ATE337137T1 - Polierkissen und poliervorrichtung - Google Patents

Polierkissen und poliervorrichtung

Info

Publication number
ATE337137T1
ATE337137T1 AT99954409T AT99954409T ATE337137T1 AT E337137 T1 ATE337137 T1 AT E337137T1 AT 99954409 T AT99954409 T AT 99954409T AT 99954409 T AT99954409 T AT 99954409T AT E337137 T1 ATE337137 T1 AT E337137T1
Authority
AT
Austria
Prior art keywords
polishing
semiconductor substrate
mpa
platen
pad
Prior art date
Application number
AT99954409T
Other languages
English (en)
Inventor
Kuniyasu Shiro
Hisashi Minamiguchi
Tetsuo Oka
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Application granted granted Critical
Publication of ATE337137T1 publication Critical patent/ATE337137T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/959—Mechanical polishing of wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
AT99954409T 1998-11-09 1999-11-05 Polierkissen und poliervorrichtung ATE337137T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31767898 1998-11-09

Publications (1)

Publication Number Publication Date
ATE337137T1 true ATE337137T1 (de) 2006-09-15

Family

ID=18090812

Family Applications (1)

Application Number Title Priority Date Filing Date
AT99954409T ATE337137T1 (de) 1998-11-09 1999-11-05 Polierkissen und poliervorrichtung

Country Status (9)

Country Link
US (1) US6362107B1 (de)
EP (1) EP1138438B1 (de)
JP (1) JP3685066B2 (de)
KR (1) KR100628854B1 (de)
CN (1) CN1099939C (de)
AT (1) ATE337137T1 (de)
DE (1) DE69932945T2 (de)
TW (1) TW440947B (de)
WO (1) WO2000027589A1 (de)

Families Citing this family (40)

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KR100867339B1 (ko) * 2000-12-01 2008-11-06 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
US6884507B2 (en) * 2001-10-05 2005-04-26 General Electric Company Use of high modulus, impact resistant foams for structural components
US7025668B2 (en) * 2002-06-18 2006-04-11 Raytech Innovative Solutions, Llc Gradient polishing pad made from paper-making fibers for use in chemical/mechanical planarization of wafers
JPWO2004059619A1 (ja) * 2002-12-26 2006-04-27 Hoya株式会社 情報記録媒体用ガラス基板及びその製造方法
JP2004303983A (ja) 2003-03-31 2004-10-28 Fuji Photo Film Co Ltd 研磨パッド
JP2005093785A (ja) * 2003-09-18 2005-04-07 Toshiba Corp Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法
US20050171224A1 (en) * 2004-02-03 2005-08-04 Kulp Mary J. Polyurethane polishing pad
US7198549B2 (en) * 2004-06-16 2007-04-03 Cabot Microelectronics Corporation Continuous contour polishing of a multi-material surface
US7189156B2 (en) * 2004-08-25 2007-03-13 Jh Rhodes Company, Inc. Stacked polyurethane polishing pad and method of producing the same
US7396497B2 (en) * 2004-09-30 2008-07-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of forming a polishing pad having reduced striations
US7275856B2 (en) * 2004-09-30 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a polishing pad having a reduced striations
US7275928B2 (en) * 2004-11-23 2007-10-02 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for forming a striation reduced chemical mechanical polishing pad
US20060108701A1 (en) * 2004-11-23 2006-05-25 Saikin Allan H Method for forming a striation reduced chemical mechanical polishing pad
TWI386989B (zh) * 2005-02-25 2013-02-21 荏原製作所股份有限公司 研磨裝置及研磨方法
EP1983558A4 (de) * 2006-02-06 2011-08-10 Toray Industries Abrasions-pad und abrasionseinrichtung
WO2008012909A1 (fr) * 2006-07-28 2008-01-31 Toray Industries, Inc. Structure de réseaux polymères interpénétrés et tampon de polissage et procédés permettant de les fabriquer
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5292958B2 (ja) * 2007-07-18 2013-09-18 東レ株式会社 研磨パッド
US20090094900A1 (en) * 2007-10-15 2009-04-16 Ppg Industries Ohio, Inc. Method of forming a polyurea polyurethane elastomer containing chemical mechanical polishing pad
JP5233292B2 (ja) * 2008-01-23 2013-07-10 日立電線株式会社 ケーブル型荷重センサ
JP5585081B2 (ja) * 2008-05-16 2014-09-10 東レ株式会社 研磨パッド
US20100035529A1 (en) * 2008-08-05 2010-02-11 Mary Jo Kulp Chemical mechanical polishing pad
US8303375B2 (en) 2009-01-12 2012-11-06 Novaplanar Technology, Inc. Polishing pads for chemical mechanical planarization and/or other polishing methods
CN102029571B (zh) * 2009-09-24 2015-07-29 贝达先进材料股份有限公司 研磨垫与其应用和其制造方法
KR101435252B1 (ko) * 2012-03-30 2014-08-28 주식회사 엘지화학 점착 테이프
TWI556910B (zh) * 2013-10-01 2016-11-11 三芳化學工業股份有限公司 複合硏磨墊及其製造方法
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN104772668A (zh) * 2015-04-01 2015-07-15 中国科学院上海光学精密机械研究所 一种用于加工非球面的柔性自适应型抛光小工具
CN107139044A (zh) * 2015-04-01 2017-09-08 中国科学院上海光学精密机械研究所 用于加工全频段高精度非球面光学元件的柔性抛光小工具
CN106046313A (zh) * 2016-06-03 2016-10-26 湖北鼎龙化学股份有限公司 一种化学机械抛光垫、缓冲层及其制备方法
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
JP6937117B2 (ja) * 2016-12-27 2021-09-22 東レコーテックス株式会社 研磨パッド
CN107053030A (zh) * 2017-01-06 2017-08-18 浙江工业大学 一种具有梯度功能的扇形组合式研抛盘
CN109693176B (zh) * 2019-01-15 2020-12-08 湖北鼎汇微电子材料有限公司 抛光层、抛光垫及制备方法
TWI761921B (zh) * 2019-10-30 2022-04-21 南韓商Ｓｋｃ索密思股份有限公司 研磨墊、製造該研磨墊之方法及使用該研磨墊以製造半導體裝置之方法
KR20230028318A (ko) * 2020-06-25 2023-02-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 패드 및 이를 사용하는 시스템 및 방법
CN112952094B (zh) * 2021-01-26 2025-03-25 宁德新能源科技有限公司 锂离子电池和电子装置
CN119953002B (zh) * 2025-03-28 2025-12-02 吉林大学 一种汽车内饰翻边机复合模具及其制作方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5257478A (en) * 1990-03-22 1993-11-02 Rodel, Inc. Apparatus for interlayer planarization of semiconductor material
US5564965A (en) * 1993-12-14 1996-10-15 Shin-Etsu Handotai Co., Ltd. Polishing member and wafer polishing apparatus
JPH08132342A (ja) * 1994-11-08 1996-05-28 Hitachi Ltd 半導体集積回路装置の製造装置
JPH0950974A (ja) * 1995-08-07 1997-02-18 Sony Corp 研磨布及び半導体装置の製造方法
JP3239764B2 (ja) * 1996-07-17 2001-12-17 株式会社ニコン Ｃｍｐ用研磨装置及び研磨ポリシャ
JPH10156724A (ja) * 1996-11-28 1998-06-16 Sony Corp 研磨布、該研磨布を用いた平坦化研磨方法、及び半導体装置の製造方法
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto

Also Published As

Publication number Publication date
CN1099939C (zh) 2003-01-29
KR20010099795A (ko) 2001-11-09
CN1330581A (zh) 2002-01-09
EP1138438A1 (de) 2001-10-04
DE69932945T2 (de) 2007-03-15
KR100628854B1 (ko) 2006-09-27
TW440947B (en) 2001-06-16
US6362107B1 (en) 2002-03-26
WO2000027589A1 (en) 2000-05-18
JP3685066B2 (ja) 2005-08-17
EP1138438B1 (de) 2006-08-23
DE69932945D1 (de) 2006-10-05
EP1138438A4 (de) 2002-08-07

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