WO2009120044A3 - 발광소자 및 그 제조방법 - Google Patents
발광소자 및 그 제조방법 Download PDFInfo
- Publication number
- WO2009120044A3 WO2009120044A3 PCT/KR2009/001582 KR2009001582W WO2009120044A3 WO 2009120044 A3 WO2009120044 A3 WO 2009120044A3 KR 2009001582 W KR2009001582 W KR 2009001582W WO 2009120044 A3 WO2009120044 A3 WO 2009120044A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- emitting element
- light
- production method
- method therefor
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/14—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a carrier transport control structure, e.g. highly-doped semiconductor layer or current-blocking structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
Abstract
실시예에 따른 발광소자는 지지 기판; 상기 지지 기판 상에 제2 전극층; 상기 지지 기판 상에 전류 퍼짐층; 싱기 제2 전극층 및 전류 퍼짐층 상에 제2 도전형의 반도체층; 상기 제2 도전형의 반도체층 상에 활성층; 상기 활성층 상에 제1 도전형의 반도체층; 및 상기 제1 도전형의 반도체층 상에 제1 전극층을 포함한다.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2009801111386A CN102037575B (zh) | 2008-03-27 | 2009-03-27 | 发光元件及其制造方法 |
US12/934,057 US8373152B2 (en) | 2008-03-27 | 2009-03-27 | Light-emitting element and a production method therefor |
EP09725283.7A EP2259346B1 (en) | 2008-03-27 | 2009-03-27 | Light-emitting element and a production method therefor |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2008-0028669 | 2008-03-27 | ||
KR1020080028669A KR101499953B1 (ko) | 2008-03-27 | 2008-03-27 | 수직구조 그룹 3족 질화물계 반도체 발광다이오드 소자 및제조방법 |
KR10-2008-0028882 | 2008-03-28 | ||
KR1020080028882A KR101526566B1 (ko) | 2008-03-28 | 2008-03-28 | 수직구조 그룹 3족 질화물계 반도체 발광다이오드 소자 및제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009120044A2 WO2009120044A2 (ko) | 2009-10-01 |
WO2009120044A3 true WO2009120044A3 (ko) | 2010-01-14 |
Family
ID=41114476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2009/001582 WO2009120044A2 (ko) | 2008-03-27 | 2009-03-27 | 발광소자 및 그 제조방법 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8373152B2 (ko) |
EP (1) | EP2259346B1 (ko) |
CN (1) | CN102037575B (ko) |
WO (1) | WO2009120044A2 (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2009148253A2 (ko) | 2008-06-02 | 2009-12-10 | 고려대학교 산학협력단 | 반도체 발광소자 제조용 지지기판 및 상기 지지기판을 이용한 반도체 발광소자 |
US8084776B2 (en) * | 2010-02-25 | 2011-12-27 | Lg Innotek Co., Ltd. | Light emitting device, light emitting device package, and lighting system |
KR101047655B1 (ko) * | 2010-03-10 | 2011-07-07 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법, 발광 소자 패키지 및 조명 시스템 |
KR101163861B1 (ko) * | 2010-03-22 | 2012-07-09 | 엘지이노텍 주식회사 | 발광소자, 전극 구조 및 발광 소자 패키지 |
KR20120040448A (ko) * | 2010-10-19 | 2012-04-27 | 삼성엘이디 주식회사 | 수직형 발광 소자 |
KR101880445B1 (ko) * | 2011-07-14 | 2018-07-24 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법, 발광소자 패키지, 및 라이트 유닛 |
US9012921B2 (en) | 2011-09-29 | 2015-04-21 | Kabushiki Kaisha Toshiba | Light emitting devices having light coupling layers |
US8664679B2 (en) | 2011-09-29 | 2014-03-04 | Toshiba Techno Center Inc. | Light emitting devices having light coupling layers with recessed electrodes |
WO2013089459A1 (en) * | 2011-12-14 | 2013-06-20 | Seoul Opto Device Co., Ltd. | Semiconductor device and method of fabricating the same |
KR101286211B1 (ko) * | 2012-02-16 | 2013-07-15 | 고려대학교 산학협력단 | 발광 소자 제조 방법 및 이를 이용하여 제조된 발광 소자 |
KR102108196B1 (ko) * | 2013-04-05 | 2020-05-08 | 서울바이오시스 주식회사 | 성장 기판이 분리된 자외선 발광소자 및 그 제조 방법 |
JP2015060886A (ja) * | 2013-09-17 | 2015-03-30 | 豊田合成株式会社 | Iii族窒化物半導体発光素子 |
TWI597863B (zh) * | 2013-10-22 | 2017-09-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
CN105355740B (zh) * | 2015-10-19 | 2017-09-22 | 天津三安光电有限公司 | 发光二极管及其制作方法 |
CN105355732B (zh) * | 2015-12-11 | 2017-09-15 | 厦门乾照光电股份有限公司 | 一种倒装蓝绿发光二极管芯片的制备方法 |
DE102017104719A1 (de) * | 2017-03-07 | 2018-09-13 | Osram Opto Semiconductors Gmbh | Strahlungsemittierender Halbleiterkörper und Halbleiterchip |
WO2020061750A1 (zh) * | 2018-09-25 | 2020-04-02 | 天津三安光电有限公司 | 一种发光二极管元件 |
CN109545931B (zh) * | 2018-12-17 | 2024-07-30 | 佛山市国星半导体技术有限公司 | 一种垂直结构led晶圆及剥离方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050236632A1 (en) * | 2004-04-23 | 2005-10-27 | Mu-Jen Lai | Vertical electrode structure of gallium nitride based light emitting diode |
KR100723150B1 (ko) * | 2005-12-26 | 2007-05-30 | 삼성전기주식회사 | 수직구조 질화물 반도체 발광소자 및 제조방법 |
KR20080018084A (ko) * | 2006-08-23 | 2008-02-27 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광 다이오드 소자 및 그 제조방법 |
Family Cites Families (60)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60206081A (ja) * | 1984-03-29 | 1985-10-17 | Sharp Corp | 半導体レ−ザ装置 |
US5058120A (en) * | 1990-02-28 | 1991-10-15 | Kabushiki Kaisha Toshiba | Visible light emitting semiconductor laser with inverse mesa-shaped groove section |
EP0695006B1 (en) * | 1990-05-09 | 1998-03-04 | Sharp Kabushiki Kaisha | A method for producing a compound semiconductor laser device |
US5268328A (en) * | 1990-09-07 | 1993-12-07 | Matsushita Electric Industrial Co., Ltd. | Method of fabricating a semiconductor laser |
JPH06314841A (ja) * | 1993-04-28 | 1994-11-08 | Mitsubishi Electric Corp | 半導体レーザ及びその製造方法 |
JP3290531B2 (ja) * | 1994-02-10 | 2002-06-10 | ローム株式会社 | 半導体レーザの製法 |
JPH09502308A (ja) * | 1994-06-20 | 1997-03-04 | フィリップス エレクトロニクス ネムローゼ フェンノートシャップ | 放射線放出半導体屈折率案内型ダイオード |
US5751752A (en) * | 1994-09-14 | 1998-05-12 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
US5974069A (en) * | 1994-09-16 | 1999-10-26 | Rohm Co., Ltd | Semiconductor laser and manufacturing method thereof |
JPH0888439A (ja) * | 1994-09-16 | 1996-04-02 | Rohm Co Ltd | 半導体レーザおよびその製法 |
US5814839A (en) * | 1995-02-16 | 1998-09-29 | Sharp Kabushiki Kaisha | Semiconductor light-emitting device having a current adjusting layer and a uneven shape light emitting region, and method for producing same |
US5742629A (en) * | 1995-07-21 | 1998-04-21 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser and production method thereof |
JPH09106946A (ja) * | 1995-10-11 | 1997-04-22 | Mitsubishi Electric Corp | 半導体装置,及び半導体レーザ,並びに高電子移動度トランジスタ装置 |
JP3429407B2 (ja) * | 1996-01-19 | 2003-07-22 | シャープ株式会社 | 半導体レーザ装置およびその製造方法 |
JPH09237933A (ja) * | 1996-02-29 | 1997-09-09 | Mitsubishi Electric Corp | 半導体レーザ,及びその製造方法 |
DE69723009T2 (de) * | 1996-09-06 | 2004-05-06 | Sanyo Electric Co., Ltd., Moriguchi | Halbleiterlaservorrichtung |
JP3985283B2 (ja) * | 1997-01-22 | 2007-10-03 | ソニー株式会社 | 発光素子 |
JP3897186B2 (ja) * | 1997-03-27 | 2007-03-22 | シャープ株式会社 | 化合物半導体レーザ |
JP3822318B2 (ja) * | 1997-07-17 | 2006-09-20 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
US6285698B1 (en) * | 1998-09-25 | 2001-09-04 | Xerox Corporation | MOCVD growth of InGaN quantum well laser structures on a grooved lower waveguiding layer |
EP1120872B1 (en) * | 1998-10-07 | 2006-12-20 | Sharp Kabushiki Kaisha | Semiconductor laser |
JP3594826B2 (ja) * | 1999-02-09 | 2004-12-02 | パイオニア株式会社 | 窒化物半導体発光素子及びその製造方法 |
JP3521793B2 (ja) * | 1999-03-03 | 2004-04-19 | 松下電器産業株式会社 | 半導体レーザの製造方法 |
JP3786544B2 (ja) * | 1999-06-10 | 2006-06-14 | パイオニア株式会社 | 窒化物半導体素子の製造方法及びかかる方法により製造された素子 |
JP2002026386A (ja) * | 2000-07-10 | 2002-01-25 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
US6712478B2 (en) * | 2001-01-19 | 2004-03-30 | South Epitaxy Corporation | Light emitting diode |
TW564584B (en) * | 2001-06-25 | 2003-12-01 | Toshiba Corp | Semiconductor light emitting device |
US6977953B2 (en) * | 2001-07-27 | 2005-12-20 | Sanyo Electric Co., Ltd. | Nitride-based semiconductor light-emitting device and method of fabricating the same |
JP4054631B2 (ja) * | 2001-09-13 | 2008-02-27 | シャープ株式会社 | 半導体発光素子およびその製造方法、ledランプ並びにled表示装置 |
TWI276230B (en) * | 2001-12-04 | 2007-03-11 | Epitech Corp Ltd | Structure and manufacturing method of light emitting diode |
JP3802424B2 (ja) * | 2002-01-15 | 2006-07-26 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
US6841409B2 (en) * | 2002-01-17 | 2005-01-11 | Matsushita Electric Industrial Co., Ltd. | Group III-V compound semiconductor and group III-V compound semiconductor device using the same |
JP2003273467A (ja) * | 2002-03-15 | 2003-09-26 | Toshiba Corp | 半導体レーザおよびその製造方法 |
JP2004119817A (ja) * | 2002-09-27 | 2004-04-15 | Sharp Corp | 半導体レーザ素子およびその製造方法 |
US7041529B2 (en) * | 2002-10-23 | 2006-05-09 | Shin-Etsu Handotai Co., Ltd. | Light-emitting device and method of fabricating the same |
DE10261675B4 (de) * | 2002-12-31 | 2013-08-14 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement mit strahlungsdurchlässiger elektrischer Kontaktschicht |
TW578318B (en) * | 2002-12-31 | 2004-03-01 | United Epitaxy Co Ltd | Light emitting diode and method of making the same |
US6995403B2 (en) * | 2003-09-03 | 2006-02-07 | United Epitaxy Company, Ltd. | Light emitting device |
JP2005277372A (ja) * | 2004-02-25 | 2005-10-06 | Sanken Electric Co Ltd | 半導体発光素子及びその製造方法 |
US7279751B2 (en) * | 2004-06-21 | 2007-10-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor laser device and manufacturing method thereof |
US7795623B2 (en) * | 2004-06-30 | 2010-09-14 | Cree, Inc. | Light emitting devices having current reducing structures and methods of forming light emitting devices having current reducing structures |
KR20070041411A (ko) * | 2004-07-12 | 2007-04-18 | 로무 가부시키가이샤 | 반도체 발광 소자 |
JP2006032623A (ja) * | 2004-07-15 | 2006-02-02 | Sharp Corp | 半導体レーザ素子の製造方法 |
US7042018B2 (en) * | 2004-09-22 | 2006-05-09 | Formosa Epitaxy Incorporation | Structure of GaN light-emitting diode |
JP4589080B2 (ja) * | 2004-10-29 | 2010-12-01 | シャープ株式会社 | エッチング方法 |
KR100691177B1 (ko) * | 2005-05-31 | 2007-03-09 | 삼성전기주식회사 | 백색 발광소자 |
CN100388515C (zh) * | 2005-09-30 | 2008-05-14 | 晶能光电(江西)有限公司 | 半导体发光器件及其制造方法 |
KR100721147B1 (ko) * | 2005-11-23 | 2007-05-22 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광다이오드 소자 |
US20070126021A1 (en) * | 2005-12-06 | 2007-06-07 | Yungryel Ryu | Metal oxide semiconductor film structures and methods |
JP4655920B2 (ja) * | 2005-12-22 | 2011-03-23 | 日立電線株式会社 | 半導体発光素子 |
JP5082504B2 (ja) * | 2006-03-31 | 2012-11-28 | 日亜化学工業株式会社 | 発光素子及び発光素子の製造方法 |
DE102006017573A1 (de) * | 2006-04-13 | 2007-10-18 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterkörper und Verfahren zu dessen Herstellung |
DE102006034847A1 (de) * | 2006-04-27 | 2007-10-31 | Osram Opto Semiconductors Gmbh | Optoelektronischer Halbleiterchip |
JP2008053685A (ja) | 2006-08-23 | 2008-03-06 | Samsung Electro Mech Co Ltd | 垂直構造窒化ガリウム系発光ダイオード素子及びその製造方法 |
JP2008060331A (ja) * | 2006-08-31 | 2008-03-13 | Rohm Co Ltd | 半導体発光素子 |
JP4770785B2 (ja) * | 2007-04-25 | 2011-09-14 | 日立電線株式会社 | 発光ダイオード |
US7759670B2 (en) * | 2007-06-12 | 2010-07-20 | SemiLEDs Optoelectronics Co., Ltd. | Vertical LED with current guiding structure |
JP4985260B2 (ja) * | 2007-09-18 | 2012-07-25 | 日立電線株式会社 | 発光装置 |
TWI341628B (en) * | 2008-02-12 | 2011-05-01 | Taiwan Tft Lcd Ass | Contact structure and bonding structure |
EP2280426B1 (en) * | 2008-04-16 | 2017-07-05 | LG Innotek Co., Ltd. | Light-emitting device |
-
2009
- 2009-03-27 EP EP09725283.7A patent/EP2259346B1/en active Active
- 2009-03-27 CN CN2009801111386A patent/CN102037575B/zh active Active
- 2009-03-27 WO PCT/KR2009/001582 patent/WO2009120044A2/ko active Application Filing
- 2009-03-27 US US12/934,057 patent/US8373152B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050236632A1 (en) * | 2004-04-23 | 2005-10-27 | Mu-Jen Lai | Vertical electrode structure of gallium nitride based light emitting diode |
KR100723150B1 (ko) * | 2005-12-26 | 2007-05-30 | 삼성전기주식회사 | 수직구조 질화물 반도체 발광소자 및 제조방법 |
KR20080018084A (ko) * | 2006-08-23 | 2008-02-27 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광 다이오드 소자 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
EP2259346B1 (en) | 2019-07-03 |
US8373152B2 (en) | 2013-02-12 |
EP2259346A4 (en) | 2014-08-20 |
CN102037575B (zh) | 2013-04-10 |
EP2259346A2 (en) | 2010-12-08 |
US20110062412A1 (en) | 2011-03-17 |
CN102037575A (zh) | 2011-04-27 |
WO2009120044A2 (ko) | 2009-10-01 |
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