JP2000233360A5 - - Google Patents
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- Publication number
- JP2000233360A5 JP2000233360A5 JP1999035640A JP3564099A JP2000233360A5 JP 2000233360 A5 JP2000233360 A5 JP 2000233360A5 JP 1999035640 A JP1999035640 A JP 1999035640A JP 3564099 A JP3564099 A JP 3564099A JP 2000233360 A5 JP2000233360 A5 JP 2000233360A5
- Authority
- JP
- Japan
- Prior art keywords
- polishing
- top ring
- turntable
- semiconductor wafer
- polished
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 description 202
- 239000000758 substrate Substances 0.000 description 69
- 239000004065 semiconductor Substances 0.000 description 59
- 239000004744 fabric Substances 0.000 description 29
- 239000012530 fluid Substances 0.000 description 26
- 238000005296 abrasive Methods 0.000 description 25
- 230000002093 peripheral Effects 0.000 description 14
- 238000009423 ventilation Methods 0.000 description 9
- 239000007788 liquid Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 3
- 239000004814 polyurethane Substances 0.000 description 3
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3564099A JP2000233360A (ja) | 1999-02-15 | 1999-02-15 | ポリッシング装置 |
| US09/504,619 US6425809B1 (en) | 1999-02-15 | 2000-02-15 | Polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3564099A JP2000233360A (ja) | 1999-02-15 | 1999-02-15 | ポリッシング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000233360A JP2000233360A (ja) | 2000-08-29 |
| JP2000233360A5 true JP2000233360A5 (de) | 2004-12-02 |
Family
ID=12447486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3564099A Pending JP2000233360A (ja) | 1999-02-15 | 1999-02-15 | ポリッシング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000233360A (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002217141A (ja) * | 2001-01-15 | 2002-08-02 | Nikon Corp | 研磨方法、研磨装置、半導体デバイス製造方法、及び半導体デバイス |
-
1999
- 1999-02-15 JP JP3564099A patent/JP2000233360A/ja active Pending
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