TWI426829B - 電漿處理裝置(二) - Google Patents
電漿處理裝置(二) Download PDFInfo
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- H—ELECTRICITY
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Description
本發明係關於一種對處理腔室內供給規定之處理氣體使其形成電漿,且藉由經電漿化之處理氣體來對配置於處理腔室內之基板進行處理的電漿處理裝置。
先前,作為上述電漿處理裝置,已知有例如日本專利特開2000-268995號公報中揭示者。該電漿處理裝置中包括:構成反應室之處理腔室,配置於處理腔室內且由上表面保持基板之基座,對處理腔室內供給處理氣體之氣體供給機構,用於使供給至處理腔室內之處理氣體形成電漿的電漿生成機構,以及對電漿生成機構施加高頻電壓之高頻電源等。
上述處理腔室由上部開口之下部部件、設置成下表面抵接於下部部件之側壁上表面的環狀體、及設置成下表面抵接於環狀體之上表面的蓋體等構成,上述環狀體由內部形成為中空圓筒狀之圓筒電極、分別設於圓筒電極之上端部及下端部之環狀上部絕緣材以及下部絕緣材、連接於上部絕緣材之上端以及下部絕緣材之下端並保持其等之環狀保持部件構成。
上述電漿生成機構由構成上述處理腔室之一部分的圓筒電極、及分別設於上部絕緣材以及下部絕緣材之外周面的環狀永久磁鐵構成。上述高頻電源對圓筒電極施加高頻電壓。
然而,若實施電漿處理,則處理腔室之內表面會附著各種生成物,而該附著物成為粒子後會引起附著於基板等之問題。故而,處理腔室定期進行清洗以除去附著物。再者,處理腔室之清洗係藉由例如分解處理腔室,並利用規定之清洗液或純水對其之各構成零件進行清洗來進行的。
繼而,上述先前之電漿處理裝置中,由於藉由保持部件來保持圓筒電極、上部絕緣材以及下部絕緣材,且其等為一體構成,故而,與逐個分解圓筒電極、上部絕緣材以及下部絕緣材,又進行組裝之情形相比,分解或組裝處理腔室更為有利。
[專利文獻1]日本專利特開2000-268995號公報
然而,上述先前之電漿處理裝置存在以下問題,例如,即便於僅對下部部件或圓筒電極等一部分構成零件進行維護時,亦必須分解包括並非維護對象之蓋體等的所有零件,故而處理腔室之分解作業及組裝作業需要花費時間,從而無法有效進行維護。
本發明係鑒於以上情況研製而者,其目的在於提供一種能有效維護處理腔室之電漿處理裝置。
為達成上述目的,本發明之電漿處理裝置包括:處理腔室,形成為上部腔室以及下部腔室之上下2部分結構,且於上述下部腔室內配置有基板;氣體供給機構,對上述上部腔室內供給處理氣體;電漿生成機構,用於使供給至上述上部腔室內之處理氣體形成電漿;以及,電壓施加機構,對上述電漿生成機構施加高頻電壓;且
上述下部腔室具有於上表面開口之內部空間,上述上部腔室具有於下表面開口之內部空間,該等內部空間相互連通,該電漿處理裝置之特徵在於:具有
升降板,水平配置且設置為升降自由,且安裝有構成上述上部腔室之至少一部分部件;
升降機構,支撐著上述升降板進行升降;
第1、第2以及第3之至少3個固定機構,用於固定上述上部腔室;且
上述上部腔室至少由外周側之下表面抵接於上述下部腔室之上部的環狀板,內部形成為中空筒狀且下端部載置於上述環狀板上之側壁部件、以及載置於上述側壁部件之上端部的頂板構成;
上述升降板具有上下貫通且尺寸可供上述頂板穿過之貫通孔;
上述電漿生成機構配置於上述側壁部件之外且固定於上述升降板之下表面;
上述第1固定機構連結、固定上述升降板與頂板,另一方面,亦能解除其等之連結及固定;
上述第2固定機構連結、固定上述升降板與環狀板,另一方面,亦能解除其等之連結及固定;
上述第3固定機構固定上述下部腔室與環狀板,另一方面,亦能解除其等之固定。
根據本發明,例如,對矽基板或玻璃基板等處理對象基板,進行蝕刻處理、灰化處理以及成膜處理等電漿處理時,藉由氣體供給機構對處理腔室內供給處理氣體,並且藉由電壓施加機構對電漿生成機構施加高頻電壓而使處理氣體形成電漿。藉此,適時搬入至處理腔室內之基板將藉由經電漿化之處理氣體來進行處理。
繼而,若進行上述電漿處理,則處理腔室之內表面上會附著有各種生成物,但除去該附著物之處理腔室之維護可以如下方式進行。
亦即,當對上部腔室之頂板進行維護時,將第1固定機構對升降板與頂板之連結及固定解除。藉此,僅將頂板拆卸,故而,易於將其自該電漿處理裝置上卸除來進行維護。維護之後,將頂板載置於側壁部件之上端部後,藉由第1固定機構來連結、固定該頂板與升降板,藉此,便能易於組裝該電漿處理裝置。
另一方面,當對上部腔室之側壁部件進行維護時,首先,將第2固定機構對升降板與環狀板之連結、固定解除後,藉由升降機構使升降板上升,並使頂板、第1固定機構以及電漿生成機構與該升降板一同移動至上方。藉此,便僅將未上升而停留不動之側壁部件拆卸,故而,能易於將其自該電漿處理裝置上卸除進行維護。維護之後,將側壁部件載置於環狀板上,並藉由升降機構使升降板下降,使頂板、第1固定機構以及電漿生成機構移動至下方之後,藉由第2固定機構連結、固定該環狀板與升降板,藉此,便能易於組裝該電漿處理裝置。
而且,當對上部腔室之環狀板進行維護時,若於拆卸側壁部件之狀態下,進而將第3固定機構對下部腔室與環狀板的固定解除,便能易於將環狀板自該電漿處理裝置上卸下進行維護。維護之後,若藉由第3固定機構固定環狀板與下部腔室,並將側壁部件載置於環狀板上之後,藉由升降機構使升降板下降,且藉由第2固定機構連結、固定環狀板與升降板,則能夠易於組裝該電漿處理裝置。
而且,當對下部腔室進行維護時,首先,將第3固定機構對下部腔室與環狀板之固定解除之後,藉由升降機構使升降板上升,從而使頂板、第1固定機構、電漿生成機構、第2固定機構、側壁部件以及環狀板與該升降板一同移動至上方,亦即,使整個上部腔室移動至上方。藉此,便能使下部腔室開口,從而易於對其進行維護。維護之後,藉由升降機構使升降板下降,從而使頂板、第1固定機構、電漿生成機構、第2固定機構、側壁部件以及環狀板移動至下方後,藉由第3固定機構來固定環狀板與下部腔室,藉此,便能易於組裝該電漿處理裝置。
如上所述,根據本發明之電漿處理裝置,將第1固定機構對頂板的固定解除,或者將第2固定機構或第3固定機構對環狀板之固定解除,並藉由升降機構使升降板上升,藉此,便能自該電漿處理裝置上簡單地拆卸構成處理腔室之零件中作為維護對象之零件,而且,當需要將維護後之零件恢復至原來狀態時,執行與拆卸時相反之操作即可,故而,可易於短時間內實施對該對象零件進行更換或清洗之維護處理。
再者,於上述頂板以及側壁部件之上端部可分別形成相互卡合而使上述頂板相對上述側壁部件進行定位之卡合部,而且,於上述環狀板以及側壁部件之下端部可分別形成相互卡合而使上述側壁部件相對上述環狀板進行定位之卡合部,而且,進而可於上述環狀板之下表面以及下部腔室之上部分別形成相互卡合而使上述環狀板相對上述下部腔室進行定位之卡合部。藉此,便能使臨時拆卸之頂板或側壁部件、環狀板之安裝作業變得容易,而且亦可防止組裝精度下降。
而且,上述電漿處理裝置,可進而具有至少覆蓋上述升降板、升降機構以及上部腔室之罩體,上述罩體包括:作業孔,於上述上部腔室之側方位置上自外側貫通至內側;及門,用以開關上述作業孔。此時,作業人員打開門,自作業孔進行維護。藉此,當升降機構以及升降板執行動作時能夠防止作業人員受傷、或者防止高頻波影響人體,起到保護作業人員之作用。
如上所述,根據本發明之電漿處理裝置,便能有效維護處理腔室。
以下,參照隨附圖式,對本發明之具體實施形態進行說明。再者,圖1為表示本發明一實施形態之蝕刻裝置的概略構成之剖面圖,圖2為圖1中箭頭A-A方向上之剖面圖,圖3為圖1中箭頭B-B方向上之剖面圖。
如圖1至圖3所示,作為本例之電漿處理裝置之蝕刻裝置1包括下述等部分:處理腔室11,形成為下部腔室12以及上部腔室13之上下2部分結構;基台20,升降自由地配設於下部腔室12內,且載置有作為蝕刻對象之矽基板K;升降氣缸23,使基台20進行升降;排氣裝置24,對處理腔室11內之壓力進行減壓;氣體供給裝置27,對上部腔室13內供給處理氣體;多個線圈(電漿生成機構)30,配置於上部腔室13之外部;線圈用高頻電源33,對線圈30施加高頻電壓;基台用高頻電源34,對基台20施加高頻電壓;升降裝置40,使上部腔室13進行升降;固定機構46,用於固定上部腔室13;罩體55,自外側覆蓋處理腔室11以及升降裝置40;以及,控制裝置(未圖示),對升降氣缸23、排氣裝置24、氣體供給裝置27、線圈用高頻電源33、基台用高頻電源34以及升降裝置40之動作進行控制。
上述下部腔室12具有於上表面開口之內部空間,上述上部腔室13具有於下表面開口之內部空間,且該等內部空間相互連通。而且,下部腔室12具有環狀之側壁12a,該側壁12a之上端面形成有環狀之卡合突起12b。而且,該側壁12a上形成有開口部12c,該開口部12c由擋板17進行開關,用於搬入或搬出矽基板K。
上述上部腔室13由如下者構成:環狀板14,外周側之下表面抵接於下部腔室12之側壁12a之上端面;側壁部件15,內部形成為中空之圓筒狀,且其下端載置於環狀板14之內周側;及,頂板16,外周側之下表面載置於側壁部件15之上端面。
上述環狀板14具有形成於其外周側下表面且與下部腔室12之側壁12a之卡合突起12b卡合之環狀卡合槽14a、及形成於內周側上表面之角部的環狀卡合凹部14b,上述頂板16具有形成於其外周側下表面之環狀卡合突起16a,上述側壁部件15成為其下端與環狀板14之卡合凹部14b卡合之卡合部,及其上端與頂板16之卡合突起16a卡合之卡合部。
上述基台20由上下配設之上部件21以及下部件22構成,於上部件21上載置有矽基板K,於下部件22連接有上述升降氣缸23。
上述排氣裝置24由排氣泵25、及連接排氣泵25與下部腔室12之排氣管26構成,並藉由排氣泵25經由排氣管26將下部腔室12內之氣體排出,使處理腔室11內部減壓至規定壓力。
上述氣體供給裝置27由處理氣體供給部28及處理氣體供給管29構成,該處理氣體供給部28供給作為處理氣體之蝕刻氣體(例如SF6
氣體)以及耐蝕刻層形成氣體(例如C4
F8
氣體),該處理氣體供給管29連接處理氣體供給部28與上部腔室13之頂板16,而且,自處理氣體供給部28經由處理氣體供給管29對上部腔室13內供給蝕刻氣體以及耐蝕刻層形成氣體。
上述電漿生成機構30包括:多個環狀線圈31,上下並列設置於上述側壁部件15之周圍;及,保持部件32,內部形成為中空之圓筒狀,其內周面具有保持各線圈31之保持孔32a。該保持部件32於下端外周面具有凸緣部32b,且下端面抵接於環狀板14之上表面,上端部固定於上述升降裝置40之升降板41的下表面。
上述線圈用高頻電源33,對線圈31施加高頻電壓,藉此,於上部腔室13內形成磁場,並利用因該磁場感應產生之電場,使供給至上部腔室13內之蝕刻氣體以及耐蝕刻層形成氣體形成電漿。上述基台用高頻電源34對基台20施加高頻電壓,藉此使基台20與電漿之間產生電位差(偏壓電位)。
上述升降裝置40具有水平配置於與頂板16高度大致相等之位置上且設置成升降自由的升降板41、及支撐著升降板41進行升降之升降機構42。上述升降板41上形成有上下貫通且尺寸大於頂板16之外徑的貫通孔41a。上述升降機構42由如下者構成:滾珠螺桿43,配置成軸線沿著上下方向且以軸線為中心旋轉自由;螺母44,與滾珠螺桿43旋接,且沿著該滾珠螺桿43移動;驅動馬達45,連接於滾珠螺桿43之上端部,且使該滾珠螺桿43以軸線為中心進行旋轉;而螺母44插入、固定於升降板41之安裝孔41b內。再者,上述滾珠螺桿43、螺母44、驅動馬達45以及安裝孔41b於圓周方向以等間隔設有3個。
上述固定機構46包括:呈環狀之固定板47;第1固定螺栓48、49,藉由固定板47連結、固定頂板16與升降板41;第2固定螺栓50,用於固定保持部件32之凸緣部32b與環狀板14;以及,第3固定螺栓51,用於固定環狀板14與下部腔室12之側壁12a。再者,第1固定螺栓48、49、第2固定螺栓50以及第3固定螺栓51於圓周方向以等間隔設有4個。再者,上述保持部件32亦起到連接升降板41之下表面與環狀板14之上表面的連接部件的作用。
上述第1固定螺栓48、49有如下兩種情形,即,其頂端部自上側穿透至形成於固定板47上的貫通孔47a內,而與形成於頂板16之上表面的螺孔16b旋接(符號48所示),以及,其頂端部自上側穿透至形成於固定板47上的貫通孔47b內,而與形成於升降板41之上表面的螺孔41c旋接(如符號49所示)。
上述第2固定螺栓50係其頂端部自上側穿透至形成於凸緣部32b之貫通孔32c內,而與形成於環狀板14之上表面的螺孔14c旋接,上述第3固定螺栓51係其頂端部自上側穿透至形成於環狀板14之貫通孔14d內,而與形成於側壁12a之上端面的螺孔12d旋接。
上述罩體55係由覆蓋下部腔室12之下罩56、以及覆蓋上部腔室13及升降裝置40之上罩57構成,上罩57自下部腔室12之側壁12a之上端部覆蓋上側,下罩56自下部腔室12之側壁12a之上端部覆蓋下側。
於上述上罩57之內表面中,支撐驅動馬達45的支撐板58配置於升降板41之上方位置,而且,配設有支撐滾珠螺桿43之下端部以軸線為中心而自由旋轉的支撐部件59。而且,上罩57進而包括:作業孔57a,於上部腔室13之側方位置自外側貫通至內側;以及,對開之門60,用以開關該作業孔57a。
上述控制裝置(未圖示)對升降氣缸23、排氣裝置24、氣體供給裝置27、線圈用高頻電源33、基台用高頻電源34以及升降裝置40之動作進行控制。具體而言,反覆交替實施蝕刻步驟及耐蝕刻層形成步驟,該蝕刻步驟係藉由線圈用高頻電源33以及基台用高頻電源34分別對線圈31以及基台20施加高頻電壓,自處理氣體供給部28對處理腔室11內供給蝕刻氣體,且藉由排氣泵2而使處理腔室11內達到規定壓力,而該耐蝕刻層形成步驟係藉由線圈用高頻電源33對線圈31施加高頻電壓,並自處理氣體供給部28對處理腔室11內供給耐蝕刻層形成氣體,再藉由排氣泵25使處理腔室11內達到規定壓力。
而且,控制裝置(未圖示)藉由驅動馬達45而使滾珠螺桿43以軸線為中心進行旋轉,使螺母44沿滾珠螺桿43向上方或者下方移動,藉此,使升降板41進行升降。
根據以上述方式構成之本例中的蝕刻裝置1,反覆交替實施蝕刻步驟與耐蝕刻層形成步驟,蝕刻步驟係使蝕刻氣體形成電漿,使電漿中之自由基與矽原子產生化學反應,或者使電漿中之離子藉由偏壓電位而向基台20側移動,並與矽基板K產生碰撞,藉此,對矽基板K進行蝕刻。另一方面,耐蝕刻層形成步驟係使耐蝕刻層形成氣體形成電漿,使由電漿中之自由基所生成之聚合物沈積於矽基板K之表面(由蝕刻所形成之槽或孔的側壁以及底面等)上,從而形成耐蝕刻層(碳氟化合物膜)。以如此方式,對矽基板K進行蝕刻。
繼而,若實施上述電漿處理,則處理腔室11之內表面將附著有各種生成物,但可以如下方式實施除去該附著物之處理腔室11之維護處理。
亦即,當對上部腔室13之頂板16進行維護時,如圖4所示,若將第1固定螺栓48、49拆卸並將固定板47拆卸,將升降板41與頂板16之連結、固定解除,則僅頂板16被拆卸,故而,能易於將頂板16自該蝕刻裝置1拆卸進行維護。維護結束之後,如若以側壁部件15之上端嵌入至頂板16之卡合突起16a內之方式,將頂板16載置於側壁部件15之上端部,並使用固定板47以及第1固定螺栓48、49將頂板16與升降板41連結、固定,便能易於組裝該蝕刻裝置1。
另一方面,當對上部腔室13之側壁部件15進行維護時,如圖5所示,首先,拆卸第2固定螺栓50,解除保持部件32之凸緣部32b與環狀板14之固定,使驅動馬達45旋轉而使頂板16、第1固定螺栓48、49、線圈31以及保持部件32與升降板41一同上升,則僅側壁部件15被拆卸,故而,易於將側壁部件15自該蝕刻裝置1中拆卸進行維護。維護結束之後,如若以使側壁部件15之下端嵌入至環狀板14之卡合凹部14b內之方式,將側壁部件15載置於環狀板14上,使驅動馬達45旋轉而使頂板16、第1固定螺栓48、49、線圈31以及保持部件32與升降板41一同下降至下降端位置為止,亦即下降至使頂板16載置於側壁部件15之上端部為止後,使用第2固定螺栓50將保持部件32之凸緣部32b與環狀板14固定,便能易於組裝該蝕刻裝置1。
而且,當對上部腔室13之環狀板14進行維護時,如若於已將側壁部件15拆卸之狀態下,進而拆卸第3固定螺栓51,將環狀板14與下部腔室12之側壁12a的固定解除,則能易於將該環狀板14自該蝕刻裝置1中拆卸進行維護。維護結束之後,如若以使下部腔室12之側壁12a之卡合突起12b嵌入至環狀板14之卡合槽14a內的方式,將環狀板14載置於側壁12a之上端面,並使用第3固定螺栓51將環狀板14與下部腔室12之側壁12a固定,再將側壁部件15載置於環狀板14上後,使驅動馬達45旋轉而使升降板41下降至下降端位置(使頂板16載置於側壁部件15之上端部的位置)之後,使用第2固定螺栓50將保持部件32之凸緣部32b與環狀板14固定,便能易於組裝該蝕刻裝置1。
而且,當對下部腔室12進行維護時,首先,拆卸第3固定螺栓51,解除環狀板14與下部腔室12之側壁12a之固定後,使驅動馬達45旋轉而使頂板16、第1固定螺栓48、49、線圈31、保持部件32、環狀板14、側壁部件15以及第2固定螺栓50與升降板41一同上升,亦即,使整個上部腔室13移動至上方,則下部腔室12會打開,從而能夠易於對其進行維護。維護結束之後,如若使驅動馬達45旋轉,而使頂板16、第1固定螺栓48、49、線圈31、保持部件32、環狀板14、側壁部件15以及第2固定螺栓50與升降板41一同下降至下降端位置為止,亦即下降至使環狀板14之下表面抵接於下部腔室12之側壁12a的上端面為止,且使用第3固定螺栓51使環狀板14與下部腔室12之側壁12a固定,則能易於組裝該蝕刻裝置1。
再者,當進行維護時,作業人員打開門60自作業孔57中進行作業。
如此,根據本例中之蝕刻裝置1,將第1固定螺栓48、49以及固定板47對頂板16之固定解除,或者將第2固定螺栓50或第3固定螺栓51對環狀板14之固定解除,並藉由升降機構42使升降板41上升,藉此,便可簡單地自該蝕刻裝置1將構成處理腔室11之零件中作為維護對象之零件拆卸,而且,當需要將維護後之零件恢復至原來狀態時,只要實施與拆卸時相反之操作即可,故而,可易於短時間內實施更換、清洗該對象零件之維護處理。
而且,當維護結束後進行零件安裝時,可藉由將側壁部件15之上端嵌入至頂板16之卡合突起16a內,而使頂板16相對側壁部件15進行定位,故可藉由將側壁部件15之下端嵌入至環狀板14之卡合凹部14b內,而使側壁部件15相對環狀板14進行定位,並可藉由將下部腔室12之側壁12a之卡合突起12b嵌入至環狀板14之卡合槽14a內,而使環狀板14相對側壁12a進行定位,故而,能使臨時拆卸之頂板16或側壁部件15、環狀板14之安裝作業變得容易,並且亦能防止組裝精度下降。
而且,由於藉由罩體55覆蓋處理腔室11以及升降裝置40,故而,當升降板41以及升降機構42動作時便能防止作業人員受傷、或高頻波對人體造成影響,從而能夠保護作業人員。
以上,對本發明之一實施形態進行了說明,但本發明可採用之具體態樣並不限於此。
上述示例係藉由保持部件32以及第2固定螺栓50來連結、固定升降板41與環狀板14,但並不限於此,亦可使上部固定於升降板41下表面之連結部件與保持部件32分開設置,且藉由第2固定螺栓50來將該連結部件之下部固定於環狀板14上。
而且,上述上部腔室13之構成並不限於上述情況,亦可為除上述環狀板14、側壁部件15以及頂板16之外亦具有構成部件之形狀。而且,上述蝕刻裝置1亦可進而具有對上部腔室13進行加熱之加熱裝置、或冷卻上部腔室13之冷卻裝置等,此時,若將加熱裝置或冷卻裝置分別可裝卸自由地安裝於升降板41上,則易於維護,故而較好。
而且,上述示例係列舉蝕刻處理作為電漿處理之一例,但並不限於此,灰化處理或成膜處理等亦可應用本發明之電漿處理裝置。而且,作為電漿處理對象之基板,並不限於矽基板K,亦可為玻璃基板等任一基板。
1...蝕刻裝置(電漿處理裝置)
11...處理腔室
12...下部腔室
13...上部腔室
14...環狀板
15...側壁部件
16...頂板
20...基台
24...排氣裝置
27...氣體供給裝置
31...線圈
32...保持部件
33...線圈用高頻電源
34...基台用高頻電源
41...升降板
42...升降機構
47...固定板
48、49...第1固定螺栓
50...第2固定螺栓
51...第3固定螺栓
55...罩體
56...下罩
57...上罩
60...門
K...矽基板
圖1為表示本發明一實施形態之蝕刻裝置之概略構成的剖面圖。
圖2為圖1中箭頭A-A方向上之剖面圖。
圖3為圖1中箭頭B-B方向上之剖面圖。
圖4為表示將頂板等拆卸後之狀態的剖面圖。
圖5為表示使升降板、頂板以及保持部件等上升後之狀態的剖面圖。
圖6為表示使升降板以及上部腔室等上升後之狀態的剖面圖。
1...蝕刻裝置(電漿處理裝置)
11...處理腔室
12...下部腔室
12a...側壁
12b...卡合突起
12c...開口部
12d...螺孔
13...上部腔室
14...環狀板
14a...卡合槽
14b...卡合凹部
14c...螺孔
14d...貫通孔
15...側壁部件
16...頂板
16a...卡合突
16b...螺孔
17...擋板
20...基台
21...上部件
22...下部件
23...升降氣缸
24...排氣裝置
25...排氣泵
26...排氣管
27...氣體供給裝置
28...處理氣體供給部
29...處理氣體供給管
30...電漿生成機構
31...線圈
32...保持部件
32a...保持孔
32b...凸緣部
32c...貫通孔
33...線圈用高頻電源
34...基台用高頻電源
40...升降裝置
41...升降板
41a...貫通孔
41b...安裝孔
41c...螺孔
42...升降機構
43...滾珠螺桿
44...螺母
45...驅動馬達
46...固定機構
47...固定板
47a...貫通孔
47b...貫通孔
48、49...第1固定螺栓
50...第2固定螺栓
51...第3固定螺栓
55...罩體
56...下罩
57...上罩
57a...作業孔
58...支撐板
59...支撐部件
A、B...箭頭
K...矽基板
Claims (5)
- 一種電漿處理裝置,其包括:處理腔室,係形成為上部腔室以及下部腔室之上下2部分結構,且於上述下部腔室內配置有基板;氣體供給機構,係對上述上部腔室內供給處理氣體;電漿生成機構,係用於使供給至上述上部腔室內之處理氣體形成電漿;以及,電壓施加機構,係對上述電漿生成機構施加高頻電壓;且上述下部腔室具有於上表面開口之內部空間,上述上部腔室具有於下表面開口之內部空間,該等內部空間相互連通,該電漿處理裝置之特徵在於:其具有:升降板,係水平配置且設置為升降自由,且安裝有構成上述上部腔室之至少一部分部件;升降機構,係支撐著上述升降板進行升降;第1、第2以及第3之至少3個固定機構,係用於固定上述上部腔室;且上述上部腔室至少由外周側之下表面抵接於上述下部腔室之上部的環狀板,內部形成為中空筒狀且下端部載置於上述環狀板上之側壁部件、以及載置於上述側壁部件之上端部的頂板構成;上述升降板具有上下貫通且尺寸可供上述頂板穿過之貫通孔;上述電漿生成機構係配置於上述側壁部件之外且固定於上述升降板之下表面;上述第1固定機構係連結、固定上述升降板與頂板,另一方面,亦能解除其等之連結及固定;上述第2固定機構係連結、固定上述升降板與環狀板,另一方面,亦能解除其等之連結及固定;及上述第3固定機構係固定上述下部腔室與環狀板,另一方面,亦能解除其等之固定。
- 如申請專利範圍第1項之電漿處理裝置,其中:於上述頂板以及側壁部件之上端部,分別形成有相互卡合而使上述頂板相對上述側壁部件進行定位之卡合部。
- 如申請專利範圍第1項之電漿處理裝置,其中:於上述環狀板以及側壁部件之下端部,分別形成有相互卡合而使上述側壁部件相對上述環狀板進行定位之卡合部。
- 如申請專利範圍第1項之電漿處理裝置,其中:於上述環狀板之下表面以及下部腔室之上部,分別形成有相互卡合而使上述環狀板相對上述下部腔室進行定位之卡合部。
- 如申請專利範圍第1至4項中任一項之電漿處理裝置,其中:進而具有至少覆蓋上述升降板、升降機構以及上部腔室之罩體;及上述罩體包括:作業孔,於上述上部腔室之側方位置上自外側貫通至內側;及門,用以開關上述作業孔。
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JP2009224432A (ja) | 2009-10-01 |
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US8771461B2 (en) | 2014-07-08 |
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