhesive tape is suitable for use in circuit connection. As described above, since blocking can be suppressed at a high level, it is possible to manufacture a circuit connection body having excellent connection reliability. Adhesive tapes used for circuit connections are known to be relatively expensive.
- the present invention provides a blocking suppression method. That is, the blocking suppression method according to the present invention includes a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and a tape-shaped substrate and one side surface thereof wound around the winding core.
- the adhesive layer having a predetermined length is used from the end of the adhesive tape. It is assumed that it is a scrapping part.
- the present invention provides a method for replacing an adhesive reel. That is, in this method, the winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and the winding core are wound on the tape-shaped base material and one surface thereof.
- a first adhesive reel having an adhesive tape having an adhesive layer is used and then replaced with a new second adhesive reel having the same configuration as the first adhesive reel, a predetermined length is used. The first adhesive reel with the adhesive tape remaining is replaced with the second adhesive reel.
- the present invention provides a method for paying out an adhesive tape. That is, in this method, the winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and the winding core are wound on the tape-shaped base material and one surface thereof.
- the present invention provides a method for manufacturing an adhesive reel. That is, the method for manufacturing an adhesive reel according to the present invention is any one of the above-described methods for manufacturing an adhesive reel, and includes a step of determining a predetermined length of the winding portion based on the characteristics of the adhesive tape. . Examples of the characteristics of the adhesive tape include the length and width of the adhesive tape, and the thickness, composition and shear viscosity of the adhesive layer.
- the present invention is a method of providing an end mark in the process of manufacturing any one of the above-mentioned adhesive material reels, wherein a predetermined length of the winding portion is determined based on the characteristics of the adhesive tape, and the used part Provided is a method for providing an end mark in a region between the slab and the unwinding part.
- the present invention provides a reel kit including an adhesive reel. That is, the reel kit according to the present invention includes a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and wound on the winding core. An adhesive reel having an adhesive tape having an adhesive layer provided on the adhesive tape, and when using the adhesive tape, the end of the adhesive tape is wound without using an adhesive layer of a predetermined length. It is provided with an instruction manual that states that it is a disposal part.
- the present invention provides a package including the adhesive reel and a packaging bag containing the adhesive reel.
- the present invention provides a package kit including an adhesive reel. That is, the packaging kit according to the present invention includes a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and a tape-shaped base material and one side surface thereof wound around the winding core.
- Adhesive reel provided with an adhesive tape having an adhesive layer provided thereon, and without using an adhesive layer of a predetermined length from the end of the adhesive tape when using the adhesive tape
- An instruction manual describing that it is a winding-up part and a packaging bag containing an adhesive reel are provided.
- the present invention provides a package set comprising one or more adhesive reels.
- the package set according to the present invention includes a winding core, a pair of side plates provided on both sides of the winding core so as to face each other, and a tape-shaped base material and one surface thereof wound around the winding core.
- One or more adhesive reels provided with an adhesive tape having an adhesive layer provided thereon, one or more packing bags containing the adhesive reels, a containing box containing all of the packing bags, and bonding
- an instruction manual which describes that the end portion of the adhesive tape is used as a scraping portion without using the adhesive layer having a predetermined length.
- the length of the winding portion may be 5 m or more, or may be 10 turns or more in a state where the adhesive tape is wound around the winding core. In the present invention, the length of the winding portion may be 5 m or more and 20 m or less, or may be 10 windings or more and 30 windings or less when the adhesive tape is wound around the core. . In the present invention, the adhesive tape may have a length of 200 m to 1000 m.
- the instruction manual may be accommodated in the inside of the packaging bag. In the present invention, the instruction manual may be a sticker or may be affixed to an adhesive reel. In the present invention, the instruction manual may be a sticker or may be affixed to a packaging bag.
- the instruction manual may be accommodated in the inside of the storage box.
- an instruction manual is a sticker and may be affixed on the storage box.
- the instruction manual contains a statement that when using the adhesive tape, the end portion of the adhesive tape is used as a rewinding portion without using an adhesive layer having a predetermined length. By being printed on the box, it may be integrally formed with the storage box.
- the peeling of the adhesive layer from the base material can be suppressed at a sufficiently high level.
- FIG. 1 is a perspective view schematically showing one embodiment of an adhesive reel according to the present invention. It is a schematic cross section which shows the structure of the adhesive material reel shown in FIG. It is a front view which shows typically the inner surface of the side plate of the adhesive material reel shown in FIG. It is a schematic cross section which shows an example of an anisotropic conductive tape. It is a schematic cross section which shows the end mark arrangement
- the core 1 includes a cylindrical core 1 and a pair of side plates 2 provided on both sides in the axial direction of the core 1 so as to face each other.
- an anisotropic conductive tape (adhesive tape) 5 is wound on the outer surface F1 of the core 1 to form a wound body.
- the anisotropic conductive tape 5 is wound around the core 1 so that the adhesive layer 8 faces the core 1 and the surface of the base 6 on which the adhesive layer is not formed faces the outside. In the wound state, the surface of the adhesive layer 8 is in contact with the base material 6 of the anisotropic conductive tape 5 on the inner side of the winding.
- the core 1 has an outer diameter of, for example, about 50 to 160 mm.
- the side plates 2 are preferably provided at both ends of the core 1 in the axial direction because a plurality of adhesive reels can be easily arranged and stored. However, a part of the core 1 penetrates the side plate 2 and is formed from the outer surface of the side plate 2.
- the side plate 2 may be provided so as to protrude.
- the side plate 2 includes a rib structure portion 2 b that protrudes from the surface F ⁇ b> 2 and extends radially from the edge of the through hole 2 a on the inner side surface F ⁇ b> 2 adjacent to the anisotropic conductive tape 5.
- the rib structure portion 2b By providing the rib structure portion 2b, even if the adhesive oozes out from the end surface of the anisotropic conductive tape 5, the area where the adhesive is adhered to the side plate 2 can be made sufficiently small. In addition, blocking can be effectively suppressed.
- the side plate 2 has been illustrated with the side plate 2 having the rib structure portion 2b from the viewpoint of further suppressing blocking, but the side plate 2 having no rib structure portion 2b may be employed.
- the adhesive reel 10 has a shaft hole 10 a into which the rotation shaft 25 a of the crimping device 25 is inserted, and the shaft hole 10 a has a convex portion provided on the rotation shaft. And a notch 10b to be fitted.
- a configuration other than the notch portion 10b may be adopted as long as it can prevent idling when the adhesive reel 10 is mounted on the rotating shaft of the crimping apparatus.
- a plastic molded product or the like can be used as a reel component including the core 1 and the side plate 2.
- the anisotropic conductive tape 5 includes a tape-like base material 6 and an adhesive layer 8 formed on one surface of the base material 6. As shown in FIG. 5, the anisotropic conductive tape 5 is a region extending in the direction from the start end 5d to the end portion 5c, where the adhesive layer 8 is used, and a predetermined portion from the end portion 5c. And the end mark EM provided in the area between the use part 5a and the discard part 5b.
- the distance from the end portion 5c to the end mark EM of the anisotropic conductive tape 5, that is, the length of the winding portion 5b (length L1 in FIG. 5) is preferably 5 m or more, more preferably 5 to 20 m. More preferably, it is 5 to 15 m, and most preferably 5 to 10 m.
- the length of the rewinding part 5b is set to 20 m or less. The amount of the adhesive layer 8 that is discarded without being discarded can be suppressed.
- the length of the winding portion 5b is preferably 10 turns or more, more preferably 10 to 30 turns, and still more preferably in the state where the anisotropic conductive tape 5 is wound around the core 1. Is 13 to 20 turns, most preferably 15 to 20 turns.
- the position where the end mark EM is disposed is determined based on the characteristics of the anisotropic conductive tape 5 (for example, the length and width of the anisotropic conductive tape 5 and the thickness, composition, and shear viscosity of the adhesive layer 8). It is preferable to do.
- the method of manufacturing the adhesive reel 10 includes a step of determining the length of the winding portion 5b based on the characteristics of the anisotropic conductive tape 5 and providing the end mark EM in a region between the use portion 5a and the winding portion 5b. Is provided.
- the adhesive layer 8 is sufficiently peeled from the base material 6 when the anisotropic conductive tape 5 is pulled out from the adhesive reel 10. It can be suppressed at a high level.
- the end mark EM is preferably disposed on the adhesive layer 8 and has a color different from that of the adhesive layer 8.
- the different colors mentioned here mean colors that are distinguished from each other from the three attributes of hue, saturation, and brightness, and further include metal colors and fluorescent colors.
- the end mark EM is disposed between the core 1 and the adhesive layer 8 when the anisotropic conductive tape 5 is wound, and is attached in close contact with the adhesive layer 8. It has been.
- the shape of the end mark EM is not particularly limited, but is usually rectangular.
- the end mark EM may be made of a resin-based material, and specific examples of the constituent material include general acrylic resin and PET. Note that the end mark EM may be disposed on the substrate 6.
- the end mark EM has a color different from that of the substrate 6.
- the end mark may be in a mode in which the above resin is pasted, but a mode in which a part of the adhesive layer 8 or the substrate 6 is coated with a paint or ink such as paint, or a pattern or characters are applied. An aspect may be sufficient.
- the color of the adhesive layer 8 and the color of the base material 6 differ, the part which does not have the adhesive bond layer 8 on the base material 6 is provided, and it is good also considering the said part as an end mark.
- the anisotropic conductive tape 5 having the end mark EM is preferably used for assembling an automated electronic member.
- the detector detects the end mark EM, and the remaining anisotropic conductive tape 5 (the unwinding portion 5b) is used. Notify that a new adhesive reel 10 should be replaced.
- the length of the end mark EM (length L2 in FIG. 5) is preferably 5 cm to 1 m, more preferably 5 to 50 cm, and still more preferably 5 to 30 cm. By making the length of the end mark EM 5 cm or more, the detector can sufficiently recognize the end mark EM. On the other hand, by making the length 1 m or less, the amount of the adhesive layer 8 discarded without being used. Can be suppressed.
- the length of the anisotropic conductive tape 5 is preferably 100 to 1000 m, more preferably 200 to 1000 m, still more preferably 200 to 500 m, still more preferably 250 to 500 m, and particularly preferably 300. ⁇ 500 m.
- the length of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited. By providing 5b, it is possible to wind the anisotropic conductive tape 5 longer than the conventional product around the core 1.
- the width of the anisotropic conductive tape 5 is preferably 0.5 to 30 mm, more preferably 0.5 to 3.0 mm, still more preferably 0.5 to 2.0 mm, and particularly preferably 0. .5 to 1.0 mm.
- the width of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited.
- the end portion 5c of the anisotropic conductive tape 5 has a predetermined length of the discarded portion 5b. It is possible to wind the anisotropic conductive tape 5 having a narrower width than the conventional product around the core 1.
- variety of the base material 6 is the same as the width
- FIG. What is necessary is just to adjust the width
- the thickness of the adhesive layer 8 may be appropriately selected according to the adhesive component to be used and the type of the adherend, but is preferably 5 to 100 ⁇ m, more preferably 5 to 60 ⁇ m, and more preferably Is 10 to 40 ⁇ m. Conventionally, since blocking is likely to occur, the thickness of the adhesive layer 8 of the anisotropic conductive tape 5 that can be wound around the core 1 has been limited. However, the anisotropic conductive tape 5 has a predetermined length on the end portion 5c side. By providing the winding portion 5b, it is possible to wind the anisotropic conductive tape 5 having the adhesive layer 8 thicker than the conventional product having a thickness of, for example, about 30 to 100 ⁇ m.
- the thickness of the substrate 6 is preferably about 4 to 200 ⁇ m, more preferably 20 to 100 ⁇ m.
- the substrate 6 is, for example, polyethylene terephthalate, polyethylene naphthalate, polyethylene isophthalate, polybutylene terephthalate, polyolefin, polyacetate, polycarbonate, polyphenylene sulfide, polyamide, ethylene / vinyl acetate copolymer, polyvinyl chloride, polyvinylidene chloride, Various plastic tapes made of synthetic rubber or liquid crystal polymer can be used. But the material which comprises the base material 6 is not limited to these. Moreover, since the base material 6 is peeled from the adhesive layer 8 at the time of use of the adhesive tape, a substrate having a release treatment applied to the contact surface with the adhesive layer 8 or the like may be used. Furthermore, what mixed 2 or more types chosen from said material, or the thing in which said film was multilayered may be used.
- an epoxy adhesive or a radical curable adhesive can be used as the adhesive component 8a of the adhesive layer 8.
- a thermoplastic adhesive such as polyurethane or polyvinyl ester can be used.
- the use of a crosslinkable material is preferred because of excellent heat resistance and moisture resistance after connection.
- an epoxy adhesive containing an epoxy resin as a main component as a thermosetting resin is preferable because it can be cured for a short time, has good connection workability, and has excellent molecular adhesion.
- the radical curable adhesive has characteristics such as excellent curability at a low temperature and in a short time as compared with the epoxy adhesive, and can be appropriately selected depending on the application.
- a pressure sensitive adhesive can also be used.
- the epoxy adhesive contains, for example, a thermosetting material such as an epoxy resin and a curing agent. Moreover, it is common to mix
- the epoxy resin examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, bisphenol A novolak type epoxy resin, bisphenol F novolak type epoxy.
- examples thereof include resins, alicyclic epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, hydantoin type epoxy resins, isocyanurate type epoxy resins, and aliphatic chain epoxy resins. These epoxy resins may be halogenated or hydrogenated. Further, an acryloyl group or a methacryloyl group may be added to the side chain of the epoxy resin. These are used individually by 1 type or in combination of 2 or more types.
- the curing agent is not particularly limited as long as it can cure the epoxy resin.
- anionic polymerizable catalyst-type curing agent cationic polymerizable catalyst-type curing agent, polyaddition-type curing agent, etc. Is mentioned.
- anionic or cationic polymerizable catalyst-type curing agents are preferred because they are excellent in rapid curability and do not require chemical equivalent considerations.
- anionic or cationic polymerizable catalyst-type curing agent examples include imidazole, hydrazide, boron trifluoride-amine complexes, onium salts (aromatic sulfonium salts, aromatic diazonium salts, aliphatic sulfonium salts, etc.), Examples include amine imides, diaminomaleonitrile, melamine and derivatives thereof, polyamine salts, dicyandiamide, and the like, and modifications thereof.
- Examples of the polyaddition type curing agent include polyamines, polymercaptans, polyphenols, and acid anhydrides.
- Latent curing agents that are microencapsulated by coating these epoxy resin curing agents with polyurethane, polyester or other polymer materials, nickel, copper or other metal thin films, inorganic materials such as calcium silicate, etc. are acceptable. It is preferable because the working time can be extended.
- curing agent is used individually by 1 type or in combination of 2 or more types.
- the compounding amount of the curing agent is generally about 0.05 to 20 parts by mass with respect to 100 parts by mass of the total amount of the thermosetting material and the thermoplastic resin blended as necessary.
- the radical curable adhesive contains, for example, a radical polymerizable material and a radical polymerization initiator. Moreover, it is common to mix
- radical polymerizable material for example, any substance having a functional group that is polymerized by radicals can be used without particular limitation.
- radical polymerizable substances such as acrylate (including corresponding methacrylate, the same shall apply hereinafter) compound, acryloxy (including corresponding methacryloxy, and the same shall apply hereinafter) compound, maleimide compound, citraconic imide resin, nadiimide resin and the like may be mentioned. It is done.
- radically polymerizable substances may be used in the state of a monomer or an oligomer, and a monomer and an oligomer can be used in combination.
- acrylate compound examples include methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, 2-hydroxy-1,3-dia Acryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxypolyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, Examples include tris (acryloyloxyethyl) isocyanurate, urethane acrylate and the like.
- the radical polymerizable substance such as an acrylate compound has at least one substituent such as a dicyclopentenyl group, a tricyclodecanyl group, or a triazine ring.
- a compound described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
- radical polymerization initiator for example, any compound that can be decomposed by heating or light irradiation to generate free radicals can be used without particular limitation. Specific examples include peroxide compounds and azo compounds. Such a curing agent is appropriately selected depending on the intended connection temperature, connection time, pot life, and the like.
- examples of the radical polymerization initiator include diacyl peroxide, peroxydicarbonate, peroxyester, peroxyketal, dialkyl peroxide, hydroperoxide, silyl peroxide, and the like.
- peroxyesters, dialkyl peroxides, hydroperoxides, silyl peroxides, and the like are preferable, and peroxyesters that provide high reactivity are more preferable.
- compounds described in International Publication No. 2009/063827 can be preferably used. These are used individually by 1 type or in combination of 2 or more types.
- the amount of the radical polymerization initiator is generally about 0.1 to 10 parts by mass with respect to 100 parts by mass of the total amount of the radical polymerizable material and the thermoplastic resin compounded as necessary.
- thermoplastic resins blended as necessary with epoxy adhesives and radical curable adhesives facilitate imparting film properties to the adhesive.
- thermoplastic resins include phenoxy resin, polyvinyl formal resin, polystyrene resin, polyvinyl butyral resin, polyester resin, polyamide resin, xylene resin, polyurethane resin, polyester urethane resin, phenol resin, terpene phenol resin, and the like.
- the compounds described in International Publication No. 2009/063827 can be suitably used.
- a phenoxy resin is preferable because of excellent adhesion, compatibility, heat resistance, mechanical strength, and the like. These are used individually by 1 type or in combination of 2 or more types.
- the blending amount of this thermoplastic resin is generally about 5 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material when blended with the epoxy adhesive. Further, when a thermoplastic resin is blended in the radical curable adhesive, the blending amount of the thermoplastic resin is generally 5 to 80 mass with respect to 100 mass parts of the total amount of the thermoplastic resin and the radical polymerizable material. About a part.
- an adhesive that has a relatively low viscosity and is likely to cause blocking in the conventional technology is used. It can be used for the adhesive layer.
- the adhesive layer 8 may have a shear viscosity at 30 ° C. of 100000 Pa ⁇ s or less. The viscosity is more preferably 1000 to 50000 Pa ⁇ s, and still more preferably 1000 to 30000 Pa ⁇ s.
- a heat radical curable adhesive and a low temperature curable adhesive may be used as the low-viscosity adhesive.
- thermo radical curable adhesive containing a radical polymerization initiator having a 1 minute half-life temperature of 160 ° C. or less.
- the 1-minute half-life temperature is more preferably 60 to 140 ° C, still more preferably 60 to 120 ° C.
- di-tert-butylperoxyhexahydroterephthalate (1 minute half-life temperature: 142 ° C., HTP-65W (trade name) manufactured by Kayaku Azo Co., Ltd.), substituted benzoyl peroxide (1 Minute half-life temperature: 131.1 ° C., manufactured by NOF Corporation, NIPPER BMT (trade name), dilauroyl peroxide (1 minute half-life temperature: 116.4 ° C., manufactured by NOF Corporation, Parroyl L (product) Name)).
- a thermal radical curable adhesive containing a thermoplastic resin, a radical polymerizable material containing a radical polymerizable substance that is liquid at 30 ° C., and a radical polymerization initiator Is mentioned.
- the content of the radical polymerizable substance in the thermal radical curable adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the radical polymerizable material.
- the content is more preferably 30 to 80 parts by mass, still more preferably 40 to 80 parts by mass.
- the adhesive component 8a may be an epoxy adhesive containing a thermoplastic resin, a thermosetting material containing an epoxy resin that is liquid at 30 ° C., and a curing agent.
- the content of the epoxy resin in the epoxy adhesive is preferably 20 to 80 parts by mass with respect to 100 parts by mass of the total amount of the thermoplastic resin and the thermosetting material.
- the content is more preferably 30 to 80 parts by mass, still more preferably 40 to 80 parts by mass.
- a component that exerts a relaxing action on internal stress from the viewpoint of suppressing the warpage of the substrate caused by the difference in linear expansion coefficient between the IC chip and the substrate is preferably blended into the adhesive component. Specifically, it is preferable to blend an acrylic rubber or an elastomer component with the adhesive component.
- a radical curable adhesive as described in International Publication No. 98/44067 can also be used.
- the conductive particles 8b include metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
- metal particles such as Au, Ag, Ni, Cu, and solder, and carbon.
- non-conductive glass, ceramic, plastic, or the like may be used as a core, and the core may be coated with the above-described metal or carbon film or metal particles.
- the conductive particles 8b are conductive particles having a plastic core or hot-melt metal particles, the conductive particles 8b have deformability when heated and pressurized. For this reason, it is possible to increase the contact area between the electrode and the conductive particles 8b at the time of connection, and the connection reliability can be improved.
- the conductive particles 8b may be, for example, metal particles made of copper covered with silver.
- conductive particles 8b a metal powder having a shape in which a large number of fine metal particles are connected in a chain shape as described in JP-A-2005-116291 can be used.
- conductive particles having protrusions as described in JP 2008-135734 A can also be used.
- insulating particles obtained by coating the surface of the conductive particles 8b with a polymer resin or the like may be added.
- insulating particles when the total amount of particles is increased, it becomes possible to suppress short circuit due to contact between particles when used as anisotropic conductive tape, and insulation between adjacent circuit electrodes Can be improved.
- the average particle diameter of the conductive particles and the insulating particles is preferably 1 to 18 ⁇ m, more preferably 2.0 to 10 ⁇ m, from the viewpoint of improving dispersibility and conductivity.
- the blending amount of the conductive particles 8b is not particularly limited, and is preferably 0.1 to 30% by volume, more preferably 0.1 to 10% by volume, and still more preferably 0, based on the entire adhesive component. .5-5% by volume.
- the blending amount of the conductive particles 8b is 0.1% by volume or more, excellent electrical conductivity can be sufficiently achieved.
- 30% by volume or less the circuit is used when used as an anisotropic conductive tape. The occurrence of short circuit can be sufficiently suppressed.
- an inorganic filler may be added to the adhesive component 8a.
- the inorganic filler is not particularly limited as long as it is, for example, a solid particulate inorganic compound.
- Specific examples of the material of the inorganic filler include, for example, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, calcium silicate, magnesium silicate, calcium oxide, magnesium oxide, alumina, aluminum nitride, aluminum borate whisker, and nitride. Examples include boron, silica such as crystalline silica and amorphous silica, and antimony oxide.
- An inorganic filler is used individually by 1 type or in combination of 2 or more types.
- the winding portion 5b having a predetermined length on the end portion 5c side of the anisotropic conductive tape 5 it is possible to add no inorganic filler to the adhesive layer 8, or the adhesive layer. Even when the blending amount is 20% by volume or less based on the volume of 8, blocking can be sufficiently suppressed.
- the inorganic filler content is more preferably 0 to 15% by volume, still more preferably 0 to 10% by volume.
- the inorganic filler content is more preferably 0 to 40% by mass, and still more preferably 0 to 30% by mass. Since the specific gravity of an inorganic filler changes with kinds, it is preferable to set content based on mass to a suitable value according to the inorganic filler to be used. For example, when the inorganic filler is silica, blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 35% by mass or less.
- the silica content is more preferably 0 to 30% by mass, and still more preferably 0 to 20% by mass.
- the inorganic filler is alumina
- blocking can be sufficiently suppressed even if the content based on the mass of the adhesive layer 8 is 50% by mass or less.
- the alumina content is more preferably 0 to 40% by mass, still more preferably 0 to 30% by mass.
- the content of the inorganic filler can be easily calculated at the time of blending, but can be measured, for example, by the following method when measured from the state of the adhesive tape.
- a crucible used for measurement is placed in an electric furnace (in an air environment) heated to 700 ° C. in advance and heated for 45 minutes.
- the temperature of the electric furnace is returned to room temperature, and the mass of the crucible taken out from the electric furnace is quickly weighed in a desiccator.
- the mass of the crucible or the like is measured to 3 decimal places (0.001 g) using a balance (Precision Electronic Balance UW series manufactured by Shimadzu Corporation).
- This ash should contain an inorganic filler and conductive particles (metal). (7)
- the type and content of conductive particles (metal content) contained in the ash are separately calculated by ICP emission spectroscopic analysis.
- the ash is decomposed with a mixed acid of hydrofluoric acid and nitric acid to obtain a test solution.
- the metal species contained in the test solution and the content thereof are quantitatively analyzed by an ICP emission spectroscopic analyzer (ICP-AES manufactured by Shimadzu Corporation).
- the mixed acid is a mixture of hydrofluoric acid, nitric acid and water at a mass ratio of 1: 1: 1.
- the mass of the conductive particles (metal component) calculated by this ICP emission spectroscopic analysis method is subtracted from the mass of the ash obtained in (6) above to obtain the mass of the inorganic filler.
- the content of the inorganic filler based on the volume is determined as follows. That is, the specific gravity of the ash extracted from the crucible and the specific gravity of the adhesive layer before heating were measured with a dry hydrometer (Shimadzu dry density meter Accupic II 1340 series) and detected by ICP emission spectroscopy. The theoretical specific gravity and content of the metal are subtracted from the ash, and the volume percentage of the inorganic filler relative to the original adhesive layer is calculated.
- a coating liquid containing an adhesive component is used on a base film (the above-mentioned various materials can be used as a base, for example, a polyethylene terephthalate film).
- the raw material of the anisotropic conductive film is produced by coating.
- This raw fabric is cut into a tape shape so as to have a width suitable for the application.
- a slit device described in JP-A-2003-285293 can be used.
- the adhesive reel 10 is manufactured by winding the anisotropic conductive tape 5 having a predetermined width around the core of the reel component.
- the first portion (terminal portion 5c) of the anisotropic conductive tape is fixed to the core and wound.
- this fixing method can use a well-known method, it can fix with an adhesive tape and an adhesive, for example.
- a fastener and a notch part can also be provided and fixed to a winding core.
- the anisotropic conductive tape 5 may be wound up through an end tape as described in International Publication No. 2010/098354 and International Publication No. 2010/110094. Although there is no restriction
- a circuit connector 100 shown in FIG. 6 includes a first circuit member 30 and a second circuit member 40 that face each other, and the first circuit member 30 and the second circuit member 40 are disposed between the first circuit member 30 and the second circuit member 40.
- a connecting portion 50a for connecting them is provided.
- the first circuit member 30 includes a circuit board 31 and circuit electrodes 32 formed on the main surface 31 a of the circuit board 31.
- the second circuit member 40 includes a circuit board 41 and circuit electrodes 42 formed on the main surface 41 a of the circuit board 41.
- the circuit member include chip components such as a semiconductor chip (IC chip), a resistor chip, and a capacitor chip. These circuit members include circuit electrodes, and generally include a large number (at least two or more) of circuit electrodes. Specific examples of the other circuit member to which the circuit member is connected include a flexible substrate having metal wiring, a flexible printed wiring board, and a wiring substrate such as a glass substrate on which indium tin oxide (ITO) is deposited. It is done.
- ITO indium tin oxide
- the anisotropic conductive tape 5 drawn from the adhesive reel 10 the circuit members can be connected efficiently and with high connection reliability. Therefore, the anisotropic conductive tape 5 according to the present embodiment is suitable for COG mounting (Chip On Glass) or COF mounting (Chip On Flex) on a wiring board of a chip component having many fine connection terminals (circuit electrodes). It is.
- each circuit electrode 32, 42 may be composed of one kind selected from gold, silver, tin, ruthenium, rhodium, palladium, osmium, iridium, platinum, and indium tin oxide (ITO), or two or more kinds. It may be comprised. Moreover, the material of the surface of the circuit electrodes 32 and 42 may be the same in all the circuit electrodes, or may be different.
- connection portion 50a includes a cured product 8A of the adhesive component 8a included in the adhesive layer 8, and conductive particles 8b dispersed therein. And in the circuit connection body 100, the circuit electrode 32 and the circuit electrode 42 which oppose are electrically connected through the conductive particle 8b.
- connection resistance between the circuit electrodes 32 and 42 is sufficiently reduced, and a good electrical connection between the circuit electrodes 32 and 42 becomes possible.
- the cured product 8A has electrical insulation, and the insulation between adjacent circuit electrodes is ensured. Therefore, the flow of current between the circuit electrodes 32 and 42 can be made smooth, and the functions of the circuit can be fully exhibited.
- FIG. 7 is a process diagram illustrating an embodiment of a method for manufacturing a circuit connector in a schematic cross-sectional view.
- the adhesive layer 8 of the anisotropic conductive tape 5 is thermally cured, and finally the circuit connector 100 is manufactured.
- the adhesive reel 10 is mounted on the rotating shaft of a connecting device (not shown).
- the anisotropic conductive tape 5 is pulled out from the adhesive reel 10 so that the adhesive layer 8 faces downward.
- the anisotropic conductive tape 5 is cut into a predetermined length and placed on the main surface 31a of the circuit member 30 (FIG. 7A).
- pressure is applied in the directions of arrows A and B in FIG. 7A to temporarily fix the adhesive layer 8 to the first circuit member 30 (FIG. 7B).
- the pressure at this time is not particularly limited as long as it does not damage the circuit member, but it is generally preferably 0.1 to 30.0 MPa.
- you may pressurize, heating, and let heating temperature be the temperature which the adhesive bond layer 8 does not harden
- the heating temperature is preferably 50 to 100 ° C. These heating and pressurization are preferably performed in the range of 0.1 to 2 seconds.
- the adhesive layer 8 is arranged so that the second circuit member 40 faces the second circuit electrode 42 toward the first circuit member 30. Put it on top. Then, while heating the adhesive layer 8, the whole is pressurized in the directions of arrows A and B in FIG.
- the heating temperature at this time is set to a temperature at which the adhesive component 8a of the adhesive layer 8 can be cured.
- the heating temperature is preferably 60 to 180 ° C, more preferably 70 to 170 ° C, and still more preferably 80 to 160 ° C. By setting the heating temperature to 60 ° C. or higher, the curing rate can be sufficiently increased, and by setting the heating temperature to 180 ° C. or lower, the undesirable side reaction can be sufficiently suppressed.
- the heating time is preferably 0.1 to 180 seconds, more preferably 0.5 to 180 seconds, and still more preferably 1 to 180 seconds.
- connection part 50a is formed by hardening of the adhesive component 8a, and the circuit connection body 100 as shown in FIG. 6 is obtained.
- the connection conditions are appropriately selected depending on the application to be used, the adhesive component, and the circuit member.
- cured with light is used as an adhesive agent component of the adhesive bond layer 8, what is necessary is just to irradiate the adhesive bond layer 8 with an actinic ray or an energy ray suitably.
- the active light include ultraviolet light, visible light, and infrared light.
- energy rays include electron beams, X-rays, ⁇ rays, and microwaves.
- the anisotropic conductive tape 5 wound around the reel part is pulled out by providing the winding portion 5b having a predetermined length on the end portion 5c side of the anisotropic conductive tape 5, the base material is pulled out. 6 can prevent the adhesive layer 8 from peeling at a sufficiently high level.
- the anisotropic conductive tape 5 is wound around the core so that the adhesive layer 8 faces the core 1 side (inside) and the surface of the substrate 6 where the adhesive layer is not formed faces the outside.
- the direction of the anisotropic conductive tape 5 may be reversed. 8 and 9, the core 1 is formed such that the surface of the base 6 on which the adhesive layer is not formed faces the core 1 (inside) and the adhesive layer 8 faces the outside.
- Anisotropic conductive tape 5 is wound around.
- the anisotropic conductive tape 5 of the adhesive reel 20 also has a winding portion 5b where the adhesive layer 8 is not used over a predetermined length from the end portion 5c, and in the region between the using portion 5a and the winding portion 5b.
- An end mark EM is provided.
- the distance from the end portion 5c of the anisotropic conductive tape 5 to the end mark EM, that is, the length of the unwinding portion 5b (length L3 in FIG. 10) is preferably 5 m or more, more preferably 5 to 20 m. More preferably, it is 5 to 15 m, and most preferably 5 to 10 m.
- the length of the rewinding part 5b is set to 20 m or less.
- the amount of the adhesive layer 8 that is discarded without being discarded can be suppressed.
- the length of the winding portion 5b is preferably 10 turns or more, more preferably 10 to 30 turns, and still more preferably in the state where the anisotropic conductive tape 5 is wound around the core 1. Is 13 to 20 turns, most preferably 15 to 20 turns.
- the end mark EM is disposed at a predetermined position, and the base material 6 faces the core 1 and the adhesive layer 8 faces the outside.
- the anisotropic conductive tape 5 By winding the anisotropic conductive tape 5 around the core 1, the occurrence of blocking can be more reliably suppressed.
- the reason why a more excellent effect is achieved by reversing the direction in which the anisotropic conductive tape 5 is wound is not necessarily clear, but the present inventors infer as follows. That is, when the anisotropic conductive tape 5 is pulled out even if the adhesive oozes out from the end face of the adhesive layer 8 in the region (use part 5a) where the anisotropic conductive tape 5 is to be used and adheres to the side plate 2.
- the adhesive layer 8 of the drawn anisotropic conductive tape 5 and the base material 6 are separated. It is considered that the suppression of blocking can be achieved because the force to be worked does not work and the influence from the portion that is adhesively bonded to the side plate 2 is small.
- the adhesive layer 8 on the substrate 6 is previously removed from the last portion (the end portion of the winding) of the anisotropic conductive tape 5 to provide a blank portion, and the adhesive layer 8 is wound around the wound body. Exposure can be prevented.
- another tape (similar to the base material can be exemplified) is prepared, and this is connected to the end of the base material 6 and wound around the wound body. May be. In addition to the above, contamination from the external environment can be suppressed by storing the adhesive reel 20 in a bag.
- FIG. 11 is a diagram showing a packaging state of the adhesive reel.
- a packaging body 90 shown in FIG. 11 includes an adhesive reel 20 and a packaging bag 80 that accommodates the adhesive reel 20.
- the packaging bag 80 is made of, for example, polyethylene, polypropylene, or polyethylene terephthalate.
- When packing it is preferable to suck and remove air in the packing bag 80 before closing the insertion port 81 of the packing bag 80.
- the insertion port 81 of the packaging bag 80 is closed and sealed by, for example, a sealing machine. In this case, it can be expected that moisture in the packing bag 80 is reduced from the initial stage of packing, and that air from the outside is prevented from entering.
- the packaging bag 80 preferably has transparency so that various information such as a product name, a lot number, an expiration date, and the like attached to the internal adhesive reel 20 can be confirmed even from outside the packaging bag 80. In this case, since various information of the adhesive reel 20 can be confirmed from the outside of the packaging bag 80, it can be expected that mixing of different products is prevented and sorting work is efficiently performed. In addition, it is preferable to use a material that adheres by heat and pressure. Moreover, it is preferable that the notch for opening is attached. In this case, the opening work at the time of use becomes easy because the notch for opening is attached. Note that the adhesive reel 10 may be accommodated in the packaging bag 80 instead of the adhesive reel 20.
- the adhesive reels 10 and 20 having the anisotropic conductive tape 5 provided with the end marks EM at predetermined positions are exemplified.
- the adhesive reels 10 and 20 have a predetermined length from the end portion 5 c of the anisotropic conductive tape 5.
- the end mark EM does not necessarily have to be provided on the anisotropic conductive tape 5 as long as the thickness can be used as the unwinding portion 5b. That is, when the adhesive tape having the same configuration as that of the adhesive reel 10 or 20 is used except that the end mark EM is not provided, the adhesive tape is bonded to a predetermined length from the end portion of the adhesive tape. It is good also as a winding-up part, without using an agent layer. For example, when the first adhesive reel having no end mark EM is used and then replaced with a new second adhesive reel having the same configuration, the first adhesive tape having a predetermined length is left. The adhesive reel may be replaced with a second adhesive reel.
- the anisotropic conductive tape 5 wound on the first adhesive reel and the start end portion of the anisotropic conductive tape 5 wound on the second adhesive reel are connected to each other. Can be attached or attached with an adhesive tape or the like.
- the anisotropic conductive tape 5 wound around the reel may be cut off in the middle of the winding-up portion, or may be fed out to the end.
- the end tape (adhesive tape) used for connection between the anisotropic conductive tape 5 and the core 1 has a start end portion of the anisotropic conductive tape 5 that the second adhesive reel has. It may be used for connection.
- a lead tape (adhesive tape) is provided at the start end of the anisotropic conductive tape 5 of the second adhesive reel, and this lead tape is used for connection with the end of the anisotropic conductive tape 5 of the first adhesive reel. May be used.
- the lead tape is for attaching and fixing the start end portion 5d of the anisotropic conductive tape 5 to a specific location (for example, the outer surface of the side plate 2).
- the adhesive reel does not have an end mark
- a packaging kit including the instruction manual and the packaging bag containing the adhesive reel may be provided to the user.
- one or more adhesive reels that do not have end marks may provide a user with a package body set provided with the instruction manual which describes making it a disposal part without using the adhesive layer of predetermined length from the terminal part of a material tape.
- a storage box for example, a box made of cardboard or a box made of resin may be used.
- the instruction manual may be accommodated inside the packing bag. Further, the instruction manual may be a sticker or may be affixed to an adhesive reel.
- the instruction manual may be a sticker or may be affixed to a packaging bag.
- the instruction manual may be stored inside the storage box. Further, the instruction manual may be a sticker or may be affixed to the storage box.
- the instruction manual when using the adhesive tape, the instruction manual is printed on the storage box with a description that the end portion of the adhesive tape is used as an unwinding portion without using an adhesive layer of a predetermined length. Therefore, it may be integrally formed with the storage box.
- a document or specification document that states that the adhesive tape having a predetermined length from the end portion of the adhesive tape is used as a rewinding portion is used. Apart from the material reel, the reel kit, the package, the package kit, or the package set, it may be provided to the user.
- the anisotropic conductive tape 5 was illustrated as an adhesive tape for circuit connection, the non-conductive tape which the adhesive bond layer 8 consists of the adhesive component 8a and does not contain the electroconductive particle 8b is the core 1.
- the adhesive reel may be produced by winding the conductive material 8 on the tape, or a conductive tape having no anisotropy in which the conductive particles 8b are blended more than the anisotropic conductive tape may be used.
- the present invention is also applicable to adhesive films for various electronic materials such as die bond films, silver films, and adhesive films for processing semiconductor wafers.
- this invention is applicable also to the conductive film of a solder substitute which connects the electrode on a photovoltaic cell, and the tab wire for current collection (refer international publication 07/125903).
- the case where the side plate 2 having the rib structure portion 2b is employed has been exemplified.
- a side plate having no rib structure portion 2b may be employed instead. Since the side plate not having such a rib structure part is more likely to be blocked than the side plate having the rib structure part described above, the blocking can be sufficiently suppressed by applying the present invention.
- an adhesive tape 15A shown in FIG. 12A includes an adhesive layer 18 having a multilayer structure.
- the adhesive layer 18 includes a conductive particle non-containing layer 18a that does not contain conductive particles and a conductive particle-containing layer 18b that contains conductive particles.
- an adhesive agent component of the conductive particle non-containing layer 18a and the conductive particle containing layer 18b the same adhesive component as that of the above-described adhesive layer 8 can be used.
- the adhesive layer 18 having the two-layer structure is used as a circuit connecting material, the decrease in the number of conductive particles on the circuit electrode due to the flow of the adhesive component can be sufficiently suppressed when the circuit members are joined to each other. .
- the adhesive layer 18 is disposed so that the surface provided with the metal bumps of the IC chip and the conductive particle-free layer 18a are in contact with the substrate on which the IC chip is to be mounted and the conductive particle-containing layer 18b, respectively. It is preferable to do.
- the adhesive tape 15 ⁇ / b> B shown in FIG. 12B is provided with a pressure-sensitive adhesive layer 9 a between the substrate 6 and the adhesive layer 8 from the viewpoint of more reliably preventing the adhesive layer 8 from peeling. .
- the adhesive tape 15 ⁇ / b> C shown in FIG. 12C is obtained by further laminating the pressure-sensitive adhesive layer 9 b on the adhesive layer 8 from the viewpoint of improving the sticking property to the circuit member.
- the cover film 13 may be laminated on the surface opposite to the base 6 of the adhesive tape 16. Good.
- Measurement frequency 10 Hz Atmosphere: under nitrogen Temperature range: 0 ° C to 150 ° C, Temperature increase rate: 10 ° C / min, Probe diameter: 8mm Sample size: 10 mm x 10 mm, Sample thickness: about 0.6 mm, Measurement strain: 1.0%.
- Example 1 [Preparation of raw materials for adhesive components]
- the following raw materials were prepared. 50 g of thermoplastic phenoxy resin (manufactured by Union Carbide Co., Ltd., trade name: PKHC, weight average molecular weight: 45000), 1: 1 toluene (boiling point 110.6 ° C.) and ethyl acetate (boiling point 77.1 ° C.) It melt
- urethane acrylate that is liquid at 30 ° C.
- an adhesive film was prepared as follows. For 40 parts by mass of the phenoxy resin solution, 40 parts by mass of liquid urethane acrylate, 20 parts by mass of liquid dimethacrylate, and 4 parts by mass of radical generator were blended to obtain a mixed solution. To the liquid mixture, nickel powder (conductive particles) having an average particle diameter of 5 ⁇ m and silica powder (inorganic filler) having an average particle diameter of 0.5 ⁇ m are blended, and nickel powder and silica powder are dispersed in the liquid mixture. A coating solution was obtained.
- the coating solution is applied to a PET film (carrier film) having a thickness of 80 ⁇ m, a width of 500 mm, and a silicone release treatment on both sides using a coating device, with a length of 320 m, a furnace length of 15 m, and a hot air temperature of 70 ° C. Drying was performed at a speed of 3 m / min using a drying furnace. This obtained the adhesive film (full length 320m) in which the adhesive layer (thickness: 40 micrometers) was provided on the one surface of PET film.
- the nickel powder content of the adhesive layer after drying was 1.5% by volume, and the silica powder content was 15% by volume (26% by mass).
- the adhesive film was cut into a width of 1.5 mm using a roll-to-roll slit facility, and an adhesive tape was wound up on a reel part (core outer diameter: 66 mm, plastic molded product) to a length of 300 m. At this time, it wound up so that the adhesive layer faced the core side (inside) and the base material made of PET faced the outside. During winding, an end mark was attached at a position 5 m from the end of the adhesive tape.
- Reel side plates are provided on both sides of the core, and the clearance distance between the reel side plate and the wound tape of the adhesive tape is about 0.1 mm to 0.5 mm on each side. It was within the range.
- a reel part having a reel side plate provided with rib structure portions 2b extending radially as shown in FIG. 1 was used.
- Example 2 An adhesive reel was prepared and evaluated in the same manner as in Example 1 except that the position where the end mark was applied was 10 m instead of 5 m from the end of the adhesive tape.
- Example 3 An adhesive reel was prepared and evaluated in the same manner as in Example 1 except that the position of the end mark was 15 m instead of 5 m from the end of the adhesive tape.
- Example 4 An adhesive reel was produced and evaluated in the same manner as in Example 1 except that the position of attaching the end mark was set to 20 m instead of 5 m from the end of the adhesive tape.
- Tables 1 and 2 show the results of the above examples and comparative examples.
- Test Example 2 The point where the adhesive tape is wound around the core so that the adhesive layer faces outside and the base material made of PET faces the core side (inside), and the end mark is not pasted on the adhesive tape Except these two points, 30 adhesive reels were produced in the same manner as in Example 1. And the incidence rate of blocking according to the distance from the terminal part of the adhesive tape was evaluated in the same manner as in Test Example 1. Table 3 shows the results.
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
更に、本発明は、上述のいずれかの接着材リールを製造する過程においてエンドマークを設ける方法であって、接着材テープの特性に基づいて巻き捨て部の所定の長さを決定し、使用部と巻き捨て部との間の領域にエンドマークを設ける方法を提供する。
本発明は、接着材リールを備える梱包体キットを提供する。すなわち、本発明に係る梱包体キットは、巻芯と、巻芯の両側に互いに対向するように設けられた一対の側板と、巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える接着材リールと、接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの接着剤層を使用せずに巻き捨て部とすることを記載した取扱い説明書と、接着材リールを収容した梱包袋と、を備える。
本発明は、1又は複数の接着材リールを備える梱包体セットを提供する。すなわち、本発明に係る梱包体セットは、巻芯と、巻芯の両側に互いに対向するように設けられた一対の側板と、巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える1又は複数の接着材リールと、接着材リールを収容した1又は複数の梱包袋と、梱包袋を全て収容した収容箱と、接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの前記接着剤層を使用せずに巻き捨て部とすることを記載した取扱い説明書と、を備える。
また、本発明において、取扱い説明書は、梱包袋の内部に収容されていてもよい。また、本発明において、取扱い説明書は、ステッカー(sticker)であってもよく、接着材リールに貼られていてもよい。また、本発明において、取扱い説明書は、ステッカーであってもよく、梱包袋に貼られていてもよい。
また、本発明において、取扱い説明書は、収容箱の内部に収容されていてもよい。また、本発明において、取扱い説明書は、ステッカーであり、収容箱に貼られていてもよい。また、本発明において、取扱い説明書は、接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの接着剤層を使用せずに巻き捨て部とする旨の記載が収容箱に印字されていることにより、収容箱と一体形成されていてもよい。
上記アクリレート化合物以外のラジカル重合性物質は、例えば、国際公開第2009/063827号に記載の化合物を好適に使用することが可能である。これらは1種を単独で又は2種類以上を組み合わせて使用される。
(1)測定に使用するるつぼを予め700℃の温度に昇温した電気炉(空気環境下)に入れ、45分間加熱する。
(2)電気炉の温度を常温に戻し、電気炉から取り出したるつぼの質量をデシケーターの中で速やかに秤量する。なお、この無機フィラーの含有量の測定において、るつぼ等の質量は天秤(島津製作所製精密電子天秤 UWシリーズ)を使用して小数点3桁(0.001g)まで測定する。
(3)天秤の上にるつぼを置き、そのるつぼ内に接着材テープから接着剤層を約1g入れる。なお、この秤量は23±3℃、50±10%RH、1気圧下で行う。
(4)接着剤層が入ったるつぼを(1)と同様に電気炉で45分間加熱する。この加熱により接着剤層が灰分となる。
(5)電気炉の温度を常温に戻し、電気炉から取り出したるつぼと灰分の質量をデシケーターの中で速やかに上記(2)(3)と同様の方法で秤量する。
(6)(5)で得られたるつぼと灰分の質量から(2)で得られたるつぼの質量を引き、灰分の質量を算出する。この灰分には、無機フィラーと導電粒子(金属分)が含まれているはずである。
(7)灰分中に含まれている導電粒子(金属分)の種類と含有量は、ICP発光分光分析法にて別に算出する。この際、灰分をフッ化水素酸及び硝酸の混酸で分解し供試液とする。この供試液中に含まれる金属種とその含有量をICP発光分光分析装置(島津製作所製ICP-AES等)により定量分析する。上記混酸は、フッ化水素酸、硝酸及び水を質量で1:1:1で混合したものである。このICP発光分光分析法にて算出された導電粒子(金属分)の質量を上記(6)で得られた灰分の質量から引き、無機フィラーの質量とする。
(8)体積を基準とした無機フィラーの含有量を以下のようにして求める。すなわち、るつぼから取り出した灰分の比重と、加熱前の接着剤層の比重を、乾式比重計(島津製作所 乾式密度計 アキュピックII 1340 シリーズ)にて測定し、ICP発光分光分析法にて検出された金属の理論比重と含有量を灰分から差し引き、元の接着剤層に対する無機フィラーの体積%を算出する。
次に、本実施形態に係る接着材リール10の接着剤層8を回路接続材料として使用して製造された回路接続体について説明する。図6に示す回路接続体100は、相互に対向する第1の回路部材30及び第2の回路部材40を備えており、第1の回路部材30と第2の回路部材40との間には、これらを接続する接続部50aが設けられている。
次に、回路接続体100の製造方法について説明する。図7は、回路接続体の製造方法の一実施形態を概略断面図により示す工程図である。本実施形態では、異方導電テープ5の接着剤層8を熱硬化させ、最終的に回路接続体100を製造する。
取扱い説明書は、梱包袋の内部に収容されていてもよい。また、取扱い説明書は、ステッカーであってもよく、接着材リールに貼られていてもよい。また、取扱い説明書は、ステッカーであってもよく、梱包袋に貼られていてもよい。
取扱い説明書は、収容箱の内部に収容されていてもよい。また、取扱い説明書は、ステッカーであってもよく、収容箱に貼られていてもよい。また、取扱い説明書は、接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの接着剤層を使用せずに巻き捨て部とする旨の記載が収容箱に印字されていることにより、収容箱と一体形成されていてもよい。
なお、接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの接着剤層を使用せずに巻き捨て部とすることを記載した資料又は仕様書等を、上述の接着材リール、リールキット、梱包体、梱包体キット、又は梱包体セットとは別にして、使用者に提供することも考えられる。
作製した接着材リールを横にした状態で、温度30℃の恒温槽(相対湿度40~60%)内に24時間にわたって放置した。その後、テンシロン(商品名、株式会社エー・アンド・デイ製)を使用し、接着材リールから接着材テープを1m/分の速度で引き出した。エンドマークが引き出されるまでの間にブロッキングが発生しなかった場合を「なし」とし、発生した場合を「あり」とした。
接着材リールの作製過程において接着材フィルムの接着剤層(厚さ:40μm)を15枚ラミネートすることで厚さ約0.6mmの接着剤層を作製し、1cm×1cmのサイズに切り出したものを試料として、接着剤層のずり粘度を測定した。この測定にはずり粘弾性測定装置(TAインスツルメンツ社製、商品名:ARES)を使用した。その結果、接着剤層の30℃におけるずり粘度は1×104Pa・sであった。なお、測定条件は以下の通りとした。
測定周波数:10Hz、
雰囲気:窒素下、
温度範囲:0℃~150℃、
昇温速度:10℃/分、
プローブ径:8mm、
試料サイズ:10mm×10mm、
試料厚み:約0.6mm、
測定ひずみ量:1.0%。
[接着剤成分の原材料の準備]
接着剤成分を作製するため、以下の原材料を準備した。
熱可塑性を有するフェノキシ樹脂(ユニオンカーバイド株式会社製、商品名:PKHC、重量平均分子量:45000)50gを、トルエン(沸点110.6℃)と酢酸エチル(沸点77.1℃)とを1:1(質量比)で混合した混合溶剤に溶解して、固形分40質量%のフェノキシ樹脂溶液を調製した。
ラジカル重合性物質として、30℃にて液状であるウレタンアクリレート(新中村化学工業株式会社製、商品名:UA-512、重量平均分子量:2800)、及び30℃にて液状であるジメタクリレート(新中村化学工業株式会社製、商品名:DCP、重量平均分子量:332)を準備した。
遊離ラジカルを発生する硬化剤(ラジカル発生剤)として、ジラウロイルパーオキサイド(日本油脂株式会社製、商品名:パーロイルL、1分半減期温度116.4℃、重量平均分子量:399)を準備した。
上述の通り準備した原材料を用いて、接着材フィルムを以下の通り作製した。
フェノキシ樹脂溶液40質量部に対して、液状ウレタンアクリレートを40質量部、液状ジメタクリレートを20質量部、ラジカル発生剤を4質量部配合して混合液を得た。当該混合液に対して、平均粒子径が5μmのニッケル粉(導電粒子)と、平均粒子径が0.5μmのシリカ粉(無機フィラー)を配合し、混合液中にニッケル粉とシリカ粉が分散した塗布液を得た。
当該塗布液を、厚さ80μm、幅500mmで両面がシリコーン離型処理されたPETフィルム(キャリアフィルム)に塗工装置を用いて320mの長さで塗布し、炉長15m、熱風温度70℃の乾燥炉を用いて3m/分の速度にて乾燥を行った。これにより、PETフィルムの一方面上に接着剤層(厚さ:40μm)が設けられた接着材フィルム(全長320m)を得た。
乾燥後における接着剤層のニッケル粉含有量は1.5体積%であり、シリカ粉含有量は15体積%(26質量%)であった。
上記接着材フィルムを、ロールツーロールのスリット設備により幅1.5mmに裁断し、リール部品(巻芯外径:66mm、プラスチック成型品)に、300mの長さで接着材テープを巻き取った。このとき、接着剤層が巻芯側(内側)を向き、PETからなる基材が外側を向くように巻き取った。なお、巻き取りの途中、接着材テープの端部から5mの位置にエンドマークを貼り付けた。巻芯の両側にはリール側板(厚さ2.0mm)が設けられており、このリール側板と接着材テープの巻重体との間の隙間距離は、左右それぞれ約0.1mm~0.5mmの範囲内であった。なお、本実施例において図1に示すような放射状に延在するリブ構造部2bを設けたリール側板を有するリール部品を使用した。
エンドマークを貼り付ける位置を接着材テープの端部から5mとする代わりに、10mとしたことの他は、実施例1と同様にして接着材リールを作製し、その評価を行った。
エンドマークを貼り付ける位置を接着材テープの端部から5mとする代わりに、15mとしたことの他は、実施例1と同様にして接着材リールを作製し、その評価を行った。
エンドマークを貼り付ける位置を接着材テープの端部から5mとする代わりに、20mとしたことの他は、実施例1と同様にして接着材リールを作製し、その評価を行った。
接着材テープにエンドマークを貼り付けなかったことの他は、実施例1と同様にして接着材リールを作製し、その評価を行った。
(試験例1)
接着材テープにエンドマークを貼り付けなかったことの他は実施例1と同様にして作製した30個の接着材リールについて、以下のようにしてブロッキングの発生率を評価した。すなわち、接着材リールを縦にした状態で固定し、先端に75gの分銅を吊り下げ、温度30℃の恒温槽(相対湿度40~60%)内に6時間にわたって放置した。その後、テンシロン(商品名、株式会社エー・アンド・デイ製)を使用し、接着材リールから接着材テープを1m/分の速度で引き出した。そして、ブロッキングが最初に発生した位置から接着材リールの終端部までの距離を測定した。表3に接着材テープの終端部からの距離に応じたブロッキングの発生率を示す。
接着剤層が外側を向き、PETからなる基材が巻芯側(内側)を向くように、接着材テープを巻芯に巻き取った点、及び接着材テープにエンドマークを貼り付けなかった点の2点以外は、実施例1と同様にして30個の接着材リールを作製した。そして、試験例1と同様にして接着材テープの終端部からの距離に応じたブロッキングの発生率を評価した。表3に結果を示す。
Claims (34)
- 巻芯と、
前記巻芯の両側に互いに対向するように設けられた一対の側板と、
前記巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープと、
を備え、
前記接着材テープは、当該接着材テープの始端部から終端部の方向に延在する領域であって前記接着剤層が使用される使用部と、当該接着材テープの終端部から所定の長さにわたって前記接着剤層が使用されない巻き捨て部と、前記使用部と前記巻き捨て部との間の領域に設けられたエンドマークとを有する、接着材リール。 - 前記巻き捨て部の長さは、5m以上である、請求項1に記載の接着材リール。
- 前記巻き捨て部の長さは、5m以上20m以下である、請求項1に記載の接着材リール。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上である、請求項1~3のいずれか一項に記載の接着材リール。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上30巻き分以下である、請求項1~3のいずれか一項に記載の接着材リール。
- 前記接着剤層は、30℃におけるずり粘度が100000Pa・s以下である、請求項1~5のいずれか一項に記載の接着材リール。
- 前記接着材テープは、幅が0.5~3.0mmである、請求項1~6のいずれか一項に記載の接着材リール。
- 前記接着材テープは、長さが200m以上である、請求項1~7のいずれか一項に記載の接着材リール。
- 前記接着材テープは、長さが200m以上1000m以下である、請求項1~7のいずれか一項に記載の接着材リール。
- 前記接着剤層は、厚さが5~60μmである、請求項1~9のいずれか一項に記載の接着材リール。
- 前記接着材テープは、回路接続に使用されるものである、請求項1~10のいずれか一項に記載の接着材リール。
- 巻芯と、前記巻芯の両側に互いに対向するように設けられた一対の側板と、前記巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える接着材リールから、前記接着材テープを繰り出して使用する際、当該接着材テープの終端部から所定の長さの前記接着剤層を使用せずに巻き捨て部とする、ブロッキング抑制方法。
- 前記巻き捨て部の長さは、5m以上である、請求項12に記載の方法。
- 前記巻き捨て部の長さは、5m以上20m以下である、請求項12に記載の方法。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上である、請求項12~14のいずれか一項に記載の方法。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上30巻き分以下である、請求項12~14のいずれか一項に記載の方法。
- 巻芯と、前記巻芯の両側に互いに対向するように設けられた一対の側板と、前記巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える第1の接着材リールを使用した後、前記第1の接着材リールと同様の構成からなる新たな第2の接着材リールに交換する際、
所定の長さの前記接着材テープを残した前記第1の接着材リールから前記第2の接着材リールに交換する、接着材リールの交換方法。 - 前記第1の接着材リールに残す前記接着材テープの前記所定の長さは、5m以上である、請求項17に記載の方法。
- 前記第1の接着材リールに残す前記接着材テープの前記所定の長さは、5m以上20m以下である、請求項17に記載の方法。
- 前記第1の接着材リールに残す前記接着材テープの前記所定の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上である、請求項17~19のいずれか一項に記載の方法。
- 前記第1の接着材リールに残す前記接着材テープの前記所定の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上30巻き分以下である、請求項17~19のいずれか一項に記載の方法。
- 巻芯と、前記巻芯の両側に互いに対向するように設けられた一対の側板と、前記巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える接着材リールから前記接着材テープを繰り出す方法であって、
当該接着材テープの終端部から所定の長さの前記接着剤層を使用せずに巻き捨て部とする、接着材テープの繰出し方法。 - 前記巻き捨て部の長さは、5m以上である、請求項22に記載の方法。
- 前記巻き捨て部の長さは、5m以上20m以下である、請求項22に記載の方法。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上である、請求項22~24のいずれか一項に記載の方法。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上30巻き分以下である、請求項22~24のいずれか一項に記載の方法。
- 請求項1~11のいずれか一項に記載の接着材リールの製造方法であり、
前記接着材テープの特性に基づいて前記巻き捨て部の前記所定の長さを決定する工程を備える、接着材リールの製造方法。 - 請求項1~11のいずれか一項に記載の接着材リールを製造する過程において前記エンドマークを設ける方法であって、
前記接着材テープの特性に基づいて前記巻き捨て部の前記所定の長さを決定し、前記使用部と前記巻き捨て部との間の領域に前記エンドマークを設ける方法。 - 巻芯と、前記巻芯の両側に互いに対向するように設けられた一対の側板と、前記巻芯に巻かれており、テープ状の基材及びその一方面上に設けられた接着剤層を有する接着材テープとを備える接着材リールと、
前記接着材テープを使用するにあたっては当該接着材テープの終端部から所定の長さの前記接着剤層を使用せずに巻き捨て部とすることを記載した取扱い説明書と、
を備えるリールキット。 - 前記巻き捨て部の長さは、5m以上である、請求項29に記載のリールキット。
- 前記巻き捨て部の長さは、5m以上20m以下である、請求項29に記載のリールキット。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上である、請求項29~31のいずれか一項に記載のリールキット。
- 前記巻き捨て部の長さは、前記巻芯に前記接着材テープが巻かれた状態において10巻き分以上30巻き分以下である、請求項29~31のいずれか一項に記載のリールキット。
- 請求項1~11のいずれか一項に記載の接着材リールと、
前記接着材リールを収容した梱包袋と、
を備える梱包体。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020147006339A KR101940355B1 (ko) | 2011-08-18 | 2012-08-15 | 접착재 릴, 블록킹 억제 방법, 접착재 릴의 교환 방법, 접착재 테이프의 조출 방법, 접착재 릴의 제조 방법, 릴 키트, 및 곤포체 |
JP2013529027A JP6036694B2 (ja) | 2011-08-18 | 2012-08-15 | 接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2011/068700 | 2011-08-18 | ||
PCT/JP2011/068700 WO2013024544A1 (ja) | 2011-08-18 | 2011-08-18 | 接着材リール |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2013024873A1 true WO2013024873A1 (ja) | 2013-02-21 |
Family
ID=47714887
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/068700 WO2013024544A1 (ja) | 2011-08-18 | 2011-08-18 | 接着材リール |
PCT/JP2012/070757 WO2013024873A1 (ja) | 2011-08-18 | 2012-08-15 | 接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/068700 WO2013024544A1 (ja) | 2011-08-18 | 2011-08-18 | 接着材リール |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6036694B2 (ja) |
KR (1) | KR101940355B1 (ja) |
CN (3) | CN102951498B (ja) |
TW (1) | TWI580628B (ja) |
WO (2) | WO2013024544A1 (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015151874A1 (ja) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2015189836A (ja) * | 2014-03-27 | 2015-11-02 | デクセリアルズ株式会社 | 接着フィルム巻装体、接続体の製造方法及び電子部品の接続方法 |
WO2019050012A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050011A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050005A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 接着剤フィルム収容セット及びその製造方法 |
WO2020184583A1 (ja) * | 2019-03-13 | 2020-09-17 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2022255414A1 (ja) * | 2021-06-02 | 2022-12-08 | 昭和電工マテリアルズ株式会社 | 接着テープ及び接着テープ巻回リール |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6119718B2 (ja) | 2013-11-19 | 2017-04-26 | デクセリアルズ株式会社 | 異方導電性フィルム及び接続構造体 |
CN114334881A (zh) | 2013-11-19 | 2022-04-12 | 迪睿合株式会社 | 各向异性导电性膜及连接构造体 |
JP6098949B2 (ja) * | 2014-12-12 | 2017-03-22 | トヨタ自動車株式会社 | 電解質膜巻回体 |
JP6510846B2 (ja) * | 2015-03-24 | 2019-05-08 | デクセリアルズ株式会社 | 異方性導電フィルム、接続方法、及び接合体 |
TWI605942B (zh) * | 2016-01-04 | 2017-11-21 | 厚生股份有限公司 | 感壓複合結構及其製造方法 |
JP6905320B2 (ja) * | 2016-09-27 | 2021-07-21 | デクセリアルズ株式会社 | 接着フィルム巻装体、接着フィルム巻装体の製造方法 |
WO2019050006A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
CN113264422A (zh) * | 2021-05-28 | 2021-08-17 | 广东电网有限责任公司 | 一种伸缩式密封带装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284005A (ja) * | 2000-03-28 | 2001-10-12 | Hitachi Chem Co Ltd | 異方導電材テープ |
JP2004115153A (ja) * | 2002-09-24 | 2004-04-15 | Shibaura Mechatronics Corp | テープ部材の貼着装置、及び貼着方法 |
JP2004200126A (ja) * | 2002-12-20 | 2004-07-15 | Hitachi Chem Co Ltd | 接着材テープの接続方法 |
JP2004237996A (ja) * | 2003-02-04 | 2004-08-26 | Shin Etsu Polymer Co Ltd | カバーテープ及びこれを用いた包装体 |
JP2007331949A (ja) * | 2007-08-20 | 2007-12-27 | Hitachi Chem Co Ltd | 接着材リール |
JP2011037636A (ja) * | 2010-11-09 | 2011-02-24 | Sony Chemical & Information Device Corp | 接着フィルムの貼付方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4147614B2 (ja) | 1998-04-15 | 2008-09-10 | 日立化成工業株式会社 | 接着剤層を有する巻重体 |
JP3959247B2 (ja) | 2001-02-16 | 2007-08-15 | ソニーケミカル&インフォメーションデバイス株式会社 | リール部材及びフィルムの巻取方法 |
JP3889944B2 (ja) | 2001-08-30 | 2007-03-07 | 日立化成工業株式会社 | 回路接続用接着フィルム及びそれを用いた回路板の製造方法 |
CN100548840C (zh) * | 2002-07-30 | 2009-10-14 | 日立化成工业株式会社 | 粘接材料带连接体及粘接材料带的连接方法 |
KR100953011B1 (ko) * | 2002-07-30 | 2010-04-14 | 히다치 가세고교 가부시끼가이샤 | 접착제 테이프의 제조방법 |
JP2007002130A (ja) * | 2005-06-24 | 2007-01-11 | Asahi Kasei Chemicals Corp | カチオン硬化性組成物およびその硬化物 |
KR101025369B1 (ko) | 2005-08-04 | 2011-03-28 | 히다치 가세고교 가부시끼가이샤 | 이방도전필름 및 그 제조방법 |
JP4238885B2 (ja) * | 2005-08-31 | 2009-03-18 | 日立化成工業株式会社 | 接着剤リール及び接着剤テープ |
JP4193858B2 (ja) | 2006-03-27 | 2008-12-10 | ソニーケミカル&インフォメーションデバイス株式会社 | フィルム状接着剤の貼付装置 |
CN102070048B (zh) * | 2006-06-21 | 2016-02-03 | 日立化成株式会社 | 带的卷绕方法 |
CN101528878A (zh) | 2006-10-31 | 2009-09-09 | 日立化成工业株式会社 | 粘接带和粘接带卷绕体 |
JP2008303067A (ja) * | 2007-05-09 | 2008-12-18 | Hitachi Chem Co Ltd | 接着材リール及びこれを用いた回路接続体の製造方法 |
JP2009004354A (ja) * | 2007-05-23 | 2009-01-08 | Hitachi Chem Co Ltd | 接着材リール及びこれを用いた回路接続体の製造方法 |
JP2009278059A (ja) * | 2008-04-17 | 2009-11-26 | Hitachi Chem Co Ltd | 熱圧着装置 |
JP2010001084A (ja) * | 2008-06-18 | 2010-01-07 | Sony Chemical & Information Device Corp | リール部材、フィルム収容体及びフィルムの引出方法 |
WO2010098354A1 (ja) * | 2009-02-27 | 2010-09-02 | 日立化成工業株式会社 | 接着材リール |
CN102037614B (zh) * | 2009-03-26 | 2014-03-19 | 日立化成株式会社 | 粘接材料卷轴 |
CN102148178A (zh) * | 2009-12-16 | 2011-08-10 | 第一毛织株式会社 | 电路小片粘性膜、卷筒、安装设备和电子产品 |
-
2011
- 2011-08-18 WO PCT/JP2011/068700 patent/WO2013024544A1/ja active Application Filing
-
2012
- 2012-08-15 WO PCT/JP2012/070757 patent/WO2013024873A1/ja active Application Filing
- 2012-08-15 JP JP2013529027A patent/JP6036694B2/ja active Active
- 2012-08-15 CN CN201210291451.6A patent/CN102951498B/zh not_active Expired - Fee Related
- 2012-08-15 CN CN2012204058050U patent/CN203021117U/zh not_active Expired - Fee Related
- 2012-08-15 KR KR1020147006339A patent/KR101940355B1/ko active IP Right Grant
- 2012-08-15 CN CN2012204055315U patent/CN203020727U/zh not_active Expired - Fee Related
- 2012-08-16 TW TW101129778A patent/TWI580628B/zh active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001284005A (ja) * | 2000-03-28 | 2001-10-12 | Hitachi Chem Co Ltd | 異方導電材テープ |
JP2004115153A (ja) * | 2002-09-24 | 2004-04-15 | Shibaura Mechatronics Corp | テープ部材の貼着装置、及び貼着方法 |
JP2004200126A (ja) * | 2002-12-20 | 2004-07-15 | Hitachi Chem Co Ltd | 接着材テープの接続方法 |
JP2004237996A (ja) * | 2003-02-04 | 2004-08-26 | Shin Etsu Polymer Co Ltd | カバーテープ及びこれを用いた包装体 |
JP2007331949A (ja) * | 2007-08-20 | 2007-12-27 | Hitachi Chem Co Ltd | 接着材リール |
JP2011037636A (ja) * | 2010-11-09 | 2011-02-24 | Sony Chemical & Information Device Corp | 接着フィルムの貼付方法 |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015189836A (ja) * | 2014-03-27 | 2015-11-02 | デクセリアルズ株式会社 | 接着フィルム巻装体、接続体の製造方法及び電子部品の接続方法 |
JP7017158B2 (ja) | 2014-03-31 | 2022-02-08 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
CN106415938A (zh) * | 2014-03-31 | 2017-02-15 | 迪睿合株式会社 | 各向异性导电膜及其制备方法 |
JP2022068165A (ja) * | 2014-03-31 | 2022-05-09 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
WO2015151874A1 (ja) * | 2014-03-31 | 2015-10-08 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
US10461054B2 (en) | 2014-03-31 | 2019-10-29 | Dexerials Corporation | Anisotropic conductive film and production method of the same |
JP2015201435A (ja) * | 2014-03-31 | 2015-11-12 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
TWI664783B (zh) * | 2014-03-31 | 2019-07-01 | 日商迪睿合股份有限公司 | 異向性導電膜、其製造方法、連接構造體、及連接構造體之製造方法 |
CN106415938B (zh) * | 2014-03-31 | 2019-09-06 | 迪睿合株式会社 | 各向异性导电膜及其制备方法 |
JP7368765B2 (ja) | 2014-03-31 | 2023-10-25 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JP2020053403A (ja) * | 2014-03-31 | 2020-04-02 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
JPWO2019050012A1 (ja) * | 2017-09-11 | 2020-08-27 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050005A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 接着剤フィルム収容セット及びその製造方法 |
WO2019050011A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2019050012A1 (ja) * | 2017-09-11 | 2019-03-14 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
JPWO2019050011A1 (ja) * | 2017-09-11 | 2020-08-20 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
JP7210846B2 (ja) | 2017-09-11 | 2023-01-24 | 株式会社レゾナック | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
JP7210845B2 (ja) | 2017-09-11 | 2023-01-24 | 株式会社レゾナック | 接着剤フィルム収容セット及びその製造方法 |
JP7264054B2 (ja) | 2017-09-11 | 2023-04-25 | 株式会社レゾナック | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
TWI808990B (zh) * | 2017-09-11 | 2023-07-21 | 日商力森諾科股份有限公司 | 電路連接用接著劑膜及其製造方法、電路連接結構體的製造方法及接著劑膜收容套組 |
JPWO2019050005A1 (ja) * | 2017-09-11 | 2020-08-20 | 日立化成株式会社 | 接着剤フィルム収容セット及びその製造方法 |
WO2020184583A1 (ja) * | 2019-03-13 | 2020-09-17 | 日立化成株式会社 | 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット |
WO2022255414A1 (ja) * | 2021-06-02 | 2022-12-08 | 昭和電工マテリアルズ株式会社 | 接着テープ及び接着テープ巻回リール |
Also Published As
Publication number | Publication date |
---|---|
TWI580628B (zh) | 2017-05-01 |
JP6036694B2 (ja) | 2016-11-30 |
KR101940355B1 (ko) | 2019-01-18 |
CN102951498A (zh) | 2013-03-06 |
JPWO2013024873A1 (ja) | 2015-03-05 |
TW201318952A (zh) | 2013-05-16 |
WO2013024544A1 (ja) | 2013-02-21 |
CN203020727U (zh) | 2013-06-26 |
CN102951498B (zh) | 2016-11-16 |
KR20140053298A (ko) | 2014-05-07 |
CN203021117U (zh) | 2013-06-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6036694B2 (ja) | 接着材リール、ブロッキング抑制方法、接着材リールの交換方法、接着材テープの繰出し方法、接着材リールの製造方法、リールキット、及び梱包体 | |
JP5928567B2 (ja) | 接着材リール | |
JP4079281B2 (ja) | 異方導電性組成物 | |
EP2312697B1 (en) | Adhesive material reel | |
JP4465788B2 (ja) | 異方導電材テープ及びリール | |
KR101139545B1 (ko) | 전자부품 포장용 커버 테이프 및 전자부품 포장체 | |
EP2315314A1 (en) | Adhesive material reel | |
JP5398455B2 (ja) | 異方性導電フィルム及びその製造方法 | |
US11008488B2 (en) | Adhesive composition and film roll | |
JP5703621B2 (ja) | 回路部材接続用接着剤、回路部材接続用接着剤シート、半導体装置及び半導体装置の製造方法 | |
JP3503735B2 (ja) | 異方導電性接着フィルム巻重体 | |
JP3712334B2 (ja) | 異方導電性接着フィルム | |
JP2008303067A (ja) | 接着材リール及びこれを用いた回路接続体の製造方法 | |
JP5539039B2 (ja) | 異方性導電フィルム及びその製造方法 | |
JPH0551053A (ja) | 耐熱カバーテープ | |
JP4844661B2 (ja) | 異方導電材テープ | |
JP2007165056A (ja) | 異方導電性フィルムの製造方法および異方導電性フィルム | |
JP2017098077A (ja) | 異方性導電フィルム、及び接続方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 12823957 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2013529027 Country of ref document: JP Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20147006339 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 12823957 Country of ref document: EP Kind code of ref document: A1 |