JP5585081B2 - 研磨パッド - Google Patents

研磨パッド Download PDF

Info

Publication number
JP5585081B2
JP5585081B2 JP2009545759A JP2009545759A JP5585081B2 JP 5585081 B2 JP5585081 B2 JP 5585081B2 JP 2009545759 A JP2009545759 A JP 2009545759A JP 2009545759 A JP2009545759 A JP 2009545759A JP 5585081 B2 JP5585081 B2 JP 5585081B2
Authority
JP
Japan
Prior art keywords
polishing
groove
layer
group
polishing pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2009545759A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2009139401A1 (ja
Inventor
邦恭 城
深雪 花本
和彦 橋阪
勉 小林
淳生 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
Original Assignee
Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP2009545759A priority Critical patent/JP5585081B2/ja
Publication of JPWO2009139401A1 publication Critical patent/JPWO2009139401A1/ja
Application granted granted Critical
Publication of JP5585081B2 publication Critical patent/JP5585081B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
JP2009545759A 2008-05-16 2009-05-13 研磨パッド Expired - Fee Related JP5585081B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009545759A JP5585081B2 (ja) 2008-05-16 2009-05-13 研磨パッド

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2008129160 2008-05-16
JP2008129160 2008-05-16
PCT/JP2009/058881 WO2009139401A1 (fr) 2008-05-16 2009-05-13 Tampon à polir
JP2009545759A JP5585081B2 (ja) 2008-05-16 2009-05-13 研磨パッド

Publications (2)

Publication Number Publication Date
JPWO2009139401A1 JPWO2009139401A1 (ja) 2011-09-22
JP5585081B2 true JP5585081B2 (ja) 2014-09-10

Family

ID=41318768

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009545759A Expired - Fee Related JP5585081B2 (ja) 2008-05-16 2009-05-13 研磨パッド

Country Status (6)

Country Link
US (1) US20110045753A1 (fr)
JP (1) JP5585081B2 (fr)
KR (1) KR20110010727A (fr)
CN (1) CN102026775A (fr)
TW (1) TW201000262A (fr)
WO (1) WO2009139401A1 (fr)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5254729B2 (ja) * 2008-09-30 2013-08-07 富士紡ホールディングス株式会社 研磨パッド
JP5291647B2 (ja) * 2010-03-08 2013-09-18 株式会社岡本工作機械製作所 取替え交換が容易な積層研磨パッド
JP5893413B2 (ja) * 2012-01-17 2016-03-23 東洋ゴム工業株式会社 積層研磨パッドの製造方法
JP5997973B2 (ja) * 2012-08-14 2016-09-28 株式会社クラレ 金属膜研磨用パッドおよびそれを用いた研磨方法
TWI556910B (zh) 2013-10-01 2016-11-11 三芳化學工業股份有限公司 複合硏磨墊及其製造方法
WO2015120430A1 (fr) * 2014-02-10 2015-08-13 President And Fellows Of Harvard College Tampon de polissage imprimé en 3d pour planarisation chimico-mécanique (cmp)
WO2015171419A1 (fr) * 2014-05-07 2015-11-12 Cabot Microelectronics Corporation Tampon de polissage multicouche pour polissage mécano-chimique (cmp)
EP2975154A1 (fr) * 2014-07-14 2016-01-20 Helmholtz-Zentrum Geesthacht Zentrum für Material- und Küstenforschung GmbH Procédé de fabrication de convertisseurs à neutrons
JP6399393B2 (ja) * 2014-09-26 2018-10-03 富士紡ホールディングス株式会社 研磨パッド
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
JP2015127094A (ja) * 2015-03-04 2015-07-09 学校法人立命館 研磨パッド
US10687613B2 (en) * 2015-05-07 2020-06-23 Craig R. Smith Rotary cleaning tool for commode surfaces
JP2018524193A (ja) * 2015-07-30 2018-08-30 ジェイエイチ ローデス カンパニー， インコーポレイテッド ポリマーラップ加工材料、ポリマーラップ加工材料を含む媒体およびシステム、およびそれらを形成し使用する方法
JP6937117B2 (ja) * 2016-12-27 2021-09-22 東レコーテックス株式会社 研磨パッド
JP6360586B1 (ja) * 2017-04-13 2018-07-18 三菱電線工業株式会社 Ｃｍｐ装置のウエハ保持用の弾性膜
JP7181040B2 (ja) * 2018-09-28 2022-11-30 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
JP7295624B2 (ja) * 2018-09-28 2023-06-21 富士紡ホールディングス株式会社 研磨パッド及びその製造方法、並びに研磨加工品の製造方法
CN110170917A (zh) * 2019-07-10 2019-08-27 蓝思科技（长沙）有限公司 一种抛光衬垫及其制备方法
JP7105334B2 (ja) * 2020-03-17 2022-07-22 エスケーシー ソルミックス カンパニー，リミテッド 研磨パッドおよびこれを用いた半導体素子の製造方法
KR102489678B1 (ko) * 2020-12-07 2023-01-17 에스케이엔펄스 주식회사 연마패드용 시트, 연마패드 및 반도체 소자의 제조방법
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
JP7239049B1 (ja) * 2022-02-18 2023-03-14 東洋インキＳｃホールディングス株式会社 研磨パッド用の湿気硬化型ホットメルト接着剤および研磨パッド

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11235656A (ja) * 1995-10-25 1999-08-31 Nec Corp 研磨パッド
JP2000071167A (ja) * 1998-08-28 2000-03-07 Toray Ind Inc 研磨パッド
JP2000202763A (ja) * 1998-11-09 2000-07-25 Toray Ind Inc 研磨装置および研磨パッド
JP2002246343A (ja) * 2001-02-13 2002-08-30 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2004090125A (ja) * 2002-08-30 2004-03-25 Central Glass Co Ltd ガラス基板の研磨装置で使用する研磨布の加工方法
JP2007030157A (ja) * 2005-06-20 2007-02-08 Elpida Memory Inc 研磨装置及び研磨方法
JP2007210236A (ja) * 2006-02-10 2007-08-23 Toyo Tire & Rubber Co Ltd 積層研磨パッド
JP2009241205A (ja) * 2008-03-31 2009-10-22 Toyo Tire & Rubber Co Ltd 研磨パッド

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3504457A (en) * 1966-07-05 1970-04-07 Geoscience Instr Corp Polishing apparatus
US5489233A (en) * 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
JPH0957608A (ja) * 1995-08-11 1997-03-04 Sony Corp 研磨パッド及びこれを用いた被表面処理加工物の研磨方法
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6273806B1 (en) * 1997-05-15 2001-08-14 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatus
US6315857B1 (en) * 1998-07-10 2001-11-13 Mosel Vitelic, Inc. Polishing pad shaping and patterning
DE69937355T2 (de) * 1998-08-28 2008-07-24 Toray Industries, Inc. Polierkissen
US6362107B1 (en) * 1998-11-09 2002-03-26 Toray Industries, Inc. Polishing pad and polishing device
US6328632B1 (en) * 1999-08-31 2001-12-11 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical and/or chemical-mechanical planarization of microelectronic substrate assemblies
US6953388B2 (en) * 1999-12-22 2005-10-11 Toray Industries, Inc. Polishing pad, and method and apparatus for polishing
US6656019B1 (en) * 2000-06-29 2003-12-02 International Business Machines Corporation Grooved polishing pads and methods of use
CN100484718C (zh) * 2000-12-01 2009-05-06 东洋橡膠工业株式会社 研磨垫用缓冲层
EP1345733B1 (fr) * 2000-12-27 2004-11-03 Lam Research Corporation Procedes de production de tampons a polir les plaquettes renforces et appareils faisant appel a ces tampons
JP3956364B2 (ja) * 2001-04-09 2007-08-08 東洋ゴム工業株式会社 ポリウレタン組成物および研磨パッド
US20050276967A1 (en) * 2002-05-23 2005-12-15 Cabot Microelectronics Corporation Surface textured microporous polishing pads
CN1639848A (zh) * 2002-08-30 2005-07-13 东丽株式会社 研磨垫、平台孔盖及研磨装置和研磨方法及半导体器件的制造方法
JP2004243428A (ja) * 2003-02-12 2004-09-02 Rodel Nitta Co 研磨パッド
JP4478859B2 (ja) * 2003-04-23 2010-06-09 ニッタ・ハース株式会社 研磨パッド
US6884156B2 (en) * 2003-06-17 2005-04-26 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
US7435161B2 (en) * 2003-06-17 2008-10-14 Cabot Microelectronics Corporation Multi-layer polishing pad material for CMP
JP3754436B2 (ja) * 2004-02-23 2006-03-15 東洋ゴム工業株式会社 研磨パッドおよびそれを使用する半導体デバイスの製造方法
CN100436060C (zh) * 2004-06-04 2008-11-26 智胜科技股份有限公司 研磨垫及其制造方法
JP2006140240A (ja) * 2004-11-11 2006-06-01 Renesas Technology Corp 研磨パッド、研磨装置及び半導体装置の製造方法
KR101279819B1 (ko) * 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 방사-편향 연마 패드
JP4884726B2 (ja) * 2005-08-30 2012-02-29 東洋ゴム工業株式会社 積層研磨パッドの製造方法
KR101294863B1 (ko) * 2006-02-06 2013-08-08 도레이 카부시키가이샤 연마 패드 및 연마 장치
JP5145683B2 (ja) * 2006-07-20 2013-02-20 東レ株式会社 研磨方法、研磨パッド、研磨パッドの製造方法
KR100818523B1 (ko) * 2006-08-17 2008-03-31 동부일렉트로닉스 주식회사 연마 패드
JP2008062355A (ja) * 2006-09-08 2008-03-21 Fujitsu Ltd 研磨装置及び電子装置の製造方法
US8257142B2 (en) * 2008-04-15 2012-09-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11235656A (ja) * 1995-10-25 1999-08-31 Nec Corp 研磨パッド
JP2000071167A (ja) * 1998-08-28 2000-03-07 Toray Ind Inc 研磨パッド
JP2000202763A (ja) * 1998-11-09 2000-07-25 Toray Ind Inc 研磨装置および研磨パッド
JP2002246343A (ja) * 2001-02-13 2002-08-30 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法及びこの半導体デバイス製造方法により製造された半導体デバイス
JP2004090125A (ja) * 2002-08-30 2004-03-25 Central Glass Co Ltd ガラス基板の研磨装置で使用する研磨布の加工方法
JP2007030157A (ja) * 2005-06-20 2007-02-08 Elpida Memory Inc 研磨装置及び研磨方法
JP2007210236A (ja) * 2006-02-10 2007-08-23 Toyo Tire & Rubber Co Ltd 積層研磨パッド
JP2009241205A (ja) * 2008-03-31 2009-10-22 Toyo Tire & Rubber Co Ltd 研磨パッド

Also Published As

Publication number Publication date
CN102026775A (zh) 2011-04-20
US20110045753A1 (en) 2011-02-24
TW201000262A (en) 2010-01-01
KR20110010727A (ko) 2011-02-07
WO2009139401A1 (fr) 2009-11-19
JPWO2009139401A1 (ja) 2011-09-22

Similar Documents

Publication Publication Date Title
JP5585081B2 (ja) 研磨パッド
US5692950A (en) Abrasive construction for semiconductor wafer modification
US9931728B2 (en) Polishing pad with foundation layer and polishing surface layer
US9931729B2 (en) Polishing pad with grooved foundation layer and polishing surface layer
KR20010099795A (ko) 연마 패드 및 연마 장치
WO2013081665A2 (fr) Tampon de polissage avec couche de fondation et couche superficielle de polissage
JP2013018056A (ja) 研磨パッド
JP2006339570A (ja) 研磨パッドおよび研磨装置
JP2020037182A (ja) 研磨パッド
WO2014103484A1 (fr) Procédé de fabrication d'un tampon de rodage stratifié
TW201313388A (zh) 研磨墊
WO2016103862A1 (fr) Tampon de polissage circulaire, et procédé de fabrication de dispositifs à semi-conducteurs
JP2005131720A (ja) 研磨パッドの製造方法
JP2006210657A (ja) 研磨パッド、研磨装置、および半導体デバイスの製造方法
JP2009148876A (ja) 研磨パッド、およびそれを用いた研磨方法
JP5315678B2 (ja) 研磨パッドの製造方法
JP2006339573A (ja) 研磨パッドおよび研磨装置
JP2009255271A (ja) 研磨パッド、およびその製造方法
JP6584261B2 (ja) 被研磨物保持材及び被研磨物保持具
JP5145683B2 (ja) 研磨方法、研磨パッド、研磨パッドの製造方法
JP2002059357A (ja) 研磨パッドおよび研磨装置ならびに研磨方法
JP2004119657A (ja) 研磨パッド、研磨装置、およびそれを用いた研磨方法
JP5292958B2 (ja) 研磨パッド
JP2004014744A (ja) 研磨パッド、研磨装置、およびそれを用いた研磨方法
JP2011200984A (ja) 研磨パッド

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20120316

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130827

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20140218

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140417

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140624

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140707

LAPS Cancellation because of no payment of annual fees