JP5124691B1 - 導電性微粉末、導電性ペースト及び電子部品 - Google Patents
導電性微粉末、導電性ペースト及び電子部品 Download PDFInfo
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- 239000000843 powder Substances 0.000 title claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims abstract description 80
- 239000002184 metal Substances 0.000 claims abstract description 80
- 239000000956 alloy Substances 0.000 claims abstract description 57
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 57
- 239000010419 fine particle Substances 0.000 claims abstract description 53
- 239000002114 nanocomposite Substances 0.000 claims abstract description 35
- 239000002105 nanoparticle Substances 0.000 claims abstract description 28
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- 229910052737 gold Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910052697 platinum Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- 229910021332 silicide Inorganic materials 0.000 claims description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
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- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 238000005469 granulation Methods 0.000 description 4
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
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- 238000001816 cooling Methods 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
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- 239000010931 gold Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
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- 239000011651 chromium Substances 0.000 description 2
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- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
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- 238000007639 printing Methods 0.000 description 2
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- 239000002994 raw material Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
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- 238000005245 sintering Methods 0.000 description 2
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- 239000000126 substance Substances 0.000 description 2
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- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 150000004767 nitrides Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
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- 238000007517 polishing process Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
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- 239000011135 tin Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
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Abstract
【解決手段】本発明は、扁平状金属/合金微粒子1を含む導電性微粉末にむけられている。扁平状金属/合金微粒子1は、母材111にナノ結晶またはナノ非結晶のナノ粒子112を混合または生成させたナノコンポジット構造を有し、最大厚みT11が50nm以下で、最大差し渡し径D1が厚みT11の2倍以上である。この導電性微粉末は、グラビア印刷の用途に適している。
【選択図】図1
Description
導電性微粉末を構成する1個の扁平状粒子の平均長径は1.0μm以上かつ20μm以下、平均厚みは5nm以上かつ100nm以下、アスペクト比は100以上、導電性ペースト膜での導電性微粉末の充填率は50%以上であることが好ましいとされている。
(a)電極が薄層化されても、電極切れが生じにくい導電性微粉末、導電性ペースト及び電子部品を提供することができる。
(b)偏析の少ない均一化された組成をもつ高品質の電極を形成するのに適した導電性微粉末、導電性ペースト及び電子部品を提供することができる。
111 母材組織
112 ナノ粒子
Claims (8)
- 扁平状の金属/合金微粒子を含む導電性微粉末であって、
前記扁平状金属/合金微粒子は、母材に結晶もしくは非結晶のナノ粒子を混合または生成させたナノコンポジット構造を有し、最大厚みが50nm以下で、最大差し渡し径が前記厚みの2倍以上であり、高融点金属と低融点金属とを含有する、
導電性微粉末。 - 請求項1に記載された導電性微粉末であって、
前記ナノコンポジット構造は、母材組織の内部にナノ粒子を分散させたもの、母材組織の粒界にナノ粒子を分散させたもの、または、母材組織の内部にナノ粒子を分散させるとともに、母材組織の粒界にナノ粒子を分散させたもの、の何れかを含む、
導電性微粉末。 - 請求項1に記載された導電性微粉末であって、前記母材及び前記ナノ粒子は、単一金属、合金、酸化物、硫化物、珪化物、炭化物又は塩化物の何れかを含有する、導電性微粉末。
- 請求項3に記載された導電性微粉末であって、前記母材及び前記ナノ粒子は、Ni、Cr、Ag、Cu、Au、Pt、Pd、Sn、In、Bi、Ga又はSbの群から選択された少なくても1種を含む、導電性微粉末。
- 導電性微粉末と、有機ビヒクルとを含む導電性ペーストであって、
前記導電性微粉末は、請求項1乃至4の何れかに記載されたものでなり、前記有機ビヒクル中に分散されている、
導電性ペースト。 - 電極を有する電子部品であって、
前記電極は、請求項1乃至5の何れかに記載された導電性微粉末の焼結体を含むナノコンポジット構造を有する、電子部品。 - 請求項6に記載された電子部品であって、前記電極は複層であり、それぞれは、セラミック素体の内部に層状に埋設されている、電子部品。
- 電子部品を製造する方法であって、
セラミック・グリーン・シートの少なくとも一面上に、導電性ペーストをグラビア印刷する工程を含み、
前記導電性ペーストは、請求項5に記載されたものでなる、
方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012064176A JP5124691B1 (ja) | 2012-03-21 | 2012-03-21 | 導電性微粉末、導電性ペースト及び電子部品 |
US13/795,285 US20130250481A1 (en) | 2012-03-21 | 2013-03-12 | Conductive fine powder, conductive paste and electronic component |
SG2013018155A SG193728A1 (en) | 2012-03-21 | 2013-03-12 | Conductive fine powder, conductive paste and electronic component |
EP13275071.2A EP2642492A1 (en) | 2012-03-21 | 2013-03-19 | Conductive fine powder, conductive paste and electronic component |
TW102109788A TWI626662B (zh) | 2012-03-21 | 2013-03-20 | 導電性微粉末、導電性糊、電子零件及其製造方法 |
KR1020130029915A KR20130107248A (ko) | 2012-03-21 | 2013-03-20 | 도전성 미분말, 도전성 페이스트 및 전자부품 |
CN201310091341XA CN103325434A (zh) | 2012-03-21 | 2013-03-21 | 导电性微粉末、导电性浆料及电子部件 |
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EP (1) | EP2642492A1 (ja) |
JP (1) | JP5124691B1 (ja) |
KR (1) | KR20130107248A (ja) |
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US9536632B2 (en) * | 2013-09-27 | 2017-01-03 | Sunpower Corporation | Mechanically deformed metal particles |
JP5885351B2 (ja) * | 2013-10-09 | 2016-03-15 | 有限会社 ナプラ | 接合部及び電気配線 |
JP6029222B1 (ja) | 2015-07-08 | 2016-11-24 | 有限会社 ナプラ | 金属粒子、ペースト、成形体、及び、積層体 |
KR102078016B1 (ko) * | 2018-04-10 | 2020-04-07 | 삼성전기주식회사 | 적층형 커패시터 |
CN112584968A (zh) * | 2018-08-08 | 2021-03-30 | 库普利昂公司 | 高温焊剂及由其形成的连接部 |
WO2020132753A1 (es) * | 2018-12-26 | 2020-07-02 | Universidad Técnica Federico Santa María | Método para obtener aleaciones metálicas a partir de un conjunto de materias primas |
CN114520067B (zh) * | 2020-11-20 | 2024-04-05 | 常州明耀半导体科技有限公司 | 一种导电浆料及透明显示装置 |
KR20230008405A (ko) * | 2021-07-07 | 2023-01-16 | 삼성전기주식회사 | 커패시터 부품 및 커패시터 부품의 제조 방법 |
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- 2013-03-12 US US13/795,285 patent/US20130250481A1/en not_active Abandoned
- 2013-03-19 EP EP13275071.2A patent/EP2642492A1/en not_active Withdrawn
- 2013-03-20 KR KR1020130029915A patent/KR20130107248A/ko not_active Application Discontinuation
- 2013-03-20 TW TW102109788A patent/TWI626662B/zh active
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CN103325434A (zh) | 2013-09-25 |
SG193728A1 (en) | 2013-10-30 |
TW201344705A (zh) | 2013-11-01 |
US20130250481A1 (en) | 2013-09-26 |
TWI626662B (zh) | 2018-06-11 |
EP2642492A1 (en) | 2013-09-25 |
KR20130107248A (ko) | 2013-10-01 |
JP2013196967A (ja) | 2013-09-30 |
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