WO2010056083A3 - 반도체 발광소자 - Google Patents

반도체 발광소자 Download PDF

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Publication number
WO2010056083A3
WO2010056083A3 PCT/KR2009/006731 KR2009006731W WO2010056083A3 WO 2010056083 A3 WO2010056083 A3 WO 2010056083A3 KR 2009006731 W KR2009006731 W KR 2009006731W WO 2010056083 A3 WO2010056083 A3 WO 2010056083A3
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WO
WIPO (PCT)
Prior art keywords
conductive
light
semiconductor
emitting diode
layer
Prior art date
Application number
PCT/KR2009/006731
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English (en)
French (fr)
Other versions
WO2010056083A2 (ko
Inventor
최번재
이상범
이진복
김유승
송상엽
Original Assignee
삼성엘이디 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성엘이디 주식회사 filed Critical 삼성엘이디 주식회사
Priority to EP09826315.5A priority Critical patent/EP2357679B1/en
Priority to US13/127,847 priority patent/US8809893B2/en
Priority to CN200980145944.5A priority patent/CN102217102B/zh
Publication of WO2010056083A2 publication Critical patent/WO2010056083A2/ko
Publication of WO2010056083A3 publication Critical patent/WO2010056083A3/ko
Priority to US14/336,973 priority patent/US9305906B2/en
Priority to US14/338,225 priority patent/US9312249B2/en

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    • HELECTRICITY
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    • H01L33/504Elements with two or more wavelength conversion materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/508Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/30Semiconductor lamps, e.g. solid state lamps [SSL] light emitting diodes [LED] or organic LED [OLED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/40Control techniques providing energy savings, e.g. smart controller or presence detection

Abstract

본 발명은 수직수평구조 반도체 발광소자에 관한 것으로서, 본 발명의 일 실시 형태는, 도전성 기판과, 상기 도전성 기판 상에 순차적으로 형성된 제1 도전형 반도체층, 활성층 및 제2 도전형 반도체층을 구비하는 발광구조물과, 상기 제1 도전형 반도체층 및 활성층을 관통하여 상기 제2 도전형 반도체층과 그 내부에서 접속된 도전성 비아 및 상기 도전성 비아로부터 연장되어 상기 발광구조물의 외부로 노출된 전기 연결부를 구비하는 제2 도전형 전극과, 상기 제2 도전형 전극을 상기 도전성 기판, 제1 도전형 반도체층 및 활성층과 전기적으로 분리시키기 위한 절연체 및 적어도 상기 발광구조물 중 상기 활성층의 측면을 덮도록 형성된 패시베이션층과, 상기 활성층에서 방출된 빛의 경로 상에 형성된 요철 구조를 구비하는 반도체 발광소자를 제공한다. 본 발명에 따르면, 외부 광 추출효율, 특히, 소자의 측 방향 광 추출효율이 향상될 수 있는 반도체 발광소자를 얻을 수 있다.
PCT/KR2009/006731 2008-11-14 2009-11-16 반도체 발광소자 WO2010056083A2 (ko)

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EP09826315.5A EP2357679B1 (en) 2008-11-14 2009-11-16 Vertical/horizontal light-emitting diode for semiconductor
US13/127,847 US8809893B2 (en) 2008-11-14 2009-11-16 Semiconductor light emitting device
CN200980145944.5A CN102217102B (zh) 2008-11-14 2009-11-16 半导体发光器件
US14/336,973 US9305906B2 (en) 2008-11-14 2014-07-21 Semiconductor light emitting device
US14/338,225 US9312249B2 (en) 2008-11-14 2014-07-22 Semiconductor light emitting device

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KR10-2008-0113568 2008-11-14
KR20080113568 2008-11-14
KR10-2008-0122094 2008-12-03
KR1020080122094 2008-12-03
KR1020090110307A KR101601621B1 (ko) 2008-11-14 2009-11-16 반도체 발광소자
KR10-2009-0110307 2009-11-16

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US14/336,973 Division US9305906B2 (en) 2008-11-14 2014-07-21 Semiconductor light emitting device
US14/338,225 Continuation US9312249B2 (en) 2008-11-14 2014-07-22 Semiconductor light emitting device

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Families Citing this family (166)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI289365B (en) * 2005-09-29 2007-11-01 Visera Technologies Co Ltd Wafer scale image module
US8796718B2 (en) * 2009-09-30 2014-08-05 Kyocera Corporation Light emitting element and method for manufacturing light emitting element
FR2953328B1 (fr) * 2009-12-01 2012-03-30 S O I Tec Silicon On Insulator Tech Heterostructure pour composants electroniques de puissance, composants optoelectroniques ou photovoltaiques
KR20110077707A (ko) * 2009-12-30 2011-07-07 엘지디스플레이 주식회사 수직형 발광 다이오드 및 그 제조방법
WO2011097694A1 (en) * 2010-02-10 2011-08-18 Lumen Dynamics Group Inc. Modular high density led array light sources
US8319247B2 (en) * 2010-03-25 2012-11-27 Koninklijke Philips Electronics N.V. Carrier for a light emitting device
WO2011143127A2 (en) * 2010-05-13 2011-11-17 Sri International Cavity electroluminescent devices with integrated microlenses
DE102010024079A1 (de) * 2010-06-17 2011-12-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip
KR101714039B1 (ko) * 2010-07-01 2017-03-08 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템
KR101252032B1 (ko) * 2010-07-08 2013-04-10 삼성전자주식회사 반도체 발광소자 및 이의 제조방법
KR101688379B1 (ko) * 2010-07-12 2016-12-22 삼성전자주식회사 발광 디바이스 및 그 제조방법
KR101761385B1 (ko) 2010-07-12 2017-08-04 엘지이노텍 주식회사 발광 소자
KR20120006410A (ko) 2010-07-12 2012-01-18 엘지이노텍 주식회사 발광 소자 및 그 제조방법
TWI495156B (zh) * 2010-07-30 2015-08-01 Epistar Corp 半導體發光元件及其製造方法
DE102010034665A1 (de) 2010-08-18 2012-02-23 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung von optoelektronischen Halbleiterchips
KR101769499B1 (ko) * 2010-08-24 2017-08-21 삼성디스플레이 주식회사 유기 전계 발광 표시 장치
KR101114191B1 (ko) * 2010-09-17 2012-03-13 엘지이노텍 주식회사 발광소자
US9070851B2 (en) 2010-09-24 2015-06-30 Seoul Semiconductor Co., Ltd. Wafer-level light emitting diode package and method of fabricating the same
DE102010046792A1 (de) 2010-09-28 2012-03-29 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zu dessen Herstellung
KR101761386B1 (ko) * 2010-10-06 2017-07-25 엘지이노텍 주식회사 발광 소자
KR101039610B1 (ko) * 2010-10-12 2011-06-09 엘지이노텍 주식회사 발광 소자 및 발광 소자 패키지
EP2442374B1 (en) 2010-10-12 2016-09-21 LG Innotek Co., Ltd. Light emitting device
TWI492423B (zh) * 2010-10-18 2015-07-11 Advanced Optoelectronic Tech 覆晶式led封裝結構
KR101663192B1 (ko) * 2010-10-20 2016-10-06 엘지이노텍 주식회사 발광 소자
US8476649B2 (en) 2010-12-16 2013-07-02 Micron Technology, Inc. Solid state lighting devices with accessible electrodes and methods of manufacturing
CN102142508A (zh) * 2010-12-16 2011-08-03 西安炬光科技有限公司 一种高功率高亮度led光源封装结构及其封装方法
KR101154320B1 (ko) * 2010-12-20 2012-06-13 엘지이노텍 주식회사 발광소자, 발광소자 패키지 및 이를 포함하는 조명 장치
KR20120070278A (ko) * 2010-12-21 2012-06-29 삼성엘이디 주식회사 발광모듈 및 발광모듈 제조방법
JP5777879B2 (ja) 2010-12-27 2015-09-09 ローム株式会社 発光素子、発光素子ユニットおよび発光素子パッケージ
JP2012186195A (ja) * 2011-03-03 2012-09-27 Toshiba Corp 半導体発光素子及びその製造方法
JP2012186414A (ja) * 2011-03-08 2012-09-27 Toshiba Corp 発光装置
CN103403892A (zh) * 2011-03-31 2013-11-20 松下电器产业株式会社 半导体发光装置
KR20120115896A (ko) * 2011-04-11 2012-10-19 삼성디스플레이 주식회사 발광 유닛 및 이를 포함하는 표시 장치
TWI425666B (zh) * 2011-04-27 2014-02-01 Univ Nat Central Growth of semi - polarized nitrides
JP5830166B2 (ja) 2011-05-25 2015-12-09 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH オプトエレクトロニクス半導体チップ
WO2012160604A1 (ja) * 2011-05-25 2012-11-29 Dowaエレクトロニクス株式会社 発光素子チップ及びその製造方法
TW201248945A (en) * 2011-05-31 2012-12-01 Chi Mei Lighting Tech Corp Light-emitting diode device and method for manufacturing the same
KR101973608B1 (ko) * 2011-06-30 2019-04-29 엘지이노텍 주식회사 발광소자
TWI493759B (zh) * 2011-07-13 2015-07-21 Lextar Electronics Corp 發光二極體結構及其製造方法
EP2742529B1 (en) 2011-08-10 2020-11-11 Heptagon Micro Optics Pte. Ltd. Opto-electronic module and method for manufacturing the same
US9299742B2 (en) 2011-08-15 2016-03-29 Micron Technology, Inc. High-voltage solid-state transducers and associated systems and methods
DE102011112000B4 (de) * 2011-08-31 2023-11-30 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Leuchtdiodenchip
TWI437737B (zh) * 2011-09-14 2014-05-11 Lextar Electronics Corp 發光二極體結構及其製造方法
KR101691589B1 (ko) * 2011-09-16 2017-01-02 서울바이오시스 주식회사 발광 다이오드 및 그것을 제조하는 방법
TW201318147A (zh) * 2011-10-26 2013-05-01 Phostek Inc 發光二極體陣列
KR101868537B1 (ko) * 2011-11-07 2018-06-19 엘지이노텍 주식회사 발광소자 및 이를 포함하는 발광 소자 패키지
TWI479694B (zh) * 2012-01-11 2015-04-01 Formosa Epitaxy Inc Light emitting diode wafers
WO2013118072A2 (en) 2012-02-10 2013-08-15 Koninklijke Philips N.V. Wavelength converted light emitting device
CN104205369A (zh) * 2012-03-19 2014-12-10 皇家飞利浦有限公司 在硅衬底上生长的发光器件
KR101887942B1 (ko) * 2012-05-07 2018-08-14 삼성전자주식회사 발광소자
CN103515503B (zh) * 2012-06-28 2017-10-17 上海蓝光科技有限公司 一种垂直结构发光二极管及其制造方法
JP2014013818A (ja) * 2012-07-04 2014-01-23 Sony Corp デバイスおよび電子装置
JP2014022401A (ja) * 2012-07-12 2014-02-03 Toshiba Corp 窒化物半導体発光素子
US9239489B2 (en) 2012-07-31 2016-01-19 Apple Inc. Display backlight with closely spaced light-emitting diode packages
US10388690B2 (en) * 2012-08-07 2019-08-20 Seoul Viosys Co., Ltd. Wafer level light-emitting diode array
US10804316B2 (en) * 2012-08-07 2020-10-13 Seoul Viosys Co., Ltd. Wafer level light-emitting diode array
GB2506993B (en) * 2012-09-24 2016-03-23 Samsung Electronics Co Ltd Illuminating apparatus
KR102188491B1 (ko) * 2012-09-24 2020-12-08 삼성전자주식회사 조명장치
US9439250B2 (en) 2012-09-24 2016-09-06 Samsung Electronics Co., Ltd. Driving light emitting diode (LED) lamps using power received from ballast stabilizers
US9196807B2 (en) * 2012-10-24 2015-11-24 Nichia Corporation Light emitting element
KR101977278B1 (ko) * 2012-10-29 2019-09-10 엘지이노텍 주식회사 발광 소자
TWI565094B (zh) * 2012-11-15 2017-01-01 財團法人工業技術研究院 氮化物半導體結構
US10390399B2 (en) * 2013-01-10 2019-08-20 Molex, Llc LED assembly having base insert molded about terminals and substrate with a plurality of LED chips positioned on said substrate
JP6751562B2 (ja) * 2013-01-10 2020-09-09 ルミレッズ ホールディング ベーフェー 側方放射用に成形された成長基板を有するled
TWI453420B (zh) * 2013-01-11 2014-09-21 Mpi Corp 孔板
US9470715B2 (en) 2013-01-11 2016-10-18 Mpi Corporation Probe head
KR102056618B1 (ko) 2013-02-01 2019-12-17 삼성전자주식회사 반도체 발광소자
JP6013931B2 (ja) * 2013-02-08 2016-10-25 株式会社東芝 半導体発光素子
KR102036347B1 (ko) 2013-02-12 2019-10-24 삼성전자 주식회사 발광소자 어레이부 및 이를 포함하는 발광소자 모듈
JP6067400B2 (ja) * 2013-02-12 2017-01-25 株式会社東芝 半導体発光素子
DE102013101598B9 (de) * 2013-02-18 2023-10-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102013103079A1 (de) * 2013-03-26 2014-10-02 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
US9219202B2 (en) * 2013-04-19 2015-12-22 Cree, Inc. Semiconductor light emitting devices including red phosphors that exhibit good color rendering properties and related red phosphors
TWI661578B (zh) * 2013-06-20 2019-06-01 晶元光電股份有限公司 發光裝置及發光陣列
DE102013107531A1 (de) * 2013-07-16 2015-01-22 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
JP6153895B2 (ja) * 2013-07-22 2017-06-28 富士フイルム株式会社 液晶表示装置
JP2015028984A (ja) * 2013-07-30 2015-02-12 日亜化学工業株式会社 半導体発光素子
KR102074950B1 (ko) * 2013-08-13 2020-03-02 삼성전자 주식회사 조명 장치, 조명 제어 시스템 및 조명 장치의 제어 방법.
KR20150025231A (ko) * 2013-08-28 2015-03-10 서울반도체 주식회사 광원 모듈 및 그 제조 방법, 및 백라이트 유닛
DE102013111422A1 (de) * 2013-10-16 2015-04-30 Osram Oled Gmbh Optoelektronisches Bauelement, Kontaktiervorrichtung und optoelektronische Baugruppe
US9818826B2 (en) * 2013-10-21 2017-11-14 Sensor Electronic Technology, Inc. Heterostructure including a composite semiconductor layer
TWI597863B (zh) * 2013-10-22 2017-09-01 晶元光電股份有限公司 發光元件及其製造方法
JP2015082596A (ja) * 2013-10-23 2015-04-27 株式会社東芝 発光装置
CN103681992A (zh) * 2014-01-07 2014-03-26 苏州晶湛半导体有限公司 半导体衬底、半导体器件及半导体衬底制造方法
KR102087197B1 (ko) * 2014-01-13 2020-03-11 삼성디스플레이 주식회사 액정 표시 장치 및 그 제조 방법
KR101552422B1 (ko) * 2014-01-14 2015-09-10 성균관대학교산학협력단 발광 다이오드용 기판 및 그 제조방법과 상기 기판을 포함하는 광원 장치
DE102014102029A1 (de) * 2014-02-18 2015-08-20 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von Halbleiterbauelementen und Halbleiterbauelement
US9412906B2 (en) 2014-02-20 2016-08-09 Epistar Corporation Light-emitting device
US9660004B2 (en) 2014-03-21 2017-05-23 Apple Inc. Flexible displays with strengthened pad area
DE102014107563A1 (de) * 2014-05-28 2015-12-03 Osram Opto Semiconductors Gmbh Halbleiterbauelement mit Kontaktstruktur
KR102181398B1 (ko) * 2014-06-11 2020-11-23 엘지이노텍 주식회사 발광소자 및 조명시스템
KR102185689B1 (ko) 2014-06-12 2020-12-02 엘지이노텍 주식회사 발광소자 및 이를 포함하는 발광소자 패키지
JP6425921B2 (ja) * 2014-06-12 2018-11-21 株式会社ジャパンディスプレイ 画像表示装置
DE102014108373A1 (de) * 2014-06-13 2015-12-17 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip
KR20160017849A (ko) * 2014-08-06 2016-02-17 서울바이오시스 주식회사 고출력 발광 장치 및 그 제조 방법
KR20160037060A (ko) * 2014-09-26 2016-04-05 서울바이오시스 주식회사 발광소자 및 그 제조 방법
JP6727483B2 (ja) * 2014-10-08 2020-07-22 コンシューマー ライティング (ユー.エス.),エルエルシー 照明装置のカラーフィルター用材料および光学部品
TWI552394B (zh) * 2014-11-18 2016-10-01 隆達電子股份有限公司 發光二極體結構與發光二極體模組
JP6375890B2 (ja) * 2014-11-18 2018-08-22 日亜化学工業株式会社 窒化物半導体素子及びその製造方法
CN109390308B (zh) * 2014-11-26 2023-02-10 意法半导体股份有限公司 具有引线键合和烧结区域的半导体器件及其制造工艺
KR20160069724A (ko) * 2014-12-09 2016-06-17 엘지이노텍 주식회사 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치
KR102252994B1 (ko) * 2014-12-18 2021-05-20 삼성전자주식회사 발광소자 패키지 및 발광소자 패키지용 파장 변환 필름
KR102417158B1 (ko) * 2015-01-29 2022-07-07 서울바이오시스 주식회사 반도체 발광소자
DE112015005634T5 (de) * 2014-12-19 2017-09-07 Seoul Viosys Co., Ltd. Halbleiter-lichtemissionseinrichtung und verfahren zur herstellung von dieser
KR102305218B1 (ko) * 2014-12-19 2021-09-29 서울바이오시스 주식회사 질화물 반도체 발광소자 및 그 제조 방법
KR102347456B1 (ko) * 2015-03-09 2022-01-07 서울바이오시스 주식회사 반도체 발광소자
US10143057B2 (en) 2015-01-05 2018-11-27 Hung Lin Board-mounted parallel circuit structure with efficient power utilization
CN104683671B (zh) * 2015-02-04 2017-11-14 广东欧珀移动通信有限公司 电子装置
JP6156402B2 (ja) 2015-02-13 2017-07-05 日亜化学工業株式会社 発光装置
FR3032664B1 (fr) * 2015-02-13 2017-03-03 Valeo Vision Dispositif lumineux pour un vehicule automobile integrant des moyens de protection contre des decharges electrostatiques
KR101669122B1 (ko) * 2015-02-26 2016-10-25 엘지이노텍 주식회사 발광 소자 패키지
KR101614370B1 (ko) * 2015-04-07 2016-04-21 엘지전자 주식회사 반도체 발광소자, 반도체 발광소자의 이송 헤드, 및 반도체 발광소자를 이송하는 방법
JP6692155B2 (ja) * 2015-12-15 2020-05-13 スタンレー電気株式会社 半導体発光素子アレイおよび車両用灯具
JP2017112321A (ja) * 2015-12-18 2017-06-22 ソニー株式会社 発光ユニットおよび表示装置
JP6901862B2 (ja) * 2016-01-29 2021-07-14 コニカ ミノルタ ラボラトリー ユー.エス.エー.,インコーポレイテッド Rgb偏光光源
US10619803B2 (en) 2016-03-16 2020-04-14 Consumer Lighting (U.S.), Llc LED apparatus employing neodymium based materials with variable content of fluorine and oxygen
US10877346B2 (en) * 2016-03-24 2020-12-29 Saturn Licensing Llc Light-emitting device, display apparatus, and illumination apparatus
CN205944139U (zh) 2016-03-30 2017-02-08 首尔伟傲世有限公司 紫外线发光二极管封装件以及包含此的发光二极管模块
KR102610028B1 (ko) * 2016-04-12 2023-12-06 삼성디스플레이 주식회사 디스플레이 장치
TWI685961B (zh) * 2016-06-17 2020-02-21 優顯科技股份有限公司 光電半導體裝置
JP7114489B2 (ja) * 2016-06-22 2022-08-08 ルミレッズ ホールディング ベーフェー 光変換パッケージ
CN106129094B (zh) * 2016-07-29 2019-01-25 京东方科技集团股份有限公司 一种显示面板、其驱动方法及防偷窥系统
KR20180015848A (ko) * 2016-08-04 2018-02-14 삼성전자주식회사 반도체 발광소자 및 반도체 발광소자의 제조 방법
KR102588170B1 (ko) * 2016-11-16 2023-10-13 삼성전자주식회사 다층 구조의 반사막을 구비한 반도체 발광 소자
US10565917B2 (en) * 2016-12-23 2020-02-18 Intel Corporation Monolithic micro LED display
US10546842B2 (en) * 2017-05-31 2020-01-28 Innolux Corporation Display device and method for forming the same
FR3068173B1 (fr) * 2017-06-27 2020-05-15 Aledia Dispositif optoelectronique
DE102017117650A1 (de) * 2017-08-03 2019-02-07 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement mit einer Kontaktstruktur und Verfahren zur Herstellung einer Kontaktstruktur für ein optoelektronisches Halbleiterbauelement
KR20190019539A (ko) * 2017-08-18 2019-02-27 삼성전자주식회사 발광 소자 및 발광소자 패키지
US10276794B1 (en) 2017-10-31 2019-04-30 Taiwan Semiconductor Manufacturing Co., Ltd. Memory device and fabrication method thereof
KR101994440B1 (ko) * 2017-11-03 2019-06-28 엘지전자 주식회사 반도체 발광 소자를 이용한 차량용 램프
US10892296B2 (en) * 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
CN109872986B (zh) * 2017-12-04 2023-07-04 新加坡有限公司 光学传感器的封装结构及光学传感器的封装方法
US10748881B2 (en) 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11522006B2 (en) 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552061B2 (en) 2017-12-22 2023-01-10 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11114499B2 (en) 2018-01-02 2021-09-07 Seoul Viosys Co., Ltd. Display device having light emitting stacked structure
US10784240B2 (en) 2018-01-03 2020-09-22 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10571756B2 (en) * 2018-02-05 2020-02-25 Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. LCD panel, LCD panel manufacturing method and display device
KR20190098709A (ko) 2018-02-14 2019-08-22 에피스타 코포레이션 발광 장치, 그 제조 방법 및 디스플레이 모듈
KR20190116827A (ko) 2018-04-05 2019-10-15 엘지이노텍 주식회사 반도체 소자
CN110504281A (zh) 2018-05-16 2019-11-26 财团法人工业技术研究院 显示阵列的制造方法
TW201947636A (zh) * 2018-05-16 2019-12-16 財團法人工業技術研究院 顯示陣列的製造方法
TWI770225B (zh) * 2018-07-12 2022-07-11 晶元光電股份有限公司 發光元件
JP2021531087A (ja) * 2018-07-13 2021-11-18 バード・ペリフェラル・バスキュラー・インコーポレーテッド 移植可能ポート、移植可能ポート検出装置、およびその方法
JP6912731B2 (ja) * 2018-07-31 2021-08-04 日亜化学工業株式会社 半導体発光素子
US11962928B2 (en) 2018-12-17 2024-04-16 Meta Platforms Technologies, Llc Programmable pixel array
US11888002B2 (en) 2018-12-17 2024-01-30 Meta Platforms Technologies, Llc Dynamically programmable image sensor
KR102030402B1 (ko) * 2018-12-26 2019-10-10 엘지디스플레이 주식회사 발광소자 및 이를 포함하는 표시장치
JP2022532327A (ja) * 2019-05-14 2022-07-14 ソウル バイオシス カンパニー リミテッド 発光チップ
US11935291B2 (en) 2019-10-30 2024-03-19 Meta Platforms Technologies, Llc Distributed sensor system
US11948089B2 (en) 2019-11-07 2024-04-02 Meta Platforms Technologies, Llc Sparse image sensing and processing
US11362251B2 (en) 2019-12-02 2022-06-14 Facebook Technologies, Llc Managing thermal resistance and planarity of a display package
US20220416119A1 (en) * 2019-12-03 2022-12-29 Vuereal Inc. High efficient micro devices
US11276806B2 (en) * 2020-01-03 2022-03-15 Advanced Semiconductor Engineering, Inc. Semiconductor device package and method for manufacturing the same
US11825228B2 (en) 2020-05-20 2023-11-21 Meta Platforms Technologies, Llc Programmable pixel array having multiple power domains
KR20210143452A (ko) 2020-05-20 2021-11-29 삼성전자주식회사 반도체 발광소자 및 이를 구비한 발광소자 패키지
CN111653205B (zh) * 2020-07-15 2021-12-28 上海天马微电子有限公司 可拉伸显示面板和显示装置
US11209697B1 (en) * 2020-11-30 2021-12-28 Unique Materials Co., Ltd. Backlight unit with phosphors and quantum dots
CN114578613A (zh) * 2020-11-30 2022-06-03 优美特创新材料股份有限公司 含有荧光粉及量子点的背光模块
KR20220151076A (ko) * 2021-05-04 2022-11-14 삼성전자주식회사 발광장치 및 식물생장용 조명장치

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453405A (en) * 1991-01-18 1995-09-26 Kopin Corporation Method of making light emitting diode bars and arrays
JP2008198998A (ja) * 2007-02-13 2008-08-28 Samsung Electro-Mechanics Co Ltd 半導体発光素子
WO2008131735A1 (de) * 2007-04-26 2008-11-06 Osram Opto Semiconductors Gmbh Optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780744B2 (ja) 1992-11-06 1998-07-30 信越半導体株式会社 GaAlAs発光素子の製造方法
CN1495523A (zh) 1996-08-27 2004-05-12 ������������ʽ���� 转移方法和有源矩阵基板的制造方法
USRE38466E1 (en) 1996-11-12 2004-03-16 Seiko Epson Corporation Manufacturing method of active matrix substrate, active matrix substrate and liquid crystal display device
US7208725B2 (en) 1998-11-25 2007-04-24 Rohm And Haas Electronic Materials Llc Optoelectronic component with encapsulant
JP3354540B2 (ja) 1999-12-24 2002-12-09 三洋電機株式会社 半導体素子およびその製造方法
JP3906654B2 (ja) 2000-07-18 2007-04-18 ソニー株式会社 半導体発光素子及び半導体発光装置
US6794265B2 (en) * 2001-08-02 2004-09-21 Ultradots, Inc. Methods of forming quantum dots of Group IV semiconductor materials
KR20040029301A (ko) 2001-08-22 2004-04-06 소니 가부시끼 가이샤 질화물 반도체소자 및 질화물 반도체소자의 제조방법
JP2003218034A (ja) 2002-01-17 2003-07-31 Sony Corp 選択成長方法、半導体発光素子及びその製造方法
JP3815335B2 (ja) 2002-01-18 2006-08-30 ソニー株式会社 半導体発光素子及びその製造方法
KR100499129B1 (ko) 2002-09-02 2005-07-04 삼성전기주식회사 발광 다이오드 및 그 제조방법
US7002182B2 (en) 2002-09-06 2006-02-21 Sony Corporation Semiconductor light emitting device integral type semiconductor light emitting unit image display unit and illuminating unit
KR100714639B1 (ko) 2003-10-21 2007-05-07 삼성전기주식회사 발광 소자
KR100506740B1 (ko) 2003-12-23 2005-08-08 삼성전기주식회사 질화물 반도체 발광소자 및 그 제조방법
KR101041311B1 (ko) * 2004-04-27 2011-06-14 파나소닉 주식회사 형광체 조성물과 그 제조 방법, 및 그 형광체 조성물을 이용한 발광장치
KR100664985B1 (ko) 2004-10-26 2007-01-09 삼성전기주식회사 질화물계 반도체 소자
KR100665222B1 (ko) 2005-07-26 2007-01-09 삼성전기주식회사 확산재료를 이용한 엘이디 패키지 및 그 제조 방법
KR100661614B1 (ko) 2005-10-07 2006-12-26 삼성전기주식회사 질화물계 반도체 발광소자 및 그 제조방법
KR100723247B1 (ko) 2006-01-10 2007-05-29 삼성전기주식회사 칩코팅형 led 패키지 및 그 제조방법
US7696964B2 (en) 2006-06-09 2010-04-13 Philips Lumileds Lighting Company, Llc LED backlight for LCD with color uniformity recalibration over lifetime
KR100752717B1 (ko) * 2006-09-20 2007-08-29 삼성전기주식회사 수직구조 질화갈륨계 발광 다이오드 소자의 제조방법
KR100930171B1 (ko) 2006-12-05 2009-12-07 삼성전기주식회사 백색 발광장치 및 이를 이용한 백색 광원 모듈
WO2008127460A2 (en) * 2006-12-08 2008-10-23 Evident Technologies Light-emitting device having semiconductor nanocrystal complexes
CN100573642C (zh) 2006-12-08 2009-12-23 鸿富锦精密工业(深圳)有限公司 Led控制电路
KR100849826B1 (ko) * 2007-03-29 2008-07-31 삼성전기주식회사 발광소자 및 이를 포함하는 패키지
US7791285B2 (en) 2007-04-13 2010-09-07 Cree, Inc. High efficiency AC LED driver circuit
KR100855065B1 (ko) 2007-04-24 2008-08-29 삼성전기주식회사 발광 다이오드 패키지
KR100982980B1 (ko) 2007-05-15 2010-09-17 삼성엘이디 주식회사 면 광원 장치 및 이를 구비하는 lcd 백라이트 유닛
KR101164026B1 (ko) 2007-07-12 2012-07-18 삼성전자주식회사 질화물계 반도체 발광소자 및 그 제조방법
KR100891761B1 (ko) 2007-10-19 2009-04-07 삼성전기주식회사 반도체 발광소자, 그의 제조방법 및 이를 이용한 반도체발광소자 패키지
KR101332794B1 (ko) 2008-08-05 2013-11-25 삼성전자주식회사 발광 장치, 이를 포함하는 발광 시스템, 상기 발광 장치 및발광 시스템의 제조 방법
KR20100030470A (ko) 2008-09-10 2010-03-18 삼성전자주식회사 다양한 색 온도의 백색광을 제공할 수 있는 발광 장치 및 발광 시스템
KR101530876B1 (ko) 2008-09-16 2015-06-23 삼성전자 주식회사 발광량이 증가된 발광 소자, 이를 포함하는 발광 장치, 상기 발광 소자 및 발광 장치의 제조 방법
WO2010033792A1 (en) * 2008-09-18 2010-03-25 Lumenz Llc Textured semiconductor light-emitting devices
US8008683B2 (en) 2008-10-22 2011-08-30 Samsung Led Co., Ltd. Semiconductor light emitting device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5453405A (en) * 1991-01-18 1995-09-26 Kopin Corporation Method of making light emitting diode bars and arrays
JP2008198998A (ja) * 2007-02-13 2008-08-28 Samsung Electro-Mechanics Co Ltd 半導体発光素子
WO2008131735A1 (de) * 2007-04-26 2008-11-06 Osram Opto Semiconductors Gmbh Optoelektronischer halbleiterkörper und verfahren zur herstellung eines solchen

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