WO2009123018A1 - 複合材料及びその製造方法 - Google Patents
複合材料及びその製造方法 Download PDFInfo
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- WO2009123018A1 WO2009123018A1 PCT/JP2009/056167 JP2009056167W WO2009123018A1 WO 2009123018 A1 WO2009123018 A1 WO 2009123018A1 JP 2009056167 W JP2009056167 W JP 2009056167W WO 2009123018 A1 WO2009123018 A1 WO 2009123018A1
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- H—ELECTRICITY
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- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
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- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0233—Filters, inductors or a magnetic substance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
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- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- C22C2202/00—Physical properties
- C22C2202/02—Magnetic
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- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
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- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
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- H05K1/02—Details
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- H05K2201/0203—Fillers and particles
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- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Definitions
- the insulating material is Al 2 O 3 , SiO 2 , TiO 2 , 2MgO ⁇ SiO 2 , MgTiO 3 , CaTiO 3 , SrTiO 3 , BaTiO 3 , 3Al 2 O 3 ⁇ 2SiO. 2.
- the composite material according to any one of the first to eleventh aspects is obtained, which includes at least one selected from the group consisting of ceramics of 2 , ZrO 2 , SiC, and AlN.
- the relative permeability ⁇ r at a frequency of 1 GHz is greater than 1, and the loss tangent tan ⁇ is 0.05 or less.
- the composite material according to any one of the first to twelfth aspects is obtained.
- the step of obtaining the fine particles coated with the insulating material by stirring the fine particles in a solvent in which the insulating material is dissolved and the fine particles coated with the obtained insulating material Is dispersed in an insulating material having substantially the same component as the insulating material, and the fine particles are stirred using a dispersion medium when stirring in a solvent in which the insulating material is dissolved.
- the composite material of the present invention and the manufacturing method thereof are applied to the manufacture of circuit boards, electronic components, electronic devices and the like.
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Abstract
Description
λg=λ0/(εr・μr)1/2
ここで、fは信号周波数、σは磁性粉末の導電率、μ0は真空の透磁率である。
金属元素を添加した平均粒径0.25μmのパーマロイ磁性粉末を、キシレンおよびシクロペンタノン4:1混合液に被覆層となる有機化合物として固形分33%に希釈したポリオレフィン樹脂を溶解した分散液に混合し、さらに分散媒体として平均粒径が200μmのジルコニアビーズを添加し、この状態で遊星攪拌を60分間実施して絶縁材料で被覆した微粒子スラリーを得た。
実施例1において、本発明の有機化合物による絶縁被覆を行わなかったものを比較例1とした。キシレンおよびシクロペンタノン4:1混合液に被覆層となる高分子ポリマーとしてポリオレフィン樹脂を溶解した分散液に混合し、さらに分散媒体として平均粒径が200μmのジルコニアビーズを添加し、この状態で遊星攪拌を30分間実施して磁性粉末スラリーを得た。このようにして得られたスラリーにポリシクロオレフィン樹脂を固形分比率40%に希釈して得た樹脂ワニスを添加しさらに遊星攪拌で5分間混合した。遊星攪拌時の公転速度はいずれも2000rpm、自転速度は800rpmとした。
Claims (22)
- 絶縁材料中に扁平状の微粒子が分散した複合材料において、前記絶縁材料と実質的に同一成分の絶縁材料で予め被覆されている扁平状の前記微粒子を含有することを特徴とする複合材料。
- 前記微粒子の厚さが0.001~5μm、かつ長さが0.002~10μmであることを特徴とする請求項1に記載の複合材料。
- 絶縁材料中に粒径0.001~10μmの微粒子が分散した複合材料において、前記絶縁材料と実質的に同一成分の絶縁材料で予め被覆されている前記粒径の前記微粒子を含有することを特徴とする複合材料。
- 前記微粒子が、アルミニウム(Al)、マンガン(Mn)、シリコン(Si)、マグネシウム(Mg)、クロム(Cr)、ニッケル(Ni)、モリブデン(Mo)、銅(Cu)、鉄(Fe)、コバルト(Co)、亜鉛(Zn)、スズ(Sn)、銀(Ag)、チタン(Ti)およびジルコニウム(Zr)からなる群から選ばれる少なくとも1種を含むことを特徴とする請求項1~3のいずれかに記載の複合材料。
- 前記微粒子が、ニッケル(Ni)、パーマロイ(Ni-Fe)鉄(Fe)、鉄(Fe)-シリコン(Si)系合金、鉄(Fe)-窒素(N)系合金、鉄(Fe)-炭素(C)系合金、鉄(Fe)-ホウ素(B)系合金、鉄(Fe)-リン(P)系合金、鉄(Fe)-アルミニウム(Al)系合金、鉄(Fe)-アルミニウム(Al)-シリコン(Si)系合金からなる群より選ばれる少なくとも一つを含むことを特徴とする請求項1~3のいずれかに記載の複合材料。
- 前記微粒子が、チタン(Ti)、バナジウム(V)、クロム(Cr)、マンガン(Mn)、コバルト(Co)、銅(Cu)、亜鉛(Zn)、ニオブ(Nb)、モリブデン(Mo)、インジウム(In)、スズ(Sn)のうちいずれか一種類以上の金属元素を添加した金属粉末であることを特徴とする請求項4に記載の複合材料。
- 前記微粒子が、ゲーサイト(FeOOH)、ヘマタイト(Fe2O3)、マグネタイト(Fe3O4)、マンガン(Mn)-亜鉛(Zn)フェライト、ニッケル(Ni)-亜鉛(Zn)フェライト、コバルト(Co)フェライト、マンガン(Mn)フェライト、ニッケル(Ni)フェライト、銅(Cu)フェライト、亜鉛(Zn)フェライト、マグネシウム(Mg)フェライト、リチウム(Li)フェライト、マンガン(Mn)-マグネシウム(Mg)フェライト、銅(Cu)-亜鉛(Zn)フェライト、マンガン(Mn)-亜鉛(Zn)フェライトからなる群より選ばれる少なくとも一つを含むことを特徴とする請求項1~3のいずれかに記載の複合材料。
- 前記複合材料中の前記微粒子が10体積%以上含有されていることを特徴とする請求項1~7のいずれかに記載の複合材料。
- 前記絶縁材料が熱可塑性樹脂を含むことを特徴とする請求項1~8のいずれかに記載の複合材料。
- 前記絶縁材料が熱硬化性樹脂を含むことを特徴とする請求項1~8のいずれかに記載の複合材料。
- 前記絶縁材料が、ポリイミド樹脂、ポリベンゾオキサゾール樹脂、ポリフェニレン樹脂、ポリベンゾシクロブテン樹脂、ポリアリーレンエーテル樹脂、ポリシロキサン樹脂、エポキシ樹脂、ウレタン樹脂、ポリエステル樹脂、ポリエステルウレタン樹脂、フッ素樹脂、ポリオレフィン樹脂、ポリシクロオレフィン樹脂、シアネート樹脂、ポリフェニレンエーテル樹脂、およびポリスチレン樹脂のうち少なくとも一つを含む合成樹脂もしくは液相樹脂を含有することを特徴とする請求項1~10のいずれかに記載の複合材料。
- 前記絶縁材料が、Al2O3、SiO2、TiO2、2MgO・SiO2、MgTiO3、CaTiO3、SrTiO3、BaTiO3、3Al2O3・2SiO2、ZrO2、SiC、AlNのセラミックスからなる群より選ばれる少なくとも一つを含むことを特徴とする請求項1~11のいずれかに記載の複合材料。
- 絶縁材料中に微粒子が分散した複合材料において、1GHzの周波数における比透磁率μrが1よりも大きく、かつ損失正接tanδが0.05以下であることを特徴とする請求項1~12のいずれかに記載の複合材料。
- 絶縁材料中に微粒子が分散した複合材料において、使用時に印加される電界に対して垂直方向と平行方向の誘電率が異なることを特徴とする請求項1~13のいずれかに記載の複合材料。
- 絶縁材料中に微粒子が分散した複合材料において、複合材料の体積抵抗率が、5×105Ω・cm以上であることを特徴とする請求項1~14のいずれかに記載の複合材料。
- 微粒子を、絶縁材料を溶解した溶剤中で分散媒体を用いて攪拌することにより、微粒子を機械的に扁平状に変形させる工程と、前記絶縁材料によって表面を被覆した前記扁平状微粒子を得る工程とを同時に行うことで、表面を絶縁材料によって被覆された扁平状微粒子スラリーを製造する工程を有することを特徴とする複合材料の製造方法。
- 表面を絶縁材料によって被覆した扁平状微粒子スラリーに、前記絶縁材料と実質的に同一成分の絶縁材料を添加する工程を有することを特徴とする複合材料の製造方法。
- 微粒子を、絶縁材料を溶解した溶剤中で攪拌することにより、前記絶縁材料によって被覆した前記微粒子を得る工程と、得られた絶縁材料で被覆された微粒子を、前記絶縁材料と実質的に同一成分の絶縁材料中に分散させる製造方法であって、前記微粒子を、絶縁材料を溶解した溶剤中で攪拌する際に、分散媒体を用いて攪拌することにより、機械的な力を付与し微粒子を扁平状に変形させる工程を含む、製造方法によって製造されたことを特徴とする請求項1~15のいずれかに記載の複合材料。
- 請求項1~15、18のいずれかに記載の複合材料を少なくとも含むことを特徴とする電子部品。
- 請求項16又は請求項17のいずれかに記載の製造方法によって作られた複合材料を少なくとも含むことを特徴とする電子部品。
- 請求項1~15、18のいずれかに記載の複合材料を少なくとも含むことを特徴とする回路基板。
- 請求項16又は請求項17のいずれかに記載の製造方法によって作られた複合材料を少なくとも含むことを特徴とする回路基板。
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CN2009801115141A CN101981631A (zh) | 2008-04-04 | 2009-03-26 | 复合材料及其制造方法 |
KR1020107024534A KR20110018870A (ko) | 2008-04-04 | 2009-03-26 | 복합 재료 및 그 제조 방법 |
US12/935,662 US20110017501A1 (en) | 2008-04-04 | 2009-03-26 | Composite material and manufacturing method thereof |
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JP (1) | JP5574395B2 (ja) |
KR (1) | KR20110018870A (ja) |
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JP5574395B2 (ja) | 2014-08-20 |
CN101981631A (zh) | 2011-02-23 |
KR20110018870A (ko) | 2011-02-24 |
US20110017501A1 (en) | 2011-01-27 |
JP2009249673A (ja) | 2009-10-29 |
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