WO2009139401A1 - Tampon à polir - Google Patents

Tampon à polir Download PDF

Info

Publication number
WO2009139401A1
WO2009139401A1 PCT/JP2009/058881 JP2009058881W WO2009139401A1 WO 2009139401 A1 WO2009139401 A1 WO 2009139401A1 JP 2009058881 W JP2009058881 W JP 2009058881W WO 2009139401 A1 WO2009139401 A1 WO 2009139401A1
Authority
WO
WIPO (PCT)
Prior art keywords
polishing
groove
layer
polishing pad
group
Prior art date
Application number
PCT/JP2009/058881
Other languages
English (en)
Japanese (ja)
Inventor
城　邦恭
深雪 花本
橋阪　和彦
小林　勉
淳生 山田
Original Assignee
東レ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 東レ株式会社 filed Critical 東レ株式会社
Priority to CN2009801169391A priority Critical patent/CN102026775A/zh
Priority to JP2009545759A priority patent/JP5585081B2/ja
Priority to US12/990,434 priority patent/US20110045753A1/en
Publication of WO2009139401A1 publication Critical patent/WO2009139401A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Definitions

  • a laminated pad using a polyurethane cushion impregnated nonwoven fabric or a foamed cushion layer having a relatively low compressive modulus such as soft foamed polyurethane has insufficient planarization characteristics or is polished.
  • the layer becomes thinner with the progress of polishing there is a problem that the flattening characteristics are lowered.
  • a laminated pad using a non-foamed elastomer with a high compression modulus or a high-density foamed cushion layer has excellent planarization characteristics, but is provided in the polishing layer.
  • the polishing is not stable, and there is a problem that the variation in polishing characteristics between pads becomes large.
  • the planarization characteristics are insufficient.
  • the thickness of the polishing layer is less than 0.8 mm, the planarization characteristics are insufficient.
  • the thickness of the polishing layer exceeds 3.0 mm, the in-plane uniformity is deteriorated.
  • polyurethane rubber is preferable, and thermoplastic polyurethane rubber is preferable because a product having relatively high thickness accuracy can be obtained, and it can be molded without using a release agent and has excellent adhesiveness.
  • Thermoplastic polyurethane is composed of a soft segment exhibiting rubber-like elasticity and a hard segment serving as a knot of a three-dimensional rope, exhibits rubber elasticity at room temperature, and plasticizes at high temperature, so that it can be extruded.
  • the hard segment is a polyurethane block polymer having a urethane bond
  • the soft segment is polyester or polyether.
  • a 20 mm square die was placed on an 8-inch silicon wafer.
  • Aluminum wiring with a width of 30 ⁇ m and a height of 1.2 ⁇ m is arranged in a space of 300 ⁇ m width in a line-and-space manner on the left half of the 20 mm square die.
  • 2 ⁇ m aluminum wiring was arranged in a line and space with a 30 ⁇ m space.
  • tetraethoxysilane was formed thereon as an insulating film by CVD so as to have a thickness of 3 ⁇ m.
  • the obtained wafer was used as a wafer for planarization property evaluation.
  • This wafer for flattening characteristic evaluation was polished under the above polishing conditions, and the difference in height between the 300 ⁇ m width space on the left half and the 300 ⁇ m width line on the right half was used as an index of the flattening characteristics.
  • the resulting raw polishing layer had a micro rubber A hardness of 92 degrees, a density of 0.77 g / cm 3 , an average cell diameter of 47 ⁇ m, and a polymethyl methacrylate content of 54 wt% in the polishing layer. It was.
  • the polishing pad produced here was affixed to a polishing machine, and a continuous polishing test of 300 wafers with oxide films was performed under the polishing conditions described in the polishing evaluation method (I).
  • the average polishing rate for every 50 sheets was 2570 (angstrom / min), and the in-plane uniformity was as good as 6.3%.
  • the difference between the maximum and minimum polishing rates was 115 (angstrom / min), so the stability index was a good 4.5%.
  • “Hybon (registered trademark) YR713-1W” (manufactured by Hitachi Chemical Co., Ltd.) as a reactive hot melt adhesive mainly composed of urethane is melted on a roll coater heated to a roll temperature of 120 ° C. The polishing layer was brought into contact with the top, and an adhesive was applied to the polishing layer. Within 1 minute after the adhesive is applied, a cushion layer made of a thermosetting urethane rubber sheet (tensile elastic modulus: 48 MPa) having a thickness of 0.05 mm is bonded onto the applied adhesive, and a roll press wire Both were quickly pressure-bonded at a pressure of 1.5 kg / cm to produce a polishing pad. The thickness of the adhesive after solidification was 80 ⁇ m.
  • the polishing pad produced here was affixed to a polishing machine, and a continuous polishing test of 300 wafers with oxide films was performed under the polishing conditions described in the polishing evaluation method (I).
  • the average polishing rate for every 50 sheets was 2700 (angstrom / min), and the in-plane uniformity was as good as 7.5%.
  • the difference between the maximum and the minimum polishing rate was 100 (angstrom / min), so the stability index was good at 3.7%.
  • the shear adhesive force between the polishing layer and the cushion layer in the prepared polishing pad was 9500 gf / (20 ⁇ 20 mm 2 ). Furthermore, a double-sided adhesive tape “442JS” (manufactured by Sumitomo 3M Limited) was bonded to the lower surface of the cushion layer at a linear pressure of 1 kg / cm using a laminator.
  • the obtained raw polishing layer had a micro rubber A hardness of 80 degrees, a density of 0.56 g / cm 3 , an average cell diameter of 65 ⁇ m, and a polymethyl methacrylate content of 47 wt% in the polishing layer. It was.
  • the polishing pad prepared here was attached to a polishing machine, and a continuous polishing test of 300 tungsten films was performed under the polishing conditions described in the polishing evaluation method (II).
  • the average polishing rate for every 50 sheets was 4700 (angstrom / min), and the in-plane uniformity was good at 5.0%. Since the difference between the maximum and minimum polishing rates was 146 (angstrom / min), the stability index was as good as 3.1%.
  • a cushion layer made of a thermoplastic urethane rubber sheet (tensile elastic modulus: 18 MPa) having a thickness of 1.5 mm is formed on the polyester film surface at a roll press linear pressure of 1.5 kg / cm. Then, they were quickly pasted together, and both of them were quickly pressure-bonded at a roll press linear pressure of 1.5 kg / cm to prepare a polishing pad.
  • the thickness of the adhesive after solidification was 50 ⁇ m.
  • the shear adhesive force between the polishing layer and the cushion layer in the prepared polishing pad was 9300 gf / (20 ⁇ 20 mm 2 ).
  • a double-sided adhesive tape “442JS” manufactured by Sumitomo 3M Limited
  • the polishing pad produced here was affixed to a polishing machine, and a continuous polishing test of 300 wafers with oxide films was performed under the polishing conditions described in the polishing evaluation method (I).
  • the average polishing rate for every 50 sheets was 2600 (angstrom / min), and the in-plane uniformity was as good as 6.5%. Since the difference between the maximum and minimum polishing rates was 300 (angstrom / min), the stability index was 11.5%, and the result was that polishing was not stable.
  • “Hybon (registered trademark) YR713-1W” (manufactured by Hitachi Chemical Co., Ltd.) as a reactive hot melt adhesive mainly composed of urethane is melted on a roll coater heated to a roll temperature of 120 ° C. The polishing layer was brought into contact with the top, and an adhesive was applied to the polishing layer. Within 1 minute after applying the adhesive, a cushion layer made of a thermoplastic urethane rubber sheet (tensile elastic modulus: 25 MPa) having a thickness of 0.3 mm is bonded onto the applied adhesive, and the roll press linear pressure is applied. Both were quickly pressure-bonded at 1.5 kg / cm to prepare a polishing pad. The thickness of the adhesive after solidification was 60 ⁇ m.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)

Abstract

L’invention concerne un tampon à polir comprenant un stratifié d’une couche abrasive doté d’une couche d’amortissement. La couche abrasive présente une microdureté A de caoutchouc de 75 degrés ou plus, et une épaisseur pouvant aller de 0,8 à 3,0 mm. La couche d’amortissement comprend un élastomère non expansé et présente une épaisseur pouvant aller de 0,05 à 1,5 mm. La couche abrasive comprend au moins deux types de rainures formées dans la surface. Les deux types de rainures sont les premières rainures et les secondes rainures. Les premières rainures présentent chacune une largeur de rainure pouvant aller de 0,5 à 1,2 mm, et un pas de rainure pouvant aller de 7,5 à 50 mm. Les secondes rainures présentent chacune une largeur de rainure pouvant aller de 1,5 à 3 mm et un pas de rainure pouvant aller de 20 à 50 mm. Chacune des premières rainures et chacune des secondes rainures s’ouvrent sur des côtés de bords latéraux de la couche abrasive.
PCT/JP2009/058881 2008-05-16 2009-05-13 Tampon à polir WO2009139401A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2009801169391A CN102026775A (zh) 2008-05-16 2009-05-13 研磨垫
JP2009545759A JP5585081B2 (ja) 2008-05-16 2009-05-13 研磨パッド
US12/990,434 US20110045753A1 (en) 2008-05-16 2009-05-13 Polishing pad

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008129160 2008-05-16
JP2008-129160 2008-05-16

Publications (1)

Publication Number Publication Date
WO2009139401A1 true WO2009139401A1 (fr) 2009-11-19

Family

ID=41318768

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/058881 WO2009139401A1 (fr) 2008-05-16 2009-05-13 Tampon à polir

Country Status (6)

Country Link
US (1) US20110045753A1 (fr)
JP (1) JP5585081B2 (fr)
KR (1) KR20110010727A (fr)
CN (1) CN102026775A (fr)
TW (1) TW201000262A (fr)
WO (1) WO2009139401A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082721A (ja) * 2008-09-30 2010-04-15 Fujibo Holdings Inc 研磨パッド
JP2011183495A (ja) * 2010-03-08 2011-09-22 Okamoto Machine Tool Works Ltd 取替え交換が容易な積層研磨パッド
JP2014038916A (ja) * 2012-08-14 2014-02-27 Kuraray Co Ltd 金属膜研磨用パッドおよびそれを用いた研磨方法
JP2018107301A (ja) * 2016-12-27 2018-07-05 東レコーテックス株式会社 研磨パッド
JP2020049636A (ja) * 2018-09-28 2020-04-02 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP2020055047A (ja) * 2018-09-28 2020-04-09 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP2021150648A (ja) * 2020-03-17 2021-09-27 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

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JP5893413B2 (ja) * 2012-01-17 2016-03-23 東洋ゴム工業株式会社 積層研磨パッドの製造方法
TWI556910B (zh) 2013-10-01 2016-11-11 三芳化學工業股份有限公司 複合硏磨墊及其製造方法
US20160354896A1 (en) * 2014-02-10 2016-12-08 President And Fellows Of Harvard College 3d-printed polishing pad for chemical-mechanical planarization (cmp)
JP6574244B2 (ja) * 2014-05-07 2019-09-11 キャボット マイクロエレクトロニクス コーポレイション Ｃｍｐ用の多層研磨パッド
EP2975154A1 (fr) * 2014-07-14 2016-01-20 Helmholtz-Zentrum Geesthacht Zentrum für Material- und Küstenforschung GmbH Procédé de fabrication de convertisseurs à neutrons
JP6399393B2 (ja) * 2014-09-26 2018-10-03 富士紡ホールディングス株式会社 研磨パッド
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
JP2015127094A (ja) * 2015-03-04 2015-07-09 学校法人立命館 研磨パッド
US10687613B2 (en) * 2015-05-07 2020-06-23 Craig R. Smith Rotary cleaning tool for commode surfaces
JP2018524193A (ja) * 2015-07-30 2018-08-30 ジェイエイチ ローデス カンパニー， インコーポレイテッド ポリマーラップ加工材料、ポリマーラップ加工材料を含む媒体およびシステム、およびそれらを形成し使用する方法
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
CN110170917A (zh) * 2019-07-10 2019-08-27 蓝思科技（长沙）有限公司 一种抛光衬垫及其制备方法
KR102489678B1 (ko) * 2020-12-07 2023-01-17 에스케이엔펄스 주식회사 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
JP7239049B1 (ja) * 2022-02-18 2023-03-14 東洋インキＳｃホールディングス株式会社 研磨パッド用の湿気硬化型ホットメルト接着剤および研磨パッド

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010082721A (ja) * 2008-09-30 2010-04-15 Fujibo Holdings Inc 研磨パッド
JP2011183495A (ja) * 2010-03-08 2011-09-22 Okamoto Machine Tool Works Ltd 取替え交換が容易な積層研磨パッド
JP2014038916A (ja) * 2012-08-14 2014-02-27 Kuraray Co Ltd 金属膜研磨用パッドおよびそれを用いた研磨方法
JP2018107301A (ja) * 2016-12-27 2018-07-05 東レコーテックス株式会社 研磨パッド
JP2020049636A (ja) * 2018-09-28 2020-04-02 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP2020055047A (ja) * 2018-09-28 2020-04-09 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP7181040B2 (ja) 2018-09-28 2022-11-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP7295624B2 (ja) 2018-09-28 2023-06-21 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP2021150648A (ja) * 2020-03-17 2021-09-27 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
JP7105334B2 (ja) 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法

Also Published As

Publication number Publication date
TW201000262A (en) 2010-01-01
KR20110010727A (ko) 2011-02-07
JP5585081B2 (ja) 2014-09-10
JPWO2009139401A1 (ja) 2011-09-22
CN102026775A (zh) 2011-04-20
US20110045753A1 (en) 2011-02-24

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