WO2009145502A3 - 발광 소자 - Google Patents

발광 소자 Download PDF

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Publication number
WO2009145502A3
WO2009145502A3 PCT/KR2009/001764 KR2009001764W WO2009145502A3 WO 2009145502 A3 WO2009145502 A3 WO 2009145502A3 KR 2009001764 W KR2009001764 W KR 2009001764W WO 2009145502 A3 WO2009145502 A3 WO 2009145502A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
electrically conductive
conductive semiconductor
light
semiconductor layer
Prior art date
Application number
PCT/KR2009/001764
Other languages
English (en)
French (fr)
Other versions
WO2009145502A2 (ko
Inventor
송준오
Original Assignee
Song June O
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Song June O filed Critical Song June O
Priority to EP09754967.9A priority Critical patent/EP2264793B8/en
Priority to US12/936,298 priority patent/US8816370B2/en
Priority to CN200980116966.9A priority patent/CN102047445B/zh
Publication of WO2009145502A2 publication Critical patent/WO2009145502A2/ko
Publication of WO2009145502A3 publication Critical patent/WO2009145502A3/ko
Priority to US14/339,205 priority patent/US10224462B2/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0091Scattering means in or on the semiconductor body or semiconductor body package
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/04Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
    • H01L33/06Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/12Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a stress relaxation structure, e.g. buffer layer
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22Roughened surfaces, e.g. at the interface between epitaxial layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40Materials therefor
    • H01L33/405Reflective materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46Reflective coating, e.g. dielectric Bragg reflector

Abstract

실시예에 따른 발광 소자는 제1 도전형의 반도체층; 상기 제1 도전형의 반도체층 상에 활성층; 상기 활성층 상에 제2 도전형의 반도체층; 상기 제1 도전형의 반도체층, 활성층, 및 제2 도전형의 반도체층을 포위하는 패시베이션층; 상기 패시베이션층 상에 요철 구조를 가진 제1 광 추출 구조층; 상기 패시베이션층 및 제1 광 추출 구조층을 관통하여 상기 제1 도전형의 반도체층과 전기적으로 연결되는 제1 전극층; 및 상기 패시베이션층 및 제1 광 추출 구조층을 관통하여 상기 제2 도전형의 반도체층과 전기적으로 연결되는 제2 전극층을 포함한다.
PCT/KR2009/001764 2008-04-05 2009-04-06 발광 소자 WO2009145502A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP09754967.9A EP2264793B8 (en) 2008-04-05 2009-04-06 Light emitting diode
US12/936,298 US8816370B2 (en) 2008-04-05 2009-04-06 Light-emitting element
CN200980116966.9A CN102047445B (zh) 2008-04-05 2009-04-06 发光元件
US14/339,205 US10224462B2 (en) 2008-04-05 2014-07-23 Light-emitting device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020080031909A KR101449030B1 (ko) 2008-04-05 2008-04-05 그룹 3족 질화물계 반도체 발광다이오드 소자 및 이의 제조방법
KR10-2008-0031909 2008-04-05

Related Child Applications (2)

Application Number Title Priority Date Filing Date
US12/936,298 A-371-Of-International US8816370B2 (en) 2008-04-05 2009-04-06 Light-emitting element
US14/339,205 Continuation US10224462B2 (en) 2008-04-05 2014-07-23 Light-emitting device

Publications (2)

Publication Number Publication Date
WO2009145502A2 WO2009145502A2 (ko) 2009-12-03
WO2009145502A3 true WO2009145502A3 (ko) 2010-02-18

Family

ID=41377739

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/001764 WO2009145502A2 (ko) 2008-04-05 2009-04-06 발광 소자

Country Status (5)

Country Link
US (2) US8816370B2 (ko)
EP (1) EP2264793B8 (ko)
KR (1) KR101449030B1 (ko)
CN (2) CN102047445B (ko)
WO (1) WO2009145502A2 (ko)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110096680A (ko) * 2010-02-23 2011-08-31 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
KR101007137B1 (ko) * 2010-03-08 2011-01-10 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
KR101081135B1 (ko) 2010-03-15 2011-11-07 엘지이노텍 주식회사 발광 소자, 발광 소자 제조방법 및 발광 소자 패키지
DE102010044560A1 (de) 2010-09-07 2012-03-08 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
KR101719623B1 (ko) * 2010-09-07 2017-03-24 엘지이노텍 주식회사 발광소자
TW201238079A (en) * 2011-03-04 2012-09-16 Genesis Photonics Inc LED structure
CN103094445A (zh) * 2011-11-08 2013-05-08 鼎元光电科技股份有限公司 具不均匀侧边的发光二极管结构
CN103107258A (zh) * 2011-11-14 2013-05-15 鼎元光电科技股份有限公司竹南分公司 具有波浪状侧边的发光二极管结构
KR101907619B1 (ko) * 2012-03-15 2018-10-15 엘지이노텍 주식회사 발광 소자
WO2014022951A1 (zh) * 2012-08-10 2014-02-13 海立尔股份有限公司 具全透明电极的led封装体结构
US9748446B2 (en) * 2013-10-11 2017-08-29 Semicon Light Co., Ltd. Semiconductor light emitting device
JP6299540B2 (ja) * 2014-09-16 2018-03-28 豊田合成株式会社 Iii族窒化物半導体発光素子の製造方法
WO2016048333A1 (en) * 2014-09-25 2016-03-31 Hewlett Packard Enterprise Development Lp A report comprising a masked value
CN104795474B (zh) * 2015-04-20 2018-10-16 映瑞光电科技(上海)有限公司 大功率led芯片及其制造方法
DE102015109786A1 (de) 2015-06-18 2016-12-22 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie optoelektronisches Halbleiterbauelement
CN107331736A (zh) * 2016-04-28 2017-11-07 中国科学院物理研究所 具有改善性能的led器件及其制造方法
US10217897B1 (en) 2017-10-06 2019-02-26 Wisconsin Alumni Research Foundation Aluminum nitride-aluminum oxide layers for enhancing the efficiency of group III-nitride light-emitting devices
CN107808912B (zh) * 2017-10-27 2019-07-09 安徽三安光电有限公司 一种氮化物发光二极管及其制备方法
DE102018110187A1 (de) * 2018-04-27 2019-10-31 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterkörper, Anordnung von einer Vielzahl von optoelektronischen Halbleiterkörpern und Verfahren zur Herstellung eines optoelektronischen Halbleiterkörpers
DE102018117018A1 (de) * 2018-07-13 2020-01-16 Osram Opto Semiconductors Gmbh Optoelektronisches halbleiterbauelement mit einer silberhaltigen stromaufweitungsstruktur und optoelektronische vorrichtung
CN110970532B (zh) * 2018-09-28 2021-10-22 丁肇诚 可提升巨量转移良率的微发光二极管
CN112310257B (zh) * 2019-07-26 2022-02-22 丁肇诚 保护层与其制造方法及用途
CN110491980B (zh) * 2019-07-31 2021-08-24 厦门三安光电有限公司 一种紫外led芯片及其制备方法
US11296266B2 (en) * 2019-11-26 2022-04-05 Facebook Technologies, Llc LED array having transparent substrate with conductive layer for enhanced current spread
CN112272870B (zh) * 2020-03-19 2024-04-02 厦门三安光电有限公司 发光二极管
CN112968100A (zh) * 2020-08-14 2021-06-15 重庆康佳光电技术研究院有限公司 一种发光器件、制备方法及电子设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060027815A1 (en) * 2004-08-04 2006-02-09 Wierer Jonathan J Jr Photonic crystal light emitting device with multiple lattices
US20060060874A1 (en) * 2004-09-22 2006-03-23 Edmond John A High efficiency group III nitride LED with lenticular surface
WO2007089460A1 (en) * 2006-01-30 2007-08-09 Cree, Inc. Improved external extraction light emitting diode based upon crystallographic faceted surfaces

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5557115A (en) * 1994-08-11 1996-09-17 Rohm Co. Ltd. Light emitting semiconductor device with sub-mount
JPH11251685A (ja) * 1998-03-05 1999-09-17 Toshiba Corp 半導体レーザ
JP2000058911A (ja) * 1998-08-13 2000-02-25 Toshiba Corp 半導体発光装置
US20020117672A1 (en) * 2001-02-23 2002-08-29 Ming-Sung Chu High-brightness blue-light emitting crystalline structure
ATE525755T1 (de) * 2001-10-12 2011-10-15 Nichia Corp Lichtemittierendes bauelement und verfahren zu seiner herstellung
JP4590905B2 (ja) 2003-10-31 2010-12-01 豊田合成株式会社 発光素子および発光装置
JP2005277374A (ja) * 2004-02-26 2005-10-06 Toyoda Gosei Co Ltd Iii族窒化物系化合物半導体発光素子及びその製造方法
JP2005259891A (ja) * 2004-03-10 2005-09-22 Toyoda Gosei Co Ltd 発光装置
TWM255518U (en) * 2004-04-23 2005-01-11 Super Nova Optoelectronics Cor Vertical electrode structure of Gallium Nitride based LED
DE102004037868A1 (de) * 2004-04-30 2005-11-24 Osram Opto Semiconductors Gmbh Strahlungsemittierendes und/oder -empfangendes Halbleiterbauelement und Verfahren zur strukturierten Aufbringung eines Kontakts auf einen Halbleiterkörper
WO2006038665A1 (ja) 2004-10-01 2006-04-13 Mitsubishi Cable Industries, Ltd. 窒化物半導体発光素子およびその製造方法
KR100638666B1 (ko) * 2005-01-03 2006-10-30 삼성전기주식회사 질화물 반도체 발광소자
WO2007029859A1 (en) * 2005-09-08 2007-03-15 Showa Denko K.K. Electrode for semiconductor light emitting device
JP2007073789A (ja) * 2005-09-08 2007-03-22 Showa Denko Kk 半導体発光素子用電極
JP4954549B2 (ja) * 2005-12-29 2012-06-20 ローム株式会社 半導体発光素子およびその製法
KR101263934B1 (ko) 2006-05-23 2013-05-10 엘지디스플레이 주식회사 발광다이오드 및 그의 제조방법
KR100765236B1 (ko) * 2006-06-30 2007-10-09 서울옵토디바이스주식회사 패터닝된 발광다이오드용 기판 제조방법 및 그것을채택하는 발광 다이오드 제조방법
KR100809216B1 (ko) * 2006-11-22 2008-02-29 삼성전기주식회사 수직구조 반도체 발광소자 제조방법
GB2447091B8 (en) * 2007-03-02 2010-01-13 Photonstar Led Ltd Vertical light emitting diodes
US9484499B2 (en) * 2007-04-20 2016-11-01 Cree, Inc. Transparent ohmic contacts on light emitting diodes with carrier substrates
WO2009004980A1 (ja) * 2007-06-29 2009-01-08 Showa Denko K.K. 発光ダイオードの製造方法
WO2009010762A1 (en) * 2007-07-19 2009-01-22 Photonstar Led Limited Vertical led with conductive vias
JP4829190B2 (ja) * 2007-08-22 2011-12-07 株式会社東芝 発光素子

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060027815A1 (en) * 2004-08-04 2006-02-09 Wierer Jonathan J Jr Photonic crystal light emitting device with multiple lattices
US20060060874A1 (en) * 2004-09-22 2006-03-23 Edmond John A High efficiency group III nitride LED with lenticular surface
WO2007089460A1 (en) * 2006-01-30 2007-08-09 Cree, Inc. Improved external extraction light emitting diode based upon crystallographic faceted surfaces

Also Published As

Publication number Publication date
CN104022204B (zh) 2017-08-25
US10224462B2 (en) 2019-03-05
KR101449030B1 (ko) 2014-10-08
CN102047445A (zh) 2011-05-04
US20110024784A1 (en) 2011-02-03
EP2264793A2 (en) 2010-12-22
US20140332803A1 (en) 2014-11-13
EP2264793B8 (en) 2017-11-29
CN104022204A (zh) 2014-09-03
US8816370B2 (en) 2014-08-26
EP2264793A4 (en) 2015-03-18
CN102047445B (zh) 2014-05-07
KR20090106301A (ko) 2009-10-08
WO2009145502A2 (ko) 2009-12-03
EP2264793B1 (en) 2017-08-16

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