WO2009113213A1 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
WO2009113213A1
WO2009113213A1 PCT/JP2008/071960 JP2008071960W WO2009113213A1 WO 2009113213 A1 WO2009113213 A1 WO 2009113213A1 JP 2008071960 W JP2008071960 W JP 2008071960W WO 2009113213 A1 WO2009113213 A1 WO 2009113213A1
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WO
WIPO (PCT)
Prior art keywords
plate
chamber
fixing
side wall
plasma
Prior art date
Application number
PCT/JP2008/071960
Other languages
English (en)
French (fr)
Inventor
利泰 速水
靖之 林
Original Assignee
住友精密工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友精密工業株式会社 filed Critical 住友精密工業株式会社
Priority to KR1020107022566A priority Critical patent/KR101438455B1/ko
Priority to EP08873212.8A priority patent/EP2256792B1/en
Priority to US12/922,520 priority patent/US8771461B2/en
Publication of WO2009113213A1 publication Critical patent/WO2009113213A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32458—Vessel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Definitions

  • the present invention relates to a plasma processing apparatus for supplying a predetermined processing gas into a processing chamber to form a plasma and processing a substrate disposed in the processing chamber with the plasma processing gas.
  • the plasma processing apparatus for example, one disclosed in Japanese Patent Application Laid-Open No. 2000-268895 is known.
  • the plasma processing apparatus includes a processing chamber constituting a reaction chamber, a susceptor that is disposed in the processing chamber and holds a substrate on an upper surface, a gas supply mechanism that supplies a processing gas into the processing chamber, and a supply to the processing chamber A plasma generation mechanism for converting the processed gas into plasma, and a high-frequency power source for applying a high-frequency voltage to the plasma generation mechanism.
  • the processing chamber includes a lower member that is open at the top, an annular body that is provided so that the lower surface contacts the upper surface of the side wall of the lower member, and a lid that is provided such that the lower surface contacts the upper surface of the annular body.
  • the annular body includes a cylindrical electrode formed in a hollow cylindrical shape, an annular upper insulating material and a lower insulating material provided at an upper end portion and a lower end portion of the cylindrical electrode, and an upper insulating material, respectively. And an annular holding member that is connected to and holds the lower end of the lower insulating material.
  • the plasma generation mechanism includes a cylindrical electrode constituting a part of the processing chamber and annular permanent magnets provided on the outer peripheral surfaces of the upper insulating material and the lower insulating material, respectively.
  • the high-frequency power source applies a high-frequency voltage to the cylindrical electrode.
  • the processing chamber is periodically cleaned to remove deposits.
  • the processing chamber is cleaned by, for example, disassembling the processing chamber and cleaning each component using a predetermined cleaning liquid or pure water.
  • the cylindrical electrode, the upper insulating material, and the lower insulating material are held by the holding member, and these are integrally configured. It is convenient to disassemble and assemble the processing chamber as compared to disassembling each one and assembling.
  • the present invention has been made in view of the above circumstances, and an object thereof is to provide a plasma processing apparatus capable of efficiently maintaining a processing chamber.
  • the upper chamber and the lower chamber are formed in an upper and lower two-part configuration, a processing chamber in which a substrate is disposed in the lower chamber, a gas supply means for supplying a processing gas into the upper chamber, and a gas supplied to the upper chamber.
  • a plasma processing apparatus comprising: plasma generating means for converting the processed gas into plasma; and voltage applying means for applying a high frequency voltage to the plasma generating means,
  • the lower chamber has an internal space that opens to the upper surface
  • the upper chamber has an internal space that opens to the lower surface
  • the internal spaces are configured to communicate with each other.
  • a lifting plate which is horizontally disposed and is provided so as to be movable up and down, to which at least a part of members constituting the upper chamber is attached; Elevating means for supporting the elevating plate to elevate and lower; And comprising at least three fixing means for fixing the upper chamber, first, second and third,
  • the upper chamber includes an annular plate whose lower surface on the outer peripheral side is in contact with the upper portion of the lower chamber, a side wall member that is formed in a hollow cylindrical shape and whose lower end is placed on the annular plate, It comprises at least a top plate placed on the upper end of the side wall member,
  • the elevating plate penetrates up and down and has a through hole of a size that allows the top plate to pass through.
  • the plasma generating means is disposed outside the side wall member and fixed to the lower surface of the elevating plate,
  • the first fixing means is configured to connect and fix the elevating plate and the top plate, while being capable of releasing the connection and fixing.
  • the second fixing means is configured to connect and fix the elevating plate and the annular plate, while being capable of releasing the connection and fixing.
  • the third fixing means is configured to fix the lower chamber and the annular plate while being able to release the fixing.
  • the processing gas is supplied into the processing chamber by the gas supply unit.
  • a high-frequency voltage is applied to the plasma generating means by the voltage applying means to turn the processing gas into plasma.
  • the substrate appropriately carried into the processing chamber is processed by the plasma processing gas.
  • the connection and fixation of the lifting plate and the top plate by the first fixing means are released. Then, since only the top plate is removed, it can be easily removed from the plasma processing apparatus for maintenance. After the maintenance, the plasma processing apparatus can be easily assembled by placing the top plate on the upper end of the side wall member and then connecting and fixing the top plate and the lift plate by the first fixing means.
  • the lifting plate is raised by the lifting means and the ceiling plate is lifted together with the lifting plate.
  • the plate, the first fixing means and the plasma generating means are moved upward.
  • the side wall member that remains without being lifted is removed, so that it can be easily removed from the plasma processing apparatus for maintenance.
  • the side wall member is placed on the annular plate, the elevation plate is lowered by the elevating means, the top plate, the first fixing means and the plasma generating means are moved downward, and then this annular shape is obtained by the second fixing means.
  • the plasma processing apparatus can be easily assembled by connecting and fixing the plate and the lifting plate.
  • the annular plate when maintaining the annular plate of the upper chamber, the annular plate can be removed from the plasma processing apparatus by removing the side wall member and further releasing the fixation of the lower chamber and the annular plate by the third fixing means. It can be easily removed and maintained.
  • the side wall member is placed on the annular plate, the raising / lowering plate is lowered by the raising / lowering means, and the annular plate and the raising / lowering plate by the second fixing means. And the plasma processing apparatus can be easily assembled.
  • the lower chamber and the annular plate are first fixed by the third fixing means, and then the lifting plate is lifted by the lifting means, and the top and first plates are fixed together with the lifting plate.
  • the means, the plasma generating means, the second fixing means, the side wall member, and the annular plate are moved upward, that is, the entire upper chamber is moved upward. Then, the lower chamber is opened and can be easily maintained.
  • the elevating plate is lowered by the elevating means and the top plate, the first fixing means, the plasma generating means, the second fixing means, the side wall member and the annular plate are moved downward, and then the annular plate is moved by the third fixing means. And the lower chamber are fixed, the plasma processing apparatus can be easily assembled.
  • the lifting / lowering means can be released by releasing the fixation of the top plate by the first fixing means or by releasing the fixation of the annular plate by the second fixing means or the third fixing means.
  • the parts that constitute the processing chamber can be easily removed from the plasma processing equipment, and removed when the parts after maintenance are returned to the original state. Since it is sufficient to perform an operation reverse to the time, maintenance such as replacement or cleaning of the target part can be easily performed in a short time.
  • the top plate and the upper end of the side wall member may be formed with engaging portions for engaging with each other to position the top plate with respect to the side wall member.
  • the lower end portion of the side wall member may be formed with an engaging portion for engaging with each other to position the side wall member with respect to the annular plate, and further, the lower surface of the annular plate and the lower chamber In the upper part, engaging portions for engaging with each other to position the annular plate with respect to the lower chamber may be formed. In this way, it is possible to facilitate the work of attaching the top plate, the side wall member, and the annular plate once removed, and to prevent a reduction in assembly accuracy.
  • the plasma processing apparatus further includes a cover body that covers at least the lifting plate, the lifting means, and the upper chamber, and the cover body has a working hole penetrating from outside to inside at a lateral position of the upper chamber; You may provide the door which opens and closes the said work hole. In this case, the worker opens the door and performs maintenance from the work hole. In this way, it is possible to protect the operator by preventing the worker from being injured during the operation of the elevating means and the elevating plate and preventing the high frequency from affecting the human body.
  • the processing chamber can be efficiently maintained.
  • FIG. 2 is a cross-sectional view in the direction of arrows AA in FIG.
  • FIG. 3 is a cross-sectional view in the direction of arrow BB in FIG. 1. It is sectional drawing which shows the state which removed the top plate etc. It is sectional drawing which shows the state which raised the raising / lowering board, the top plate, the holding member, etc. It is sectional drawing which shows the state which raised the raising / lowering board and the upper chamber.
  • FIG. 1 is a cross-sectional view showing a schematic configuration of an etching apparatus according to an embodiment of the present invention
  • FIG. 2 is a cross-sectional view in the direction of arrows AA in FIG. 1
  • FIG. 3 is a cross-sectional view in the direction of arrow BB in FIG. 1.
  • the etching apparatus 1 which is a plasma processing apparatus of this example includes a processing chamber 11 formed in a two-part configuration of a lower chamber 12 and an upper chamber 13, and can move up and down in the lower chamber 12.
  • the lower chamber 12 has an internal space that opens to the upper surface, and the upper chamber 13 has an internal space that opens to the lower surface, and these internal spaces communicate with each other.
  • the lower chamber 12 includes an annular side wall 12a, and an annular engagement protrusion 12b is formed on the upper end surface of the side wall 12a. Further, the side wall 12a is opened and closed by the shutter 17, and an opening 12c for carrying in and out the silicon substrate K is formed.
  • the upper chamber 13 has an annular plate 14 whose lower surface on the outer peripheral side is in contact with the upper end surface of the side wall 12 a of the lower chamber 12, and a hollow cylindrical shape inside, and a lower end mounted on the inner peripheral side of the annular plate 14.
  • the side wall member 15 to be placed and the top plate 16 on which the lower surface on the outer peripheral side is placed on the upper end surface of the side wall member 15 are configured.
  • the annular plate 14 is formed on the lower surface of the outer peripheral side, and is formed with an annular engagement groove 14a that engages with the engagement protrusion 12b of the side wall 12a of the lower chamber 12, and an annular shape formed at the corner of the upper surface on the inner peripheral side.
  • An engagement recess 14b, the top plate 16 includes an annular engagement projection 16a formed on the lower surface on the outer peripheral side, and the side wall member 15 has an engagement recess 14b of the annular plate 14 at its lower end. The engaging portion that engages and the upper end of the engaging portion engage with the engaging protrusion 16 a of the top plate 16.
  • the base 20 is composed of an upper member 21 and a lower member 22 arranged vertically, a silicon substrate K is placed on the upper member 21, and the elevating cylinder 23 is connected to the lower member 22.
  • the exhaust device 24 includes an exhaust pump 25 and an exhaust pipe 26 connecting the exhaust pump 25 and the lower chamber 12.
  • the exhaust pump 25 exhausts the gas in the lower chamber 12 through the exhaust pipe 26.
  • the inside of the processing chamber 11 is reduced to a predetermined pressure.
  • the gas supply device 27 includes a processing gas supply unit 28 for supplying an etching gas (for example, SF 6 gas) and an etching-resistant layer forming gas (for example, C 4 F 8 gas) as a processing gas, and a processing gas supply unit 28. And a processing gas supply pipe 29 for connecting the top plate 16 of the upper chamber 13 to the etching gas and the etching resistant layer forming gas from the processing gas supply section 28 into the upper chamber 13 through the processing gas supply pipe 29. Supply.
  • etching gas for example, SF 6 gas
  • an etching-resistant layer forming gas for example, C 4 F 8 gas
  • the plasma generation mechanism 30 includes a plurality of annular coils 31 arranged vertically around the side wall member 15 and a hollow cylindrical shape inside, and holds the coils 31 on the inner peripheral surface thereof.
  • the holding member 32 is provided with a hole 32a.
  • the holding member 32 includes a flange portion 32 b on the outer peripheral surface of the lower end, the lower end surface abuts on the upper surface of the annular plate 14, and the upper end portion is fixed to the lower surface of the elevating plate 41 of the elevating device 40.
  • the coil high-frequency power source 33 applies a high-frequency voltage to the coil 31 to form a magnetic field in the upper chamber 13, and an electric field induced by the magnetic field causes an etching gas and an anti-resistance to be supplied in the upper chamber 13.
  • the etching layer forming gas is turned into plasma.
  • the base high-frequency power supply 34 applies a high-frequency voltage to the base 20 to generate a potential difference (bias potential) between the base 20 and the plasma.
  • the elevating device 40 includes an elevating plate 41 that is horizontally disposed at substantially the same height as the top plate 16 and is provided so as to be movable up and down, and an elevating mechanism 42 that supports the elevating plate 41 and moves up and down.
  • the elevating plate 41 is formed with a through hole 41 a that penetrates vertically and is larger than the outer diameter of the top plate 16.
  • the elevating mechanism 42 includes a ball screw 43 that is arranged so that its axis is along the vertical direction and is rotatable about the axis, a nut 44 that engages with the ball screw 43 and moves along the ball screw 43, and the ball screw 43.
  • a drive motor 45 that rotates the shaft about the axis, and a nut 44 is inserted and fixed in the mounting hole 41b of the lift plate 41.
  • Three ball screws 43, nuts 44, drive motors 45, and mounting holes 41b are provided at equal intervals in the circumferential direction.
  • the fixing mechanism 46 includes an annular fixing plate 47, first fixing bolts 48 and 49 for connecting and fixing the top plate 16 and the lifting plate 41 with the fixing plate 47, and a flange portion 32 b of the holding member 32. It consists of a second fixing bolt 50 for fixing the annular plate 14 and a third fixing bolt 51 for fixing the annular plate 14 and the side wall 12 a of the lower chamber 12.
  • the first fixing bolts 48 and 49, the second fixing bolt 50, and the third fixing bolt 51 are provided at equal intervals in the circumferential direction.
  • the holding member 32 also functions as a connecting member that connects the lower surface of the elevating plate 41 and the upper surface of the annular plate 14.
  • the first fixing bolts 48, 49 are inserted into through holes 47 a formed in the fixing plate 47 from the upper ends thereof and screwed into screw holes 16 b formed in the upper surface of the top plate 16 ( And a tip of which is inserted into a through hole 47b formed in the fixed plate 47 from above and screwed into a screw hole 41c formed in the upper surface of the elevating plate 41 (reference 49). Show).
  • the tip of the second fixing bolt 50 is inserted from above into a through hole 32c formed in the flange 32b, and is screwed into a screw hole 14c formed in the upper surface of the annular plate 14.
  • the front end of the fixing bolt 51 is inserted into a through hole 14d formed in the annular plate 14 from above, and is screwed into a screw hole 12d formed in the upper end surface of the side wall 12a.
  • the cover body 55 includes a lower cover 56 that covers the lower chamber 12 and an upper cover 57 that covers the upper chamber 13 and the lifting device 40, and the upper cover 57 covers the upper side from the upper end of the side wall 12 a of the lower chamber 12.
  • the lower cover 56 covers the lower side from the upper end of the side wall 12 a of the lower chamber 12.
  • the upper cover 57 On the inner surface of the upper cover 57, a support plate 58 that supports the drive motor 45 is disposed above the elevating plate 41, and a support member 59 that rotatably supports the lower end of the ball screw 43 about the axis. Arranged. Further, the upper cover 57 includes a working hole 57a penetrating from the outside to the inside at a lateral position of the upper chamber 13, and a double door 60 that opens and closes the working hole 57a.
  • the control device controls the operation of the lifting cylinder 23, the exhaust device 24, the gas supply device 27, the coil high-frequency power source 33, the base high-frequency power source 34, and the lifting device 40. Specifically, a high-frequency voltage is applied to the coil 31 and the base 20 by the coil high-frequency power source 33 and the base high-frequency power source 34, respectively, an etching gas is supplied into the processing chamber 11 from the processing gas supply unit 28, and exhausted. An etching process for bringing the inside of the processing chamber 11 to a predetermined pressure by the pump 25 and a high frequency voltage is applied to the coil 31 by the high frequency power source 33 for the coil, and an etching resistant layer forming gas is supplied from the processing gas supply unit 28 into the processing chamber 11. Then, the etching-resistant layer forming step in which the inside of the processing chamber 11 is set to a predetermined pressure by the exhaust pump 25 is repeatedly performed.
  • control device (not shown) rotates the ball screw 43 about the axis by the drive motor 45 to move the nut 44 upward or downward along the ball screw 43, thereby moving the lifting plate 41 up and down. .
  • the etching process and the etching resistant layer forming process are alternately and repeatedly performed.
  • the etching gas is turned into plasma, and radicals in the plasma are converted into silicon.
  • the silicon substrate K is etched by chemically reacting with atoms or by ions in the plasma moving toward the base 20 side by a bias potential and colliding with the silicon substrate K.
  • the etching-resistant layer forming step the etching-resistant layer forming gas is turned into plasma, and a polymer generated from radicals in the plasma is transferred to the surface of the silicon substrate K (such as grooves and holes formed by etching, sidewalls and bottom surfaces). )
  • an etching resistant layer fluorocarbon film
  • the top plate 16 of the upper chamber 13 when maintaining the top plate 16 of the upper chamber 13, as shown in FIG. 4, the first fixing bolts 48 and 49 are removed, the fixing plate 47 is removed, and the elevator plate 41 and the top plate 16 are connected.
  • the fixation is released, only the top plate 16 is removed, so that it can be easily removed from the etching apparatus 1 for maintenance.
  • the top plate 16 is placed on the upper end of the side wall member 15 so that the upper end of the side wall member 15 fits into the engagement protrusion 16a of the top plate 16, and the fixing plate 47 and the first fixing bolt 48, If the top plate 16 and the lift plate 41 are connected and fixed using 49, the etching apparatus 1 can be easily assembled.
  • the second fixing bolt 50 is removed to release the fixing between the flange portion 32 b of the holding member 32 and the annular plate 14.
  • the drive motor 45 is rotated to raise the top plate 16, the first fixing bolts 48 and 49, the coil 31, and the holding member 32 together with the lifting plate 41, only the side wall member 15 is removed, and this is removed from the etching apparatus 1. It can be easily removed and maintained.
  • the side wall member 15 is placed on the annular plate 14 so that the lower end of the side wall member 15 fits into the engagement recess 14b of the annular plate 14, and the drive motor 45 is rotated to rotate the drive plate 45 together with the lift plate 41.
  • the etching apparatus 1 After the plate 16, the first fixing bolts 48 and 49, the coil 31 and the holding member 32 are lowered to the lower end position, that is, until the top plate 16 is placed on the upper end portion of the side wall member 15, the second fixing bolt If the flange portion 32b of the holding member 32 and the annular plate 14 are fixed by 50, the etching apparatus 1 can be easily assembled.
  • the third fixing bolt 51 is further removed with the side wall member 15 removed, and the fixation between the annular plate 14 and the side wall 12a of the lower chamber 12 is released. Then, the annular plate 14 can be easily removed from the etching apparatus 1 and maintained. After the maintenance is completed, the third fixing bolt 51 is mounted by placing the annular plate 14 on the upper end surface of the side wall 12a so that the engaging protrusion 12b of the side wall 12a of the lower chamber 12 fits into the engaging groove 14a of the annular plate 14.
  • the drive motor 45 is rotated to move the elevating plate 41 to the lower end position (the top plate 16 is the side wall member). If the flange portion 32b of the holding member 32 and the annular plate 14 are fixed by the second fixing bolt 50 after being lowered to the position at which the upper end portion 15 is placed), the etching apparatus 1 can be easily assembled. it can.
  • the third fixing bolt 51 is removed to release the fixation between the annular plate 14 and the side wall 12a of the lower chamber 12, and then the drive motor 45 is rotated to raise and lower the lifting plate 41.
  • the top plate 16 the first fixing bolts 48 and 49, the coil 31, the holding member 32, the annular plate 14, the side wall member 15 and the second fixing bolt 50 are raised, that is, when the entire upper chamber 13 is moved upward.
  • the lower chamber 12 is opened and can be easily maintained.
  • the driving motor 45 is rotated to lower the top plate 16, the first fixing bolts 48 and 49, the coil 31, the holding member 32, the annular plate 14, the side wall member 15 and the second fixing bolt 50 together with the lifting plate 41.
  • the etching apparatus 1 can be easily assembled.
  • the operator For maintenance, the operator opens the door 60 and works from the work hole 57.
  • the fixing of the top plate 16 by the first fixing bolts 48 and 49 and the fixing plate 47 is released, and the annular shape by the second fixing bolt 50 and the third fixing bolt 51 is used.
  • the fixation of the plate 14 and raising the elevating plate 41 by the elevating mechanism 42 it is possible to easily remove the parts to be maintained from the etching apparatus 1 among the parts constituting the processing chamber 11.
  • the part after maintenance is returned to the original state, it is sufficient to perform an operation opposite to that at the time of removal. Therefore, maintenance such as replacement or cleaning of the target part can be performed easily and in a short time.
  • the top plate 16 can be positioned with respect to the side wall member 15 by fitting the upper end of the side wall member 15 into the engagement protrusion 16a of the top plate 16, and the engagement of the annular plate 14
  • the side wall member 15 By fitting the lower end of the side wall member 15 in the mating recess 14b, the side wall member 15 can be positioned with respect to the annular plate 14, and the engagement protrusion 12b of the side wall 12a of the lower chamber 12 is inserted into the engagement groove 14a of the annular plate 14. Since the annular plate 14 can be positioned with respect to the side wall 12a by fitting, the mounting work of the top plate 16, the side wall member 15, and the annular plate 14 once removed can be facilitated, and the assembly accuracy is lowered. Can be prevented.
  • the operator can be prevented from being injured during the operation of the lifting plate 41 and the lifting mechanism 42, and high frequency can be prevented from affecting the human body. Can be protected.
  • the lifting plate 41 and the annular plate 14 are connected and fixed by the holding member 32 and the second fixing bolt 50.
  • the present invention is not limited to this, and the upper portion is fixed to the lower surface of the lifting plate 41.
  • the connected member may be provided separately from the holding member 32, and the lower part of the connected member may be fixed to the annular plate 14 by the second fixing bolt 50.
  • the configuration of the upper chamber 13 is not limited to the above-described one, and may be a shape including constituent members in addition to the annular plate 14, the side wall member 15, and the top plate 16.
  • the etching apparatus 1 may further include a heating device that heats the upper chamber 13 and a cooling device that cools the upper chamber 13. In this case, the heating device and the cooling device are respectively attached to and detached from the lifting plate 41. It is preferable to install it freely, because it is easy to maintain.
  • the etching process is given as an example of the plasma process.
  • the present invention is not limited to this, and the plasma processing apparatus of the present invention can be applied to an ashing process or a film forming process.
  • the substrate to be plasma processed is not limited to the silicon substrate K, and may be any substrate such as a glass substrate.
  • the present invention is suitable as a plasma processing apparatus capable of efficiently maintaining a processing chamber.

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Abstract

　本発明は、処理チャンバを効率的にメンテナンスすることができるプラズマ処理装置に関する。プラズマ処理装置１は、下部チャンバ１２及び上部チャンバ１３を有する処理チャンバ１１と、シリコン基板Ｋが載置される基台２０と、処理ガス供給装置２７と、コイル３２と、コイル用高周波電源３３と、貫通穴４１ａを有し、昇降自在に設けられる昇降板４１と、昇降板４１を支持して昇降させる昇降機構４２と、上部チャンバ１３を固定するための固定機構４６とを備える。固定機構４６は、固定板４７と、固定板４７により天板１６と昇降板４１とを連結，固定するための第１固定ボルト４８，４９と、保持部材３２の鍔部３２ｂと環状板１４とを固定するための第２固定ボルト５０と、環状板１４と下部チャンバ１２の側壁１２ａとを固定するための第３固定ボルト５１とからなる。

Description

プラズマ処理装置
　本発明は、処理チャンバ内に所定の処理ガスを供給してプラズマ化し、プラズマ化した処理ガスによって、処理チャンバ内に配置された基板を処理するプラズマ処理装置に関する。
　従来、前記プラズマ処理装置として、例えば、特開２０００－２６８９９５号公報に開示されたものが知られている。このプラズマ処理装置は、反応室を構成する処理チャンバと、処理チャンバ内に配置され、上面に基板を保持するサセプタと、処理チャンバ内に処理ガスを供給するガス供給機構と、処理チャンバ内に供給された処理ガスをプラズマ化するためのプラズマ生成機構と、プラズマ生成機構に高周波電圧を印加する高周波電源などを備える。
　前記処理チャンバは、上部が開口した下部部材と、下部部材の側壁上面に下面が当接するように設けられた環状体と、環状体の上面に下面が当接するように設けられた蓋体などから構成されており、前記環状体は、内部が中空の円筒状に形成された円筒電極と、円筒電極の上端部及び下端部にそれぞれ設けられる環状の上部絶縁材及び下部絶縁材と、上部絶縁材の上端及び下部絶縁材の下端に接続してこれらを保持する環状の保持部材とから構成される。
　前記プラズマ生成機構は、前記処理チャンバの一部を構成している円筒電極と、上部絶縁材及び下部絶縁材の外周面にそれぞれ設けられる環状の永久磁石とから構成される。前記高周波電源は、円筒電極に高周波電圧を印加する。
　ところで、プラズマ処理を行うと、処理チャンバの内面には各種の生成物が付着するが、この付着物は、パーティクルとなって基板に付着するなどの問題を引き起こす。このため、処理チャンバは定期的に洗浄されて付着物が除去される。尚、処理チャンバの洗浄は、例えば、処理チャンバを分解し、その各構成部品を所定の洗浄液や純水を用いて洗浄することで行なわれる。
　そして、上記従来のプラズマ処理装置では、保持部材によって円筒電極，上部絶縁材及び下部絶縁材が保持され、これらが一体的に構成されているので、円筒電極，上部絶縁材及び下部絶縁材を１つずつ分解し、また、組み立てる場合に比べ、処理チャンバを分解したり、組み立てるのに好都合である。
特開２０００－２６８９９５号公報
　しかしながら、上記従来のプラズマ処理装置では、例えば、下部部材のみや円筒電極のみなど構成部品の一部をメンテナンスする場合であっても、メンテナンス対象でない蓋体などを含むすべての部品を分解しなければならないので、処理チャンバの分解作業や組立作業に時間を要し、効率的にメンテナンスを行うことができないという問題があった。
　本発明は、以上の実情に鑑みなされたものであって、処理チャンバを効率的にメンテナンスすることができるプラズマ処理装置の提供をその目的とする。
　上記目的を達成するための本発明は、
　上部チャンバ及び下部チャンバの上下２部構成に形成され、前記下部チャンバ内に基板が配置される処理チャンバと、前記上部チャンバ内に処理ガスを供給するガス供給手段と、前記上部チャンバ内に供給された処理ガスをプラズマ化するためのプラズマ生成手段と、前記プラズマ生成手段に高周波電圧を印加する電圧印加手段とを備えたプラズマ処理装置であって、
　前記下部チャンバは、上面に開口する内部空間を有し、前記上部チャンバは、下面に開口する内部空間を有して、これらの内部空間が相互に連通するように構成されたプラズマ処理装置において、
　水平に配置されて昇降自在に設けられ、前記上部チャンバを構成する少なくとも一部の部材が取り付けられる昇降板と、
　前記昇降板を支持して昇降させる昇降手段と、
　前記上部チャンバを固定するための第１，第２及び第３の少なくとも３つの固定手段とを備えてなり、
　前記上部チャンバは、外周側の下面が前記下部チャンバの上部に当接する環状板と、内部が中空の筒状に形成され、その下端部が前記環状板上に載置される側壁部材と、前記側壁部材の上端部に載置される天板とから少なくとも構成され、
　前記昇降板は、上下に貫通し、前記天板が通過可能な大きさの貫通穴を有し、
　前記プラズマ生成手段は、前記側壁部材の外方に配置されて前記昇降板の下面に固設され、
　前記第１固定手段は、前記昇降板と天板とを連結，固定する一方、これらの連結，固定を解除可能に構成され、
　前記第２固定手段は、前記昇降板と環状板とを連結，固定する一方、これらの連結，固定を解除可能に構成され、
　前記第３固定手段は、前記下部チャンバと環状板とを固定する一方、これらの固定を解除可能に構成されてなることを特徴とするプラズマ処理装置に係る。
　この発明によれば、例えば、シリコン基板やガラス基板などの処理対象基板に、エッチング処理，アッシング処理及び成膜処理などのプラズマ処理を行うときには、ガス供給手段により処理チャンバ内に処理ガスを供給するとともに、電圧印加手段によりプラズマ生成手段に高周波電圧を印加して処理ガスをプラズマ化する。これにより、処理チャンバ内に適宜搬入された基板が、プラズマ化した処理ガスによって処理される。
　そして、このようなプラズマ処理を行うと、処理チャンバの内面には各種の生成物が付着するが、この付着物の除去といった処理チャンバのメンテナンスは、次のようにして行うことができる。
　即ち、上部チャンバの天板をメンテナンスする際には、第１固定手段による昇降板及び天板の連結，固定を解除する。そうすると、天板のみが外れるため、これを当該プラズマ処理装置から容易に取り外してメンテナンスすることができる。メンテナンス後は、天板を側壁部材の上端部に載置した後、第１固定手段によりこの天板と昇降板とを連結，固定することで、当該プラズマ処理装置を容易に組み立てることができる。
　一方、上部チャンバの側壁部材をメンテナンスする際には、まず、第２固定手段による昇降板及び環状板の連結，固定を解除した後、昇降手段により昇降板を上昇させて、この昇降板とともに天板，第１固定手段及びプラズマ生成手段を上方に移動させる。そうすると、上昇せずに留まった側壁部材のみが外れるため、これを当該プラズマ処理装置から容易に取り外してメンテナンスすることができる。メンテナンス後は、側壁部材を環状板上に載置し、昇降手段により昇降板を下降させて天板，第１固定手段及びプラズマ生成手段を下方に移動させた後、第２固定手段によりこの環状板と昇降板とを連結，固定することで、当該プラズマ処理装置を容易に組み立てることができる。
　また、上部チャンバの環状板をメンテナンスする際には、側壁部材を取り外した状態で、更に、第３固定手段による下部チャンバ及び環状板の固定を解除すれば、この環状板を当該プラズマ処理装置から容易に取り外してメンテナンスすることができる。メンテナンス後は、第３固定手段により環状板と下部チャンバとを固定し、側壁部材を環状板上に載置した後、昇降手段により昇降板を下降させ、第２固定手段により環状板と昇降板とを連結，固定すれば、当該プラズマ処理装置を容易に組み立てることができる。
　また、下部チャンバをメンテナンスする際には、まず、第３固定手段による下部チャンバ及び環状板の固定を解除した後、昇降手段により昇降板を上昇させて、この昇降板とともに天板，第１固定手段，プラズマ生成手段，第２固定手段，側壁部材及び環状板を上方に移動させる、即ち、上部チャンバ全体を上方に移動させる。そうすると、下部チャンバが開口し、これを容易にメンテナンスすることができる。メンテナンス後は、昇降手段により昇降板を下降させて天板，第１固定手段，プラズマ生成手段，第２固定手段，側壁部材及び環状板を下方に移動させた後、第３固定手段により環状板と下部チャンバとを固定することで、当該プラズマ処理装置を容易に組み立てることができる。
　このように、本発明に係るプラズマ処理装置によれば、第１固定手段による天板の固定を解除することや、第２固定手段や第３固定手段による環状板の固定を解除して昇降手段により昇降板を上昇させることで、処理チャンバを構成する部品の内、メンテナンス対象とする部品を当該プラズマ処理装置から簡単に取り外すことができ、また、メンテナンス後の部品を元に戻す際には取り外し時とは逆の操作を行えば良いので、この対象部品を交換したり、洗浄するといったメンテナンスを容易に且つ短時間で実施することができる。
　尚、前記天板及び側壁部材の上端部には、互いに係合して前記天板を前記側壁部材に対し位置決めするための係合部がそれぞれ形成されていても良く、また、前記環状板及び側壁部材の下端部には、互いに係合して前記側壁部材を前記環状板に対し位置決めするための係合部がそれぞれ形成されていても良く、また、更に、前記環状板の下面及び下部チャンバの上部には、互いに係合して前記環状板を前記下部チャンバに対し位置決めするための係合部がそれぞれ形成されていても良い。このようにすれば、一旦取り外した天板や側壁部材、環状板の取付作業の容易化を図ることができるとともに、組立精度の低下を防止することができる。
　また、前記プラズマ処理装置は、前記昇降板，昇降手段及び上部チャンバを少なくとも覆うカバー体を更に有し、前記カバー体は、前記上部チャンバの側方位置で外側から内側に貫通する作業穴と、前記作業穴を開閉する戸とを備えていても良い。この場合、作業者は、戸を開け、作業穴からメンテナンスを行う。このようにすれば、昇降手段及び昇降板の動作時に作業者が負傷することや、高周波が人体に影響を与えるのを防止して作業者を保護することができる。
　以上のように、本発明に係るプラズマ処理装置によれば、処理チャンバを効率的にメンテナンスすることができる。
本発明の一実施形態に係るエッチング装置の概略構成を示した断面図である。 図１における矢示Ａ－Ａ方向の断面図である。 図１における矢示Ｂ－Ｂ方向の断面図である。 天板などを取り外した状態を示す断面図である。 昇降板，天板及び保持部材などを上昇させた状態を示す断面図である。 昇降板及び上部チャンバなどを上昇させた状態を示す断面図である。
符号の説明
　１　　エッチング装置（プラズマ処理装置）
　１１　処理チャンバ
　１２　下部チャンバ
　１３　上部チャンバ
　１４　環状板
　１５　側壁部材
　１６　天板
　２０　基台
　２４　排気装置
　２７　ガス供給装置
　３１　コイル
　３２　保持部材
　３３　コイル用高周波電源
　３４　基台用高周波電源
　４１　昇降板
　４２　昇降機構
　４７　固定板
　４８，４９　第１固定ボルト
　５０　第２固定ボルト
　５１　第３固定ボルト
　５５　カバー体
　５６　下カバー
　５７　上カバー
　６０　扉
　Ｋ　　シリコン基板
　以下、本発明の具体的な実施形態について、添付図面に基づき説明する。尚、図１は、本発明の一実施形態に係るエッチング装置の概略構成を示した断面図であり、図２は、図１における矢示Ａ－Ａ方向の断面図であり、図３は、図１における矢示Ｂ－Ｂ方向の断面図である。
　図１乃至図３に示すように、本例のプラズマ処理装置たるエッチング装置１は、下部チャンバ１２及び上部チャンバ１３の上下２部構成に形成された処理チャンバ１１と、下部チャンバ１２内に昇降自在に配設され、エッチング対象であるシリコン基板Ｋが載置される基台２０と、基台２０を昇降させる昇降シリンダ２３と、処理チャンバ１１内の圧力を減圧する排気装置２４と、上部チャンバ１３内に処理ガスを供給するガス供給装置２７と、上部チャンバ１３の外部に配置された複数のコイル（プラズマ生成機構）３０と、コイル３０に高周波電圧を印加するコイル用高周波電源３３と、基台２０に高周波電圧を印加する基台用高周波電源３４と、上部チャンバ１３を昇降させる昇降装置４０と、上部チャンバ１３を固定するための固定機構４６と、処理チャンバ１１及び昇降装置４０を外側から覆うカバー体５５と、昇降シリンダ２３，排気装置２４，ガス供給装置２７，コイル用高周波電源３３，基台用高周波電源３４及び昇降装置４０の作動を制御する制御装置（図示せず）などを備える。
　前記下部チャンバ１２は、上面に開口する内部空間を備え、前記上部チャンバ１３は、下面に開口する内部空間を備えており、これらの内部空間が相互に連通している。また、下部チャンバ１２は、環状の側壁１２ａを備え、この側壁１２ａの上端面には環状の係合突起１２ｂが形成されている。また、この側壁１２ａには、シャッタ１７によって開閉され、シリコン基板Ｋを搬入したり、搬出するための開口部１２ｃが形成されている。
　前記上部チャンバ１３は、外周側の下面が下部チャンバ１２の側壁１２ａの上端面に当接する環状板１４と、内部が中空の円筒状に形成され、その下端が環状板１４の内周側に載置される側壁部材１５と、外周側の下面が側壁部材１５の上端面に載置される天板１６とから構成される。
　前記環状板１４は、その外周側下面に形成され、下部チャンバ１２の側壁１２ａの係合突起１２ｂと係合する環状の係合溝１４ａと、内周側上面の角部に形成された環状の係合凹部１４ｂとを備え、前記天板１６は、その外周側の下面に形成された環状の係合突起１６ａを備え、前記側壁部材１５は、その下端が環状板１４の係合凹部１４ｂと係合する係合部と、その上端が天板１６の係合突起１６ａと係合する係合部となっている。
　前記基台２０は、上下に配設された上部材２１及び下部材２２からなり、上部材２１上にシリコン基板Ｋが載置され、下部材２２には前記昇降シリンダ２３が接続される。
　前記排気装置２４は、排気ポンプ２５と、排気ポンプ２５と下部チャンバ１２とを接続する排気管２６とから構成され、排気ポンプ２５により排気管２６を介して下部チャンバ１２内の気体を排気し、処理チャンバ１１の内部を所定圧力に減圧する。
　前記ガス供給装置２７は、処理ガスとして、エッチングガス（例えば、ＳＦ６ガス）及び耐エッチング層形成ガス（例えば、Ｃ４Ｆ８ガス）を供給する処理ガス供給部２８と、処理ガス供給部２８と上部チャンバ１３の天板１６とを接続する処理ガス供給管２９とから構成され、処理ガス供給部２８から処理ガス供給管２９を介して上部チャンバ１３内にエッチングガス及び耐エッチング層形成ガスを供給する。
　前記プラズマ生成機構３０は、前記側壁部材１５の周囲に上下に並設された複数の環状のコイル３１と、内部が中空の円筒状に形成され、その内周面に各コイル３１を保持する保持穴３２ａを備えた保持部材３２とからなる。この保持部材３２は、下端外周面に鍔部３２ｂを備えており、下端面が環状板１４の上面に当接し、上端部が前記昇降装置４０の昇降板４１の下面に固設されている。
　前記コイル用高周波電源３３は、コイル３１に高周波電圧を印加することで、上部チャンバ１３内に磁界を形成し、この磁界によって誘起される電界により、上部チャンバ１３内に供給されたエッチングガス及び耐エッチング層形成ガスをプラズマ化する。前記基台用高周波電源３４は、基台２０に高周波電圧を印加することで、基台２０とプラズマとの間に電位差（バイアス電位）を生じさせる。
　前記昇降装置４０は、天板１６とほぼ同じ高さ位置に水平に配置されて昇降自在に設けられる昇降板４１と、昇降板４１を支持して昇降させる昇降機構４２とを備える。前記昇降板４１には、上下に貫通し、天板１６の外径よりも大きい貫通穴４１ａが形成される。前記昇降機構４２は、軸線が上下方向に沿うように且つ軸線中心に回転自在に配置されたボールねじ４３と、ボールねじ４３に螺合し、これに沿って移動するナット４４と、ボールねじ４３の上端部に接続し、これを軸線中心に回転させる駆動モータ４５とから構成されており、ナット４４が昇降板４１の取付穴４１ｂ内に挿入，固定されている。尚、前記ボールねじ４３，ナット４４，駆動モータ４５及び取付穴４１ｂは、円周方向等間隔で３つ設けられている。
　前記固定機構４６は、環状をした固定板４７と、固定板４７により天板１６と昇降板４１とを連結，固定するための第１固定ボルト４８，４９と、保持部材３２の鍔部３２ｂと環状板１４とを固定するための第２固定ボルト５０と、環状板１４と下部チャンバ１２の側壁１２ａとを固定するための第３固定ボルト５１とからなる。尚、第１固定ボルト４８，４９、第２固定ボルト５０及び第３固定ボルト５１は、円周方向等間隔で４つ設けられる。尚、前記保持部材３２は、昇降板４１の下面と環状板１４の上面とを接続する接続部材としても機能している。
　前記第１固定ボルト４８，４９は、その先端部が固定板４７に形成された貫通穴４７ａ内に上側から挿通されて、天板１６の上面に形成されたねじ穴１６ｂに螺合するもの（符合４８で示す）と、その先端部が固定板４７に形成された貫通穴４７ｂ内に上側から挿通されて、昇降板４１の上面に形成されたねじ穴４１ｃに螺合するもの（符合４９で示す）とがある。
　前記第２固定ボルト５０は、その先端部が鍔部３２ｂに形成された貫通穴３２ｃ内に上側から挿通されて、環状板１４の上面に形成されたねじ穴１４ｃに螺合し、前記第３固定ボルト５１は、その先端部が環状板１４に形成された貫通穴１４ｄ内に上側から挿通されて、側壁１２ａの上端面に形成されたねじ穴１２ｄに螺合している。
　前記カバー体５５は、下部チャンバ１２を覆う下カバー５６と、上部チャンバ１３及び昇降装置４０を覆う上カバー５７とからなり、上カバー５７は下部チャンバ１２の側壁１２ａの上端部から上側をカバーし、下カバー５６は、下部チャンバ１２の側壁１２ａの上端部から下側をカバーしている。
　前記上カバー５７の内面には、駆動モータ４５を支持する支持板５８が昇降板４１の上方位置に配置され、また、ボールねじ４３の下端部を軸線中心に回転自在に支持する支持部材５９が配設される。また、更に、上カバー５７は、上部チャンバ１３の側方位置で外側から内側に貫通する作業穴５７ａと、この作業穴５７ａを開閉する観音開きの扉６０とを備える。
　前記制御装置（図示せず）は、昇降シリンダ２３，排気装置２４，ガス供給装置２７，コイル用高周波電源３３，基台用高周波電源３４及び昇降装置４０の作動を制御する。具体的には、コイル用高周波電源３３及び基台用高周波電源３４によってコイル３１及び基台２０に高周波電圧をそれぞれ印加し、処理ガス供給部２８から処理チャンバ１１内にエッチングガスを供給し、排気ポンプ２５によって処理チャンバ１１内を所定圧力にするエッチング工程と、コイル用高周波電源３３によってコイル３１に高周波電圧を印加し、処理ガス供給部２８から処理チャンバ１１内に耐エッチング層形成ガスを供給し、排気ポンプ２５によって処理チャンバ１１内を所定圧力にする耐エッチング層形成工程とを交互に繰り返して実行する。
　また、制御装置（図示せず）は、駆動モータ４５によりボールねじ４３を軸線中心に回転させてナット４４をボールねじ４３に沿って上方又は下方に移動させ、これにより、昇降板４１を昇降させる。
　以上のように構成された本例のエッチング装置１によれば、エッチング工程と耐エッチング層形成工程とが交互に繰り返し実行され、エッチング工程では、エッチングガスがプラズマ化され、プラズマ中のラジカルがシリコン原子と化学反応したり、プラズマ中のイオンがバイアス電位により基台２０側に向けて移動してシリコン基板Ｋと衝突することで、シリコン基板Ｋがエッチングされる。一方、耐エッチング層形成工程では、耐エッチング層形成ガスがプラズマ化され、プラズマ中のラジカルから生成された重合物が、シリコン基板Ｋの表面（エッチングによって形成される溝や穴の側壁及び底面など）に堆積し、耐エッチング層（フロロカーボン膜）が形成される。このようにしてシリコン基板Ｋのエッチングが進行する。
　そして、このようなプラズマ処理を行うと、処理チャンバ１１の内面には各種の生成物が付着するが、この付着物の除去といった処理チャンバ１１のメンテナンスは、次のようにして行うことができる。
　即ち、上部チャンバ１３の天板１６をメンテナンスする際には、図４に示すように、第１固定ボルト４８，４９を外して固定板４７を外し、昇降板４１と天板１６との連結，固定を解除すると、天板１６のみが外れるため、これを当該エッチング装置１から容易に取り外してメンテナンスすることができる。メンテナンス終了後は、天板１６の係合突起１６ａ内に側壁部材１５の上端が嵌まるように天板１６を側壁部材１５の上端部に載置し、固定板４７及び第１固定ボルト４８，４９を用いて天板１６と昇降板４１とを連結，固定すれば、当該エッチング装置１を容易に組み立てることができる。
　一方、上部チャンバ１３の側壁部材１５をメンテナンスする際には、図５に示すように、まず、第２固定ボルト５０を外して保持部材３２の鍔部３２ｂと環状板１４との固定を解除し、駆動モータ４５を回転させて昇降板４１とともに天板１６、第１固定ボルト４８，４９、コイル３１及び保持部材３２を上昇させると、側壁部材１５のみが外れるため、これを当該エッチング装置１から容易に取り外してメンテナンスすることができる。メンテナンス終了後は、環状板１４の係合凹部１４ｂ内に側壁部材１５の下端が嵌まるように側壁部材１５を環状板１４上に載置し、駆動モータ４５を回転させて昇降板４１とともに天板１６、第１固定ボルト４８，４９、コイル３１及び保持部材３２を下降端位置まで、即ち、天板１６が側壁部材１５の上端部に載置されるまで下降させた後、第２固定ボルト５０により保持部材３２の鍔部３２ｂと環状板１４とを固定すれば、当該エッチング装置１を容易に組み立てることができる。
　また、上部チャンバ１３の環状板１４をメンテナンスする際には、側壁部材１５を取り外した状態で、更に、第３固定ボルト５１を外して環状板１４と下部チャンバ１２の側壁１２ａとの固定を解除すれば、この環状板１４を当該エッチング装置１から容易に取り外してメンテナンスすることができる。メンテナンス終了後は、環状板１４の係合溝１４ａ内に下部チャンバ１２の側壁１２ａの係合突起１２ｂが嵌まるように環状板１４を側壁１２ａの上端面に載置して第３固定ボルト５１により環状板１４と下部チャンバ１２の側壁１２ａとを固定し、側壁部材１５を環状板１４に載置した後、駆動モータ４５を回転させて昇降板４１を下降端位置（天板１６が側壁部材１５の上端部に載置される位置）まで下降させた後、第２固定ボルト５０により保持部材３２の鍔部３２ｂと環状板１４とを固定すれば、当該エッチング装置１を容易に組み立てることができる。
　また、下部チャンバ１２をメンテナンスする際には、まず、第３固定ボルト５１を外して環状板１４と下部チャンバ１２の側壁１２ａとの固定を解除した後、駆動モータ４５を回転させて昇降板４１とともに天板１６、第１固定ボルト４８，４９、コイル３１、保持部材３２、環状板１４、側壁部材１５及び第２固定ボルト５０を上昇させると、即ち、上部チャンバ１３全体を上方に移動させると、下部チャンバ１２が開口し、これを容易にメンテナンスすることができる。メンテナンス終了後は、駆動モータ４５を回転させて昇降板４１とともに天板１６、第１固定ボルト４８，４９、コイル３１、保持部材３２、環状板１４、側壁部材１５及び第２固定ボルト５０を下降端位置まで、即ち、環状板１４の下面が下部チャンバ１２の側壁１２ａの上端面に当接するまで下降させ、第３固定ボルト５１により環状板１４と下部チャンバ１２の側壁１２ａとを固定すれば、当該エッチング装置１を容易に組み立てることができる。
　尚、メンテナンスを行うに当たり、作業者は、扉６０を開けて作業穴５７から作業を行う。
　斯くして、本例のエッチング装置１によれば、第１固定ボルト４８，４９及び固定板４７による天板１６の固定を解除することや、第２固定ボルト５０や第３固定ボルト５１による環状板１４の固定を解除して昇降機構４２により昇降板４１を上昇させることで、処理チャンバ１１を構成する部品の内、メンテナンス対象とする部品を当該エッチング装置１から簡単に取り外すことができ、また、メンテナンス後の部品を元に戻す際には取り外し時とは逆の操作を行えば良いので、この対象部品を交換したり、洗浄するといったメンテナンスを容易に且つ短時間で実施することができる。
　また、メンテナンス終了後、部品を取り付ける際、天板１６の係合突起１６ａ内に側壁部材１５の上端を嵌めることで天板１６を側壁部材１５に対し位置決めすることができ、環状板１４の係合凹部１４ｂ内に側壁部材１５の下端を嵌めることで側壁部材１５を環状板１４に対し位置決めすることができ、環状板１４の係合溝１４ａ内に下部チャンバ１２の側壁１２ａの係合突起１２ｂを嵌めることで環状板１４を側壁１２ａに対し位置決めすることができるので、一旦取り外した天板１６や側壁部材１５、環状板１４の取付作業の容易化を図ることができるとともに、組立精度の低下を防止することができる。
　また、処理チャンバ１１及び昇降装置４０をカバー体５５により覆っているので、昇降板４１及び昇降機構４２の動作時に作業者が負傷することや、高周波が人体に影響を与えるのを防止して作業者を保護することができる。
　以上、本発明の一実施形態について説明したが、本発明の採り得る具体的な態様は、何らこれに限定されるものではない。
　上例では、保持部材３２及び第２固定ボルト５０によって昇降板４１と環状板１４とを連結，固定するようにしたが、これに限られるものではなく、上部が昇降板４１の下面に固設された連結部材を保持部材３２とは別に設け、この連結部材の下部を第２固定ボルト５０により環状板１４に固定するようにしても良い。
　また、前記上部チャンバ１３の構成は上述したものに限定されるものではなく、前記環状板１４，側壁部材１５及び天板１６の他に構成部材を備えるような形状であっても良い。また、前記エッチング装置１は、上部チャンバ１３を加熱する加熱装置や、上部チャンバ１３を冷却する冷却装置などを更に備えていても良く、この場合、加熱装置や冷却装置をそれぞれ昇降板４１に着脱自在に取り付けると、メンテナンスし易く、好ましい。
　また、上例では、プラズマ処理の一例としてエッチング処理を挙げたが、これに限定されるものではなく、アッシング処理や成膜処理などにも本発明のプラズマ処理装置を適用することができる。また、プラズマ処理対象となる基板は、シリコン基板Ｋに限られず、ガラス基板など、どのような基板であっても良い。
　以上詳述したように、本発明は、処理チャンバを効率的にメンテナンスすることができるプラズマ処理装置として好適である。

Claims (5)

  1. 　上部チャンバ及び下部チャンバの上下２部構成に形成され、前記下部チャンバ内に基板が配置される処理チャンバと、前記上部チャンバ内に処理ガスを供給するガス供給手段と、前記上部チャンバ内に供給された処理ガスをプラズマ化するためのプラズマ生成手段と、前記プラズマ生成手段に高周波電圧を印加する電圧印加手段とを備えたプラズマ処理装置であって、
    　前記下部チャンバは、上面に開口する内部空間を有し、前記上部チャンバは、下面に開口する内部空間を有して、これらの内部空間が相互に連通するように構成されたプラズマ処理装置において、
    　水平に配置されて昇降自在に設けられ、前記上部チャンバを構成する少なくとも一部の部材が取り付けられる昇降板と、
    　前記昇降板を支持して昇降させる昇降手段と、
    　前記上部チャンバを固定するための第１，第２及び第３の少なくとも３つの固定手段とを備えてなり、
    　前記上部チャンバは、外周側の下面が前記下部チャンバの上部に当接する環状板と、内部が中空の筒状に形成され、その下端部が前記環状板上に載置される側壁部材と、前記側壁部材の上端部に載置される天板とから少なくとも構成され、
    　前記昇降板は、上下に貫通し、前記天板が通過可能な大きさの貫通穴を有し、
    　前記プラズマ生成手段は、前記側壁部材の外方に配置されて前記昇降板の下面に固設され、
    　前記第１固定手段は、前記昇降板と天板とを連結，固定する一方、これらの連結，固定を解除可能に構成され、
    　前記第２固定手段は、前記昇降板と環状板とを連結，固定する一方、これらの連結，固定を解除可能に構成され、
    　前記第３固定手段は、前記下部チャンバと環状板とを固定する一方、これらの固定を解除可能に構成されてなることを特徴とするプラズマ処理装置。
  2. 　前記天板及び側壁部材の上端部には、互いに係合して前記天板を前記側壁部材に対し位置決めするための係合部がそれぞれ形成されてなることを特徴とする請求項１記載のプラズマ処理装置。
  3. 　前記環状板及び側壁部材の下端部には、互いに係合して前記側壁部材を前記環状板に対し位置決めするための係合部がそれぞれ形成されてなることを特徴とする請求項１記載のプラズマ処理装置。
  4. 　前記環状板の下面及び下部チャンバの上部には、互いに係合して前記環状板を前記下部チャンバに対し位置決めするための係合部がそれぞれ形成されてなることを特徴とする請求項１記載のプラズマ処理装置。
  5. 　前記昇降板，昇降手段及び上部チャンバを少なくとも覆うカバー体を更に有し、
    　前記カバー体は、前記上部チャンバの側方位置で外側から内側に貫通する作業穴と、前記作業穴を開閉する戸とを備えてなることを特徴とする請求項１乃至４記載の記載のいずれかのプラズマ処理装置。
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TW200939907A (en) 2009-09-16
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US8771461B2 (en) 2014-07-08

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